KR20130008408A - Epoxy resin compound and radiant heat circuit board using the same - Google Patents
Epoxy resin compound and radiant heat circuit board using the same Download PDFInfo
- Publication number
- KR20130008408A KR20130008408A KR1020110069138A KR20110069138A KR20130008408A KR 20130008408 A KR20130008408 A KR 20130008408A KR 1020110069138 A KR1020110069138 A KR 1020110069138A KR 20110069138 A KR20110069138 A KR 20110069138A KR 20130008408 A KR20130008408 A KR 20130008408A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- inorganic filler
- circuit board
- total weight
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The present invention is an epoxy resin composition mainly composed of an epoxy resin, a curing agent and an inorganic filler, wherein the epoxy resin comprises an epoxy resin of the formula. Therefore, heat conductivity can be improved using the epoxy resin containing the mesogenic structure which raises crystallinity. In addition, it is possible to provide a high heat-radiating substrate by using the epoxy resin in a printed circuit board as an insulating material.
Description
The present invention relates to an epoxy resin composition and relates to an epoxy resin composition used as an insulating layer of a heat radiation circuit board.
The circuit board includes a circuit pattern on an electrically insulating substrate, and is a substrate for mounting electronic components or the like.
Such an electronic component may be a heating element, for example, a light emitting diode (LED) or the like, and the heating element emits a severe heat. The heat emitted from the heat generating element raises the temperature of the circuit board, causing malfunction of the heat generating element and reliability.
Therefore, the heat dissipation structure for discharging the heat from the electronic component to the outside is important for the circuit board, and the thermal conductivity of the insulation layer formed on the circuit board has a great influence.
In order to increase the thermal conductivity of the insulating layer, an inorganic filler needs to be filled at a high density, and an epoxy resin excellent in low viscosity has been proposed.
Bisphenol A type epoxy resins and bisphenol F type epoxy resins are generally widely used as low viscosity epoxy resins. These epoxy resins are difficult to handle because they are liquid at room temperature and have problems in heat resistance, mechanical strength and toughness have.
The embodiment provides an epoxy resin composition having a novel composition.
The embodiment provides a heat radiation circuit board with improved heat efficiency.
Examples are epoxy resin compositions containing epoxy resins, hardeners, and inorganic fillers as main components, wherein the epoxy resins claim an epoxy resin composition comprising an epoxy resin of the formula:
Meanwhile, an embodiment includes a metal plate, an insulating layer formed on the metal plate, and a circuit pattern formed on the insulating layer, wherein the insulating layer cures an epoxy resin composition mainly composed of an epoxy resin, a curing agent, and an inorganic filler. And the epoxy resin claims a heat radiation circuit board that satisfies the following formula.
According to the present invention, the thermal conductivity can be improved by using an epoxy resin containing a mesogen structure for increasing crystallinity. In addition, it is possible to provide a high heat-radiating substrate by using the epoxy resin in a printed circuit board as an insulating material.
The crystalline epoxy resin is excellent in formability and reliability while improving high thermal conductivity, low absorption, low thermal expansion, and high heat resistance.
1 is a sectional view of a heat radiating circuit board of the present invention.
DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.
In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .
Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.
The present invention provides an epoxy resin composition having high crystallinity and improved thermal conductivity.
Hereinafter, the crystalline epoxy resin composition of this invention contains an epoxy resin, a hardening | curing agent, and an inorganic filler as a main component.
The epoxy resin contains 13 w% or more of the crystalline epoxy resin, preferably 50 w% or more.
In this case, the crystalline epoxy resin satisfies the following formula.
When the use ratio of the crystalline epoxy resin is less than the above range, crystallization does not occur when a cured product is used, and the effect such as thermal conductivity is small.
The above-mentioned epoxy resin includes, in addition to the above-mentioned crystalline epoxy resin used as an essential component of the present invention, other usual amorphous epoxy resins having two or more epoxy groups in the molecule.
Examples thereof include bisphenol A, 3,3 ', 5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl sulfone, 4,4'-di Hydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, fluorene bisphenol, 4,4'-biphenol, 3,3 ', 5,5'-tetramethyl-4,4'-di Dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,2-dihydroxynaphthalene, 1,2-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-di Dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, Allylated or polyallylated dihydroxynaphthalene, allylated bisphenol A, allylated bisphenol F, allylated phenol novolac, Phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cresol novolak, xylenol novolak, poly- p- hydroxystyrene, tris- (4-hydroxy Phenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallylated pyrogallol, , Tri-valent phenols such as 2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, or tetrabromobisphenol A And glycidyl ether compounds derived from halogenated bisphenols. These amorphous epoxy resins may be used alone or in combination of two or more.
The hardening | curing agent used for the epoxy resin composition of this invention can use all what is generally known as an epoxy resin hardening | curing agent, Preferably a phenolic hardening | curing agent can be used.
Phenolic curing agents include a phenolic resin in addition to the phenolic compound as a single compound among the phenolic compounds.
Specific examples of the phenol curing agent include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, and 1,4-bis (4-hydroxyphenoxy) Benzene, 1,3-bis (4-hydroxyphenoxy) benzene, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxydiphenylketone, 4,4'-dihydroxy Sidiphenylsulfone, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenan Tren-10-oxide, phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cresol novolak, xylenol novolak, poly-p-hydroxystyrene, hydroquinone, resorcin , Catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butylpyrogallol, allylated pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol , 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydrate Loxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2, 4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allyl of the dihydroxynaphthalene Cargo or polyallylate, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, allylated pyrogallol and the like.
You may use a hardening | curing agent in mixture of 2 or more types of hardening | curing agents.
In addition to the phenolic curing agent, a generally known curing agent can be used. For example, an amine type hardener, an acid anhydride type hardener, a phenol type hardener, a polymercaptan type hardener, a polyaminoamide type hardener, an isocyanate type hardener, a block isocyanate type hardener, etc. can be included. The compounding quantity of these hardening | curing agents can be suitably set considering the kind of hardening | curing agent to mix | blend and the physical property of the heat conductive epoxy resin molded object obtained.
Specific examples of the amine-based curing agent may be aliphatic amines, polyether polyamines, alicyclic amines, aromatic amines and the like. Examples of the aliphatic amines include ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, Diamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N - hydroxyethylethylenediamine, tetra (hydroxyethyl) ethylenediamine, and the like. Examples of the polyether polyamines include triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine and the like. Examples of the alicyclic amines include isophoronediamine, methadecenediamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9- -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, and the like. Examples of the aromatic amines include tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4- , 4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4- Aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine,? - (m-amino Phenyl) ethylamine,? - (p-aminophenyl) ethylamine, diaminodiethyldimethyldiphenylmethane and?,? '- bis (4-aminophenyl) -p-diisopropylbenzene.
Specific examples of the acid anhydride-based curing agent include dodecenylsuccinic anhydride, polyadipic acid anhydride, polyazelaic anhydride, poly sebacic anhydride, poly (ethyloctadecanedioic) anhydride, poly (phenylhexadecanedioic) anhydride, There may be mentioned phthalic acid, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhydromic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, phthalic anhydride, anhydrous Hexanetetracarboxylic acid anhydride, ethylene glycol bistrimellitate, anhydrous hic acid, anhydrous nadic acid, methylnadic anhydride, 5- (2,5-dioxotetrahydro-3- Methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, 1-methyl - Dicarb -1,2,3,4-tetrahydro-1-naphthalenesuccinic acid dianhydride, and the like.
The epoxy resin composition includes 40 to 97% by weight of inorganic fillers based on the whole epoxy resin composition.
When less than this, the effect aimed at by this invention, such as high thermal conductivity, low thermal expansion property, and high heat resistance, is not fully exhibited. This effect is better as the addition amount of the inorganic filler is larger, but it does not improve with the volume fraction and remarkably improves from a specific addition amount. These physical properties are due to the effect that the higher-order structure in the polymer state is controlled, and since this higher-order structure is mainly achieved on the surface of the inorganic filler, it is considered that a specific amount of the inorganic filler is required. On the other hand, when the addition amount of an inorganic filler is larger than this, since a viscosity becomes high and moldability deteriorates, it is unpreferable.
The inorganic filler is preferably a spherical inorganic filler. The spherical inorganic filler is not particularly limited as long as it is spherical, including spheroidal cross-section, but it is particularly preferable that the spherical inorganic filler is as close as possible to spheroidization as far as possible from the viewpoint of fluidity improvement.
The inorganic filler may be alumina, aluminum nitride, silicon nitride, boron nitride, crystal silica, or the like, and two or more different inorganic fillers may be mixed and used.
It is preferable that the average particle diameter of an inorganic filler is 30 micrometers or less. If the average particle diameter is larger than this range, the flowability of the epoxy resin composition is impaired and the strength is lowered.
A known curing accelerator may be blended into the epoxy resin composition of the present invention. For example, there are amines, imidazoles, organic phosphines, Lewis acids, and the like. Specifically, 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine Tertiary amines such as triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecyl Imidazoles such as imidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, tetraphenylphosphonium tetraphenylborate, tetraphenyl Tetra substituted phosphonium tetra substituted borate, such as phosphonium ethyl triphenyl borate and tetrabutyl phosphonium tetrabutyl borate, 2-ethyl-4-methylimidazole tetraphenyl borate, and N-methylmorpholine tetraphenyl Tetraphenyl boron salts such as borate and the like.
In the epoxy resin composition of the present invention, a wax can be used as a releasing agent generally used in an epoxy resin composition. As the wax, for example, stearic acid, montanic acid, montanic acid ester, phosphate ester or the like can be used.
In the epoxy resin composition of the present invention, a coupling agent generally used in an epoxy resin composition may be used to improve the adhesion between the inorganic filler and the resin component. As the coupling agent, for example, an epoxy silane can be used.
The epoxy resin composition of the present invention, when the epoxy resin, the curing agent and the inorganic filler as a main component, the epoxy resin satisfies 3 to 60w% of the total weight, the inorganic filler satisfies 40 to 97w%, the curing agent Meets 0.5 to 5w%.
Other components besides epoxy resin, curing agent and coupling agent are dissolved in a solvent such as acetone, MEK, MIBK, IPA, butanol or toluene, and the mixture is heated and stirred. The inorganic filler is added thereto and mixed by a mixer or the like . Thereafter, a coupling agent is added and mixed and kneaded by a heating roll, a kneader, and the like. There is no restriction | limiting in particular in the compounding order of these components.
At this time, the solvent satisfies 10 to 20w% of the total weight of the epoxy resin composition.
The epoxy resin composition of the present invention can be applied to a heat radiation circuit board as shown in FIG.
1, a heat radiating
The
The
The metal protrusion extends from the
An insulating
The insulating
The insulating
A plurality of
By forming the insulating
<Examples>
The present invention will be described in more detail with reference to the following Examples.
(Example 1)
Bisphenol-A 10.7 w%, o-cresol-novolac 3.2 w%, 4,4'oxybis of the formula (N- (4-
(oxiran-2-ylmethoxy) benzylidene) aniline) 2.1 w%, NC-3000H (Nippon Kayaku) 6.5 w% epoxy resin and TPP-K curing agent 1.8 w%, imidazole series curing accelerator 0.3 w%, BYK-W980 After all 0.5 w% of the additives were mixed and stirred at 40 ° C for 10 minutes, 74.9 w% of an alumina inorganic filler was added thereto, and stirred for 20 to 30 minutes at room temperature to obtain the crystalline epoxy resin composition of Example 1.
The thermal conductivity was measured by the unsteady hot wire method (non-stationary hot wire method) using a LFA447 type thermal conductivity meter manufactured by NETZSCH.
The heat of fusion was measured at a temperature rising rate of 10 ° C./min using a differential scanning calorimetry device (DSC Q100 manufactured by TA).
The glass transition temperature was measured at a temperature rising rate of 10 ° C./min using a DSC Q100 thermometer measuring device manufactured by TA.
(Example 2)
o-cresol-novolac 3.1 w%, 4,4'oxybis of the formula (N- (4- (oxiran-2-
ylmethoxy) benzylidene) aniline) 3.1 w%, NC-3000H (Nippon Kayaku) 7.4 w% epoxy resin and imidazole curing agent 2.3 w%, imidazole curing accelerator 0.2 w%, BYK-W980 additive 0.7 w% After mixing all, stirring for 10 minutes at 40 degreeC, 83.2 w% of an alumina inorganic filler was added, and it stirred for 20 to 30 minutes at room temperature, and obtained the crystalline epoxy resin composition of Example 2.
(Example 3)
Bisphenol-A 1.9w%, 4,4'oxybis of formula (N- (4- (oxiran-2-ylmethoxy) benzylidene) aniline) 7.5 w%, NC-3000H (Nippon Kayaku Co.) 4.7 w% epoxy resin And a total of 0.8 w% of imidazole series curing agent, 0.1 w% of imidazole series curing accelerator, and 0.7 w% of BYK-W980 additive were stirred at 40 ° C for 10 minutes, and then 84.3 w% of alumina inorganic filler was added at room temperature. It stirred for 30 minutes and obtained the crystalline epoxy resin composition of Example 3.
(Example 4)
Bisphenol-A 1.8w%, 4,4'oxybis (N- (4- (oxiran-2-ylmethoxy))
benzylidene) aniline) 10.6 w%, NC-3000H (Nippon Kayaku) 4.4 w% of the epoxy resin mixed with 0.8 w% imidazole curing agent, 0.1 w% imidazole curing agent, 0.7 w% of BYK-W980 additive After stirring at 40 ° C. for 10 minutes, 81.6 w% of an alumina inorganic filler was added thereto, followed by stirring at room temperature for 20 to 30 minutes to obtain a crystalline epoxy resin composition of Example 4.
(Example 5)
Bisphenol-A 0.9w%, 4,4'oxybis (N- (4- (oxiran-2-ylmethoxy))
benzylidene) aniline) 6.4 w%, NC-3000H (Nippon Kayaku) 4.6 w% of epoxy resin, imidazole curing agent 0.8 w%, imidazole curing accelerator 0.1 w%, BYK-W980 additive 0.7 w% After stirring for 10 minutes at 40 ℃, 86.5 w% of the alumina inorganic filler was added, and stirred for 20 to 30 minutes at room temperature to obtain the crystalline epoxy resin composition of Example 5.
(Comparative Example 1)
Bisphenol-A 10.7w%, o-cresol-novolac 5.3w%, NC-3000H (Nippon Kayaku) 6.5 w% epoxy resin of TPP-K curing agent 1.8 w%, imidazole series curing accelerator 0.3 w%, After mixing all 0.5 w% of BYK-W980 additive and stirred for 10 minutes at 40 ℃, 74.9 w% of an alumina inorganic filler was added and stirred for 20 to 30 minutes at room temperature to obtain the crystalline epoxy resin composition of Example 1.
(Comparative Example 2)
o-cresol-novolac 6.2w%, NC-3000H (Nippon Kayaku) 7.4 w% epoxy resin and imidazole curing agent 2.3 w%, imidazole curing accelerator 0.2 w%, BYK-W980 additive 0.7 w% After mixing all the mixture and stirred for 10 minutes at 40 ℃, 83.2 w% of the alumina inorganic filler was added and stirred for 20 to 30 minutes at room temperature to obtain the crystalline epoxy resin composition of Example 2.
<Experimental Example>
Thermal conductivity measurement
The thermal conductivity of each Example and the comparative example was measured by the abnormal heat wire method using the LFA447 type | mold thermal conductivity meter by NETZSCH company, and it is shown in Table 1.
Heat of fusion measurement
It measured by the temperature increase rate of 10 degree-C / min using the differential scanning calorimetry apparatus (DSC Q100 by TA company), and is shown in Table 1. It can be confirmed that the heat of fusion of each example and the comparative example belongs to a similar category.
Glass transition temperature
The glass transition temperature was measured using a DSC Q100 thermomechanical measuring apparatus manufactured by TA Corporation at a heating rate of 10 ° C / minute and is shown in Table 1. It can be confirmed that the glass transition temperature of each of the examples and the comparative examples satisfies 100 deg. C or more, so that the other properties do not deteriorate even when the crystalline epoxy resin of the formula is included.
As shown in Table 1, looking at the thermal conductivity of Example 1 and Comparative Example 1 containing the same amount of inorganic filler, it can be seen that the thermal conductivity of Example 1 appears higher. Also in Example 2 and Comparative Example 2, the same effect is shown.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.
Heat
Claims (16)
The epoxy resin is an epoxy resin composition comprising an epoxy resin of the following formula.
Epoxy resin composition containing 50% by weight or more of the epoxy resin of the formula relative to the total weight of the epoxy resin.
Wherein the inorganic filler satisfies 40 to 97 w% with respect to the total weight of the epoxy resin composition.
Wherein said inorganic filler is at least one of alumina, boron nitride, aluminum nitride, crystalline silica, or silicon nitride.
Wherein the epoxy resin satisfies 3 to 60 w% based on the total weight of the epoxy resin composition.
Wherein the curing agent satisfies 0.5 to 5% by weight based on the total weight of the epoxy resin composition.
The epoxy resin composition is used as an insulating material of the circuit board.
The epoxy resin is an epoxy resin composition comprising an amorphous epoxy resin.
The epoxy resin composition further comprises a curing accelerator, coupling agent.
When the said epoxy resin composition contains 85 w% or more of the said inorganic fillers, the epoxy resin composition which satisfy | fills 3 W / m * k or more of thermal conductivity.
Epoxy resin composition comprising an epoxy resin of the above formula 13% or more based on the total weight of the epoxy resin.
Epoxy resin composition of the above formula is a crystalline resin.
An insulating layer formed on the metal plate, and
A circuit pattern formed on the insulating layer
/ RTI >
The insulating layer
A heat radiation circuit board formed by curing an epoxy resin composition containing an epoxy resin, a curing agent, and an inorganic filler as a main component, wherein the epoxy resin satisfies the following formula.
The inorganic filler is a heat dissipation circuit board that satisfies 40 to 97w% with respect to the total weight of the epoxy resin composition.
The inorganic filler is at least one of alumina, boron nitride, aluminum nitride, crystalline silica or silicon nitride.
Epoxy resin of the above formula is a crystalline epoxy resin, the heat dissipation circuit board contained 12w% or more based on the total weight of the epoxy resin.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110069138A KR20130008408A (en) | 2011-07-12 | 2011-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
| EP12811953.4A EP2731993B1 (en) | 2011-07-12 | 2012-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
| CN201280044371.9A CN103797068A (en) | 2011-07-12 | 2012-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
| TW101125122A TWI612071B (en) | 2011-07-12 | 2012-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
| PCT/KR2012/005547 WO2013009114A2 (en) | 2011-07-12 | 2012-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
| US14/232,510 US20140290986A1 (en) | 2011-07-12 | 2012-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110069138A KR20130008408A (en) | 2011-07-12 | 2011-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130008408A true KR20130008408A (en) | 2013-01-22 |
Family
ID=47838522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110069138A KR20130008408A (en) | 2011-07-12 | 2011-07-12 | Epoxy resin compound and radiant heat circuit board using the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20130008408A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102158938B1 (en) | 2019-09-18 | 2020-09-23 | (주) 매그나텍 | Epoxy resin composition and heat dissipation circuit board using the same |
-
2011
- 2011-07-12 KR KR1020110069138A patent/KR20130008408A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102158938B1 (en) | 2019-09-18 | 2020-09-23 | (주) 매그나텍 | Epoxy resin composition and heat dissipation circuit board using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101326934B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| TWI612071B (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR101896963B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR20120074109A (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| JP5265461B2 (en) | Crystalline modified epoxy resin, epoxy resin composition and crystalline cured product | |
| WO2009110424A1 (en) | Modified epoxy resin, epoxy resin compositions and cured articles | |
| KR101326960B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR20130008409A (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR20140076345A (en) | Resin composite and printed circuit board using the same | |
| KR101966212B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR101360551B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR101262588B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR102135414B1 (en) | Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same | |
| KR20130008408A (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR101896965B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR101976579B1 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR101987260B1 (en) | Epoxy resin, epoxy resin compound and radiant heat circuit board using the same | |
| TWI545141B (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| KR102104525B1 (en) | Epoxy resin composite and printed circuit board comprising isolation using the same | |
| KR102104524B1 (en) | Epoxy resin composite and printed circuit board comprising isolation using the same | |
| KR20150072904A (en) | Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same | |
| KR20140076942A (en) | Epoxy resin composite and printed circuit board using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| E601 | Decision to refuse application | ||
| E801 | Decision on dismissal of amendment | ||
| J301 | Trial decision |
Free format text: TRIAL NUMBER: 2017101006016; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20171215 Effective date: 20190508 |