CN111992833B - Laser tin soldering method for preset tin - Google Patents
Laser tin soldering method for preset tin Download PDFInfo
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- CN111992833B CN111992833B CN202010671052.7A CN202010671052A CN111992833B CN 111992833 B CN111992833 B CN 111992833B CN 202010671052 A CN202010671052 A CN 202010671052A CN 111992833 B CN111992833 B CN 111992833B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a laser soldering method and a laser soldering device for presetting tin, wherein firstly, a tin ball is melted by laser to the surface of a base material to be soldered to form a tin cladding; the tin cladding is then melted using a laser and the wire to be soldered is embedded in the tin cladding. The method is simple and convenient to use, and utilizes the characteristics of stable average power, high heat energy conversion efficiency, uniform energy distribution and the like of a continuous laser, the soldering form of laser non-contact surface heat release and the concentrated and stable release of energy are fast, so that the working efficiency is better improved, meanwhile, the non-contact irradiation is carried out, the base material and the electronic component are undoubtedly not physically deformed, the quality of the component is greatly improved, and the damage and the deformation of the material are avoided.
Description
Technical Field
The invention relates to a laser soldering method and device, belongs to the technical field of soldering of 5G connectors, and particularly discloses a laser soldering method and device for presetting tin.
Background
Laser is widely applied to modern soldering as a heat source, the laser soldering is suitable for soldering of network connectors, soldering of tiny connectors and thin lines, and is widely applied to electronic and automobile industries, such as manufacturing work of PCB (printed circuit board) boards, FPCB (flexible printed circuit board), connecting terminals, sensors and the like, the laser soldering is used as a combination of modern science and technology and traditional technology, and has unique characteristics compared with the traditional technology of soldering iron, reflow soldering and Haba soldering, and the application field and the application level of the laser soldering are very wide, so that the soldering efficiency and the soldering quality can be greatly improved. The non-contact type surface heat-releasing soldering form and the energy are concentrated and stably released quickly, so that the working efficiency is better improved, meanwhile, the non-contact type irradiation does not cause physical deformation of the base material and the electronic component undoubtedly, the quality of the device is greatly improved, and the damage and the deformation of the material are avoided. The appearance of the laser soldering technology realizes the field which cannot be applied by the traditional soldering technology, particularly the soldering of a network connector on 5G communication, dense components and parts, irregular shape layout welding point positions and ultrahigh transmission efficiency requirements of the network connector, which all challenge the traditional soldering mode and cannot meet the requirements, and the laser soldering is characterized in that laser is used as a heating source, so that the random change within a 360-degree range can be realized according to the running track of the light speed per se, and the laser soldering technology is undoubtedly an unthinkable advantage under the development of the traditional soldering technology. In addition, because the laser soldering can release stable heat within a fixed time, a soldered product can be very stable, the consistency is good, the yield is high, and a large amount of heat can be released in a short time, so the laser soldering can be quickly soldered, the requirement on the environment is lower, the soldering can be carried out under the condition of common room temperature without special conditions, the laser soldering is one of the processing methods in the soldering field at present, along with the comprehensive development of technology, the continuous consolidation and application of the laser soldering technology, the upgrading of the product driven by a new process, and the display and application of more technologies, the development of the laser soldering is carried out for more than ten years, people search for the laser wire feeding, the laser ball-spraying welding, the laser paste welding and other laser soldering modes from the initial understanding of the technology to the large-scale application at present, however, in the existing soldering processes, the soldering between the connecting head of the network data wire in the soldering field of the 5G connector and the wire rod has certain problems, the welding pad and the wire are fixed by the carrier firstly, the welding pad and the wire are welded by adding the welding material and irradiating the welding pad by the laser, the tin material and the wire are welded, so that the tin amount is easily wrapped unevenly, and small holes appear in the tin, so that the impedance is large.
Disclosure of Invention
The invention provides a laser soldering device and a process method for presetting tin, which are used for solving the problems of low transmission efficiency and low transmission speed of a connector of a 5G network data line, substandard quality and the like in the background technology, the invention adopts laser as a heat source, adopts a step-by-step and twice laser irradiation soldering mode, utilizes the surface of a pad substrate to place soldering paste and solder balls of solder materials, utilizes the energy heat of the laser to melt the solder materials by controlling the energy and time of the laser and the movement track to form preheating, melting and heat preservation three stages, melts the melted tin materials on the surface of a pad to be processed, fixes the wire rod to be soldered to the surface of the pad by a jig, utilizes the energy heat of the laser to melt the tin by controlling the energy and time of the laser and the movement track to form melting and heat preservation two stages, leads the wire rod to sink under the action of the jig, and wraps the wire rod by the tin, and (4) completing soldering.
The invention relates to a laser soldering method for presetting tin, which comprises the steps of firstly melting a tin ball by laser to the surface of a base material to be soldered to form a tin cladding; the tin cladding is then melted using a laser and the wire to be soldered is embedded in the tin cladding.
In a preferred embodiment of the invention, the surface of the substrate to be welded is provided with a flux paste.
In a preferred embodiment of the present invention, the flux paste is dispensed onto the pad locations on the surface of the substrate to be soldered using a dispenser.
In a preferred embodiment of the invention, firstly, the solder balls on the surface of the base material to be welded are processed by three times by using a continuous laser, a vibrating mirror and a field lens, and are melted on the surface of the base material to be welded to form a tin cladding; secondly, a tin cladding on the surface of the base material to be welded is processed twice by utilizing a continuous laser matched with a vibrating mirror and a field lens, so that the wire to be welded is embedded into the tin cladding.
In a preferred embodiment of the invention, when the solder ball on the surface of the substrate to be welded is processed for the first time, the parameters of the continuous laser are set to be that the laser power is 7-30W, the speed is 1500-; when the tin ball on the surface of the base material to be welded is processed for the second time, the parameters of the continuous laser are set to be 20-50W of laser power, 1000-2000 mm per second of speed and 5-20 times of times; and when the solder ball on the surface of the base material to be welded is processed for the third time, the parameters of the continuous laser are set to be 20-40W of laser power, 1500-2500 mm per second and 5-10 times.
In a preferred embodiment of the invention, when the tin cladding on the surface of the base material to be welded is processed for the first time, the parameters of the continuous laser are set, the laser power is 30-50W, the speed is 1500-; when the tin cladding on the surface of the base material to be welded is processed for the second time, the parameters of the continuous laser are set, the laser power is 10-30W, the speed is 1000-3000 mm per second, and the times are 5-10.
In a preferred embodiment of the invention, the wavelength of the continuous laser is 1060-1070 nanoseconds, the average power is 50-120 watts, the beam mass M2 factor is less than or equal to 1.2, the output spot size is 6-9 mm, the output spot beam ellipticity is greater than 90%, the beam divergence angle is less than 0.5 mrad, the clear aperture of the galvanometer is 10 mm, the moving speed of the galvanometer is 0-7000 mm, and the focal length of the field lens is 163-255 mm.
In a preferred embodiment of the invention, the terminal PCB is used for 5G network connection of the terminal PCB and the soldering of the data line head.
The invention also discloses a laser soldering device with preset tin, which comprises a dispensing unit for adding the soldering paste to the surface of the base material to be soldered, a laser soldering machine for melting the tin material on the surface of the base material to be soldered and a clamp for positioning the base material to be soldered.
In a preferred embodiment of the present invention, the dispensing unit includes a three-axis moving platform and a paste discharge syringe disposed at a moving end of the three-axis moving platform; the laser soldering unit comprises a continuous laser, a lifting platform and an XY-axis working platform; the fixture comprises a lower support plate, a middle positioning plate and an upper cover plate, wherein the lower support plate is provided with a positioning taper pin, the middle positioning plate is provided with a positioning taper hole, and the upper cover plate is provided with a line pressing claw.
The invention has the beneficial effects that: the method is simple and convenient to use, and utilizes the characteristics of stable average power, high heat energy conversion efficiency, uniform energy distribution and the like of a continuous laser, the soldering form of laser non-contact surface heat release and the concentrated and stable release of energy are fast, so that the working efficiency is better improved, meanwhile, the non-contact irradiation is carried out, the base material and the electronic component are undoubtedly not physically deformed, the quality of the component is greatly improved, and the damage and the deformation of the material are avoided. The welding mode of twice laser soldering adopts a step-by-step twice laser irradiation soldering mode, a soldering flux paste and a soldering material tin ball are placed on the surface of a pad substrate, the energy heat of laser is utilized to melt the soldering material in three stages of preheating, melting and heat preservation by controlling the energy and time of the laser and the movement track, so that the melted tin material is melted on the surface of a pad to be processed, a wire to be soldered is fixed to the surface of the pad through a jig, the position to be soldered of the wire is pre-tinned, the energy heat of the laser is utilized again to melt the tin in two stages of melting and heat preservation by controlling the energy and time of the laser and the movement track, the wire is enabled to sink under the action of the jig, and the tin wraps the wire to complete the soldering. Compared with other laser soldering processes in the soldering of the connector of the 5G network data line, the process avoids the problems that a solder wire is unstable and is limited by a jig during the laser wire feeding soldering, the solder wire is thermally conducted to a terminal board pad by the solder wire, uneven heating is easy to cause, and insufficient soldering is generated, the problem that a liquid solder ball is connected between a wire and the pad during the laser ball-spraying soldering, the wire and the pad have a gap, a cavity is formed in tin, the problems that tin explosion and fine cavities are generated during the volatilization process of a soldering flux in the laser solder paste soldering, and the efficiency is low when the tin explosion is not generated in the solder paste soldering is avoided. The laser soldering device and the process method for presetting tin well solve the problems, the laser soldering process of tin is preset for the first time, soldering flux is added on the surface of a bonding pad, the soldering flux amount is accurately controlled, the weight of the solder ball is accurately controlled, the laser irradiation mode is accurately controlled, the energy of laser heating is accurately controlled, the tin is fully melted, the bonding pad is firmly connected, the wire rod with the preset tin is used for soldering with the tin material on the bonding pad, the irradiation modes of two times are on the same material tin material, the gap and the cavity which are generated due to the inconsistent heating of the material are avoided, the contact area and the wrapping area of the tin and the wire rod are greatly improved, the heating is consistent, the quality of the tin material is also consistent, the impedance of the tin material at the soldering joint is greatly reduced, the transmission efficiency and the transmission speed of the tin soldering device are improved, and the process problem of soldering at the tin position of a 5G network data line connector is well solved, the yield is high, the process method is suitable for automatic soldering, and the problem of soldering of a connector which needs ultrahigh transmission efficiency in a tiny device is solved.
Drawings
FIG. 1 is a schematic view of an exploded structure of a dispenser mechanism for dispensing a flux paste;
FIG. 2 is an exploded view of a laser soldering machine;
FIG. 3 is a schematic diagram of a simple optical path of a laser soldering machine;
FIG. 4 is a schematic structural view of a carrier plate of the fixture;
FIG. 5 is a schematic mechanical view of a terminal-mounted PCB clamp;
fig. 6 is a simple schematic diagram of the cover plate 1;
FIG. 7 is a schematic diagram of a simple structure of a PCB board with solder terminals;
FIG. 8 is a track diagram of a welding layer of soldering with preset solder balls, a superposed shape of laser spot focusing light spots and a soldering sequence diagram;
fig. 9 is a simple schematic diagram of the cover plate 2;
FIG. 10 is a schematic view of a wire to be soldered;
fig. 11 is a schematic view of a simple structure of a wire to be soldered;
FIG. 12 is a schematic view of a simple assembly of a PCB board and a wire to be soldered;
fig. 13 is a diagram of a trace of a Printed Circuit Board (PCB) of a soldering terminal and a wire to be soldered, a diagram of a shape of a focused light spot of a laser spot and a soldering sequence;
in the figure: 1-dispensing a paste syringe of a dispenser for dispensing a paste flux; 2-a dispenser parameter controller; 3-Y axis moving stage; 4-X axis motion stage; 5-Z axis mobile station; 6-soldering the whole machine; 7-a continuous fiber laser; 8-a vibrating lens; 9-a lifting platform; 10-field lens; 11-X.Y axis working platform of tin soldering machine; 12-focused laser spots; 13-a clamp carrier plate; 14-terminal PCB board clamp; 15-a solder ball added cover plate 1; 16-terminal board PCB board; 17-soldering pattern layer trace diagram of tin ball soldering; 18-shape diagram of superposition of laser spot focusing light spots of tin ball soldering; 19-a wire bond cover plate; 20-line pressing claws; 21-a wire to be welded; a 22-soldering terminal PCB and a soldering layer trace diagram of a wire to be soldered; 23-laser spot focusing spot superposition of soldering wire.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The laser soldering method for presetting tin is characterized in that: firstly, melting the solder balls by laser to the surface of a base material to be welded to form a tin cladding; the tin cladding is then melted using a laser and the wire to be soldered is embedded in the tin cladding.
Preferably, the surface of the substrate to be welded is provided with a flux paste.
Preferably, the paste flux is dispensed to the pad position of the surface of the substrate to be welded by a dispenser.
Preferably, firstly, a solder ball on the surface of the base material to be welded is processed by a continuous laser, a vibrating mirror and a field lens for three times, and the solder ball is melted on the surface of the base material to be welded to form a tin cladding; secondly, a tin cladding on the surface of the base material to be welded is processed twice by utilizing a continuous laser to cooperate with a galvanometer and a field lens, so that the wire to be welded is embedded into the tin cladding.
Preferably, when the solder ball on the surface of the base material to be welded is processed for the first time, the parameters of the continuous laser are set to be 7-30W of laser power, 1500-3000 mm per second of speed and 3-8 times; when the tin ball on the surface of the base material to be welded is processed for the second time, the parameters of the continuous laser are set to be 20-50W of laser power, 1000-2000 mm per second of speed and 5-20 times of times; and when the solder ball on the surface of the base material to be welded is processed for the third time, the parameters of the continuous laser are set to be 20-40W of laser power, 1500-2500 mm per second and 5-10 times. Preferably, when the tin cladding on the surface of the base material to be welded is processed for the first time, the parameters of the continuous laser are set, the laser power is 30-50W, the speed is 1500-; when the tin cladding on the surface of the base material to be welded is processed for the second time, the parameters of the continuous laser are set, the laser power is 10-30W, the speed is 1000-3000 mm per second, and the times are 5-10.
Preferably, the wavelength of the continuous laser is 1060-1070 nanoseconds, the average power is 50-120 watts, the beam quality M2 factor is less than or equal to 1.2, the output spot size is 6-9 mm, the output spot beam ellipticity is greater than 90%, the beam divergence angle is less than 0.5 mrad, the clear aperture of the galvanometer is 10 mm, the moving speed of the galvanometer is 0-7000 mm, and the focal length of the field lens is 163-255 mm.
Preferably, the terminal PCB is used for soldering a terminal PCB board of a 5G network connection data wire and a data wire end.
The invention also discloses a laser soldering device with preset tin, which comprises a dispensing unit for adding soldering flux to the surface of the base material to be soldered, a laser soldering unit for melting the tin material on the surface of the base material to be soldered and a clamp for positioning the base material to be soldered, wherein the dispensing unit can adopt a dispenser, the laser soldering unit can adopt a laser soldering machine, and the dispensing unit comprises a three-axis moving platform and a paste outlet needle cylinder arranged at the moving end of the three-axis moving platform; the laser soldering unit comprises a continuous laser, a lifting platform and an XY-axis working platform; the clamp unit comprises a lower support plate, a middle positioning plate and an upper cover plate, wherein the lower support plate is provided with a positioning taper pin, the middle positioning plate is provided with a positioning taper hole, and the upper cover plate is provided with a wire pressing claw.
When the specific processing object of the invention is the soldering of a terminal PCB board of a 5G network connection data line and a data line end, the specific operation steps are as follows:
firstly, a dispensing device is installed and debugged, a device mechanism is shown in figure 1, the dispensing device controls the weight of soldering paste by adjusting the pressure and time of air pressure controlled by parameters, the soldering paste can be spotted on each pad position on a motion track control terminal board, an optical system of a soldering device is installed and debugged, the device mechanism is shown in figure 2, light spots emitted by a laser 1 pass through a vibrating mirror 2, the vibrating mirror 2 controls the motion track of the light spots and is focused into a circular light spot 7 with the diameter of 0.07 mm through a field lens 4, the ellipticity of the light spots at the laser focus is more than 95 percent and is basically circular, and the following steps are carried out:
the first step is as follows: and placing the terminal board to be soldered on a terminal board clamp, fixing the terminal board through a cover plate on the clamp, and exposing a substrate copper sheet pad of the terminal board to be soldered.
The second step is that: the clamp provided with the terminal board is placed on the carrier board, the carrier is installed on the two-position platform, the carrier is fixed, and the two-dimensional platform drives the carrier to the position of the spot flux paste.
The third step: and adjusting the parameters of the dispensing machine, controlling the weight of the point soldering paste, and dispensing the soldering paste at all positions of the copper sheet bonding pads of the substrate to be soldered.
The fourth step: and taking down the fixture with the terminal board and the solder paste.
The fifth step: and the solder balls are manually placed, so that each solder ball is placed on the surface of the copper sheet pad of the substrate with the soldering paste.
And a sixth step: and mounting the clamp with the solder balls on a carrier plate, placing the carrier plate on a two-position platform of a laser soldering machine, and moving the two-position platform to a laser soldering position.
The seventh step: the lifting platform is adjusted to enable the focus of the laser to reach a specific position, sufficient power density is kept, and the position with the best tin melting effect and the fastest efficiency can be promoted.
Eighth step: and editing a soldering graph on the software, wherein the soldering graph is edited according to the shape of the pad.
The ninth step: and setting the laser power, speed and times of laser emission of the laser. And editing the graphs according to the shapes of the bonding pads, wherein 3 same graphs are edited, each graph is provided with a different layer, and different layers are provided with different laser powers, speeds and times.
The tenth step: and adjusting the position of a soldering point, keeping the X axis and the Y axis of the two-dimensional platform static, driving laser to move by the movement of the X axis and the Y axis of the galvanometer, gathering the laser on the surface of the copper sheet bonding pad of the substrate, and setting the soldering sequence.
The eleventh step: and controlling laser light to irradiate on the tin ball so that the tin is melted on the copper sheet bonding pad of the substrate.
The twelfth step: and if the two sides of the terminal board need to be soldered, taking down the terminal board, overturning and placing, repeating the first step, the second step, the third step, the fourth step, the fifth step, the sixth step, the seventh step, the eighth step, the ninth step, the tenth step and the tenth step, and ensuring that the two sides are all soldered.
The thirteenth step: and taking down the terminal board carrier on which tin is pre-loaded on a two-position platform on the tin soldering machine, taking down the cover plate, mounting the data wire to be soldered on the cover plate with the pressing claw on the terminal board carrier, wherein each wire corresponds to the copper sheet welding disc of the substrate.
The fourteenth step is that: and mounting a carrier for mounting the data line to be soldered and the soldering pad on a two-position platform of a soldering machine, and moving the carrier to the laser soldering position.
The fifteenth step: the lifting platform is adjusted to enable the focus of the laser to reach a specific position, sufficient power density is kept, and the position with the best tin melting effect and the fastest efficiency can be promoted.
Sixteenth, step: and editing a soldering graph on software, wherein the soldering graph is edited according to the shape of the bonding pad.
Seventeenth step: and setting the laser power, speed and times of laser emission of the laser. And editing the graph according to the shape of the bonding pad, setting different layers, and setting different laser powers, speeds and times for the different layers.
And eighteenth step: the position of a welding spot is adjusted, the X axis and the Y axis of the two-dimensional platform are kept static, laser with specific energy moves through the X axis and the Y axis of the galvanometer to drive the laser to move, and the tin soldering sequence is set on the surface of tin focused through the field lens.
The nineteenth step: and controlling laser light to irradiate on the tin and the data wire to be soldered, after the tin is melted, pressing the wire under the action of a claw force, cooling the tin, and then wrapping the wire rod to finish tin soldering.
The twentieth step: and if the two sides of the terminal board are required to be soldered, turning over the terminal board and the data wire to be soldered, and repeating the thirteenth step, the fourteenth step, the fifteenth step, the sixteenth step, the seventeenth step, the eighteenth step and the nineteenth step to finish soldering.
The invention adopts the dispenser to dispense the soldering paste, controls the weight of the soldering paste, ensures that the soldering paste can be melted into liquid to cover all the bonding pads in the process of preliminary heating by laser, cleans the bonding pads of the copper oxide substrate, removes oxides and fully promotes the tin material to melt the surfaces of the bonding pads to be processed. The solder balls are manually placed, the size of each solder ball is determined according to the size of a pad of a terminal board substrate to be soldered, and the tin quantity of each solder ball can be ensured to be enough to cover the pads of the terminal boards and wrap wires. The laser parameters of the continuous laser are 1060-1070 nanoseconds, the average power is 50-120 watts, the beam quality M2 factor is less than or equal to 1.2, the laser is a continuous laser, the frequency and the pulse width cannot be set, and the output spot size of the laser is 6-9 millimeters. The ellipticity of output light spot light beam is more than 90%, the divergence angle of the light beam is less than 0.5 milliradian, the laser has no peak power, the average power is very stable, the heat energy conversion efficiency is high, the energy distribution is uniform, the light spot from the laser device moves through the optical path of the vibrating mirror, the aperture of the light passing aperture of the vibrating mirror 2 is 10 mm, the laser with the reflection wavelength of 1064 nanoseconds is reflected, the moving speed of the vibrating mirror is 0-7000 mm/s adjustable, after the focusing of the field mirror, the area to be soldered is soldered, the continuous laser device sets parameters according to the specific image layers, the laser power is 7-30W set by the first image layer, the speed is 1500-3000 mm/s, the times are 3-8 times, the power is 20-50W set by the second image layer, the speed is 1000-2000 mm/s, the times are 5-20 times, the power is 20-40W set by the third image layer, the speed is 1500-2500 mm/s, the times are 5-10, the first layer parameters are used for promoting the flux paste to melt and cover the substrate bonding pad of the terminal board, and meanwhile, the temperature of the solder ball material is increased, so that the absorption rate of tin to laser is increased, the reflection of the material to the laser is effectively reduced, and the temperature of the material is promoted to be increased to more than 100 ℃. The parameter effect that the second picture layer set up is the tin ball that promotes to melt into, on the metal pad through liquid tin transmission energy simultaneously, promotes the butt fusion of pad and tin. The third layer is used for heat preservation and cooling of tin, the energy and time of the third layer are set to be forty percent of those of the second layer, the tin is ensured to be in a liquid state, the internal tin is promoted to be fully melted, the internal gas is fully volatilized, the tin is ensured to form solid tin without gaps, the tin balls are melted on the surface of a terminal bonding pad, the wire is manually loaded, a clamp is adopted to fix a claw, the wire can be fixed to be in the center of the bonding pad, certain downward pressure can be ensured to press the wire, about 3N pressure exists to press the wire, one end wire of a wire to be welded of a data wire adopts a wire which is pre-tinned, the pre-tinned length is the length needing tin soldering, laser soldering is driven by vibrating mirror movement again, and the continuous laser sets the parameters according to the specific layer. The first layer laser power is 30-50W, the speed is 1500-2500 mm/s, the times are 5-20 times, the second layer power is 10-30W, the speed is 1000-3000 mm/s, the times are 5-10 times, the first layer parameter is used for promoting the wire heating and the tin melting into liquid state, and the wire terminal and the tin are heated simultaneously, so that the heating between the wire terminal and the tin can be uniform. The second section is provided with parameters for promoting liquid tin, completely moistening the wire, having no gap and simultaneously playing a role in heat preservation.
Specifically, when 18 pads to be welded are arranged on a single surface of a terminal PCB as shown in fig. 7, the size of each pad is 0.4 mm in width and 2 mm in length, the distance between every two pads is 0.5 mm, 6 groups of wires with aluminum foils are arranged in a data line (as shown in fig. 10), each group of aluminum foil wires contains 3 wire connectors to be welded, wire ends are stripped, the diameter of each wire end is 0.2 mm, the length of each wire end pre-tinned is 1.5 mm, and after the optical path systems of a dispensing machine and a soldering welding machine are adjusted, the following steps are carried out:
the first step is as follows: the PCB board with the terminal to be soldered as shown in figure 7 is placed on the PCB board clamp with the terminal as shown in figure 5, the terminal board is fixed by the cover plate through the cover plate with the solder balls as shown in figure 6 on the carrier, and the copper sheet welding disc of the substrate of the terminal board to be soldered is exposed.
The second step is that: the fixture carrier plate shown in fig. 4 is installed on a Y-axis motion platform of the dispenser, the carrier provided with the terminal plate is placed on the fixture carrier plate shown in fig. 4, the carrier and a controller of the dispenser are fixed, and the Y-axis platform is controlled to drive the carrier to a position for dispensing the flux paste.
The third step: and adjusting the parameters of the dispensing machine, controlling the weight of the dispensing soldering paste to be 0.3 mg, controlling the motion of the motion platform by the dispensing machine controller, and dispensing the soldering paste in sequence when all the copper sheet pads of the substrate to be soldered move to the positions of the dispensing soldering paste in sequence.
The fourth step: and taking down the carrier which is provided with the terminal board and has the solder paste.
The fifth step: and (3) manually placing solder balls, ensuring that each solder ball is placed on the surface of the copper sheet pad of the substrate on which the soldering paste is dispensed, sequentially placing 18 solder balls, wherein the diameter of each solder ball is 0.5 mm, and each mass error of each solder ball is not more than 0.1 mg.
And a sixth step: the fixture carrier plate shown in figure 4 is arranged on a power conveying platform 11 of a soldering machine shown in figure 2, a carrier terminal board with the placed solder balls is arranged on the fixture carrier plate, and a two-position platform is moved to the position below a laser soldering galvanometer.
The seventh step: the laser focus is adjusted to a specific position by adjusting the lifting platform, the position 15 mm above the focus keeps enough power density, the position with the best tin melting effect and the fastest efficiency can be promoted, when a light spot walks along a rectangular track 17 shown in fig. 8, a rectangular light spot 18 is formed under the rapid operation of the galvanometer, and the size of the light spot is 0.35 mm in width and 1.8 mm in length.
Eighth step: and editing a soldering graph on the software, wherein the soldering graph is rectangular according to the shape of the bonding pad.
The ninth step: and setting the laser power, speed and times of laser emission of the laser. 3 same rectangles are edited by a single bonding pad, different layers are arranged on each graph, different laser power, speed and times are arranged on different layers, the laser power 28W is arranged on the first layer, the speed is 2100 mm per second, the times are 6, the power 45W is arranged on the second layer, the speed is 1600 mm per second, the times are 14, the power 30W is arranged on the third layer, the speed is 2000 mm per second, the times are 8, 18 bonding pads are arranged on a terminal PCB, and 18 welding patterns of the single bonding pad are copied and displayed.
The tenth step: adjusting the positions of soldering points, adjusting the positions of 18 welding patterns, ensuring that the laser of each soldering pattern is struck on a pad and does not exceed the pad, keeping a two-dimensional platform X and a Y axis static, driving the laser to move by the movement of the X axis and the Y axis of a galvanometer, and gathering the laser on the surface of the pad of the copper sheet of the substrate, wherein the soldering sequence is as shown in a1 below in figure 8; d 1; g 1; j 1; m 1; p 1; b 1; e 1; h 1; k 1; n 1; q 1; c 1; f 1; i 1; l 1; o 1; r 1.
The eleventh step: and controlling laser light to irradiate on the tin ball so that the tin is melted on the copper sheet bonding pad of the substrate.
The twelfth step: the product is soldered by a single-side soldering pad, if two sides of the terminal board need to be soldered, the terminal board needs to be taken down, turned over and placed, and the first step, the second step, the third step, the fourth step, the fifth step, the sixth step, the seventh step, the eighth step, the ninth step, the tenth step and the tenth step are repeated, so that the two sides are guaranteed to be soldered.
The thirteenth step: taking down the terminal board carrier shown in figure 5 with tin pre-loaded on the carrier board of the soldering machine, taking down the upper tin ball cover plate 1 shown in figure 6, installing a data wire to be soldered on the terminal board carrier shown in figure 10, installing the cover plate 2 with a lower pressing claw shown in figure 9 on the terminal board carrier, wherein each wire corresponds to a fixing claw of a copper sheet pad of a substrate, the wire can be fixed to be positioned in the center of the pad, the wire is pressed by about 4N pressure, one end wire of the wire to be welded of the data wire adopts the wire with tin pre-loaded, the length of the tin pre-loading is 1.5 mm, and one wire is arranged on each pad.
The fourteenth step is that: and mounting a carrier for mounting the data line to be soldered and the soldering pad on a clamp carrier plate shown in figure 4, and moving a two-position platform to the position below the laser soldering galvanometer.
The fifteenth step: the laser focus is adjusted to a specific position by adjusting the lifting platform, enough power density is kept at a position 5 mm above the focus, the position with the highest tin melting effect and the highest efficiency can be promoted, when a light spot walks along a rectangular track 22 shown in fig. 13, a rectangular light spot 23 is formed under the quick operation of the galvanometer, and the light spot is 0.3 mm wide and 1.6 mm long.
Sixteenth, step: and editing a soldering graph on software, wherein the soldering graph is rectangular according to the shape of the bonding pad.
Seventeenth step: and setting the laser power, speed and times of laser emission of the laser. According to the method, different layers are set according to the shape editing graph of a bonding pad, different laser power, speed and frequency are set for the different layers, 2 same graphs are edited, different layers are set for each graph, different laser power, different laser speed and different frequency are set for the different layers, the laser power of a first layer is 48W, the speed is 1600 mm per second, the frequency is 16, the power of a second layer is 28W, the speed is 2000 mm per second, the frequency is 8, 18 bonding pads are arranged on a terminal PCB, and the welding graphs of the single bonding pad are copied and displayed for 18.
And eighteenth step: adjusting the positions of soldering points, adjusting the positions of 18 welding patterns, ensuring that the laser of each soldering pattern is struck on a pad and does not exceed the pad, keeping a two-dimensional platform X and a Y axis static, driving the laser to move by the movement of the X axis and the Y axis of a galvanometer, and gathering the laser on the surface of the pad of the copper sheet of the substrate, wherein the soldering sequence is as shown in the following a2 in the figure 8; d 2; g 2; j 2; m 2; p 2; b 2; e 2; h 2; k 2; n 2; q 2; c 2; f 2; i 2; l 2; o 2; r 2.
The nineteenth step: and controlling laser light to irradiate on the tin and the data wire to be soldered, after the tin is melted, pressing the wire under the action of a claw force, cooling the tin, and then wrapping the wire rod to finish tin soldering.
The twentieth step: and if both sides of the product need to be soldered, the terminal board and the data wire to be soldered are turned over, and the tenth step, the fourteenth step, the fifteenth step, the sixteenth step, the seventeenth step, the eighteenth step and the nineteenth step are repeated to finish soldering.
It should be understood that the above are only specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily made by those skilled in the art within the technical scope of the present invention disclosed herein should be covered within the scope of the present invention.
Claims (2)
1. A laser soldering method of preset tin is characterized in that: the device is used for soldering a terminal PCB (printed Circuit Board) of a 5G network connection data line and a data line end, and adopts a laser soldering device with preset tin, and the device comprises a dispensing unit for adding soldering flux to the surface of a base material to be soldered, a laser soldering unit for melting tin on the surface of the base material to be soldered and a clamp unit for positioning the base material to be soldered; the specific operation steps are as follows:
the first step is as follows: placing the terminal board to be soldered on a terminal board clamp, fixing the terminal board through a cover plate on the clamp, and exposing a substrate copper sheet pad of the terminal board to be soldered;
the second step is that: placing the clamp provided with the terminal board on a carrier board, mounting the carrier on a two-dimensional platform, fixing the carrier, and driving the carrier to a position for dispensing the soldering paste by the two-dimensional platform;
the third step: adjusting the parameters of the dispensing machine, controlling the weight of the point soldering paste, and dispensing the soldering paste at all positions of the copper sheet bonding pads of the substrate to be soldered;
the fourth step: taking down the fixture which is provided with the terminal board and provided with the solder paste;
the fifth step: manually placing the solder balls to ensure that each solder ball is placed on the surface of the copper sheet pad of the substrate with the soldering paste;
and a sixth step: mounting the fixture with the solder balls on a carrier plate, placing the carrier plate on a two-dimensional platform of a laser soldering machine, and moving the two-dimensional platform to a laser soldering position;
the seventh step: the lifting platform is adjusted to enable the focus of the laser to reach a specific position, and sufficient power density is kept, so that the position with the best tin melting effect and the fastest efficiency can be promoted;
eighth step: editing a soldering graph on software, and editing the graph according to the shape of the pad by using the soldering graph;
the ninth step: setting the laser power, speed and times of laser emission of a laser; editing graphs according to the shape of the bonding pad, editing 3 same graphs, setting different layers for each graph, and setting different laser powers, speeds and times for the different layers; wherein, the laser power of the first layer is 7-30W, the speed is 1500-, the energy and time of the tin heat preservation and cooling device are set to be forty percent of the parameters of the second layer, so that the tin is ensured to be in a liquid state, the full melting of the internal tin is promoted, the internal gas is fully volatilized, and the formation of solid tin without gaps is ensured;
the tenth step: adjusting the position of a soldering point, keeping the X axis and the Y axis of the two-dimensional platform static, driving laser with specific energy to move through the X axis and the Y axis of a galvanometer, gathering the laser on the surface of a copper sheet bonding pad of the substrate, and setting the soldering sequence;
the eleventh step: controlling laser light to irradiate on the tin ball, so that the tin is melted on the copper sheet bonding pad of the substrate;
the twelfth step: if the two sides of the terminal board need to be soldered, taking down the terminal board, turning over and placing, repeating the first step, the second step, the third step, the fourth step, the fifth step, the sixth step, the seventh step, the eighth step, the ninth step, the tenth step and the tenth step, and ensuring that the two sides are all soldered;
the thirteenth step: taking down a terminal board carrier pre-loaded with tin on a two-dimensional platform on a soldering machine, taking down a cover plate, installing data lines to be soldered on the terminal board carrier, installing the cover plate with a pressing claw on the terminal board carrier, and fixing a wire rod in the center of a bonding pad by each line corresponding to a copper sheet bonding pad of a substrate;
the fourteenth step is that: mounting a carrier for mounting a data line to be soldered and a soldering pad on a two-dimensional platform of a soldering machine, and moving the carrier to a laser soldering position;
the fifteenth step: the lifting platform is adjusted to enable the focus of the laser to reach a specific position, and sufficient power density is kept, so that the position with the best tin melting effect and the fastest efficiency can be promoted;
sixteenth, step: editing a soldering graph on software, wherein the soldering graph is an edited graph according to the shape of the bonding pad;
seventeenth step: setting the laser power, speed and times of laser emission of a laser; editing 2 same graphs according to the shape of the bonding pad, wherein each graph is provided with a different layer, and the different layers are provided with different laser powers, speeds and times; wherein, the first layer laser power is 30-50W, the speed is 1500-;
and eighteenth step: adjusting the position of a welding spot, keeping an X axis and a Y axis of the two-dimensional platform static, driving laser with specific energy to move through the X axis and the Y axis of a galvanometer, focusing the laser on the surface of tin through a field lens, and setting the soldering sequence of the tin;
the nineteenth step: controlling laser light to irradiate on the tin and a data wire to be soldered, after the tin is melted, pressing the wire under the action of claw force, cooling the tin and then wrapping the wire rod to finish tin soldering;
the twentieth step: and if the two sides of the terminal board are required to be soldered, turning over the terminal board and the data wire to be soldered, and repeating the thirteenth step, the fourteenth step, the fifteenth step, the sixteenth step, the seventeenth step, the eighteenth step and the nineteenth step to finish soldering.
2. The laser soldering method of preplaced tin according to claim 1, characterized in that: the dispensing unit comprises a three-axis moving platform and a paste outlet needle cylinder arranged at the moving end of the three-axis moving platform; the laser soldering unit comprises a continuous laser, a lifting platform and an XY-axis working platform; the clamp unit comprises a lower support plate, a middle positioning plate and an upper cover plate, wherein the lower support plate is provided with a positioning taper pin, the middle positioning plate is provided with a positioning taper hole, and the upper cover plate is provided with a line pressing claw.
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| CN112620861A (en) * | 2020-12-17 | 2021-04-09 | 珠海冠宇电池股份有限公司 | Method and device for welding battery liquid injection hole |
| CN113084290B (en) * | 2021-03-15 | 2023-04-28 | 武汉华工激光工程有限责任公司 | Laser soldering system and method |
| CN115922021A (en) * | 2021-08-12 | 2023-04-07 | 台达电子工业股份有限公司 | Automatic tin soldering system and automatic tin soldering method |
| CN113814509A (en) * | 2021-09-16 | 2021-12-21 | 武汉普思立激光科技有限公司 | Laser soldering device with tin preset |
| CN114749745B (en) * | 2022-04-28 | 2023-10-27 | 深圳市紫宸激光设备有限公司 | Automatic laser soldering method, device and system |
| CN115255547B (en) * | 2022-09-06 | 2023-07-21 | 重庆电子工程职业学院 | Positioning soldering equipment for electronic element of computer main board |
| CN115194282B (en) * | 2022-09-11 | 2022-11-29 | 苏州松德激光科技有限公司 | Intelligent quantitative laser soldering machine |
| CN115655832A (en) * | 2022-12-09 | 2023-01-31 | 华芯半导体研究院(北京)有限公司 | Compound semiconductor epitaxial wafer Hall sample preparation device |
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