KR20210010451A - 적층막 및 Ag 합금 스퍼터링 타깃 - Google Patents

적층막 및 Ag 합금 스퍼터링 타깃 Download PDF

Info

Publication number
KR20210010451A
KR20210010451A KR1020207032425A KR20207032425A KR20210010451A KR 20210010451 A KR20210010451 A KR 20210010451A KR 1020207032425 A KR1020207032425 A KR 1020207032425A KR 20207032425 A KR20207032425 A KR 20207032425A KR 20210010451 A KR20210010451 A KR 20210010451A
Authority
KR
South Korea
Prior art keywords
film
less
alloy
content
sputtering target
Prior art date
Application number
KR1020207032425A
Other languages
English (en)
Korean (ko)
Inventor
유토 도시모리
소헤이 노나카
Original Assignee
미쓰비시 마테리알 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 마테리알 가부시키가이샤 filed Critical 미쓰비시 마테리알 가부시키가이샤
Priority claimed from PCT/JP2019/019612 external-priority patent/WO2019221257A1/ja
Publication of KR20210010451A publication Critical patent/KR20210010451A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
KR1020207032425A 2018-05-17 2019-05-17 적층막 및 Ag 합금 스퍼터링 타깃 KR20210010451A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2018-095293 2018-05-17
JP2018095293 2018-05-17
JPJP-P-2019-090548 2019-05-13
JP2019090548A JP2019203194A (ja) 2018-05-17 2019-05-13 積層膜、及び、Ａｇ合金スパッタリングターゲット
PCT/JP2019/019612 WO2019221257A1 (ja) 2018-05-17 2019-05-17 積層膜、及び、Ａｇ合金スパッタリングターゲット

Publications (1)

Publication Number Publication Date
KR20210010451A true KR20210010451A (ko) 2021-01-27

Family

ID=68726254

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207032425A KR20210010451A (ko) 2018-05-17 2019-05-17 적층막 및 Ag 합금 스퍼터링 타깃

Country Status (4)

Country Link
JP (1) JP2019203194A (ja)
KR (1) KR20210010451A (ja)
CN (1) CN112119179A (ja)
TW (1) TW202011420A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113088749A (zh) * 2021-03-11 2021-07-09 先导薄膜材料（广东）有限公司 一种银合金及其制备方法
EP4328986A1 (en) * 2021-04-20 2024-02-28 Kureha Corporation Transparent electrically conductive piezoelectric laminate film
WO2024057671A1 (ja) * 2022-09-16 2024-03-21 株式会社アルバック 酸化物半導体薄膜形成用スパッタリングターゲット、酸化物半導体薄膜形成用スパッタリングターゲットの製造方法、酸化物半導体薄膜、薄膜半導体装置及びその製造方法
JP7425933B1 (ja) 2022-09-16 2024-01-31 株式会社アルバック 酸化物半導体薄膜形成用スパッタリングターゲット、酸化物半導体薄膜形成用スパッタリングターゲットの製造方法、酸化物半導体薄膜、薄膜半導体装置及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291356A (ja) 1996-04-26 1997-11-11 Asahi Glass Co Ltd 透明導電膜付き基体とその製造方法
JPH10239697A (ja) 1997-02-25 1998-09-11 Nippon Sheet Glass Co Ltd 透明導電膜付き基板およびその製造方法
JP2016040411A (ja) 2014-08-12 2016-03-24 三菱マテリアル株式会社 積層膜、積層配線膜及び積層配線膜の製造方法
JP2016164305A (ja) 2015-02-27 2016-09-08 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット及びＡｇ合金膜の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003160860A (ja) * 2001-11-27 2003-06-06 Mitsubishi Materials Corp 光記録媒体の反射膜形成用銀合金スパッタリングターゲット
JP5235011B2 (ja) * 2009-11-16 2013-07-10 株式会社神戸製鋼所 有機ｅｌディスプレイ用の反射アノード電極
WO2016043183A1 (ja) * 2014-09-18 2016-03-24 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット、Ａｇ合金スパッタリングターゲットの製造方法、Ａｇ合金膜およびＡｇ合金膜の製造方法
JP6801264B2 (ja) * 2015-07-28 2020-12-16 三菱マテリアル株式会社 Ａｇ合金膜とその製造方法、Ａｇ合金スパッタリングターゲットおよび積層膜
JP6888318B2 (ja) * 2016-03-23 2021-06-16 三菱マテリアル株式会社 積層透明導電膜、積層配線膜及び積層配線膜の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291356A (ja) 1996-04-26 1997-11-11 Asahi Glass Co Ltd 透明導電膜付き基体とその製造方法
JPH10239697A (ja) 1997-02-25 1998-09-11 Nippon Sheet Glass Co Ltd 透明導電膜付き基板およびその製造方法
JP2016040411A (ja) 2014-08-12 2016-03-24 三菱マテリアル株式会社 積層膜、積層配線膜及び積層配線膜の製造方法
JP2016164305A (ja) 2015-02-27 2016-09-08 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット及びＡｇ合金膜の製造方法

Also Published As

Publication number Publication date
JP2019203194A (ja) 2019-11-28
CN112119179A (zh) 2020-12-22
TW202011420A (zh) 2020-03-16

Similar Documents

Publication Publication Date Title
KR20210010451A (ko) 적층막 및 Ag 합금 스퍼터링 타깃
WO2012137461A1 (ja) 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
KR101854009B1 (ko) 도전성 막 형성용 은 합금 스퍼터링 타겟 및 그 제조 방법
WO2019221257A1 (ja) 積層膜、及び、Ａｇ合金スパッタリングターゲット
JP2022008503A (ja) 積層膜、及び、Ａｇ合金スパッタリングターゲット
JP6135275B2 (ja) 保護膜形成用スパッタリングターゲット
JP2007115431A (ja) 透明導電膜、透明電極、電極基板及びその製造方法
JP6376438B2 (ja) Ｃｕ−Ｍｎ合金スパッタリングターゲット材およびその製造方法
JP6250614B2 (ja) Ｃｕ積層膜、およびＣｕ合金スパッタリングターゲット
JP2019131850A (ja) 積層膜、及び、Ａｇ合金スパッタリングターゲット
JP5830908B2 (ja) 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
JP5669014B2 (ja) 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
TWI673374B (zh) 濺鍍靶及層合膜
JP5830907B2 (ja) 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
JP5547574B2 (ja) Ａｌ基合金スパッタリングターゲット
WO2016043183A1 (ja) Ａｇ合金スパッタリングターゲット、Ａｇ合金スパッタリングターゲットの製造方法、Ａｇ合金膜およびＡｇ合金膜の製造方法
JP6207406B2 (ja) スパッタリングターゲット材及び配線積層体
WO2020162221A1 (ja) Ａｇ合金スパッタリングターゲット、及び、Ａｇ合金膜
US20210310113A1 (en) Multilayer film, and ag alloy sputtering target
WO2016132847A1 (ja) Ｃｕ合金膜およびＣｕ積層膜
WO2021090581A1 (ja) Ａｇ合金スパッタリングターゲット、及び、Ａｇ合金膜
WO2020162206A1 (ja) Ａｇ合金スパッタリングターゲット、及び、Ａｇ合金膜
WO2016132578A1 (ja) 銅基合金スパッタリングターゲット
JP2017139381A (ja) 表示装置用配線構造