KR20240019240A - 노광 장치, 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법 - Google Patents
노광 장치, 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법 Download PDFInfo
- Publication number
- KR20240019240A KR20240019240A KR1020247000393A KR20247000393A KR20240019240A KR 20240019240 A KR20240019240 A KR 20240019240A KR 1020247000393 A KR1020247000393 A KR 1020247000393A KR 20247000393 A KR20247000393 A KR 20247000393A KR 20240019240 A KR20240019240 A KR 20240019240A
- Authority
- KR
- South Korea
- Prior art keywords
- exposure
- pattern
- substrate
- optical system
- light modulator
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims abstract description 294
- 230000003287 optical effect Effects 0.000 claims abstract description 160
- 238000005286 illumination Methods 0.000 claims abstract description 51
- 238000005259 measurement Methods 0.000 claims description 86
- 238000000034 method Methods 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 10
- 238000012937 correction Methods 0.000 description 39
- 238000010586 diagram Methods 0.000 description 14
- 230000008859 change Effects 0.000 description 8
- 239000013307 optical fiber Substances 0.000 description 7
- 230000009467 reduction Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021111777 | 2021-07-05 | ||
| JPJP-P-2021-111777 | 2021-07-05 | ||
| PCT/JP2022/026497 WO2023282211A1 (ja) | 2021-07-05 | 2022-07-01 | 露光装置、デバイス製造方法およびフラットパネルディスプレイの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240019240A true KR20240019240A (ko) | 2024-02-14 |
Family
ID=84800651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247000393A KR20240019240A (ko) | 2021-07-05 | 2022-07-01 | 노광 장치, 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023282211A1 (ja) |
| KR (1) | KR20240019240A (ja) |
| CN (1) | CN117795423A (ja) |
| TW (1) | TW202309672A (ja) |
| WO (1) | WO2023282211A1 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005266779A (ja) | 2004-02-18 | 2005-09-29 | Fuji Photo Film Co Ltd | 露光装置及び方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000267294A (ja) * | 1999-03-12 | 2000-09-29 | Orc Mfg Co Ltd | 露光装置 |
| JP2018060001A (ja) * | 2016-10-04 | 2018-04-12 | 東京エレクトロン株式会社 | 補助露光装置及び露光量分布取得方法 |
-
2022
- 2022-07-01 WO PCT/JP2022/026497 patent/WO2023282211A1/ja active Application Filing
- 2022-07-01 TW TW111124763A patent/TW202309672A/zh unknown
- 2022-07-01 JP JP2023533109A patent/JPWO2023282211A1/ja active Pending
- 2022-07-01 KR KR1020247000393A patent/KR20240019240A/ko unknown
- 2022-07-01 CN CN202280043478.5A patent/CN117795423A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005266779A (ja) | 2004-02-18 | 2005-09-29 | Fuji Photo Film Co Ltd | 露光装置及び方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202309672A (zh) | 2023-03-01 |
| JPWO2023282211A1 (ja) | 2023-01-12 |
| CN117795423A (zh) | 2024-03-29 |
| WO2023282211A1 (ja) | 2023-01-12 |
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