KR20160002353A - 레이저 가공 장치 - Google Patents

레이저 가공 장치 Download PDF

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Publication number
KR20160002353A
KR20160002353A KR1020150085103A KR20150085103A KR20160002353A KR 20160002353 A KR20160002353 A KR 20160002353A KR 1020150085103 A KR1020150085103 A KR 1020150085103A KR 20150085103 A KR20150085103 A KR 20150085103A KR 20160002353 A KR20160002353 A KR 20160002353A
Authority
KR
South Korea
Prior art keywords
laser beam
objective lens
workpiece
contamination
condensing
Prior art date
Application number
KR1020150085103A
Other languages
English (en)
Korean (ko)
Inventor
마사루 나카무라
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160002353A publication Critical patent/KR20160002353A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K2203/50—
    • B23K2203/56—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020150085103A 2014-06-30 2015-06-16 레이저 가공 장치 KR20160002353A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014134023A JP2016010809A (ja) 2014-06-30 2014-06-30 レーザー加工装置
JPJP-P-2014-134023 2014-06-30

Publications (1)

Publication Number Publication Date
KR20160002353A true KR20160002353A (ko) 2016-01-07

Family

ID=55169012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150085103A KR20160002353A (ko) 2014-06-30 2015-06-16 레이저 가공 장치

Country Status (4)

Country Link
JP (1) JP2016010809A (ja)
KR (1) KR20160002353A (ja)
CN (1) CN105312777A (ja)
TW (1) TW201603928A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110612480A (zh) * 2017-05-12 2019-12-24 国际商业机器公司 超声波自清洁***
KR102079965B1 (ko) * 2018-09-06 2020-02-21 이용연 심 자동 추적 기능을 구비한 레이저 브레이징 용접 시스템
CN113245706A (zh) * 2020-01-28 2021-08-13 松下知识产权经营株式会社 激光加工方法、激光加工装置及其输出控制装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6423812B2 (ja) * 2016-02-29 2018-11-14 ファナック株式会社 反射光を抑制しつつレーザ加工を開始できるレーザ加工装置
JP6659654B2 (ja) 2017-11-24 2020-03-04 ファナック株式会社 レーザ加工前に外部光学系の異常を警告するレーザ加工装置
FR3085205B1 (fr) * 2018-08-22 2020-07-24 Livbag Sas Dispositif et methode de controle de verre de protection de soudeuse laser
CA3110302A1 (en) * 2018-10-05 2020-04-09 Alcon Inc. Occlusion sensing in ophthalmic laser probes
JP2020110823A (ja) * 2019-01-11 2020-07-27 株式会社ディスコ レーザー加工装置および集光レンズの確認方法
JP6648399B1 (ja) * 2019-03-29 2020-02-14 株式会社東京精密 レーザ加工装置、レーザ加工装置の収差調整方法、レーザ加工装置の収差制御方法、及びレーザ加工方法
JP7373950B2 (ja) * 2019-09-12 2023-11-06 株式会社ディスコ レーザー加工装置および保護ウィンドウ確認方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007069249A (ja) 2005-09-07 2007-03-22 Disco Abrasive Syst Ltd レーザー加工装置

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JPS6066227A (ja) * 1983-09-21 1985-04-16 Matsushita Electric Ind Co Ltd レ−ザ加工装置のレンズ汚れ検出装置
JPS60234788A (ja) * 1984-05-07 1985-11-21 Amada Co Ltd レ−ザ光軸調整方法
JPH03184684A (ja) * 1989-12-13 1991-08-12 Yamazaki Mazak Corp レーザ加工機における加工制御方法
JPH10156569A (ja) * 1996-11-25 1998-06-16 Nikon Corp レーザ加工装置
JP2000033487A (ja) * 1998-07-17 2000-02-02 Sony Corp レーザカッティング装置
JP2000283888A (ja) * 1999-03-29 2000-10-13 Nippon Steel Corp 加工用レーザ集光光学系の検査方法およびその装置
JP2002176240A (ja) * 2000-12-07 2002-06-21 Shibuya Kogyo Co Ltd ビアホール加工方法及びその装置
CN1265933C (zh) * 2001-03-23 2006-07-26 三菱电机株式会社 激光加工方法
ATE336708T1 (de) * 2001-11-09 2006-09-15 Trumpf Werkzeugmaschinen Gmbh Verfahren und vorrichtung zur erfassung von informationen für die überwachung einer laseranordnung
JP4348199B2 (ja) * 2004-01-16 2009-10-21 日立ビアメカニクス株式会社 レーザ加工方法およびレーザ加工装置
JP2005334924A (ja) * 2004-05-26 2005-12-08 Yamazaki Mazak Corp レーザ加工機における光路系ミラー・レンズ汚れ検出装置
JP2007307597A (ja) * 2006-05-19 2007-11-29 Disco Abrasive Syst Ltd レーザー加工装置
JP4490410B2 (ja) * 2006-11-28 2010-06-23 住友重機械工業株式会社 レーザ照射装置及びレーザ加工方法
CN100585363C (zh) * 2008-03-07 2010-01-27 沈阳航空工业学院 Co2激光器光路镜片温度检测及温差超限报警***
WO2010137475A1 (ja) * 2009-05-25 2010-12-02 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
JP5609458B2 (ja) * 2010-09-13 2014-10-22 トヨタ自動車株式会社 レーザ照射位置情報取得方法及びレーザの焦点合わせ方法
JP5851784B2 (ja) * 2011-09-28 2016-02-03 株式会社ディスコ 高さ位置検出装置およびレーザー加工機
JP2013094832A (ja) * 2011-11-02 2013-05-20 Disco Corp レーザー加工装置における光路確認方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007069249A (ja) 2005-09-07 2007-03-22 Disco Abrasive Syst Ltd レーザー加工装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110612480A (zh) * 2017-05-12 2019-12-24 国际商业机器公司 超声波自清洁***
CN110612480B (zh) * 2017-05-12 2022-01-28 国际商业机器公司 超声波自清洁***
KR102079965B1 (ko) * 2018-09-06 2020-02-21 이용연 심 자동 추적 기능을 구비한 레이저 브레이징 용접 시스템
CN113245706A (zh) * 2020-01-28 2021-08-13 松下知识产权经营株式会社 激光加工方法、激光加工装置及其输出控制装置

Also Published As

Publication number Publication date
JP2016010809A (ja) 2016-01-21
TW201603928A (zh) 2016-02-01
CN105312777A (zh) 2016-02-10

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