KR20140076942A - Epoxy resin composite and printed circuit board using the same - Google Patents
Epoxy resin composite and printed circuit board using the same Download PDFInfo
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- KR20140076942A KR20140076942A KR1020120145540A KR20120145540A KR20140076942A KR 20140076942 A KR20140076942 A KR 20140076942A KR 1020120145540 A KR1020120145540 A KR 1020120145540A KR 20120145540 A KR20120145540 A KR 20120145540A KR 20140076942 A KR20140076942 A KR 20140076942A
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- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Abstract
The epoxy resin composition according to one embodiment of the present invention comprises a crystalline epoxy compound of the following formula, an amorphous epoxy compound, a curing agent, and an inorganic filler, wherein the epoxy compound of Formula 1 is an epoxy compound of Formula 1, 40 parts by weight or more of the sum of the qualitative epoxy compounds.
[Chemical Formula]
Wherein R 1 to R 6 may each be selected from the group consisting of H, Cl, Br, F, C 1 -C 3 alkyl, C 1 -C 3 alkene, C 1 -C 3 alkyne, 2 or 3.
Description
The present invention relates to an epoxy resin composition, and more particularly, to a printed circuit board comprising an epoxy resin composition and an insulating layer formed therefrom.
The printed circuit board includes a circuit pattern formed on the insulating layer, and various electronic components can be mounted on the printed circuit board.
The electronic component mounted on the printed circuit board may be, for example, a heating element. The heat emitted by the heating element can degrade the performance of the printed circuit board. As electronic components become more highly integrated and have higher capacity, heat dissipation problems of printed circuit boards are becoming more and more important.
An epoxy resin composition containing an epoxy resin such as bisphenol A type or bisphenol F type is used in order to obtain an insulating layer which is electrically insulating and has excellent thermal conductivity. The bisphenol A type or bisphenol F type has a low viscosity and allows high packing density of the inorganic filler, but has a problem of insufficient heat resistance, hardenability, mechanical strength and toughness.
Accordingly, an epoxy resin composition comprising a crystalline epoxy compound containing a mesogen structure, a novolac resin and an inorganic filler has been used (Korean Patent Publication No. 2012-0068949). Such an epoxy resin composition is excellent in storage stability and curability before curing, but has limitations in obtaining a desired level of heat resistance and thermal conductivity.
Disclosure of Invention Technical Problem [8] The present invention provides an epoxy resin composition and a printed circuit board using the same.
The epoxy resin composition according to an embodiment of the present invention comprises a crystalline epoxy compound of the following formula (1), an amorphous epoxy compound, a curing agent, and an inorganic filler, wherein the epoxy compound of the formula (1) At least 40 parts by weight of the sum of amorphous epoxy compounds.
[Chemical Formula 1]
Wherein R 1 to R 6 may each be selected from the group consisting of H, Cl, Br, F, C 1 -C 3 alkyl, C 1 -C 3 alkene, C 1 -C 3 alkyne, 2 or 3.
The crystalline epoxy compound may be an epoxy compound of the following formula (2).
(2)
The amorphous epoxy compound may be at least one selected from the group consisting of bisphenol A, bisphenol F, hydroquinone, azomethine, and mixtures thereof.
The diameter of the particles of the inorganic filler may be 0.3 탆 to 60 탆.
The epoxy compound of Formula 1 and the amorphous epoxy compound are contained in an amount of 3 to 40 parts by weight based on the total epoxy resin composition and the curing agent is contained in an amount of 0.5 to 30 parts by weight with respect to the total epoxy resin composition, The filler may include 30 to 99 parts by weight of the entire epoxy resin composition.
A printed circuit board according to an embodiment of the present invention includes a metal plate, an insulating layer formed on the metal plate, and a circuit pattern formed on the insulating layer, Based resin composition.
According to the embodiment of the present invention, an epoxy resin composition having high thermal conductivity can be obtained. By using this, an insulating layer having high thermal conductivity can be obtained, and reliability and heat radiation performance of a printed circuit board can be improved.
1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.
The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
The terms including ordinal, such as second, first, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.
In the present specification, wt% can be replaced by parts by weight.
According to one embodiment of the present invention, there is provided an epoxy resin composition comprising an epoxy resin containing a mesogen structure, a curing agent and an inorganic filler. Here, a mesogen is a basic unit of a liquid crystal and includes a rigid structure. The mesogens may include a rigid structure such as, for example, biphenyl.
The epoxy resin composition according to an embodiment of the present invention may contain an epoxy compound in an amount of 3 wt% to 40 wt%, preferably 5 wt% to 20 wt%, more preferably 7 wt% to 15 wt%, based on the entire epoxy resin composition . If the total epoxy resin composition contains 3 wt% or less of an epoxy compound, the adhesion may deteriorate. If the epoxy compound is contained in an amount of 40 wt% or more, adjustment of the thickness may be difficult.
At this time, the epoxy resin composition may contain 3 wt% or more of a crystalline epoxy compound relative to the entire epoxy resin composition. When the crystalline epoxy compound is contained in an amount less than 3 wt% of the entire epoxy resin composition, crystallization is not possible and the heat conduction effect may be low. The epoxy resin composition may contain a crystalline epoxy compound in an amount of 40 wt% or more based on the total epoxy compound (for example, the sum of the crystalline epoxy compound and the amorphous epoxy compound). When the crystalline epoxy compound is contained in an amount lower than 40 wt% of the total epoxy compound, crystallinity may be deteriorated and the heat conduction effect may be low.
Here, the crystalline epoxy compound may be a mesogen compound represented by the following general formula (1).
[Chemical Formula 1]
Wherein R 1 to R 6 may each be selected from the group consisting of H, Cl, Br, F, C 1 -C 3 alkyl, C 1 -C 3 alkene, C 1 -C 3 alkyne, 2 or 3.
The crystalline epoxy compound may be represented by the following general formula (2).
(2)
(2) can be named as 4'4'-bis (4-carboxybenzylidene) -diaminodiphenylmethane diglycidyl ester (4'4'-bis (4-carboxybenzylidene) -diaminodiphenylmethane diglycidyl ester).
Meanwhile, the epoxy resin composition according to an embodiment of the present invention may further include other conventional amorphous epoxy compounds having two or more epoxy groups in the molecule, in addition to the crystalline epoxy compound of Formula 1 or 2. The amorphous epoxy compound may be contained in an amount of 5 wt% to 60 wt%, preferably 10 wt% to 40 wt% of the total epoxy compound. When the amorphous epoxy compound is contained in an amount lower than the above range, stability at room temperature is insufficient. When the amorphous epoxy compound is contained in an amount higher than the above range, heat conduction characteristics may be insufficient.
Examples of amorphous epoxy compounds include bisphenol A, bisphenol F, 3,3 ', 5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl Sulfone, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, fluorene bisphenol, 4,4'-biphenol, 3,3 ', 5,5'-tetra Methyl-4,4'-dihydroxybiphenyl, 2,2'-biphenol, resorcin, catechol, t-butylcatechol, hydroquinone, t-butylhydroquinone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-di Dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2-dihydroxynaphthalene, , 8-dihydroxynaphthalene, the allyl or polyallylate of the dihydroxynaphthalene, the allyl bisphenol A, the allyl Bisphenol F, and allylated phenol novolac; and divalent phenols such as phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolac, p- cresol novolak, xylenol novolac, p-hydroxystyrene, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, fluoroglycinol, pyrogallol, , Allyl pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin , Glycidyl ether compounds derived from halogenated bisphenols such as tetrabromobisphenol A, azomethine, and mixtures thereof.
The epoxy resin composition according to an embodiment of the present invention may contain a curing agent in an amount of 0.5 wt% to 30 wt%, preferably 3 wt% to 15 wt%, more preferably 5 wt% to 10 wt%, based on the entire epoxy resin composition. When the curing agent is contained in an amount of 0.5 wt% or less based on the total epoxy resin composition, adhesion may be deteriorated. If the curing agent is contained in an amount of 30 wt% or more of the entire epoxy resin composition, the thickness adjustment may be difficult. The curing agent contained in the epoxy resin composition may be 4,4'-bis (4-carboxybenzylidene) -diaminodiphenylmethane diglycidyl ester which is the same backbone as the crystalline epoxy compound of formula (2).
The epoxy resin composition may further include at least one of a phenol-based curing agent, an amine-based curing agent, and an acid anhydride-based curing agent.
Examples of the phenolic curing agent include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis (4-hydroxyphenoxy ) Benzene, 1,3-bis (4-hydroxyphenoxy) benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'- Dihydroxybiphenyl, 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphene, But are not limited to, phenol novolac, bisphenol A novolac, o-cresol novolak, m-cresol novolac, p-cresol novolak, xylenol novolac, poly- p- hydroxystyrene, hydroquinone, But are not limited to, carboxymethylcellulose, carrageenan, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t- butyl pyrogallol, allylated pyrogallol, polyallylated pyrogallol, Dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,2-dihydroxynaphthalene, Naphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4 Dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allylide of dihydroxynaphthalene Or polyallylate, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, allylated pyrogallol, and mixtures thereof.
The amine-based curing agent may be, for example, an aliphatic amine, a polyether polyamine, an alicyclic amine, an aromatic amine, etc. Examples of the aliphatic amine include ethylene diamine, 1,3- (Hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, tetraethylenepentamine, pentaerythritol tetramine, tetraethylenepentamine, pentaerythritol hexamine, N-hydroxyethylethylenediamine, tetra (hydroxyethyl) ethylenediamine, and the like. Examples of the polyether polyamines include triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, and mixtures thereof. Examples of the alicyclic amines include isophoronediamine, methadecenediamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9- -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, and the like. Examples of the aromatic amines include tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4- , 4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4- (M-aminophenyl) ethylamine, [alpha] - (p-amino) benzylamine, benzyldimethylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine, Phenyl) ethylamine, diaminodiethyldimethyldiphenylmethane,?,? '- bis (4-aminophenyl) -p-diisopropylbenzene and mixtures thereof.
Examples of the acid anhydride-based curing agent include dodecenylsuccinic anhydride, polyadipic acid anhydride, polyazelaic anhydride, poly sebacic anhydride, poly (ethyloctadecanedioic) anhydride, poly (phenylhexadecanedioic) anhydride, methyltetrahydro There may be mentioned phthalic anhydride, phthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhydromic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, Anhydrides such as trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethylene glycol bistrimellitate, anhydrous hic acid, anhydrous nadic acid, methylnadic anhydride, 5- (2,5-dioxotetrahydro- Methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, 1- Methyl-dicarboxy-1 , 2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, and mixtures thereof.
The epoxy resin composition may further comprise a curing accelerator.
The epoxy resin composition according to an embodiment of the present invention may contain 30 wt% to 99 wt%, preferably 50 wt% to 95 wt%, and more preferably 70 wt% to 93 wt%, of an inorganic filler based on the entire epoxy resin composition . When the inorganic filler is contained in an amount less than 30 wt%, the high thermal conductivity, low thermal expansion, and high temperature heat resistance of the epoxy resin composition are not guaranteed. The high thermal conductivity, low thermal expansion, and high temperature heat resistance are better as the amount of the inorganic filler added is larger, but it is not improved according to the volume fraction thereof, and is remarkably improved from a certain amount. However, if the addition amount of the inorganic filler is more than 99 wt%, the viscosity becomes high and the moldability is weakened.
The inorganic filler comprises at least one of alumina (Al 2 O 3 ), aluminum nitride (AlN) and boron nitride (BN). The particle diameter of the inorganic filler may be 0.3 탆 to 60 탆. When the particle diameter of the inorganic filler is 60 탆 or more, there is a problem in workability. When the particle diameter is 0.3 탆 or less, there is a problem in dispersibility.
The alumina may be contained in an amount of 0.5 wt% to 90 wt% with respect to the total epoxy resin composition. Aluminum nitride may be contained in an amount of 0.5 wt% to 80 wt% with respect to the entire epoxy resin composition. Boron nitride may be contained in an amount of 0 wt% to 80 wt% with respect to the entire epoxy resin composition.
Meanwhile, the epoxy resin composition according to an embodiment of the present invention may contain 0.1 wt% to 2 wt%, preferably 0.5 wt% to 1.5 wt%, of additives relative to the total epoxy resin composition. The additive may be, for example, phenoxy. If the additive is added at lower than 0.1 wt%, it is difficult to obtain the required properties (for example, adhesion), and if it is added at a level higher than 2 wt%, the moldability is deteriorated due to the viscosity increase.
The prepreg can be prepared by coating or impregnating the epoxy resin composition according to one embodiment of the present invention on a fiber substrate or a glass substrate, and semi-curing the composition by heating.
The epoxy resin composition according to an embodiment of the present invention can be applied to a printed circuit board. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.
Referring to FIG. 1, a printed
The
On the
On the insulating
By using the epoxy resin composition according to one embodiment of the present invention as an insulating layer, a printed circuit board excellent in heat radiation performance can be obtained.
Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples.
≪ Example 1 >
(4-carboxybenzylidene) - (4-carboxybenzylidene) -bisphenol was obtained by mixing 2.2 wt% of the crystalline epoxy compound of Formula 1, 3.2 wt% of bisphenol F, 7.4 wt% of hydroquinone, 9.7 wt% of azomethine, 2.1% by weight of diaminodiphenylmethane diglycidyl ester and 0.5% by weight of an additive were further added and mixed and cured at 180 캜 for 90 minutes to obtain an epoxy resin composition of Example 1.
≪ Example 2 >
(4-carboxybenzylidene) - (4-carboxybenzylidene) - bis (4-carboxybenzylidene) 2.5% by weight of diaminodiphenylmethane diglycidyl ester and 0.7% by weight of an additive were further added and mixed. The mixture was cured at 180 DEG C for 90 minutes to obtain an epoxy resin composition of Example 2.
≪ Example 3 >
(4-carboxybenzylidene) - bis (4-carboxybenzylidene) -bisphenol was prepared by mixing 7.8 wt% of a crystalline epoxy compound of Formula 1, 1.5 wt% of bisphenol F, 2.5 wt% of hydroquinone, 2.3 wt% of azomethine, and 84.3 wt% 0.9% by weight of diaminodiphenylmethane diglycidyl ester and 0.7% by weight of an additive were further added and mixed and cured at 180 캜 for 90 minutes to obtain an epoxy resin composition of Example 3.
<Example 4>
(4-carboxybenzylidene) -diaminodiphenylmethane diglycidyl ether was mixed with 12 wt% of the crystalline epoxy compound of formula (1), 4.4 wt% of bisphenol F, 3.1 wt% of hydroquinone and 80.0 wt% 0.9% by weight of a cidyl ester and 0.7% by weight of an additive were further added and mixed and cured at 180 캜 for 90 minutes to obtain an epoxy resin composition of Example 4.
≪ Example 5 >
(4-carboxybenzylidene) -diaminodiphenylmethane dianhydride was obtained by mixing 8.1 wt% of a crystalline epoxy compound of Formula 1, 8.6% of bisphenol F, 1.2 wt% of hydroquinone and 80.5 wt% 0.9 wt% of glycidyl ester, and 0.7 wt% of an additive were further added and mixed and cured at 180 캜 for 90 minutes to obtain an epoxy resin composition of Example 5.
≪ Comparative Example 1 &
Bisphenol A 2.7 wt%, bisphenol F 2.7 wt%, hydroquinone 17.1 wt%, azomethine 5.5 wt% and alumina 68.5 wt% were mixed, and 4'4'-bis (4- carboxybenzylidene) -diaminodiphenyl 2.8 wt% of methane diglycidyl ester and 0.7 wt% of an additive were further added and mixed and cured at 180 DEG C for 90 minutes to obtain an epoxy resin composition of Comparative Example 1. [
The thermal conductivity of the epoxy resin compositions of Examples 1 to 5 and Comparative Example 1 was measured by an unsteady hot wire method using a LFA447 type thermal conductivity meter manufactured by NETZSCH. Table 1 shows the results.
As shown in Table 1, the thermal conductivity of the epoxy resin composition containing the crystalline epoxy compound of Formula 1 (see Examples 1 to 5) was the same as that of the epoxy resin composition containing no crystalline epoxy compound of Formula 1 (Comparative Example 1 ), Which is higher than the thermal conductivity of the heat exchanger. In particular, as in Examples 3 to 5, when the crystalline epoxy compound of Chemical Formula 1 is contained in an amount of 40 wt% or more of the total epoxy compound, the thermal conductivity becomes higher.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that
Claims (6)
Amorphous epoxy compound,
Hardener, and
An inorganic filler,
Wherein the epoxy compound of Formula 1 is contained in an amount of 40 parts by weight or more based on the sum of the epoxy compound of Formula 1 and the amorphous epoxy compound:
[Chemical Formula 1]
Wherein R 1 to R 6 may each be selected from the group consisting of H, Cl, Br, F, C 1 -C 3 alkyl, C 1 -C 3 alkene, C 1 -C 3 alkyne, 2 or 3.
Wherein the crystalline epoxy compound is an epoxy compound of the following formula (2).
(2)
Wherein the amorphous epoxy compound is at least one selected from the group consisting of bisphenol A, bisphenol F, hydroquinone, azomethine, and mixtures thereof.
Wherein the inorganic filler has a particle diameter of 0.3 to 60 占 퐉.
The epoxy compound of Formula 1 and the amorphous epoxy compound are contained in an amount of 3 to 40 parts by weight based on the total epoxy resin composition and the curing agent is contained in an amount of 0.5 to 30 parts by weight with respect to the total epoxy resin composition, Wherein the filler comprises 30 to 99 parts by weight of the entire epoxy resin composition.
An insulating layer formed on the metal plate, and
And a circuit pattern formed on the insulating layer,
Wherein the insulating layer is made of the epoxy resin composition of claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120145540A KR102012312B1 (en) | 2012-12-13 | 2012-12-13 | Epoxy resin composite and printed circuit board using the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120145540A KR102012312B1 (en) | 2012-12-13 | 2012-12-13 | Epoxy resin composite and printed circuit board using the same |
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| KR20140076942A true KR20140076942A (en) | 2014-06-23 |
| KR102012312B1 KR102012312B1 (en) | 2019-08-20 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5364912A (en) * | 1990-09-13 | 1994-11-15 | The Dow Chemical Company | Thermoplastic resins from polyglycidyl esters containing mesogenic moieties |
| JP2012211225A (en) * | 2011-03-30 | 2012-11-01 | Hitachi Chemical Co Ltd | Resin composition, resin sheet, prepreg, laminated board, metal substrate, and printed wiring board |
-
2012
- 2012-12-13 KR KR1020120145540A patent/KR102012312B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5364912A (en) * | 1990-09-13 | 1994-11-15 | The Dow Chemical Company | Thermoplastic resins from polyglycidyl esters containing mesogenic moieties |
| JP2012211225A (en) * | 2011-03-30 | 2012-11-01 | Hitachi Chemical Co Ltd | Resin composition, resin sheet, prepreg, laminated board, metal substrate, and printed wiring board |
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| KR102012312B1 (en) | 2019-08-20 |
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