KR20170017044A

KR20170017044A - Soldering device for camera module

Info

Publication number: KR20170017044A
Application number: KR1020150110100A
Authority: KR
Inventors: 최지훈
Original assignee: 크루셜머신즈 주식회사
Priority date: 2015-08-04
Filing date: 2015-08-04
Publication date: 2017-02-15

Abstract

According to an embodiment of the present invention, the present invention relates to a soldering device for a camera module comprising: a laser module irradiating a laser beam to a solder ball; a vision system detecting a camera module and a substrate through an imaging device; a stage supporting and aligning the camera module and the substrate; and a controller electrically connected and controlling the laser module, the vision system, and the stage.

Description

[0001] SOLDERING DEVICE FOR CAMERA MODULE [0002]

The present invention relates to a soldering apparatus for a camera module.

In recent years IT products including mobile phones (smart phones) have become clear trends. As a result, components included in electronic devices, such as camera modules, are becoming smaller and smaller, and accordingly, there is a growing need for appropriate fine wiring and contact connection.

Accordingly, as the precision required for the soldering work for connecting the electrodes of the camera module to the substrate is increased, development of equipment capable of such high-precision soldering is required.

On the other hand, the housing material of the camera module is limited due to the necessity of heat dissipation of the electronic device. For example, when the camera module housing is changed from a material coated with Ni to SUS to a Cu and Ni coating, which easily emits heat from the mobile phone itself, there can be a problem of cold storage and non-storage. The problem of poor coupling between the camera module and the substrate can be confirmed in the drawings of FIGS. 1 and 2. FIG. In particular, in the photograph of FIG. 2, the soldering defective portion is indicated in the red circle.

Accordingly, a new reliable camera module soldering apparatus is required. There is a need for a soldering apparatus capable of ensuring reliable soldering even when a high-precision work is possible and a new module material (a module material having a heat radiation effect) is adopted.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described technical problems.

According to an aspect of the present invention, there is provided a soldering apparatus for a camera module, comprising: a laser module for irradiating a soldering ball with a laser beam; a vision system for detecting a camera module and a substrate through an image pickup device; A stage for supporting and aligning the module and the substrate; and a controller electrically connected to the laser module, the vision system, and the stage to control them.

According to the embodiment of the present invention, it is possible to provide a new reliable and high-precision camera module soldering apparatus. This device allows for reliable laser bonding even when a thermally effective camera module material is used.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram showing poor solderability / goodness of a camera module housing and a substrate. FIG.
2 is a photograph showing defective soldering according to the prior art.
3 is a perspective view of a soldering apparatus for a camera module according to an embodiment of the present invention.
4 is a block diagram of a soldering apparatus for a camera module according to FIG.
5 is a view illustrating a process in which the solder ball pick-up unit picks up the solder ball.
6 is a view showing a process of deforming and dipping a solder ball.
7 is a view illustrating a process of soldering using a solder ball.
8 is a view showing a state in which the camera module seat is rotated.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" (connected, connected, coupled) with another part, it is not only the case where it is "directly connected" "Is included. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a perspective view of a soldering apparatus for a camera module according to an embodiment of the present invention, and FIG. 4 is a block diagram of a soldering apparatus for a camera module according to FIG.

As shown, the soldering apparatus includes the following components.

1. Laser module

Soldering is the main purpose, and the soldering ball is melted and soldered by heat. To increase the thermal effect, a laser with an LD wavelength band can be applied. The wavelength band of the laser may be 900 to 990 nm.

2. Vision system

When the camera module is placed on the machining table, the vision camera stores the current position based on a point of the camera module. After moving to the soldering position using the orthogonal robot based on this position, the position reference point is measured so that soldering can be performed.

The alignment accuracy of the vision system can be, for example, less than 10 micrometers, and high brightness white LEDs can be used as illumination.

3. Stage

The alignment system receives the alignment data signal in the vision system, aligns the workpiece using the XY axis, and continuously moves the X-Y data position received from the controller. The Z axis is for focus adjustment, and the θ axis can be optionally included.

The stage and the biaxial robot controller can be configured as one robot system. The strokes of the stage can be set such that the X axis and the Y axis are 300 mm and the Z axis is 100 mm, respectively.

4. Controller

Integrated management and control of laser, scanner, stage, vision and other utility related data. PC controller can be used, and interface card can use PCI method.

A soldering process using a soldering apparatus for a camera module according to an embodiment of the present invention will be described below.

FIG. 5 is a view illustrating a process in which a solder ball pick-up unit picks up a solder ball, FIG. 6 illustrates a process of deforming and dipping a solder ball, and FIG. 7 illustrates a process of soldering using a solder ball.

In the soldering process, a solder ball pickup unit picks up a solder ball as shown in FIG.

Thereafter, as shown in FIG. 6, the solder ball is deformed and the paste is dipped. When the solder ball is deformed, the position of the solder ball is fixed, stable subsequent soldering operation is possible, and shape and bonding performance of the soldered portion are improved.

Thereafter, soldering is performed on the camera PCB and the pad surface as shown in FIG.

The experiment was carried out according to the above three process sequences. The experiment was carried out by irradiating with LD laser for 2.1 seconds using 500 micrometer solder balls. As a result, it was confirmed that the soldering work was stably performed on the fine pitch electrode.

Vision is used throughout the process. For example, whether or not a solder ball is picked up and whether or not a solder ball is inserted in a cassette can be detected through vision.

In order to prevent the solder ball from sinking down, it is possible to install a module for each PCB interval, and add a detachable module for each PCB interval of the camera to be soldered.

8 is a view showing a state in which the camera module seat is rotated. As shown in the figure, the seat portion on which the camera module is mounted can be turned to the left and right. For example, laser soldering may be performed by inserting a solder ball on the left side of the camera module, rotating the mount part, and inserting a solder ball on the right side of the camera module.

Soldering experiments were carried out using the soldering apparatus according to the present invention. In the experiment, the electrode of the camera module is a material coated with Ni on Cu (camera module housing) and soldered on a PCB, that is, an Au coated substrate on HTTC.

Because the camera module housing is made of metal and has a heat dissipation effect, it does not rise to the soldering temperature unless the laser irradiation is done properly. When irradiating a laser beam with a diameter of 300 micrometers onto a SnAg wire with a diameter of 200 micrometers, the heating effect in the housing is not sufficient. That is, the required temperature of HTTC and SnAg wire of 160 ° C can be achieved, but only the heating effect of about 80 ° C which is lower than the required temperature of Cu of 160 ° C is shown.

On the other hand, when irradiating a laser beam with a diameter of 300 micrometers onto the electrode and irradiating the copper laser beam onto a SnAg wire having a diameter of 200 micrometers, the camera module housing, HTTC and SnAg are simultaneously heated to obtain a uniform temperature distribution . That is, HTTC, SnAg wire, and Cu both achieve the required temperature of 160 degrees.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

Claims

A soldering apparatus for a camera module,
A laser module for irradiating the soldering ball with a laser beam,
A vision system for detecting the camera module and the substrate through the imaging device,
A stage for supporting and aligning the camera module and the substrate,
A laser module, a vision system, and a controller electrically connected to and controlling the stage,
And a soldering portion for the camera module.