KR20120063206A

KR20120063206A - Resin applying apparatus

Info

Publication number: KR20120063206A
Application number: KR1020100124284A
Authority: KR
Inventors: 정재관
Original assignee: 주식회사 탑 엔지니어링
Priority date: 2010-12-07
Filing date: 2010-12-07
Publication date: 2012-06-15

Abstract

PURPOSE: A resin applying apparatus is provided to accurately adjust the accurate amount of a resin by adjusting the moving distance of a piston per time and adjusting the discharging amount of the resin per time. CONSTITUTION: A resin applying apparatus includes a cylinder(14), a piston(15), a rotation driving unit, and a head unit. A resin inlet(141) and a resin outlet(142) are arranged at the cylinder. The inlet is in connection with a resin container. The outlet is in connection with a nozzle discharging the resin. The piston rotates and linearly moves in the cylinder. A groove is formed on the outer circumference of the piston to open the inlet and the outlet according to the rotation of the piston. The rotation driving unit rotates the piston. A head unit is composed of a linearly moving unit(17). The linearly moving unit linearly moves the piston.

Description

Resin Mapping Device {RESIN APPLYING APPARATUS}

The present invention relates to a resin coating device for applying a resin around the semiconductor element.

The resin coating device used in the manufacture of semiconductor devices can reduce the defective rate only when the accuracy of the coating amount and the coating position of the resin is ensured.

The conventional resin coating device is connected to the nozzle and provided with a syringe in which the resin is accommodated, and the resin is discharged from the nozzle by applying a predetermined pneumatic pressure from the pressure source into the syringe to pressurize the resin contained in the syringe. In the conventional resin coating device using pneumatic to apply the resin as described above, since a certain amount of resin can be discharged only by changing the size of the discharge air pressure according to the remaining amount of resin remaining in the syringe, Accordingly, a process for the operator to stop the operation of the resin coating device and change the size of the discharge air pressure was required.

In addition, in the case where the operation of the resin coating device is stopped, there is a disadvantage in that the resin is formed at the discharge port of the nozzle in order to keep the coating amount of the resin in the subsequent process constant. In addition, in order to prevent the resin from forming in the discharge port of the nozzle, a negative pressure is applied to the inside of the syringe. When the magnitude of the negative pressure is excessive, there is a problem in that the resin remaining in the nozzle flows back toward the syringe.

As described above, the conventional resin coating device has various problems in applying the resin at a constant coating amount because the discharge method using pneumatic pressure is used.

The present invention has been made to solve the above problems of the prior art, and an object of the present invention is to provide a resin coating device that can apply a resin in a constant coating amount.

Resin coating device according to the present invention for achieving the above object is connected to the receiving container containing the resin, the inlet for the resin is introduced and the cylinder is provided with an outlet for the resin is discharged is connected to the nozzle discharged, and the A piston having a groove formed on an outer circumferential surface thereof so as to open the inlet and the outlet respectively according to the rotational movement and the linear movement in the cylinder, a rotary drive device for rotating the piston, and the piston It may be configured to include a head unit consisting of a linear drive device for moving to.

The resin coating device according to the present invention includes a resin supply unit including a cylinder and a piston, and can apply resin to the circumference of the semiconductor element through rotational and linear movement of the piston, thereby applying resin using air pressure. Compared with the conventional coating method, there is an effect that the correct amount of resin can be applied around the semiconductor element.

In addition, the resin coating device according to the present invention is a problem of the conventional discharge method using the pneumatic pressure, the problem of changing the discharge air pressure in accordance with the remaining amount of the resin in the syringe, the phenomenon that the resin is formed in the discharge port of the nozzle, the syringe There is an effect that can eliminate problems such as the backflow of the resin that occurs when the negative pressure is applied to the inside.

In addition, since the resin coating device according to the present invention can adjust the discharge amount per unit time of the resin by adjusting the moving distance per unit time of the piston, the discharge amount of the resin compared to the conventional coating method for applying the resin using air pressure The effect can be precisely adjusted.

1 is a perspective view showing a resin coating device according to the present invention.
FIG. 2 is a perspective view illustrating a head unit of the resin coating apparatus of FIG. 1.
3 is a cross-sectional view illustrating a resin supply unit of the head unit of FIG. 2.
4 to 11 are cross-sectional views sequentially showing the operation of the resin supply unit of FIG.
12 is a schematic diagram illustrating a path in which the nozzle of the head unit moves with respect to the semiconductor device.
13 is a cross-sectional view showing a state where a resin is applied around the semiconductor element.
14 is a cross-sectional view showing a state in which resin is abnormally coated around the semiconductor element.
15 is a cross-sectional view showing a state in which resin is normally applied around the semiconductor element.
16 is a graph showing a change in the moving speed of the head unit with respect to the application section.
17 is a schematic view showing a path in which the nozzle of the head unit moves with respect to the semiconductor device.
18 is a graph showing a change in the forward speed of the piston with respect to the application section.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of a resin coating device according to the present invention.

As shown in FIG. 1, the resin coating device according to the present invention includes a head unit 1, an X-axis moving apparatus 2 for moving the head unit 1 in the X-axis direction, and a head unit 1. Y-axis moving device 3 for moving the axis in the Y-axis direction, Z-axis moving device 4 for moving the head unit 1 in the Z-axis direction, and semiconductor element 6 attached on the tape 5. And a control unit (not shown) for controlling the operation of coating the resin.

As the X-axis moving device 2, the Y-axis moving device 3 and the Z-axis moving device 4, a linear transfer mechanism such as an actuator, a linear motor or a ball screw device, which is operated by pneumatic or hydraulic pressure, may be applied.

As shown in FIG. 2 and FIG. 3, the head unit 1 includes a housing 11 in which resin is accommodated therein, a nozzle 12 in communication with the housing 11, and in which resin is discharged; It may be configured to include a resin supply unit 13 is provided between the cylinder 11 and the nozzle 12 to supply the resin accommodated in the housing 11 to the nozzle 12.

The resin supply unit 13 is a cylinder 14 having a cylinder 14 connected to the housing 11 and having an inlet 141 through which resin is introduced and a nozzle 12 connected to a nozzle 12 with an outlet 142 through which resin is discharged. Piston 15 and the piston (14) is formed in the outer circumferential surface to the rotational and linear movement in the interior (14), so that the inlet 141 and the outlet 142 can be opened according to the rotational movement, respectively ( A rotary drive device 16 connected to 15 to rotate the piston 15, and a linear drive device 17 connected to the piston 15 to move the piston 15 in a straight line (Y-axis direction in FIG. 2). It may be configured to include).

The inlet 141 and the outlet 142 of the storage container 11 may be formed to open in directions opposite to each other in the Z-axis direction in FIG. 2.

The rotary drive device 16 is connected through the piston 15 and the rotary shaft 161 and serves to rotate the piston 15 while rotating the rotary shaft 161. As the rotary drive device 16, an electric motor may be applied.

The linear driving device 17 is disposed between the piston 15 and the rotating shaft 161, and may include a piezoelectric element that moves forward or backward in the Y-axis direction in FIG. However, the present invention is not limited to that the linear drive device 17 includes a piezoelectric element, and the piston 15 such as an actuator, a linear motor or a ball screw device that operates pneumatically or hydraulically with the linear drive device 17. Various linear transfer mechanisms connected to the can be applied.

4 to 11, the operation of the resin supply unit 13 will be described.

First, as shown in FIG. 4 and a cross-sectional view taken along line AA of FIG. 4, the piston 15 is a cylinder in a state where the groove 151 of the piston 15 is located at the inlet 141 of the cylinder 14. When retreating in the direction away from 14, a predetermined negative pressure acts inside the cylinder 14, and the resin contained in the housing 11 is sucked into the cylinder through the inlet 141 and the groove 151. Resin corresponding to one discharge amount may flow into the cylinder 14 by the retraction movement of the piston 15. However, the present invention is not limited to such a configuration, and the resin corresponding to one or more discharge amounts may be introduced into the cylinder 14 by the backward movement of the piston 15. The amount of resin introduced into the cylinder 14 may be determined by the volume of the interior of the cylinder 14 and the volume of the groove 151 of the piston 15.

6 and 6, the piston 15 is grooved by the operation of the rotary drive device 16 in a state where the resin is sucked into the cylinder 14, as shown in FIG. When the piston 15 moves forward in a direction adjacent to the cylinder 14 after rotating to such a degree that the outlet 151 and the outlet do not communicate with each other, a predetermined pressure is applied to the resin contained in the cylinder 14.

8 and 8, when the piston 15 is rotated in a direction in which the groove 151 and the outlet 142 communicate with each other, the groove of the piston 15 ( As the 151 and the outlet 142 communicate with each other, the resin contained in the cylinder 14 flows out through the outlet 142 and is discharged to the outside through the nozzle 12. In this state, when the piston 15 is advanced in the direction adjacent to the cylinder 14, the resin contained in the syringe 14 may be continuously discharged through the outlet 142 while being pressurized. Resin corresponding to one discharge amount may be discharged to the outside through the nozzle 12 by the forward movement of the piston 15. However, the present invention is not limited to this configuration, and the resin corresponding to the discharge amount of one or more times may be discharged to the outside through the nozzle 12 by the forward movement of the piston 15. The discharge amount of the resin discharged through the nozzle 12 may be determined according to the distance that the piston 15 moves.

Then, as shown in FIG. 11, which is a sectional view taken along the line DD of FIG. 10 and FIG. 10, after the discharge of the resin accommodated in the cylinder 14 is completed, the operation of sucking the resin into the cylinder 14 is performed. The piston 14 may be rotated in a direction in which the groove 151 communicates with the inlet 141 by the operation of the rotary drive device 16.

In addition, a process of discharging the resin from the nozzle 12 may be sequentially performed by repeatedly performing the above operation.

As described above, the process of supplying the resin to the nozzle 12 by the operation of the resin supply unit 13 proceeds while the resin is pressurized according to the linear movement of the piston 15, the linear movement distance of the piston 15. And the discharge amount of the resin discharged through the nozzle 12 is proportional. That is, the discharge amount of the resin increases as the linear movement distance of the piston 15 increases, and the discharge amount of the resin decreases as the linear distance of the piston 15 decreases. Accordingly, the resin discharged from the nozzle 12 through adjusting the linear travel distance per unit time of the piston 15 in a state where the groove 151 of the piston 15 and the outlet 142 of the cylinder 14 communicate with each other. The discharge amount per unit time can be determined.

12 and 13, the semiconductor device 6 generally has a quadrangular shape, and the resin L is continuously formed along the circumference of the semiconductor device 6 having the quadrangular shape. Is applied. When the point where the discharge of the resin L is started in the application section to which the resin L is applied is called the start point SP and the point where the discharge of the resin L is finished is the end point EP, the nozzle 12 Is moved horizontally from the start point SP to the end point EP horizontally in a square shape. Such horizontal movement of the nozzle 12 may be performed by movement of the head unit 1 in the X-axis direction and the Y-axis direction by the operation of the X-axis moving apparatus 2 and the Y-axis moving apparatus 3. have.

When the horizontal movement path of the nozzle 12, that is, the straight path among the application sections to which the resin L is applied, is called a straight section, and the curved section where two straight sections are adjacent to each other is called a corner section, the nozzle ( 12) discharges the resin L while moving along four straight sections and four corner sections. Here, as shown in FIG. 14, when the discharge amount per unit time of the resin L discharged from the nozzle 12 is the same, and the moving speed of the nozzle 12 is the same in the straight section and the corner section, the straight section in the corner section. Resin (L) having a large amount compared to the amount of the resin (L) to be applied to can be applied. In this case, a problem may occur in which the resin L coated on the corner section may interfere with an electronic component or an electronic pattern disposed around the semiconductor device. Therefore, as shown in FIG. 15, it is preferable to make the application shape of the resin L applied to the straight section and the corner section constant. In order to solve this problem, the following methods may be considered.

(1) The method of increasing the horizontal moving speed of the head unit 1 in the corner section as compared to the straight section.

As shown in FIG. 16, when the horizontal moving speed of the head unit 1 is larger in the corner section than in the straight section, the discharge amount of the resin L per unit time in the corner section can be reduced compared to the straight section. The amount of resin L applied in the section can be reduced, whereby the application shape of the resin L in the straight section and the corner section can be kept constant.

(2) A method of reducing the distance between the movement path of the nozzle 12 and the semiconductor element 6 in the corner section compared to the straight section.

As shown in Fig. 17, when the distance between the movement path of the nozzle 12 and the semiconductor element 6 in the corner section is smaller than the straight section, the resin section is closer to the semiconductor element 6 in the corner section. Since (L) can be applied, the application shape of the resin (L) in the straight section and the corner section can be kept constant.

(3) A method of reducing the discharge amount per unit time of the resin (L) discharged from the nozzle 12 in the corner section compared to the straight section

As shown in Fig. 18, in order to reduce the discharge amount per unit time of the resin L in the corner section as compared to the straight section, the forward speed of the piston 15 in the corner section (linear movement distance per unit time of the piston 15) It can be carried out by reducing the compared to the straight section. As a result, the amount of resin L discharged from the nozzle 12 in the corner section can be reduced as compared with the straight section, so that the coating shape of the resin L in the straight section and the corner section can be kept constant.

On the other hand, the resin (L) overlaps at the site where the starting point (SP) and the end point (EP) are adjacent to each other, so that the coating shape of the resin (L) is prevented from being distorted as the coating thickness of the resin (L) increases. Piston 15 is preferably retracted in the direction away from the cylinder (14). As the piston 15 retracts at the end point EP, the pressure exerted on the resin L contained in the cylinder 14 decreases, thereby reducing the discharge amount of the resin L at the end point EP. Therefore, it can be prevented that the thickness of the resin (L) is largely applied at the portion where the start point (SP) and the end point (EP) are adjacent.

The resin coating device according to the present invention as described above is provided with a resin supply unit 13 including a cylinder 14 and a piston 15, and the resin (L) through the rotational movement and the linear movement of the piston 15 ) Can be applied around the semiconductor element 6, so that the correct amount of resin L is applied around the semiconductor element 6, as compared with the conventional coating method of applying resin L using air pressure. It can work.

In addition, since the resin coating device according to the present invention can adjust the discharge amount per unit time of the resin (L) by adjusting the linear movement distance (the advance speed of the piston 15) per unit time of the piston 15, the air pressure Compared with the conventional coating method in which resin L is applied by using, the amount of discharge of resin L can be accurately adjusted.

The technical ideas described in the embodiments of the present invention may be implemented independently or in combination with each other.

1: head unit 2: X-axis shifter
3: Y-axis shifter 11: storage box
12: Nozzle 13: Resin Supply Unit
14: cylinder 15: piston
16: rotary drive device 17: linear drive device

Claims

A cylinder which is connected to a storage container in which the resin is accommodated, is connected to an inlet for inflowing the resin and a nozzle for discharging the resin, and has an outlet for outflowing the resin;
A piston having a rotational movement and a linear movement in the cylinder, the groove being formed on an outer circumferential surface of the cylinder to open the inlet and the outlet respectively according to the rotational movement;
A rotary driving device for rotating the piston; And
Resin coating device comprising a head unit configured to a linear drive device for moving the piston in a straight line.

The method of claim 1,
When a straight section is called a straight section and a curved section is a corner section among the coating sections to which the nozzle moves,
Resin coating device characterized in that the linear movement distance per unit time of the piston is smaller in the corner section than the straight section.

The method of claim 1,
When a straight section is called a straight section and a curved section is a corner section among the coating sections to which the nozzle moves,
And a distance between the horizontal movement path of the nozzle and the semiconductor element is smaller in the corner section than in the straight section.

The method of claim 1,
When a straight section is called a straight section and a curved section is a corner section among the coating sections to which the nozzle moves,
The horizontal movement speed of the nozzle is larger than the straight section in the resin section, characterized in that larger in the corner section.

The method of claim 1,
When the point at which the discharge of the resin from the nozzle is started is called the starting point and the point at which the discharge of the resin from the nozzle is terminated is called the end point, the piston retreats in the direction away from the cylinder at the end point Resin coating device made.

The method of claim 1,
And a resin corresponding to one ejection amount is introduced into the cylinder by one linear movement of the piston, and a resin corresponding to one ejection amount is ejected.