KR20130117268A - Apparatus for chucking substrate - Google Patents

Apparatus for chucking substrate Download PDF

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Publication number
KR20130117268A
KR20130117268A KR1020120040294A KR20120040294A KR20130117268A KR 20130117268 A KR20130117268 A KR 20130117268A KR 1020120040294 A KR1020120040294 A KR 1020120040294A KR 20120040294 A KR20120040294 A KR 20120040294A KR 20130117268 A KR20130117268 A KR 20130117268A
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KR
South Korea
Prior art keywords
substrate
chucking
unit
chuck
chucking unit
Prior art date
Application number
KR1020120040294A
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Korean (ko)
Inventor
조천수
김병진
Original Assignee
세메스 주식회사
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Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020120040294A priority Critical patent/KR20130117268A/en
Publication of KR20130117268A publication Critical patent/KR20130117268A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The substrate chucking apparatus according to the present invention includes a gripping portion, a first chucking unit and a second chucking unit. The gripping portion grips an edge of the substrate such that one surface of the substrate having the other surface opposite to one surface to be processed is exposed downward. The first chucking unit is disposed on the other surface of the substrate to chuck the peripheral region of the other surface of the substrate. The second chucking unit chucks the central region adjacent to the peripheral region of the other surface of the substrate and drives up and down to prevent the substrate from sagging. This simplifies the apparatus, shortens the processing time, and increases the uniformity of the processing according to the flatness of the substrate, thereby improving productivity.

Description

Substrate Chucking Device {APPARATUS FOR CHUCKING SUBSTRATE}

The present invention relates to a substrate chucking apparatus, and more particularly, to a substrate chucking apparatus for top chucking a substrate in an OLED deposition process.

In general, a semiconductor device is manufactured by repeatedly performing processes such as deposition and etching on a substrate. The above process is performed while the substrate is chucked in a vacuum process chamber. As an example of such a substrate chucking apparatus, a vacuum chuck, an electrostatic chuck, and the like are used.

The chucking method includes a lower chucking method in which a chuck is disposed below and a substrate is disposed on the chuck, and an upper chucking method in which a chuck is positioned above and a substrate is disposed below the chuck. In the upper chucking method, the surface to be processed of the substrate faces downward, and a process such as deposition is performed from a source disposed below. In particular, in the OLED deposition process, the deposition process is performed by the upper chucking method.

However, in the upper chucking method, since the chuck is positioned above the substrate and does not support the lower portion of the substrate, the substrate may be struck downward by gravity. In addition, when chucking the substrate, there is a problem in that it is difficult for the chuck to chuck the substrate stably.

Therefore, in the conventional substrate chucking apparatus using the upper chucking method, first, the substrate is chucked by the lower chucking method, and then the substrate is inverted by a separate substrate reversing means to change the upper chucking state, and then the process is performed. To this end, the conventional substrate chucking apparatus is provided with a substrate reversing unit for reversing the substrate.

However, the conventional substrate chucking apparatus having the substrate inversion unit has a problem that the apparatus is enlarged as a whole by mounting the substrate inversion unit, requires a large space for the inversion operation of the substrate, and the process time is long. In addition, in the upper chucking state in which the substrate is inverted, the substrate sag may regenerate with time. That is, it is difficult to maintain the flatness of the substrate after chucking.

An object of the present invention is to provide a substrate chucking device capable of chucking a substrate without inversion of the substrate in the upper chucking method and maintaining flatness of the substrate even after the upper chucking.

The substrate chucking apparatus according to the embodiment for realizing the object of the present invention includes a gripping portion, a first chucking unit and a second chucking unit. The gripping portion grips an edge of the substrate such that one surface of the substrate having the other surface opposite to one surface to be processed is exposed downward. The first chucking unit is disposed on the other surface of the substrate to chuck the peripheral region of the other surface of the substrate. The second chucking unit chucks the central region adjacent to the peripheral region of the other surface of the substrate and drives up and down to prevent the substrate from sagging.

In one embodiment of the present invention, a driving unit for transmitting power for the vertical drive of the second chucking unit, and after the second chucking unit chucking the central region of the substrate, the second chuck of the second chucking unit The controller may further include a controller configured to control the driving unit so that the king surface is parallel to the first chucking surface of the first chucking unit.

According to the substrate chucking apparatus, the substrate can be chucked without the inversion of the substrate in the upper chucking method by providing a chucking unit for dividing the substrate into a plurality of regions, chucking the divided regions, and driving up and down to prevent the substrate from sagging. The flatness of the substrate can be maintained even after the upper chucking. This simplifies the apparatus, shortens the processing time, and increases the uniformity of the processing according to the flatness of the substrate, thereby improving productivity.

1 is a plan view of a substrate chucking apparatus according to an embodiment of the present invention.
2A and 2B are cross-sectional views illustrating a chucking method of the substrate chucking apparatus of FIG. 1.
3A and 3B are plan views of a substrate chucking apparatus according to another embodiment of the present invention.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a substrate chucking apparatus according to an embodiment of the present invention, Figures 2a and 2b are cross-sectional views for explaining the chucking method of the substrate chucking apparatus of FIG.

1, 2A, and 2B, the substrate chucking apparatus 100 includes a grip part 110, a first chucking unit 120, and a second chucking unit 130. In addition, the substrate chucking apparatus 100 may further include a driver 140 and a controller 150. The driving unit 140 and the control unit 150 may be configured separately from the first chucking unit 120 and the second chucking unit 130, respectively, or the first chucking unit 120 and the It may be provided in a configuration shared in the second chucking unit 130. In the present embodiment, it will be described that the driving unit 140 and the controller 150 are provided in a configuration shared by the first chucking unit 120 and the second chucking unit 130.

Although not shown in detail, the substrate chucking apparatus 100 may be disposed in a process chamber (not shown), and the process chamber may perform deposition, etching, and cleaning processes on the chucked substrate 10. The substrate 10 may be a semiconductor substrate for manufacturing a semiconductor device such as a wafer. However, the substrate 10 is not limited to a semiconductor substrate, and may be a substrate for manufacturing a flat panel display panel, which is a main component of a flat panel display device.

In addition, a nozzle unit (not shown) may be disposed in the process chamber for injecting a chemical liquid onto the substrate 10, and the nozzle unit may include a plurality of nozzles, and the nozzles may include the chemical liquid. Reciprocating scan motion may be performed to uniformly spray onto the substrate 10.

The gripping portion 110 clamps the substrate 10. The gripping portion 110 has a frame frame of a window shape, and is configured to fix an edge portion of the substrate 10. Here, the substrate 10 has the other surface opposite to one surface, which is the surface to be processed, and is clamped to the gripping portion 110 so that one surface, which is the surface to be processed, is exposed downward. The gripping portion 110 may be made of an elastic material to press and fix the edge portion of the substrate 10, or may have a structure for holding the portion in the form of a protrusion. The holding unit 110 may have various shapes and structures according to the size of the substrate and the type of the process.

The first chucking unit 120 is disposed above the peripheral area SA of the other surface of the substrate 10 to chuck the peripheral area SA on the other surface of the substrate 10. The peripheral area SA may be divided into a plurality of areas. That is, the substrate 10 is divided into a plurality of areas including the peripheral area SA and the central area CA, and the substrate chucking apparatus 100 includes a plurality of areas corresponding to each area of the substrate 10. Two chucking units.

Since the first chucking unit 120 chucks the substrate 10 in an upper chucking manner, the first chucking surface 121 is formed on the other surface of the substrate 10 opposite to the surface to be processed. That is, in the upper chucking method, the peripheral area SA of the other surface of the substrate 10 is chucked by the first chucking unit 120, and one surface of the substrate 10 is a target surface on which a process such as deposition is performed. Becomes

The second chucking unit 130 is disposed above the central area CA of the substrate 10 adjacent to the peripheral area SA to chuck the central area CA of the substrate 10. Unlike the plurality of first chucking units 120 disposed in the peripheral area SA, a plurality of second chucking units 130 disposed in the central area CA may be provided in singular number. In the present embodiment, the area of the substrate 10 is divided into a center area CA and an edge area SA, and the chucking units are arranged in each area, but the division of the area and the arrangement structure of the chucking units are described as an example. It is not limited to this.

Like the first chucking unit 120, the second chucking unit 130 chucks the substrate 10 in an upper chucking manner, such that the second chucking surface 131 is formed on the other surface of the substrate 10. do. That is, in the upper chucking method, the center area CA of the other surface of the substrate 10 is chucked by the second chucking unit 130, and one surface of the substrate 10 is a surface to be processed such as a deposition process. Becomes

The first chucking unit 120 and the second chucking unit 130 may include at least one of an electrostatic chuck, an adhesive chuck, and a vacuum chuck. The electrostatic chuck is provided with a dielectric layer in which an electrostatic electrode is embedded, and applies a voltage to the electrostatic electrode to form an electrostatic force on the substrate 10, thereby electrostatically adsorbing and fixing the substrate 10 adjacent to the dielectric layer. do.

The driving unit 140 performs vertical driving of the second chucking unit 130. In addition, the driving unit 140 may perform vertical driving of the first chucking unit 120. The driver 140 is driven under the control of the controller 150. The driving unit 140 is connected to a driving motor (not shown) that provides power for driving the first and second chucking units 120 and 130, and the first and second chucking units 120 and 130. It may be configured to include a lifting member. The driving unit 140 is not limited to the present exemplary embodiment and may have various modifications for driving the top, bottom, front, and left and right of the first and second chucking units 120 and 130.

The control unit 150 may chuck the central area CA of the substrate 10 by the second chucking unit 130, and then the second chucking surface 131 of the second chucking unit 130 may be formed of the second chucking unit 130. The driving unit 140 is controlled to be parallel to the first chucking surface 121 of the first chucking unit 120. First, in a state where the gripping part 110 clamps the substrate 10, the controller 150 lowers the first and second chucking units 120 and 130 so as to contact the substrate 10. The driving unit 140 is controlled. In the state where the gripping portion 110 clamps the substrate 10, the only structure for supporting the substrate 10 is the gripping portion 110 that grips the edge, so that a central region of the substrate 10 is provided. Substrate deflection occurs in which CA is convex downward. In particular, the larger the size of the substrate 10 and the longer the processing time, the larger the deflection of the substrate.

Accordingly, the controller 150 controls the driving unit 140 to chuck the substrate 10 by further lowering the second chucking unit 130 positioned above the central area CA of the substrate 10. do. Here, when the second chucking unit 130 is configured as an electrostatic chuck, power is provided to completely adsorb the substrate 10 to the second chucking surface 131. Next, the controller 150 controls the driving unit 140 to raise the second chucking unit 130 in a state where the substrate 10 is adsorbed. Here, the driving unit 140 is controlled such that the second chucking surface 131 of the second chucking unit 130 is parallel to the first chucking surface 121 of the first chucking unit 120. As the first chucking surface 121 of the first chucking unit 120 is parallel to the second chucking surface 131 of the second chucking unit 130, the substrate sag disappears, and the substrate is removed even during the process. Flatness can be maintained.

In addition, the substrate chucking apparatus 100 may further include a sensing sensor (not shown) for sensing positions of the first and second chucking units 120 and 130. The substrate chucking apparatus 100 may further include various components capable of sensing horizontality of the first and second chucking surfaces 121 and 131.

As such, the substrate chucking apparatus 100 according to the present exemplary embodiment may chuck the substrate without the inversion of the substrate in the upper chucking method, and maintain the flatness of the substrate even after the upper chucking. As a result, the processing time may be shortened and the uniformity of the processing may be increased according to the flatness of the substrate, thereby improving productivity.

3A and 3B are plan views of a substrate chucking apparatus according to another embodiment of the present invention.

Referring to FIG. 3A, the substrate chucking apparatus 100a according to the present exemplary embodiment divides one substrate 10a into a plurality of sub-regions 11a, 12a, and 13a, and each sub-region 11a, 12a, and 13a. May be divided into a plurality of regions and include first and second chucking units 120a and 130a corresponding to the regions. Here, the gripper 110a having the divided structure may serve as a criterion for distinguishing the subregions 11a, 12a, and 13a. The gripper 110a may have an intermediate frame 111a for dividing the subregions 11a, 12a, and 13a. Each of the subregions 11a, 12a, and 13a is divided into a peripheral region and a central region, and a plurality of first and second chucking units 120a and 130a are disposed to correspond to the peripheral region and the central region. When processing a large substrate, the substrate chucking apparatus 100a having such a structure may be easy to maintain the flatness of the substrate 10a. In the present embodiment, in addition to chucking a single substrate 10a into a plurality of sub-regions 11a, 12a, and 13a, descriptions of other configurations and chucking methods are the same as those of FIGS. 1, 2A, and 2B. Therefore, duplicate descriptions will be omitted.

Referring to FIG. 3B, the substrate chucking apparatus 100b according to the present exemplary embodiment may chuck a plurality of substrates 11b, 12b, 13b, and 14b. The holding part 110b of the present embodiment has a structure capable of clamping separate substrates 11b, 12b, 13b, and 14b, which have divided regions but are completely separated. The first and second chucking units 120b and 130b corresponding to the substrates 11b, 12b, 13b, and 14b are disposed. Except for chucking the plurality of substrates 11b, 12b, 13b, and 14b in this embodiment, the descriptions of other configurations and chucking methods are the same as those described with reference to FIGS. 1, 2A, and 2B, so that redundant descriptions are omitted. do.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. You will understand.

According to the substrate chucking apparatus according to the present invention, by chucking and flattening the central region of the substrate having severe substrate deflection, the substrate can be chucked without inversion of the substrate in the upper chucking method, and the flatness of the substrate can be maintained even after the upper chucking. . This shortens the process time and increases the uniformity of the process treatment according to the flatness of the substrate and thus has industrial applicability in which productivity can be improved.

10: substrate
100: substrate chucking device 110: gripping portion
120: first chucking unit 130: second chucking unit
140: driving unit 150: control unit

Claims (2)

A holding part for holding an edge of the substrate such that one surface of the substrate having the other surface opposite to one surface to be processed is exposed downward;
A first chucking unit disposed on the other surface of the substrate to chuck a peripheral region of the other surface of the substrate; And
And a second chucking unit for chucking a central region adjacent to a peripheral region of the other surface of the substrate and driving up and down to prevent sagging of the substrate. The method of claim 1,
A driving unit transmitting power for vertical driving of the second chucking unit; And
After the second chucking unit chucking the central region of the substrate, the control unit for controlling the drive unit so that the second chucking surface of the second chucking unit is parallel to the first chucking surface of the first chucking unit. Substrate chucking apparatus, characterized in that.
KR1020120040294A 2012-04-18 2012-04-18 Apparatus for chucking substrate KR20130117268A (en)

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KR1020120040294A KR20130117268A (en) 2012-04-18 2012-04-18 Apparatus for chucking substrate

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170128915A (en) * 2016-05-16 2017-11-24 세메스 주식회사 Apparatus and Method for holding a substrate
US10546768B2 (en) 2015-02-25 2020-01-28 Corning Incorporated Apparatus and method to electrostatically chuck substrates to a moving carrier
KR20220015137A (en) * 2020-07-30 2022-02-08 주식회사 선익시스템 Deposition method
KR20220113017A (en) * 2021-02-05 2022-08-12 주식회사 야스 Split-type substrate holding device capable of multi-model correspondence with front-end contactless substrates

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546768B2 (en) 2015-02-25 2020-01-28 Corning Incorporated Apparatus and method to electrostatically chuck substrates to a moving carrier
KR20170128915A (en) * 2016-05-16 2017-11-24 세메스 주식회사 Apparatus and Method for holding a substrate
KR20220015137A (en) * 2020-07-30 2022-02-08 주식회사 선익시스템 Deposition method
KR20220113017A (en) * 2021-02-05 2022-08-12 주식회사 야스 Split-type substrate holding device capable of multi-model correspondence with front-end contactless substrates

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