KR20130019379A - Photocurable composition - Google Patents
Photocurable composition Download PDFInfo
- Publication number
- KR20130019379A KR20130019379A KR1020127023630A KR20127023630A KR20130019379A KR 20130019379 A KR20130019379 A KR 20130019379A KR 1020127023630 A KR1020127023630 A KR 1020127023630A KR 20127023630 A KR20127023630 A KR 20127023630A KR 20130019379 A KR20130019379 A KR 20130019379A
- Authority
- KR
- South Korea
- Prior art keywords
- carbon atoms
- group
- bonds
- alkyl
- black
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 83
- 239000000843 powder Substances 0.000 claims abstract description 23
- -1 oxime ester compound Chemical class 0.000 claims abstract description 19
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 12
- VYOKOQDVBBWPKO-UHFFFAOYSA-N 1-nitro-9h-carbazole Chemical group N1C2=CC=CC=C2C2=C1C([N+](=O)[O-])=CC=C2 VYOKOQDVBBWPKO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 79
- 125000004432 carbon atom Chemical group C* 0.000 claims description 52
- 125000000217 alkyl group Chemical group 0.000 claims description 32
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 21
- 125000005843 halogen group Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- 125000001424 substituent group Chemical group 0.000 claims description 12
- 239000000049 pigment Substances 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 125000000623 heterocyclic group Chemical group 0.000 claims description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 31
- 239000011347 resin Substances 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 19
- 238000000576 coating method Methods 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 230000018109 developmental process Effects 0.000 description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 238000013329 compounding Methods 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000000016 photochemical curing Methods 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VJFCXDHFYISGTE-UHFFFAOYSA-N O=[Co](=O)=O Chemical compound O=[Co](=O)=O VJFCXDHFYISGTE-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 150000003016 phosphoric acids Chemical class 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QGZHYFIQDSBZCB-UHFFFAOYSA-N (2-ethylphenyl)-(2,4,6-trimethylbenzoyl)phosphinic acid Chemical compound CCC1=CC=CC=C1P(O)(=O)C(=O)C1=C(C)C=C(C)C=C1C QGZHYFIQDSBZCB-UHFFFAOYSA-N 0.000 description 1
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- RSROEZYGRKHVMN-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.CCC(CO)(CO)CO RSROEZYGRKHVMN-UHFFFAOYSA-N 0.000 description 1
- FUQUBWCLBBUXCM-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-1-ene Chemical group CC=C.CCC(CO)(CO)CO FUQUBWCLBBUXCM-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- SEEVRZDUPHZSOX-UHFFFAOYSA-N [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(C)=NOC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- ZDBOSKRWBXIDFD-UHFFFAOYSA-N [PH3]=O.C1(=CC=CC=C1)P(C(C1=C(C=C(C=C1C)C)C)=O)C1=CC=CC=C1 Chemical class [PH3]=O.C1(=CC=CC=C1)P(C(C1=C(C=C(C=C1C)C)C)=O)C1=CC=CC=C1 ZDBOSKRWBXIDFD-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- ZUNGGJHBMLMRFJ-UHFFFAOYSA-O ethoxy-hydroxy-oxophosphanium Chemical compound CCO[P+](O)=O ZUNGGJHBMLMRFJ-UHFFFAOYSA-O 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- LXTZRIBXKVRLOA-UHFFFAOYSA-N padimate a Chemical compound CCCCCOC(=O)C1=CC=C(N(C)C)C=C1 LXTZRIBXKVRLOA-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/32—Compounds containing nitrogen bound to oxygen
- C08K5/33—Oximes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
-
- H—ELECTRICITY
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Abstract
본 발명은 고정밀의 패턴 형성을 가능하게 하고, 또한 흑백 2층 구조의 버스 전극(4a, 4b)에 있어서는 또한 언더 컷에 의한 라인 결손을 일으키지 않고 패턴의 형성을 가능하게 한 광경화성 조성물 및 그것을 이용한 흑백 2층 구조의 버스 전극을 제공한다. 본 발명의 광경화성 조성물은 무기 분말, 유기 결합제, 광중합성 단량체 및 하기 화학식 (I)로 표시되는 니트로카르바졸 구조를 갖는 옥심에스테르 화합물을 포함하는 광중합 개시제를 함유하는 것을 특징으로 한다.
Description
본 발명은 플라즈마 디스플레이 패널(이하, 「PDP」라고 약칭함)의 전면 기판에 정밀한 전극 회로를 형성하는 데 유용한 알칼리 현상형의 광경화성 조성물 및 그것을 이용하여 전극, 특히 흑백 2층 구조의 버스 전극에서의 흑색층(하층)을 형성한 PDP에 관한 것이다.The present invention relates to an alkali developing photocurable composition useful for forming a precise electrode circuit on a front substrate of a plasma display panel (hereinafter abbreviated as " PDP ") and an electrode, in particular a bus electrode having a monochrome two-layer structure. The PDP which formed the black layer (lower layer) of this invention is related.
PDP는 플라즈마 방전에 의한 발광을 이용하여 영상이나 정보의 표시를 행하는 평면 디스플레이이다. PDP에 의한 컬러 표시의 원리는, 리브(격벽)에 의해 이격된 전면 유리 기판과 배면 유리 기판에 형성된 대향하는 양쪽 전극간의 셀 공간(방전 공간) 내에서 플라즈마 방전을 생기게 하여, 각 셀 공간 내에 봉입되어 있는 He, Xe 등의 가스의 방전에 의해 발생하는 자외선으로 배면 유리 기판 내면에 형성된 형광체를 여기하여 3원색의 가시광을 발생시키는 것이다. 각 셀 공간은 현재 주류로 되어 있는 AC형 PDP에 있어서는 기판면에 평행하게 줄지어 설치된 리브에 의해 구획된다. 이하, 도면을 참조하면서 설명한다.A PDP is a flat panel display which displays an image or information using light emission by plasma discharge. The principle of the color display by the PDP is to generate plasma discharge in the cell space (discharge space) between the opposing electrodes formed on the front glass substrate and the back glass substrate spaced by the ribs (bulk walls), and to enclose in each cell space. Ultraviolet rays generated by the discharge of gases such as He and Xe excite the phosphor formed on the inner surface of the rear glass substrate to generate three primary colors of visible light. Each cell space is partitioned by ribs arranged in parallel with the substrate surface in the AC PDP which is currently mainstream. A description with reference to the drawings is as follows.
도 1은 풀 컬러 표시의 3전극 구조의 면 방전 방식 PDP의 구조예를 부분적으로 도시하고 있다. 전면 유리 기판(1)의 하면에는 방전을 위한 투명 전극(3a 또는 3b)과, 이 투명 전극의 라인 저항을 낮추기 위한 버스 전극(4a 또는 4b)을 포함하는 한쌍의 표시 전극(2a, 2b)이 소정의 피치로 다수 줄지어 설치되어 있다. 이들 표시 전극(2a, 2b) 상에는 전하를 축적하기 위한 투명 유전체층(5)(저융점 유리)이 인쇄, 소성에 의해 형성되고, 그 위에 보호층(MgO)(6)이 증착되어 있다.Fig. 1 partially shows a structural example of a surface discharge type PDP of a three-electrode structure in full color display. The lower surface of the
한편, 배면 유리 기판(11) 상에는 방전 공간을 구획하는 스트라이프상의 리브(격벽)(12)와 각 방전 공간 내에 배치된 어드레스 전극(데이터 전극)(13)이 소정의 피치로 다수 줄지어 설치되어 있다. 또한, 각 방전 공간의 내면에는 적색(14a), 청색(14b), 녹색(14c)의 3색의 형광체막이 규칙적으로 배치되어 있다. 풀 컬러 표시에 있어서는, 이들 적색, 청색, 녹색의 3원색의 형광체막(14a, 14b, 14c)으로 1개의 화소가 구성된다.On the other hand, on the
상기 구조의 PDP에서는 한쌍의 표시 전극(2a와 2b)의 사이에 교류의 펄스 전압을 인가하고, 동일 기판 상의 전극간에서 방전시키기 때문에 「면 방전 방식」이라고 불리고 있다. 또한, 방전에 의해 발생한 자외선은 배면 기판(11)의 형광체막(14a, 14b, 14c)을 여기하고, 발생한 가시광을 전면 유리 기판(1)의 투명 전극(3a, 3b)을 투과하여 보는 구조로 되어 있다(반사형).In the PDP having the above structure, an alternating pulse voltage is applied between the pair of
버스 전극(4a, 4b)의 형성은, 종래 Cr-Cu-Cr의 3층을 증착이나 스퍼터링에 의해 성막한 후, 포토리소그래피법으로 패터닝이 행해져 왔다. 그러나, 공정수가 많아 고비용이 되므로, 최근에는 은 페이스트 등의 도전성 페이스트를 스크린 인쇄한 후 소성하는 방법, 또는 150 ㎛ 이하의 선폭으로 하기 위해서는 감광성 도전성 페이스트를 도포하고, 패턴 마스크를 통하여 노광한 후, 현상하고, 이어서 소성하는 방법이 행해지고 있다.In the formation of the
최근, 화면의 콘트라스트를 향상시키기 위하여, 버스 전극을 형성할 때, 표시측이 되는 하층에 도전성이 떨어지는 흑색 도전성 페이스트의 흑색층을 인쇄하고, 그 위에 도전성이 좋은 은 페이스트의 백색층을 인쇄하여 흑백 2층 구조의 전극을 형성하는 경우가 있다(예를 들면, 특허문헌 1 등 참조).Recently, in order to improve the contrast of the screen, when forming the bus electrode, a black layer of black conductive paste having poor conductivity is printed on the lower layer serving as the display side, and a white layer of good conductive silver paste is printed thereon The electrode of a two-layer structure may be formed (for example, refer
그러나, 이러한 흑백 2층 구조의 형태에서는 백색층의 광투과성이 부족하기 때문에, 하층인 흑색층의 충분한 광경화를 행할 수 없어, 현상 후 백색층의 라인 폭에 대하여 흑색층의 라인 폭이 극단적으로 작아진다고(언더 컷) 하는 문제점이 발생하고 있었다.However, in the form of such a black and white two-layer structure, since the light transmittance of the white layer is insufficient, sufficient photocuring of the lower black layer cannot be performed, and the line width of the black layer is extremely extreme with respect to the line width of the white layer after development. The problem of becoming small (undercut) has arisen.
본 발명은 상기 과제를 감안하여 이루어진 것이며, 그 목적은 고정밀의 패턴 형성을 가능하게 하고, 또한 흑백 2층 구조의 버스 전극에 있어서 또한 언더 컷에 의한 라인 결손을 일으키지 않고 패턴의 형성을 가능하게 한 광경화성 조성물을 제공하는 데에 있다.This invention is made | formed in view of the said subject, The objective was to enable the formation of a pattern with high precision, and also to form the pattern in the bus electrode of a black-and-white two-layer structure without making the line defect by undercut. It is to provide a photocurable composition.
상기 목적을 달성하기 위하여, 본 발명의 일 형태에 따르면, 무기 분말, 유기 결합제, 광중합성 단량체 및 하기 화학식 (I)로 표시되는 니트로카르바졸 구조를 갖는 옥심에스테르 화합물을 포함하는 광중합 개시제를 함유하는 것을 특징으로 하는 광경화성 조성물이 제공된다. 이에 따라, 언더 컷을 감소시킨 흑백 2층 구조 버스 전극을 형성할 수 있다.In order to achieve the above object, according to one embodiment of the present invention, an inorganic powder, an organic binder, a photopolymerizable monomer, and a photopolymerization initiator containing an oxime ester compound having a nitrocarbazole structure represented by the following general formula (I) There is provided a photocurable composition. Thereby, the black-and-white two-layer structure bus electrode which reduced the undercut can be formed.
(식 중, R1은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 CN을 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 OR11, COR11, SR11, NR12R13, -NCOR12-OCOR13, CN, 할로겐 원자, -CR11=CR12R13 또는 -CO-CR11=CR12R13으로 더 치환될 수도 있고, R11, R12 및 R13은 각각 독립적으로 수소 원자, 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 탄소수 2 내지 20의 복소환기를 나타내고,Wherein R 1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or CN, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are OR 11 , COR 11 , SR 11 , NR 12 R 13 , -NCOR 12 -OCOR 13 , CN, a halogen atom, -CR 11 = CR 12 R 13 or -CO-CR 11 = CR 12 R 13 may be further substituted, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms,
R2는 R21 또는 OR21을 나타내고, R21은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 할로겐 원자로 더 치환될 수도 있고, R3은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고,R 2 represents R 21 or OR 21 , R 21 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are May be further substituted with a halogen atom, R 3 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms,
R1, R3, R11, R12 및 R13으로 표시되는 치환기의 알킬렌 부분의 메틸렌기는 불포화 결합, 에테르 결합, 티오에테르 결합, 에스테르 결합, 티오에스테르 결합, 아미드 결합 또는 우레탄 결합에 의해 1 내지 5회 중단될 수도 있고, 상기 치환기의 알킬 부분은 분지측쇄가 있을 수도 있고, 환상 알킬일 수도 있고, 상기 치환기의 알킬 말단은 불포화 결합일 수도 있고, R3은 인접하는 벤젠환과 하나가 되어 환을 형성할 수도 있고,The methylene group of the alkylene moiety of the substituent represented by R 1 , R 3 , R 11 , R 12 and R 13 is selected from the group consisting of unsaturated bonds, ether bonds, thioether bonds, ester bonds, thioester bonds, amide bonds or urethane bonds. Or may be interrupted 5 times, the alkyl moiety of the substituent may have a branched side chain, cyclic alkyl, the alkyl terminal of the substituent may be an unsaturated bond, and R 3 becomes one with an adjacent benzene ring to ring Can form a
R4 및 R5는 각각 독립적으로 R21, OR21, CN 또는 할로겐 원자를 나타내고, a 및 b는 각각 독립적으로 0 내지 3임)R 4 and R 5 each independently represent R 21 , OR 21 , CN or a halogen atom, and a and b are each independently 0 to 3)
본 발명의 광경화성 조성물에 따르면, 고정밀의 패턴 형성을 가능하게 하고, 또한 흑백 2층 구조의 버스 전극에 있어서는 또한 언더 컷 감소를 실현할 수 있다.According to the photocurable composition of this invention, high-precision pattern formation is attained and undercut reduction can be implement | achieved further in the bus electrode of a black-and-white two-layer structure.
도 1은 면 방전 방식의 AC형 PDP의 부분 분해 사시도.
도 2는 흑백 2층의 버스 전극의 형성 공정의 일례를 도시하는 개략 부분 단면도.1 is a partially exploded perspective view of an AC type PDP of a surface discharge method.
2 is a schematic partial cross-sectional view showing one example of a process of forming a bus electrode of two black and white layers.
본 발명의 발명자들은 흑백 2층 구조의 버스 전극의 형성에 있어서, 무기 분말, 유기 결합제, 광중합성 단량체 및 상기 화학식 (I)로 표시되는 니트로카르바졸 구조를 갖는 옥심에스테르 화합물을 포함하는 광중합 개시제를 포함하는 광경화성 조성물을 이용함으로써 언더 컷을 억제한 패턴 형성이 가능해지는 것을 발견하고, 본 발명을 완성하기에 이르렀다.The inventors of the present invention provide a photopolymerization initiator comprising an oxime ester compound having an inorganic powder, an organic binder, a photopolymerizable monomer and a nitrocarbazole structure represented by the formula (I) in the formation of a black and white two-layer bus electrode. By using the photocurable composition containing, it discovered that pattern formation which suppressed the undercut was attained, and came to complete this invention.
이하, 본 실시 형태의 광경화성 조성물에 대하여 상세하게 설명한다.Hereinafter, the photocurable composition of this embodiment is demonstrated in detail.
우선, 흑백 2층 구조의 버스 전극의 흑색 피막층(하층)에 이용되는 광경화성 조성물(이하, 「흑색층용 조성물」이라고 함)에 대하여 상세하게 설명한다.First, the photocurable composition (henceforth a "composition for a black layer") used for the black film layer (lower layer) of the bus electrode of a black-and-white two-layer structure is demonstrated in detail.
본 실시 형태의 광경화성 조성물에 이용되는 무기 분말은 전극 패턴의 용도에 따라 상이하며, 흑색층용 조성물로서 이용하는 경우에는 흑색 안료가 이용된다.The inorganic powder used for the photocurable composition of this embodiment changes with the use of an electrode pattern, and when using as a composition for black layers, a black pigment is used.
본 실시 형태의 흑색층용 조성물에 이용되는 흑색 안료로서는, 후술하는 소성 공정에서 300 내지 600℃라고 하는 고온 소성을 행하기 때문에, 고온에서의 색조 안정성을 갖는 무기 안료를 이용하는 것이 바람직하다. 구체적으로는, 예를 들면 Cu, Fe, Cr, Mn, Co, Ni, Ru, La, Sr 등의 단독 금속 산화물 및/또는 금속 원소 2종 이상을 포함하는 복합 산화물을 포함하는 흑색 안료를 들 수 있다. 특히, 구리-크롬계 흑색 복합 산화물, 구리-철계 흑색 복합 산화물, 사삼산화코발트(Co3O4) 등은 소성 후에 형성되는 흑색 피막이 치밀한 것이 되며, 색조가 우수하기 때문에 바람직하게 이용된다. 이것들은 단독으로 또는 2종 이상을 조합하여 이용할 수 있다.As black pigment used for the composition for black layers of this embodiment, since high temperature baking of 300-600 degreeC is performed at the baking process mentioned later, it is preferable to use the inorganic pigment which has the color tone stability at high temperature. Specifically, for example, a black pigment containing a single metal oxide such as Cu, Fe, Cr, Mn, Co, Ni, Ru, La, Sr and / or a composite oxide containing two or more metal elements may be mentioned. have. In particular, copper-chromium black composite oxide, copper-iron black composite oxide, cobalt trioxide (Co 3 O 4 ), etc. are preferably used because the black film formed after firing is dense and has excellent color tone. These can be used individually or in combination of 2 or more types.
이러한 흑색 안료의 평균 입경(D50)으로서는 2 ㎛ 이하의 것이 바람직하다. 평균 입경이 2 ㎛ 이하이면, 소량의 첨가로도 밀착성 등을 손상시키지 않고 치밀한 소성 피막을 형성할 수 있고, 충분한 층간 도전성(투명 전극과 버스 전극 백색층의 층간 도통) 및 흑색도를 동시에 만족할 수 있다. 한편, 평균 입경이 2 ㎛보다도 커지면, 소성 피막의 치밀성이 나빠져 형성되는 흑색 전극 패턴의 흑색도가 저하하기 쉽다. 또한, 0.01 ㎛보다 작아지면 은폐력이 저하하여 투명감이 나타나는 경우가 있기 때문에, 보다 바람직하게는 0.01 내지 1 ㎛이다.As average particle diameter (D50) of such a black pigment, the thing of 2 micrometers or less is preferable. When the average particle diameter is 2 μm or less, a dense plastic film can be formed without impairing adhesion or the like even with a small amount of addition, and satisfies sufficient interlayer conductivity (interlayer conduction between the transparent electrode and the bus electrode white layer) and blackness at the same time. have. On the other hand, when an average particle diameter is larger than 2 micrometers, the blackness of the black electrode pattern formed by worsening the compactness of a plastic film will fall easily. Moreover, when smaller than 0.01 micrometer, hiding power may fall and transparency may appear, More preferably, it is 0.01-1 micrometer.
또한, 이러한 흑색 안료의 배합량으로서는, 유기 결합제 100 질량부당 10 내지 100 질량부의 범위가 바람직하다. 상기 범위보다 적은 경우, 소성 후에 충분한 흑색이 얻어지지 않는다. 한편, 상기 범위보다 많은 경우, 광투과성이 저하하고, 언더 컷이 생기기 쉬워진다. 보다 바람직하게는 50 내지 100 질량부이다.Moreover, as a compounding quantity of such a black pigment, the range of 10-100 mass parts per 100 mass parts of organic binders is preferable. If less than the above range, sufficient black color is not obtained after firing. On the other hand, when there is more than the said range, light transmittance falls and it will become easy to produce an undercut. More preferably, it is 50-100 mass parts.
또한, 무기 분말로서 소성 후의 기판에의 밀착성 향상을 위하여, 필요에 따라 유리 프릿을 배합할 수 있다. 이러한 유리 프릿으로서는 유리 전이점(Tg)이 300 내지 500℃, 유리 연화점(Ts)이 400 내지 600℃인 저융점 유리 분말인 것이 바람직하며, 산화납, 산화비스무트, 산화아연, 산화리튬 또는 알칼리붕규산염을 주성분으로 하는 것이 바람직하게 이용된다.Moreover, a glass frit can be mix | blended as needed in order to improve the adhesiveness to the board | substrate after baking as an inorganic powder. The glass frit is preferably a low melting glass powder having a glass transition point (Tg) of 300 to 500 ° C. and a glass softening point (Ts) of 400 to 600 ° C., and lead oxide, bismuth oxide, zinc oxide, lithium oxide, or alkali boron. What has a silicate as a main component is used preferably.
산화납을 주성분으로 하는 바람직한 예로서는, 산화물 기준의 질량％로 PbO가 48 내지 82％, B2O3이 0.5 내지 22％, SiO2가 3 내지 32％, Al2O3이 0 내지 12％, BaO가 0 내지 15％, TiO2가 0 내지 2.5％, Bi2O3이 0 내지 25％의 조성을 갖고, 연화점이 420 내지 580℃인 비정질성 프릿을 들 수 있다.Preferred examples of a main component of lead oxide, PbO 48 to 82% by mass of the oxide basis, B 2 O 3 is 0.5 to 22%, the SiO 2 is from 3 to 32%, Al 2 O 3 0 to 12%, An amorphous frit having a composition of 0 to 15% of BaO, 0 to 2.5% of TiO 2 , and 0 to 25% of Bi 2 O 3 , and a softening point of 420 to 580 ° C.
또한, 산화비스무트를 주성분으로 하는 바람직한 예로서는, 산화물 기준의 질량％로 Bi2O3이 6 내지 88％, B2O3이 5 내지 30％, SiO2가 5 내지 25％, Al2O3이 0 내지 5％, BaO가 0 내지 20％, ZnO가 1 내지 20％의 조성을 갖고, 연화점이 420 내지 580℃인 비정질성 프릿을 들 수 있다.In addition, as a preferable example containing bismuth oxide as a main component, Bi 2 O 3 is 6 to 88%, B 2 O 3 is 5 to 30%, SiO 2 is 5 to 25%, and Al 2 O 3 is the mass% of the oxide basis. An amorphous frit having a composition of 0 to 5%, BaO of 0 to 20%, ZnO of 1 to 20%, and a softening point of 420 to 580 ° C.
또한, 산화아연을 주성분으로 하는 바람직한 예로서는, 산화물 기준의 질량％로 ZnO가 25 내지 60％, K2O가 2 내지 15％, B2O3이 25 내지 45％, SiO2가 1 내지 7％, Al2O3이 0 내지 10％, BaO가 0 내지 20％, MgO가 0 내지 10％의 조성을 갖고, 연화점이 420 내지 580℃인 비정질성 프릿을 들 수 있다.Moreover, as a preferable example which has zinc oxide as a main component, ZnO is 25 to 60%, K 2 O is 2 to 15%, B 2 O 3 is 25 to 45%, SiO 2 is 1 to 7% by mass% on the basis of oxide. And amorphous frits having a composition of Al 2 O 3 of 0 to 10%, BaO of 0 to 20%, and MgO of 0 to 10%, and having a softening point of 420 to 580 ° C.
이러한 유리 프릿의 배합량은, 유기 결합제 100 질량부당 200부 이하, 바람직하게는 100부 이하의 비율로 배합할 수 있다.The compounding quantity of this glass frit can be mix | blended in the ratio of 200 parts or less, preferably 100 parts or less per 100 mass parts of organic binders.
본 실시 형태의 흑색층용 조성물에 이용되는 유기 결합제로서는 카르복실기를 함유하는 수지, 구체적으로는 그 자체가 에틸렌성 불포화 이중 결합을 갖는 카르복실기 함유 감광성 수지 및 에틸렌성 불포화 이중 결합을 갖지 않는 카르복실기 함유 수지 모두가 사용 가능하다. 바람직하게 사용할 수 있는 수지(올리고머 및 중합체 중 어느 것이라도 좋음)로서는, 이하와 같은 것을 들 수 있다.As an organic binder used for the composition for black layers of this embodiment, both the resin containing a carboxyl group, specifically, the carboxyl group-containing photosensitive resin which has itself an ethylenically unsaturated double bond, and the carboxyl group-containing resin which does not have an ethylenically unsaturated double bond are used. Can be used Examples of the resin that can be preferably used include any of oligomers and polymers.
(1) 불포화 카르복실산과 불포화 이중 결합을 갖는 화합물을 공중합시킴으로써 얻어지는 카르복실기 함유 수지.(1) Carboxyl group containing resin obtained by copolymerizing unsaturated carboxylic acid and the compound which has an unsaturated double bond.
(2) 불포화 카르복실산과 불포화 이중 결합을 갖는 화합물의 공중합체에 에틸렌성 불포화기를 팬던트로서 부가시킴으로써 얻어지는 카르복실기 함유 감광성 수지.(2) The carboxyl group-containing photosensitive resin obtained by adding an ethylenically unsaturated group as a pendant to the copolymer of an unsaturated carboxylic acid and the compound which has an unsaturated double bond.
(3) 에폭시기와 불포화 이중 결합을 갖는 화합물과 불포화 이중 결합을 갖는 화합물의 공중합체에 불포화 카르복실산을 반응시키고, 생성된 2급 수산기에 다염기산 무수물을 반응시켜 얻어지는 카르복실기 함유 감광성 수지.(3) The carboxyl group-containing photosensitive resin obtained by making an unsaturated carboxylic acid react with the copolymer of the compound which has an epoxy group and an unsaturated double bond, and the compound which has an unsaturated double bond, and makes a polybasic acid anhydride react with the produced | generated secondary hydroxyl group.
(4) 불포화 이중 결합을 갖는 산 무수물과 불포화 이중 결합을 갖는 화합물의 공중합체에 수산기와 불포화 이중 결합을 갖는 화합물을 반응시켜 얻어지는 카르복실기 함유 감광성 수지.(4) The carboxyl group-containing photosensitive resin obtained by making the copolymer of the acid anhydride which has an unsaturated double bond, and the compound which has an unsaturated double bond react with the compound of a hydroxyl group and an unsaturated double bond.
(5) 에폭시 화합물과 불포화 모노카르복실산을 반응시키고, 생성된 2급 수산기에 다염기산 무수물을 반응시켜 얻어지는 카르복실기 함유 감광성 수지.(5) The carboxyl group-containing photosensitive resin obtained by making an epoxy compound and unsaturated monocarboxylic acid react, and making a produced secondary hydroxyl group react with polybasic acid anhydride.
(6) 불포화 이중 결합을 갖는 화합물과 글리시딜(메트)아크릴레이트의 공중합체의 에폭시기에, 1분자 중에 1개의 카르복실기를 갖고 에틸렌성 불포화 결합을 갖지 않는 유기산을 반응시키고, 생성된 2급 수산기에 다염기산 무수물을 반응시켜 얻어지는 카르복실기 함유 수지.(6) An epoxy group of a copolymer of a compound having an unsaturated double bond and a glycidyl (meth) acrylate is reacted with an organic acid having one carboxyl group in one molecule and not having an ethylenically unsaturated bond, and the resulting secondary hydroxyl group Carboxyl group-containing resin obtained by making polybasic acid anhydride react.
(7) 수산기 함유 중합체에 다염기산 무수물을 반응시켜 얻어지는 카르복실기 함유 수지.(7) Carboxyl group-containing resin obtained by making polybasic acid anhydride react with a hydroxyl-containing polymer.
(8) 수산기 함유 중합체에 다염기산 무수물을 반응시켜 얻어지는 카르복실기 함유 수지에, 에폭시기와 불포화 이중 결합을 갖는 화합물을 더 반응시켜 얻어지는 카르복실기 함유 감광성 수지.(8) The carboxyl group-containing photosensitive resin obtained by making the compound which has an epoxy group and an unsaturated double bond further react with the carboxyl group-containing resin obtained by making polybasic acid anhydride react with a hydroxyl-containing polymer.
또한, 본 명세서 중에 있어서, (메트)아크릴레이트란 아크릴레이트, 메타크릴레이트 및 그들의 혼합물을 총칭하는 용어이며, 다른 유사한 표현에 대해서도 마찬가지이다.In addition, in this specification, (meth) acrylate is a term which generically mentions acrylate, methacrylate, and mixtures thereof, and the same also about other similar expression.
이러한 카르복실기 함유 수지는 단독으로 또는 혼합하여 이용할 수도 있지만, 어느 경우라도 이것들은 합계로 조성물 전량의 10 내지 80 질량％의 비율로 배합하는 것이 바람직하다. 배합량이 상기 범위보다도 지나치게 적은 경우, 형성하는 피막 중의 상기 수지의 분포가 불균일해지기 쉽고, 충분한 광경화성 및 광경화 심도가 얻어지기 어렵고, 선택적 노광, 현상에 의한 패터닝이 곤란해진다. 한편, 상기 범위보다도 지나치게 많으면, 소성시의 패턴의 비틀림이나 선폭 수축을 일으키기 쉬워진다.Although these carboxyl group-containing resin can be used individually or in mixture, in any case, it is preferable to mix these in the ratio of 10-80 mass% of the composition whole quantity in total. When the compounding amount is too small than the above range, the distribution of the resin in the film to be formed is likely to be nonuniform, and sufficient photocurability and photocuring depth are hardly obtained, and patterning by selective exposure and development becomes difficult. On the other hand, when there is too much more than the said range, it will become easy to produce the distortion of a pattern at the time of baking, and shrinkage of a line width.
이러한 카르복실기 함유 수지의 중량 평균 분자량으로서는 각각 1,000 내지 100,000인 것임이 바람직하다. 분자량이 1,000보다 낮은 경우, 현상시의 피막의 밀착성에 악영향을 준다. 한편, 100,000보다도 높은 경우, 현상 불량을 일으키기 쉬워진다. 보다 바람직하게는 5,000 내지 70,000의 범위이다.As a weight average molecular weight of such carboxyl group-containing resin, it is preferable that it is 1,000-100,000, respectively. When the molecular weight is lower than 1,000, it adversely affects the adhesion of the film during development. On the other hand, when it is higher than 100,000, it will become easy to produce developing defect. More preferably, it is the range of 5,000-70,000.
또한, 카르복실기 함유 수지의 산가로서는 각각 50 내지 250 mgKOH/g의 범위인 것이 바람직하다. 산가가 50 mgKOH/g보다 낮은 경우, 알칼리 수용액에 대한 용해성이 불충분하여 현상 불량을 일으키기 쉬워진다. 한편, 250 mgKOH/g보다 높은 경우, 현상시에 피막의 밀착성의 열화나 광경화부(노광부)의 용해가 생기기 쉬워진다.Moreover, as an acid value of carboxyl group-containing resin, it is preferable that it is the range of 50-250 mgKOH / g, respectively. When the acid value is lower than 50 mgKOH / g, the solubility in an aqueous alkali solution is insufficient, which tends to cause poor development. On the other hand, when it is higher than 250 mgKOH / g, deterioration of the adhesiveness of a film and dissolution of a photocurable part (exposure part) easily arise at the time of image development.
또한, 카르복실기 함유 감광성 수지의 경우에는, 그의 이중 결합 당량이 350 내지 2,000인 것이 바람직하다. 이중 결합 당량이 350보다도 작은 경우, 소성시에 잔사가 남기 쉬워진다. 한편, 2,000보다도 큰 경우, 현상시의 작업 여유도가 좁고, 또한 광경화시에 고노광량을 필요로 한다. 보다 바람직하게는 400 내지 1,500의 것이다.Moreover, in the case of carboxyl group-containing photosensitive resin, it is preferable that the double bond equivalent is 350-2,000. When the double bond equivalent is smaller than 350, residues tend to remain during firing. On the other hand, when larger than 2,000, the work margin at the time of image development is narrow, and high exposure amount is required at the time of photocuring. More preferably, it is 400-1500.
본 실시 형태의 흑색층용 조성물에 이용되는 광중합성 단량체는, 조성물의 광경화성의 촉진 및 현상성을 향상시키기 위하여 이용된다. 이러한 광중합성 단량체로서는, 예를 들면 2-히드록시에틸아크릴레이트, 2-히드록시프로필아크릴레이트, 디에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 폴리에틸렌글리콜디아크릴레이트, 폴리우레탄디아크릴레이트, 트리메틸올프로판트리아크릴레이트, 펜타에리트리톨트리아크릴레이트, 펜타에리트리톨테트라아크릴레이트, 트리메틸올프로판에틸렌옥사이드 변성 트리아크릴레이트, 트리메틸올프로판프로필렌옥사이드 변성 트리아크릴레이트, 디펜타에리트리톨펜타아크릴레이트, 디펜타에리트리톨헥사아크릴레이트 및 상기 아크릴레이트에 대응하는 각 메타크릴레이트류; 프탈산, 아디프산, 말레산, 이타콘산, 숙신산, 트리멜리트산, 테레프탈산 등의 다염기산과 히드록시알킬(메트)아크릴레이트와의 모노-, 디-, 트리- 또는 그 이상의 폴리에스테르 등을 들 수 있지만, 특정한 것에 한정되는 것이 아니며, 또한 이것들을 단독으로 또는 2종 이상을 조합하여 이용할 수 있다. 이들 광중합성 단량체 중에서도 1분자 중에 2개 이상의 (메트)아크릴로일기를 갖는 다관능 단량체가 바람직하다.The photopolymerizable monomer used for the composition for black layers of this embodiment is used in order to promote the photocurability of a composition, and to improve developability. Examples of such photopolymerizable monomers include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, and polyurethane diacrylate. , Trimethylol propane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropanepropylene oxide modified triacrylate, dipentaerythritol pentaacrylate, Dipentaerythritol hexaacrylate and respective methacrylates corresponding to the acrylates; Mono-, di-, tri- or more polyesters of polybasic acids such as phthalic acid, adipic acid, maleic acid, itaconic acid, succinic acid, trimellitic acid and terephthalic acid with hydroxyalkyl (meth) acrylates. However, it is not limited to a specific thing, Moreover, these can be used individually or in combination of 2 or more types. Among these photopolymerizable monomers, the polyfunctional monomer which has two or more (meth) acryloyl groups in 1 molecule is preferable.
이러한 광중합성 단량체의 배합량은, 유기 결합제 100 질량부당 20 내지 100 질량부가 적당하다. 배합량이 20 질량부보다도 적은 경우, 조성물의 충분한 광경화성이 얻어지기 어려워지고, 한편 100 질량부를 초과하여 다량이 되면, 피막 표면부의 광경화가 그 심부에 비하여 빨라지기 때문에 경화 불균일을 일으키기 쉬워진다.20-100 mass parts is suitable for the compounding quantity of such a photopolymerizable monomer per 100 mass parts of organic binders. When the blending amount is less than 20 parts by mass, sufficient photocurability of the composition is difficult to be obtained. On the other hand, when the amount exceeds 100 parts by mass, the photocuring of the surface portion of the coating is faster than that of the deeper portion, so that curing unevenness is likely to occur.
본 실시 형태의 흑색층용 조성물에 이용되는 광중합 개시제로서는, 하기 화학식 (I)로 표시되는 니트로카르바졸 구조를 갖는 옥심에스테르 화합물을 이용하는 것이 중요하다. 하기 화학식 (I)로 표시되는 옥심에스테르 화합물은 고감도이기 때문에, 광투과성이 부족한 백색층 밑에 있어도 충분한 광경화를 행할 수 있고, 언더 컷의 발생을 억제할 수 있다.As a photoinitiator used for the composition for black layers of this embodiment, it is important to use the oxime ester compound which has the nitrocarbazole structure represented by following General formula (I). Since the oxime ester compound represented by the following general formula (I) is highly sensitive, sufficient photocuring can be performed even under a white layer lacking light transparency, and the occurrence of undercut can be suppressed.
(식 중, R1은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 CN을 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 OR11, COR11, SR11, NR12R13, -NCOR12-OCOR13, CN, 할로겐 원자, -CR11=CR12R13 또는 -CO-CR11=CR12R13으로 더 치환될 수도 있고, R11, R12 및 R13은 각각 독립적으로 수소 원자, 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 탄소수 2 내지 20의 복소환기를 나타내고,Wherein R 1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or CN, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are OR 11 , COR 11 , SR 11 , NR 12 R 13 , -NCOR 12 -OCOR 13 , CN, a halogen atom, -CR 11 = CR 12 R 13 or -CO-CR 11 = CR 12 R 13 may be further substituted, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms,
R2는 R21 또는 OR21을 나타내고, R21은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 할로겐 원자로 더 치환될 수도 있고, R3은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고,R 2 represents R 21 or OR 21 , R 21 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are May be further substituted with a halogen atom, R 3 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms,
R1, R3, R11, R12 및 R13으로 표시되는 치환기의 알킬렌 부분의 메틸렌기는 불포화 결합, 에테르 결합, 티오에테르 결합, 에스테르 결합, 티오에스테르 결합, 아미드 결합 또는 우레탄 결합에 의해 1 내지 5회 중단될 수도 있고, 상기 치환기의 알킬 부분은 분지측쇄가 있을 수도 있고, 환상 알킬일 수도 있고, 상기 치환기의 알킬 말단은 불포화 결합일 수도 있고, R3은 인접하는 벤젠환과 하나가 되어 환을 형성할 수도 있고,The methylene group of the alkylene moiety of the substituent represented by R 1 , R 3 , R 11 , R 12 and R 13 is selected from the group consisting of unsaturated bonds, ether bonds, thioether bonds, ester bonds, thioester bonds, amide bonds or urethane bonds. Or may be interrupted 5 times, the alkyl moiety of the substituent may have a branched side chain, cyclic alkyl, the alkyl terminal of the substituent may be an unsaturated bond, and R 3 becomes one with an adjacent benzene ring to ring Can form a
R4 및 R5는 각각 독립적으로 R21, OR21, CN 또는 할로겐 원자를 나타내고, a 및 b는 각각 독립적으로 0 내지 3임)R 4 and R 5 each independently represent R 21 , OR 21 , CN or a halogen atom, and a and b are each independently 0 to 3)
이러한 광중합 개시제의 배합량은, 유기 결합제 100 질량부에 대하여 0.5 내지 20 질량부가 바람직하다. 0.5 질량부 미만이면, 조성물의 충분한 광경화성이 얻어지기 어려워진다. 한편, 20 질량부를 초과하면, 피막 표면부의 광경화가 그 심부에 비하여 빨라지기 때문에 경화 불균일을 일으키기 쉬워진다. 보다 바람직하게는 1 내지 10 질량부이다.As for the compounding quantity of such a photoinitiator, 0.5-20 mass parts is preferable with respect to 100 mass parts of organic binders. If it is less than 0.5 mass part, sufficient photocurability of a composition will become difficult to be obtained. On the other hand, when 20 mass parts is exceeded, since photocuring of a film surface part becomes quick compared with the core part, hardening unevenness becomes easy to occur. More preferably, it is 1-10 mass parts.
또한, 필요에 따라 상기 광중합 개시제와 함께 다른 광중합 개시제, 증감제 등을 배합할 수 있다.In addition, other photopolymerization initiators, sensitizers, and the like can be blended with the photopolymerization initiator as necessary.
이러한 광중합 개시제로서는, 예를 들면 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르 등의 벤조인과 벤조인알킬에테르류; 아세토페논, 2,2-디메톡시-2-페닐아세토페논, 2,2-디에톡시-2-페닐아세토페논, 1,1-디클로로아세토페논 등의 아세토페논류; 2-메틸-1-[4-(메틸티오)페닐]-2-모르폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르폴리노페닐)-부타논-1, 2-(디메틸아미노)-2-[(4-메틸페닐)메틸]-1-[4-(4-모르폴리닐)페닐]-1-부타논 등의 아미노아세토페논류; 2-메틸안트라퀴논, 2-에틸안트라퀴논, 2-t-부틸안트라퀴논, 1-클로로안트라퀴논 등의 안트라퀴논류; 2,4-디메틸티오크산톤, 2,4-디에틸티오크산톤, 2-클로로티오크산톤, 2,4-디이소프로필티오크산톤 등의 티오크산톤류; 아세토페논디메틸케탈, 벤질디메틸케탈 등의 케탈류; 벤조페논 등의 벤조페논류; 또는 크산톤류; (2,6-디메톡시벤조일)-2,4,4-펜틸포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드, 2,4,6-트리메틸벤조일디페닐포스핀옥사이드, 에틸-2,4,6-트리메틸벤조일페닐포스피네이트 등의 포스핀옥사이드류; 1-[9-에틸-6-(2-메틸벤조일)-9H-카르바졸-9-일]-1-(o-아세틸옥심) 등의 옥심에스테르류; 각종 퍼옥사이드류 등을 들 수 있으며, 이들 광중합 개시제를 단독으로 또는 2종 이상을 조합하여 이용할 수 있다.As such a photoinitiator, For example, benzoin and benzoin alkyl ether, such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether; Acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone and 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone- Aminoacetophenones such as 1, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone; Anthraquinones such as 2-methyl anthraquinone, 2-ethyl anthraquinone, 2-t-butyl anthraquinone, and 1-chloro anthraquinone; Thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-diisopropylthioxanthone; Ketal such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Benzophenones such as benzophenone; Or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphineoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine Phosphine oxides such as oxides and ethyl-2,4,6-trimethylbenzoylphenylphosphinate; Oxime esters such as 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-9-yl] -1- (o-acetyl oxime); Various peroxides etc. can be mentioned, These photoinitiators can be used individually or in combination of 2 or more types.
또한, 증감제로서는, 예를 들면 N,N-디메틸아미노벤조산 에틸에스테르, N,N-디메틸아미노벤조산 이소아밀에스테르, 펜틸-4-디메틸아미노벤조에이트, 트리에틸아민, 트리에탄올아민 등의 3급 아민류와 같은 광증감제를 들 수 있으며, 이들 증감제를 1종 또는 2종 이상과 조합하여 이용할 수 있다.As the sensitizer, tertiary amines such as N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine and triethanolamine, for example. And photosensitizers such as these, and these sensitizers may be used alone or in combination with two or more kinds.
본 실시 형태의 흑색층용 조성물을 희석함으로써 페이스트화하고, 기재 등에 용이하게 도포할 수 있도록 하기 위하여 적절한 양의 용제를 배합할 수 있다.In order to make it paste by diluting the composition for black layers of this embodiment, and to make it apply | coat easily to a base material etc., an appropriate amount of solvent can be mix | blended.
이러한 용제로서는, 예를 들면 메틸에틸케톤, 시클로헥사논 등의 케톤류; 톨루엔, 크실렌, 테트라메틸벤젠 등의 방향족 탄화수소류; 셀로솔브, 메틸셀로솔브, 카르비톨, 메틸카르비톨, 부틸카르비톨, 프로필렌글리콜모노메틸에테르, 디프로필렌글리콜모노메틸에테르, 디프로필렌글리콜모노에틸에테르, 트리에틸렌글리콜모노에틸에테르 등의 글리콜에테르류; 아세트산 에틸, 아세트산 부틸, 셀로솔브아세테이트, 부틸셀로솔브아세테이트, 카르비톨아세테이트, 부틸카르비톨아세테이트, 프로필렌글리콜모노메틸에테르아세테이트, 2,2,4-트리메틸-1,3-펜탄디올모노이소부티레이트 등의 에스테르류; 에탄올, 프로판올, 에틸렌글리콜, 프로필렌글리콜, 테르피네올 등의 알코올류; 옥탄, 데칸 등의 지방족 탄화수소; 석유 에테르, 석유 나프타, 수소 첨가 석유 나프타, 솔벤트 나프타 등의 석유계 용제를 들 수 있으며, 이것들을 단독으로 또는 2종 이상을 조합하여 이용할 수 있다.As such a solvent, For example, ketones, such as methyl ethyl ketone and cyclohexanone; Aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; Glycol ethers such as cellosolve, methyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether ; Ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate, etc. Esters of; Alcohols such as ethanol, propanol, ethylene glycol, propylene glycol and terpineol; Aliphatic hydrocarbons such as octane and decane; Petroleum solvents, such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, are mentioned, These can be used individually or in combination of 2 or more types.
또한, 광경화성 수지 조성물의 보존 안정성 향상을 위하여, 무기 분말의 성분인 금속 또는 산화물 분말과의 착체화 또는 염 형성 등의 효과가 있는 화합물을 안정제로서 첨가하는 것이 바람직하다.Moreover, in order to improve the storage stability of a photocurable resin composition, it is preferable to add the compound which has an effect, such as complexing with metal or oxide powder which is a component of an inorganic powder, or salt formation, as a stabilizer.
이러한 안정제로서는 말론산, 아디프산, 포름산, 아세트산, 아세토아세트산, 시트르산, 스테아르산, 말레산, 푸마르산, 프탈산 등의 각종 유기산이나 인산, 아인산, 차아인산, 인산 메틸, 인산 에틸, 인산 부틸, 인산 페닐, 아인산 에틸, 아인산 디페닐, 모노(2-메타크릴로일옥시에틸)산 포스페이트 등의 각종 인산 화합물(무기 인산, 유기 인산), 붕산 등의 산을 들 수 있으며, 단독으로 또는 2종 이상을 조합하여 이용할 수 있다. 이러한 안정제는 무기 분말 100 질량부당 0.1 내지 10 질량부의 비율로 첨가하는 것이 바람직하다.As such stabilizers, various organic acids such as malonic acid, adipic acid, formic acid, acetic acid, acetoacetic acid, citric acid, stearic acid, maleic acid, fumaric acid and phthalic acid, phosphoric acid, phosphorous acid, hypophosphoric acid, methyl phosphate, ethyl phosphate, butyl phosphate and phosphoric acid Acids, such as various phosphoric acid compounds (inorganic phosphoric acid, organic phosphoric acid), boric acid, such as a phenyl, ethyl phosphite, a diphenyl phosphite, a phosphate mono (2-methacryloyloxyethyl) acid, can be mentioned, and it is single or 2 types or more Can be used in combination. Such stabilizer is preferably added at a ratio of 0.1 to 10 parts by mass per 100 parts by mass of the inorganic powder.
또한, 필요에 따라 히드로퀴논, 히드로퀴논모노메틸에테르, t-부틸카테콜, 피로갈롤, 페노티아진 등의 열중합 금지제, 미분 실리카, 유기 벤토나이트, 몬모릴로나이트 등의 증점제, 실리콘계, 불소계, 고분자계 등의 소포제 및/또는 레벨링제, 이미다졸계, 티아졸계, 트리아졸계 등의 실란 커플링제 등과 같은 공지된 첨가제를 배합할 수 있다.Further, if necessary, thermal polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol, phenothiazine, thickeners such as finely divided silica, organic bentonite, montmorillonite, silicone, fluorine, polymer, etc. Known additives such as antifoaming agents and / or leveling agents, silane coupling agents such as imidazole series, thiazole series, triazole series and the like can be blended.
또한, 이상 설명한 흑색층용 조성물은 블랙 매트릭스 패턴의 재료에 이용하여도 문제없이 사용할 수 있다.In addition, even if it uses for the material of a black-matrix pattern, the composition for black layers demonstrated above can be used without a problem.
다음에, 흑백 2층 구조의 버스 전극의 백색 피막층(상층)에 이용되는 광경화성 조성물(이하, 「백색층용 조성물」이라고 함)에 대하여 상세하게 설명한다.Next, the photocurable composition (henceforth a "composition for white layer") used for the white film layer (upper layer) of the bus electrode of a black-and-white two-layer structure is demonstrated in detail.
본 실시 형태의 백색층용 조성물은, 무기 분말로서 상술한 흑색층용 조성물의 흑색 안료 대신에 도전성 분말을 이용한 것 이외에는 기본적으로는 동일한 성분, 배합 비율로 되어 있다. 따라서, 본 실시 형태의 백색층용 조성물에 관하여, 상술한 흑색층용 조성물과의 상위점만을 이하에 설명한다.The composition for white layers of this embodiment is basically the same component and compounding ratio except having used electroconductive powder instead of the black pigment of the composition for black layers mentioned above as an inorganic powder. Therefore, only the difference with the composition for black layers mentioned above about the composition for white layers of this embodiment is demonstrated below.
본 실시 형태의 백색층용 조성물에 이용되는 도전성 분말로서는, 예를 들면 Ag, Au, Ni, Cu, Al, Sn, Pt, Ru 등의 단체와 그의 합금 외에, SnO2, In2O3, ITO(Indium Tin Oxide), RuO2 등을 이용할 수 있다. 이것들은 단독으로 또는 2종 이상을 조합하여 이용할 수 있다.The conductive powder used for the white layer composition of the present embodiment, for example, Ag, Au, Ni, Cu, Al, Sn, Pt, in addition to groups and alloys thereof, such as Ru, SnO 2, In 2 O 3, ITO ( Indium Tin Oxide), RuO 2 and the like can be used. These can be used individually or in combination of 2 or more types.
이러한 도전성 분말의 형상으로서는 구상, 플레이크상, 덴드라이트상 등 여러가지의 것을 이용할 수 있지만, 광 특성, 분산성을 고려하면 구상의 것을 이용하는 것이 바람직하다. 또한, 평균 입경(D50)으로서는 라인 형상의 점에서 10 ㎛ 이하의 것이 바람직하다. 보다 바람직하게는 5 ㎛ 이하의 것이다. 또한, 비표면적으로서는 0.01 내지 2.0 m2/g인 것이 바람직하다. 비표면적이 0.01 m2/g 미만인 경우, 보존시에 침강을 야기하기 쉽고, 한편 2.0 m2/g을 초과하는 경우, 흡유량이 커져 조성물의 유동성이 손상된다. 보다 바람직하게는 0.1 내지 1.0 m2/g의 것이다.Various shapes such as spherical shape, flake shape, and dendrite shape can be used as the shape of the conductive powder, but in consideration of optical properties and dispersibility, it is preferable to use spherical ones. Moreover, as average particle diameter D50, the thing of 10 micrometers or less is preferable at the point of a line shape. More preferably, it is 5 micrometers or less. Moreover, it is preferable that it is 0.01-2.0 m <2> / g as a specific surface area. When the specific surface area is less than 0.01 m 2 / g, it is easy to cause sedimentation during storage, while when the specific surface area exceeds 2.0 m 2 / g, the oil absorption amount becomes large and the fluidity of the composition is impaired. More preferably, it is 0.1-1.0 m <2> / g.
또한, 도전성 분말의 산화 방지, 조성물 내에서의 분산성 향상, 현상성의 안정화를 위하여, 특히 Ag, Ni, Al에 대해서는 지방산에 의한 처리를 행하는 것이 바람직하다. 이러한 지방산으로서는, 예를 들면 올레산, 리놀레산, 리놀렌산, 스테아르산 등을 들 수 있다.Moreover, in order to prevent the oxidation of electroconductive powder, the improvement of dispersibility in a composition, and stabilization of developability, it is preferable to perform processing with a fatty acid especially about Ag, Ni, Al. Examples of such fatty acids include oleic acid, linoleic acid, linolenic acid, stearic acid, and the like.
이러한 도전성 분말의 배합량은, 유기 결합제 100 질량부당 50 내지 2,000 질량부로 하는 것이 바람직하다. 도전 분말의 배합량이 50 질량부보다 적으면 양호한 도전성을 얻는 것이 곤란해지고, 2,000 질량부를 초과하면 페이스트화가 곤란해지는 경향이 있다.It is preferable that the compounding quantity of such electroconductive powder shall be 50-2,000 mass parts per 100 mass parts of organic binders. When the compounding quantity of an electrically conductive powder is less than 50 mass parts, it becomes difficult to obtain favorable electroconductivity, and when it exceeds 2,000 mass parts, there exists a tendency for pasting to become difficult.
본 실시 형태의 백색층용 조성물에 이용되는 광중합성 단량체로서는 흑색층용 조성물에 이용되는 광중합성 단량체를 이용할 수 있지만, 특히 소성 후의 선폭 억제의 관점에서 2관능 단량체를 이용하는 것이 바람직하다.Although the photopolymerizable monomer used for the composition for black layers can be used as a photopolymerizable monomer used for the composition for white layers of this embodiment, it is preferable to use a bifunctional monomer especially from a viewpoint of the line width suppression after baking.
본 실시 형태의 백색층용 조성물에는, 필요에 따라 흑색층용 조성물에 이용되는 광중합 개시제를 배합할 수 있다. 광중합 개시제를 임의 성분으로 한 것은, 광중합 개시제를 배합하지 않아도 경화가 진행되어 전극 패턴을 형성할 수 있기 때문이다. 이것은 후술하는 버스 전극 형성 공정에 있어서, 도포ㆍ건조 또는 노광시에 하층(흑색층) 도막 중의 광중합 개시제가 상층 도막으로 확산됨으로써 상층 도막에서 가교 반응이 진행되거나, 또는 노광시에 하층 도막 중에서의 가교 반응이 상층 도막까지 진행됨으로써 경화되기 때문이라고 생각된다.The photoinitiator used for the composition for black layers can be mix | blended with the composition for white layers of this embodiment as needed. The reason why the photopolymerization initiator is used as an optional component is that curing can proceed and an electrode pattern can be formed without mixing the photopolymerization initiator. In the bus electrode forming step described later, the photopolymerization initiator in the lower layer (black layer) coating film diffuses into the upper coating film during application, drying or exposure, so that the crosslinking reaction proceeds in the upper coating film, or crosslinking in the lower coating film during exposure. It is thought that it is because reaction advances to an upper coating film and it hardens | cures.
한편, 백색층용 조성물을 단층 전극 패턴에 적용하는 경우에는 광중합 개시제를 배합할 필요가 있다. 이 경우, 광중합 개시제로서 상술한 화학식 (I)로 표시되는 니트로카르바졸 구조를 갖는 옥심에스테르 화합물을 배합함으로써 양호한 해상성을 얻을 수 있다.On the other hand, when applying the composition for white layers to a single layer electrode pattern, it is necessary to mix | blend a photoinitiator. In this case, good resolution can be obtained by mix | blending the oxime ester compound which has the nitrocarbazole structure represented by the above-mentioned general formula (I) as a photoinitiator.
다음에, 본 실시 형태의 광경화성 조성물을 이용한 전극 패턴 형성 방법에 대하여 상세하게 설명한다.Next, the electrode pattern formation method using the photocurable composition of this embodiment is demonstrated in detail.
본 발명의 광경화성 조성물은, 미리 필름상으로 성막되어 있는 경우에는 기판 상에 라미네이트하면 되지만, 페이스트상의 경우, 스크린 인쇄법, 바 코터, 블레이드 코터 등 적절한 도포 방법으로 기판, 예를 들면 PDP의 전면 기판이 되는 유리 기판에 도포하고, 이어서 지촉 건조성을 얻기 위하여 열풍 순환식 건조로, 원적외선 건조로 등에서 예를 들면 약 60 내지 120℃에서 5 내지 40분 정도 건조시켜 용제를 증발시켜 태크 프리의 도막을 얻는다. 그 후, 노광, 현상, 소성을 행하여 소정의 패턴의 전극 회로를 형성한다.The photocurable composition of the present invention may be laminated on a substrate when the film is previously formed into a film, but in the case of a paste, the front surface of the substrate, for example, PDP, may be formed by a suitable coating method such as a screen printing method, a bar coater, a blade coater, and the like. It is applied to a glass substrate serving as a substrate, and then dried in a hot air circulation drying furnace, a far-infrared drying furnace, or the like for about 5 to 40 minutes at, for example, about 60 to 120 ° C. to evaporate the solvent by evaporating the tack free coating film. Get Thereafter, exposure, development, and baking are performed to form an electrode circuit of a predetermined pattern.
노광 공정으로서는 소정의 노광 패턴을 갖는 네가티브 마스크를 이용한 접촉 노광 및 비접촉 노광이 가능하다. 노광에 이용하는 광원으로서는 할로겐 램프, 고압 수은등, 레이저광, 메탈 할라이드 램프, 블랙 램프, 무전극 램프 등이 사용된다. 노광량으로서는 50 내지 1000 mJ/cm2 정도가 바람직하다.As an exposure process, contact exposure and non-contact exposure using the negative mask which has a predetermined exposure pattern are possible. As a light source used for exposure, a halogen lamp, a high pressure mercury lamp, a laser beam, a metal halide lamp, a black lamp, an electrodeless lamp, etc. are used. As the exposure dose, 50 to 1000 mJ / cm 2 Degree is preferred.
현상 공정으로서는 스프레이법, 침지법 등이 이용된다. 현상액으로서는 수산화나트륨, 수산화칼륨, 탄산나트륨, 탄산칼륨, 규산나트륨 등의 금속 알칼리 수용액이나, 모노에탄올아민, 디에탄올아민, 트리에탄올아민 등의 아민 수용액을 들 수 있다. 특히, 약 1.5 질량％ 이하의 농도의 희알칼리 수용액이 바람직하게 이용되지만, 조성물 중의 카르복실기 함유 수지의 카르복실기가 비누화되고, 미경화부(미노광부)가 제거되면 되며, 상기한 바와 같은 현상액에 한정되는 것이 아니다. 또한, 현상 후에 불필요한 현상액의 제거를 위하여 수세나 산 중화를 행하는 것이 바람직하다.As the developing step, a spray method, a dipping method, or the like is used. Examples of the developer include aqueous metal alkali solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate and sodium silicate, and aqueous solutions of amines such as monoethanolamine, diethanolamine, and triethanolamine. In particular, an aqueous alkali solution of a concentration of about 1.5% by mass or less is preferably used, but the carboxyl group of the carboxyl group-containing resin in the composition may be saponified, and the uncured portion (unexposed portion) should be removed, and it is limited to the developer as described above. no. In addition, it is preferable to perform washing with water or acid neutralization in order to remove unnecessary developer after development.
소성 공정으로서는 현상 후의 기판을 대기 또는 질소 분위기 하에서 약 400 내지 600℃의 가열 처리를 행하여 원하는 도체 패턴을 형성한다. 또한, 이때의 승온 속도는 20℃/분 이하로 설정하는 것이 바람직하다.As a firing process, the board | substrate after image development heat-processes about 400-600 degreeC in air | atmosphere or nitrogen atmosphere, and forms a desired conductor pattern. In addition, it is preferable to set the temperature increase rate at this time to 20 degrees C / min or less.
흑백 2층 구조의 버스 전극을 형성하는 경우에 대해서는, 도 2를 이용하여 상세하게 설명한다.The case where the bus electrode of the monochrome two-layer structure is formed is demonstrated in detail using FIG.
우선, 도 2의 (A)에 도시한 바와 같이, 미리 스퍼터링, 이온 플레이팅, 화학 증착, 전착 등의 종래 공지된 수단에 의해 ITO(Indium Tin Oxide) 등에 의해 투명 전극(201)이 형성된 전면 유리 기판(200)에 상술한 흑색층용 조성물을 도포하고, 그 후 건조를 행하여 태크 프리의 흑색층(202)을 형성한다.First, as shown in Fig. 2A, the front glass in which the
다음에, 도 2의 (B)에 도시한 바와 같이, 형성한 흑색층(202) 상에 도전성 분말을 함유하는 도전성이 높은 백색층용 조성물을 도포하고, 그 후 건조를 행하여 태크 프리의 백색층(도전성층)(203)을 형성한다.Next, as shown in FIG.2 (B), the composition for white layers with high electroconductivity containing electroconductive powder is apply | coated on the formed
그 후, 도 2의 (C)에 도시한 바와 같이, 이것에 노광 패턴을 갖는 포토마스크(204)를 겹쳐 흑백 2층의 도막에 대하여 노광한다. 이어서, 알칼리 수용액에 의해 현상하여 비노광 부분을 제거하고, 그 후 소성함으로써 도 2의 (D)에 도시한 바와 같이 투명 전극(201) 상에 흑색층(하층)(202)과 백색층(상층)(203)을 포함하는 버스 전극(205)이 형성된다.Thereafter, as shown in FIG. 2C, a
또한, 흑색층용 조성물과 백색층용 조성물이 미리 필름상으로 성막된 드라이 필름인 경우에는, 기판 상에 열 압착하여 순차적으로 라미네이트한 후, 노광, 현상 및 베이킹(소성)의 각 공정을 행함으로써 제조할 수 있다. 또한, 기판 상에 흑색층용 조성물을 도포하고, 건조, 노광, 현상, 베이킹의 각 공정을 행하여 하층(흑색)을 형성한 후, 백색층용 조성물을 도포하고, 건조, 노광, 현상 및 베이킹의 각 공정을 행하여 상층(백색)을 형성하는 방법을 채용할 수도 있다.In addition, when the composition for black layers and the composition for white layers are the dry films previously formed into a film form, it can be manufactured by carrying out each process of exposure, image development, and baking (baking) after thermocompression bonding on a board | substrate and laminating them sequentially. Can be. Moreover, after apply | coating the composition for black layers on a board | substrate, performing each process of drying, exposure, image development, and baking, and forming a lower layer (black), the composition for white layers is apply | coated and each process of drying, exposure, image development, and baking. The method of forming an upper layer (white) can also be employ | adopted.
<실시예><Examples>
이하에 실시예 및 비교예를 나타내어 본 발명에 대하여 구체적으로 설명하지만, 본 발명이 하기 실시예에 한정되는 것이 아닌 것은 물론이다. 또한, 이하에 있어서 「부」 및 「％」로 되어 있는 것은, 특별이 언급이 없는 한 전부 질량 기준이다.The present invention will be described in more detail with reference to the following examples and comparative examples, but it goes without saying that the present invention is not limited to the following examples. In addition, it is a mass reference | standard unless it mentions specially about "part" and "%" below.
[유기 결합제(알칼리 가용성 수지 A)의 합성][Synthesis of Organic Binder (Alkali Soluble Resin A)]
온도계, 교반기, 적하 깔때기 및 환류 냉각기를 구비한 플라스크에 메틸메타크릴레이트와 메타크릴산을 0.87:0.13의 몰비로 투입하고, 용매로서 디에틸렌글리콜모노메틸에테르아세테이트, 촉매로서 아조비스이소부티로니트릴을 넣고, 질소 분위기 하에 80℃에서 7시간 교반하여 알칼리 가용성 수지 A 용액을 얻었다. 이 알칼리 가용성 수지 A 용액은, 알칼리 가용성 수지 A의 중량 평균 분자량이 약 10,000, 산가가 95 mgKOH/g, 그 고형분은 57％이었다.Methyl methacrylate and methacrylic acid were charged to a flask equipped with a thermometer, agitator, dropping funnel and reflux condenser at a molar ratio of 0.87: 0.13, diethylene glycol monomethyl ether acetate as a solvent, and azobisisobutyronitrile as a catalyst. Was added, and the mixture was stirred at 80 ° C. for 7 hours under a nitrogen atmosphere to obtain an alkali-soluble resin A solution. As for this alkali-soluble resin A solution, the weight average molecular weight of alkali-soluble resin A was about 10,000, the acid value was 95 mgKOH / g, and the solid content was 57%.
또한, 얻어진 알칼리 가용성 수지 A(공중합 수지)의 중량 평균 분자량은, 시마즈 세이사꾸쇼 제조의 펌프 LC-6AD와 쇼와 덴꼬사 제조의 칼럼 Shodex(등록 상표) KF-804, KF-803, KF-802를 3개 연결한 고속 액체 크로마토그래피에 의해 측정하였다.In addition, the weight average molecular weight of obtained alkali-soluble resin A (copolymerization resin) is the pump LC-6AD by the Shimadzu Corporation Corporation and the column Shodex (registered trademark) KF-804, KF-803, and KF-made by Showa Denko Co., Ltd. The 802 was measured by high performance liquid chromatography of three.
표 1에 나타내는 여러가지 성분, 비율(질량부)로 배합하여 교반기로 예비 혼합한 후, 3축 롤밀로 혼련하여 백색층용 조성물로서 조성물 1, 2, 흑색층용 조성물로서 조성물 3, 4를 얻었다.After mix | blending with the various components and ratio (mass part) shown in Table 1, and pre-mixing with a stirrer, it knead | mixed with the triaxial roll mill and obtained the composition 3, 4 as the composition for white layers, and the composition for black layers.
*1: 1,9-노난디올디아크릴레이트(교에이샤 가가꾸사 제조)* 1: 1,9-nonanediol diacrylate (made by Kyoeisha Chemical Co., Ltd.).
*2: 트리메틸올프로판 EO 변성 트리아크릴레이트(도아 고세이사 제조)* 2: trimethylolpropane EO modified triacrylate (manufactured by Toagosei Co., Ltd.)
*3: 옥심에스테르 개시제(아데카사 제조)* 3: Oxime ester initiator (made by Adeka Corporation)
*4: 에타논,1-[9-에틸-6-(2-메틸벤조일)-9H-카르바졸-3-일]-,1-(O-아세틸옥심)(시바 스페셜티 케미컬즈사 제조 옥심에스테르 개시제)* 4: Ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyl oxime) (oxime ester initiator by Ciba Specialty Chemicals Co., Ltd.) )
*5: 평균 입경(D50) 2.2 ㎛, 최대 입경(Dmax) 6.3 ㎛, 비표면적 0.3 m2/g* 5: Average particle diameter (D50) 2.2 µm, maximum particle diameter (Dmax) 6.3 µm, specific surface area 0.3 m 2 / g
*6: 사삼산화코발트 평균 입경(D50) 0.3 ㎛* 6: cobalt trioxide average particle diameter (D50) 0.3 µm
*7: Bi2O3 50％, B2O3 16％, ZnO 14％, SiO2 2％, BaO 18％ 열팽창 계수 α300=86×10-7/℃, 유리 연화점 501℃* 7: Bi 2 O 3 50%, B 2 O 3 16%, ZnO 14%, SiO 2 2%, BaO 18% Thermal expansion coefficient α 300 = 86 × 10 −7 / ° C., glass softening point 501 ° C.
*8: 모다플로우(몬산토사 제조 레벨링ㆍ소포제)* 8: Modaflow (Monsanto company leveling and defoaming agent)
*9: P-1M(교에이샤 가가꾸사 제조 인산 에스테르계 안정제)* 9: P-1M (Phosphate ester stabilizer manufactured by Kyoeisha Chemical Co., Ltd.)
*10: 디에틸렌글리콜모노메틸에테르아세테이트* 10: diethylene glycol monomethyl ether acetate
<평가 기판의 제작><Production of Evaluation Board>
도포ㆍ건조: (흑백 2층 피막)Coating and drying: (black and white two-layer film)
표 1에 나타내는 조성물 3, 4를 각각 유리 기판 상에 각각 300메쉬의 폴리에스테르 스크린으로 전체면 인쇄하고, IR식 건조로에서 100℃로 20분간 건조함으로써 기판 상에 흑색의 도막을 형성하였다.The black and white coating films were formed on the board | substrate by carrying out the whole surface printing on the glass substrate with the composition 3 and 4 shown in Table 1, respectively by 300 mesh polyester screen, and drying at 100 degreeC for 20 minutes in IR type drying furnace.
이어서, 조성물 3을 이용한 흑색 도막에는 조성물 1을, 조성물 4를 이용한 흑색 도막에는 조성물 2를 이용하여 각각 200메쉬의 폴리에스테르 스크린을 이용하여 상기 흑색 도막상 전체면에 도포하고, IR식 건조로에서 100℃로 20분간 건조하여 지촉 건조성이 양호한 흑백 2층의 피막을 형성하고, 이것들을 평가 기판으로 하였다.Subsequently, the
도포ㆍ건조: (단층 피막)Coating and drying: (single layer coating)
표 1에 나타내는 조성물 1, 2를 유리 기판 상에 각각 200메쉬의 폴리에스테르 스크린으로 전체면 인쇄하고, IR식 건조로에서 100℃로 20분간 건조하여 지촉 건조성이 양호한 백색의 피막을 형성하고, 이것들을 평가 기판으로 하였다.The
흑백 2층 구조의 버스 전극으로서, 조성물 1, 3의 조합의 평가 기판을 실시예 1, 조성물 2, 4의 조합의 평가 기판을 비교예 1로 하였다. 또한, 단층 전극 패턴으로서, 조성물 1을 이용한 평가 기판을 실시예 2, 조성물 2를 이용한 평가 기판을 비교예 2로 하여 이하의 평가를 행하였다.The evaluation board | substrate of the combination of Example 1, the composition 2, and 4 was used for the evaluation board | substrate of the combination of the
<평가><Evaluation>
(해상성)(Resolution)
상기 평가 기판에 대하여 광원에 메탈 할라이드 램프를 이용하여 조성물 상의 적산 광량이 200 mJ/cm2가 되도록 노광한 후, 액체 온도 30℃의 0.4％ 탄산나트륨 수용액을 이용하여 현상 시간을 10, 15, 30 및 40초로 하여 현상을 행하고 수세를 거쳐 에어 나이프로 건조하였다. 그 후, 잔존 라인을 관찰하여 결손없이 잔존한 최소 폭의 라인을 해상성으로 하였다.After exposing the evaluation substrate to a light source using a metal halide lamp so that the amount of accumulated light on the composition is 200 mJ / cm 2 , the development time is 10, 15, 30 and 0.4% using an aqueous 0.4% sodium carbonate solution having a liquid temperature of 30 ° C. It developed for 40 second, and it washed with water, and dried with the air knife. Then, the residual line was observed and the line of the minimum width | variety which remained without a defect was made into the resolution.
실시예 1은 본 실시 형태의 광경화성 조성물을 흑백 2층 버스 전극에 적용한 경우이며, 종래의 광경화성 조성물을 이용한 비교예 1에 비하여 해상성(선폭)이 향상되어 있는 것을 알 수 있다.Example 1 is a case where the photocurable composition of this embodiment is applied to the black-and-white two-layer bus electrode, and it turns out that resolution (line width) is improved compared with the comparative example 1 which used the conventional photocurable composition.
실시예 2는 본 실시 형태의 광경화성 조성물을 (단층) 전극에 적용한 경우이며, 양호한 해상성이 얻어지고 있는 것을 알 수 있다. 한편, 종래의 광경화성 조성물을 이용한 비교예 2에서는 라인 형성이 불가능하여 광경화성 부족인 것을 알 수 있었다.Example 2 is a case where the photocurable composition of this embodiment is applied to a (monolayer) electrode, and it turns out that favorable resolution is obtained. On the other hand, in Comparative Example 2 using the conventional photocurable composition, it was found that the line formation was impossible and the photocurability was insufficient.
1, 200: 전면 유리 기판
2a, 2b: 표시 전극
3a, 3b, 201: 투명 전극
4a, 4b, 205: 버스 전극
5: 투명 유전체층
6: 보호층
11: 배면 유리 기판
12: 리브(격벽)
13: 어드레스 전극
14a, 14b, 14c: 형광체막
202: 흑색층(하층)
203: 백색층(상층, 도전층)
204: 포토마스크1, 200: front glass substrate
2a, 2b: display electrode
3a, 3b, 201: transparent electrode
4a, 4b, and 205 bus electrodes
5: transparent dielectric layer
6: protective layer
11: back glass substrate
12: rib (bulk)
13: address electrode
14a, 14b, 14c: phosphor film
202: black layer (lower layer)
203: white layer (upper layer, conductive layer)
204: photomask
Claims (6)
(식 중, R1은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 CN을 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 OR11, COR11, SR11, NR12R13, -NCOR12-OCOR13, CN, 할로겐 원자, -CR11=CR12R13 또는 -CO-CR11=CR12R13으로 더 치환될 수도 있고, R11, R12 및 R13은 각각 독립적으로 수소 원자, 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 탄소수 2 내지 20의 복소환기를 나타내고,
R2는 R21 또는 OR21을 나타내고, R21은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 할로겐 원자로 더 치환될 수도 있고, R3은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고,
R1, R3, R11, R12 및 R13으로 표시되는 치환기의 알킬렌 부분의 메틸렌기는 불포화 결합, 에테르 결합, 티오에테르 결합, 에스테르 결합, 티오에스테르 결합, 아미드 결합 또는 우레탄 결합에 의해 1 내지 5회 중단될 수도 있고, 상기 치환기의 알킬 부분은 분지측쇄가 있을 수도 있고, 환상 알킬일 수도 있고, 상기 치환기의 알킬 말단은 불포화 결합일 수도 있고, R3은 인접하는 벤젠환과 하나가 되어 환을 형성할 수도 있고,
R4 및 R5는 각각 독립적으로 R21, OR21, CN 또는 할로겐 원자를 나타내고, a 및 b는 각각 독립적으로 0 내지 3임)A photocurable composition for a black and white two-layer structure bus electrode comprising an inorganic powder, an organic binder, a photopolymerizable monomer and a photopolymerization initiator comprising an oxime ester compound having a nitrocarbazole structure represented by the following general formula (I).
Wherein R 1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or CN, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are OR 11 , COR 11 , SR 11 , NR 12 R 13 , -NCOR 12 -OCOR 13 , CN, a halogen atom, -CR 11 = CR 12 R 13 or -CO-CR 11 = CR 12 R 13 may be further substituted, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms,
R 2 represents R 21 or OR 21 , R 21 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are May be further substituted with a halogen atom, R 3 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms,
The methylene group of the alkylene moiety of the substituent represented by R 1 , R 3 , R 11 , R 12 and R 13 is selected from the group consisting of unsaturated bonds, ether bonds, thioether bonds, ester bonds, thioester bonds, amide bonds or urethane bonds. Or may be interrupted 5 times, the alkyl moiety of the substituent may have a branched side chain, cyclic alkyl, the alkyl terminal of the substituent may be an unsaturated bond, and R 3 becomes one with an adjacent benzene ring to ring Can form a
R 4 and R 5 each independently represent R 21 , OR 21 , CN or a halogen atom, and a and b are each independently 0 to 3)
(식 중, R1은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 CN을 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 OR11, COR11, SR11, NR12R13, -NCOR12-OCOR13, CN, 할로겐 원자, -CR11=CR12R13 또는 -CO-CR11=CR12R13으로 더 치환될 수도 있고, R11, R12 및 R13은 각각 독립적으로 수소 원자, 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기, 탄소수 7 내지 30의 아릴알킬기 또는 탄소수 2 내지 20의 복소환기를 나타내고,
R2는 R21 또는 OR21을 나타내고, R21은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고, 알킬기, 아릴기 및 아릴알킬기의 수소 원자는 할로겐 원자로 더 치환될 수도 있고, R3은 탄소수 1 내지 20의 알킬기, 탄소수 6 내지 30의 아릴기 또는 탄소수 7 내지 30의 아릴알킬기를 나타내고,
R1, R3, R11, R12 및 R13으로 표시되는 치환기의 알킬렌 부분의 메틸렌기는 불포화 결합, 에테르 결합, 티오에테르 결합, 에스테르 결합, 티오에스테르 결합, 아미드 결합 또는 우레탄 결합에 의해 1 내지 5회 중단될 수도 있고, 상기 치환기의 알킬 부분은 분지측쇄가 있을 수도 있고, 환상 알킬일 수도 있고, 상기 치환기의 알킬 말단은 불포화 결합일 수도 있고, R3은 인접하는 벤젠환과 하나가 되어 환을 형성할 수도 있고,
R4 및 R5는 각각 독립적으로 R21, OR21, CN 또는 할로겐 원자를 나타내고, a 및 b는 각각 독립적으로 0 내지 3임)A photocurable composition for a single layer electrode pattern comprising an inorganic powder, an organic binder, a photopolymerizable monomer and a photopolymerization initiator comprising an oxime ester compound having a nitrocarbazole structure represented by the following general formula (I).
Wherein R 1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or CN, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are OR 11 , COR 11 , SR 11 , NR 12 R 13 , -NCOR 12 -OCOR 13 , CN, a halogen atom, -CR 11 = CR 12 R 13 or -CO-CR 11 = CR 12 R 13 may be further substituted, and R 11 , R 12 and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms,
R 2 represents R 21 or OR 21 , R 21 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms, and the hydrogen atoms of the alkyl group, aryl group and arylalkyl group are May be further substituted with a halogen atom, R 3 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms,
The methylene group of the alkylene moiety of the substituent represented by R 1 , R 3 , R 11 , R 12 and R 13 is selected from the group consisting of unsaturated bonds, ether bonds, thioether bonds, ester bonds, thioester bonds, amide bonds or urethane bonds. Or may be interrupted 5 times, the alkyl moiety of the substituent may have a branched side chain, cyclic alkyl, the alkyl terminal of the substituent may be an unsaturated bond, and R 3 becomes one with an adjacent benzene ring to ring Can form a
R 4 and R 5 each independently represent R 21 , OR 21 , CN or a halogen atom, and a and b are each independently 0 to 3)
It is obtained using the photocurable composition for single layer electrode patterns of Claim 4 or 5, The plasma display panel characterized by the above-mentioned.
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| JP2010083419 | 2010-03-31 | ||
| JPJP-P-2010-083419 | 2010-03-31 | ||
| PCT/JP2011/001923 WO2011122026A1 (en) | 2010-03-31 | 2011-03-30 | Photocurable composition |
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| KR20130019379A true KR20130019379A (en) | 2013-02-26 |
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| JP (1) | JPWO2011122026A1 (en) |
| KR (1) | KR20130019379A (en) |
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| CN106444282A (en) * | 2015-08-13 | 2017-02-22 | 常州强力先端电子材料有限公司 | Photosensitive resin composition containing oxime ester photoinitiator and application of photosensitive resin composition |
| CN108475019B (en) * | 2016-03-29 | 2022-02-11 | 株式会社艾迪科 | Black photosensitive resin composition |
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| JP5140903B2 (en) * | 2004-07-02 | 2013-02-13 | 三菱化学株式会社 | Colored resin composition, color filter, and liquid crystal display device |
| JP2006278221A (en) * | 2005-03-30 | 2006-10-12 | Taiyo Ink Mfg Ltd | Photosensitive black paste for all together calcination, and manufacturing method of pdp front substrate using this paste |
| KR100910103B1 (en) * | 2006-12-27 | 2009-07-30 | 가부시키가이샤 아데카 | Oxime ester compound and photopolymerization initiator containing the compound |
| JP4335265B2 (en) * | 2007-03-28 | 2009-09-30 | パナソニック株式会社 | Method for manufacturing plasma display panel |
| JP5143683B2 (en) * | 2007-09-21 | 2013-02-13 | 東進セミケム株式会社 | Slurry composition for forming plasma display panel electrode |
| JP2010061041A (en) * | 2008-09-05 | 2010-03-18 | Jsr Corp | Radiation-sensitive composition, color filter, black matrix, and liquid crystal display element |
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| WO2011122026A1 (en) | 2011-10-06 |
| JPWO2011122026A1 (en) | 2013-07-04 |
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