KR20110132079A - Flexible pcb using carbon nano tube and manufacturing method thereof - Google Patents
Flexible pcb using carbon nano tube and manufacturing method thereof Download PDFInfo
- Publication number
- KR20110132079A KR20110132079A KR1020100051894A KR20100051894A KR20110132079A KR 20110132079 A KR20110132079 A KR 20110132079A KR 1020100051894 A KR1020100051894 A KR 1020100051894A KR 20100051894 A KR20100051894 A KR 20100051894A KR 20110132079 A KR20110132079 A KR 20110132079A
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- KR
- South Korea
- Prior art keywords
- manufacturing
- pattern
- circuit board
- carbon nanotube
- carbon nanotubes
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0095—Manufacture or treatments or nanostructures not provided for in groups B82B3/0009 - B82B3/009
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a manufacturing technology of a flexible printed circuit board using carbon nanotubes, and transfers a base substrate made of an insulating film to pass through a CNT toner filled with CNT powder, which is a carbon nanotube material, and a circuit designed pattern through laser printing. A method of manufacturing a flexible printed circuit board comprising a circuit printing step of transferring and fixing CNT powder to a surface of a base substrate to form a carbon nanotube pattern, and a flexible printed circuit board using carbon nanotubes manufactured by such a manufacturing technique. It features.
The present invention uses a carbon nanotube as a circuit pattern material, but by forming a carbon nanotube pattern using a laser printing method to manufacture a flexible circuit board, CAD / CAM process-> circuit printing process compared to the conventional manufacturing process of FPCB -> It can not only reduce the manufacturing process and equipment, but also reduce the manufacturing cost and manufacturing overhead by simplifying the hot press process, improve the ease of wiring and the accuracy of the pattern, and improve productivity. Can be.
Description
The present invention relates to a manufacturing technology of a flexible circuit board, and more particularly, using a carbon nanotube as a circuit pattern material, but by forming a carbon nanotube pattern by using a laser printing method to manufacture a flexible circuit board manufacturing process and equipment. The present invention relates to a flexible circuit board using carbon nanotubes and a method of manufacturing the same, which can reduce manufacturing costs and reduce manufacturing overheads.
In general, a flexible circuit board (hereinafter referred to as "FPCB") is a circuit board that forms a circuit by coating copper foil (copper) on a thin insulating film (polyimide, etc.) having a thickness of 10 μm. It has the advantage that three-dimensional wiring is possible, and since the device can be made smaller and lighter, the demand is continuously increasing.
Looking at the manufacturing process of the conventional FPCB schematically, as shown in Figure 1, the circuit design process (S1) by CAD / CAM, copper plating step of laminating the copper foil on the insulating film (S2), D / F process (Dry film is attached Step; S3), exposure step (S4) for irradiating UV, etching step (S5) for forming a circuit, D / F peeling step (S6), hot press for attaching a cover lay It comprises a process (S7).
Here, in performing the etching process, chemical substances such as sodium carbonate or potassium carbonate are generally used. However, there is a problem in that a purification facility and cost are added, and there is a problem of polluting the environment, and a circuit through etching is not formed uniformly. There was a problem that the defective rate reaches about 20%.
In addition, there is a problem that the manufacturing process is complicated, as a result of which the initial production equipment cost is high and the management cost is high.
Moreover, when FPCB is applied to electronic products, there is a problem of lowering energy efficiency of electronic products due to heat generated from FPCB.
The present invention has been made in view of the above-described problems, and by using a laser printing method to form a circuit pattern by printing carbon nanotubes on a flexible circuit board can reduce the manufacturing process and manufacturing cost of the flexible circuit board manufacturing cost And to provide a flexible circuit board using a carbon nanotube to reduce the manufacturing overhead costs and its manufacturing method.
The present invention can simplify the CAD / CAM process-> circuit printing process-> hot press process compared to the existing manufacturing process of the FPCB, reducing the defect rate that can occur in the etching process during the existing FPCB manufacturing process and discharge of environmentally harmful substances The present invention provides a flexible circuit board using carbon nanotubes and a method for manufacturing the same, which can reduce the purification cost.
The present invention can improve the heat dissipation effect that affects the reliable life of electronic components such as chips mounted on the FPCB, and the size of the heat sink for heat dissipation of components (Chip, CPU, etc.) of electronic products The present invention provides a flexible circuit board using carbon nanotubes and a method for manufacturing the same, which can help reduce the amount of carbon dioxide.
In the flexible circuit board using the carbon nanotubes of the present invention, CNT powder, which is carbon nanotube material, is printed on the surface of a base substrate made of an insulating film by laser printing according to a circuit designed pattern, thereby transferring and fixing the carbon nanotubes. It is characterized by having a circuit pattern layer.
In addition, the method of manufacturing a flexible circuit board using the carbon nanotubes of the present invention, while transferring the base substrate of the insulating film through a transfer roller to pass through the CNT toner filled with CNT powder of carbon nanotube material, laser printing It characterized in that it comprises a circuit printing step of forming a carbon nanotube pattern by transferring and fixing the CNT powder on the surface of the base substrate as the circuit designed pattern through.
The present invention uses a carbon nanotube as a circuit pattern material, but by forming a carbon nanotube pattern using a laser printing method to manufacture a flexible circuit board, CAD / CAM process-> circuit printing process compared to the conventional manufacturing process of FPCB -> It can not only reduce the manufacturing process and equipment, but also reduce the manufacturing cost and manufacturing overhead by simplifying the hot press process, improve the ease of wiring and the accuracy of the pattern, and improve productivity. Can be.
According to the present invention, carbon nanotubes can be used to reduce power consumption and increase energy efficiency due to excellent electrical conductivity, and can lead to an increase in lifespan of electronic components such as chips through heat dissipation due to excellent thermal conductivity. It can provide usefulness, help to reduce the size of heat sink for heat dissipation of electronic parts (Chip, CPU, etc.) and enable the production of miniaturized and light weight products.
The present invention can reduce the pattern defect rate that can occur in the etching process in the existing FPCB manufacturing process and can reduce the purification cost according to the generation and discharge of environmentally harmful substances.
1 is a block diagram showing a conventional FPCB manufacturing process.
Figure 2 is a cross-sectional view showing an FPCB using carbon nanotubes according to the present invention.
Figure 3 is a block diagram showing a FPCB manufacturing process according to the present invention.
Figure 4 is a view showing for explaining the circuit pattern formation principle of the laser printing method according to the present invention.
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
As shown in FIG. 2, the
In this case, the
The carbon nanotube material may be composed of a mixture of carbon nanotubes (CNT) and polymer resins. In this case, carbon nanotubes are carbon allotrope composed of carbon, and one carbon atom has three different carbon atoms. It is a material that forms a tube shape by combining with a hexagonal honeycomb pattern, and has excellent electrical conductivity, so it is an alternative to the existing conductive pattern by copper, and can provide the effect of reducing power consumption and increasing energy efficiency. Since the thermal conductivity is excellent, it can contribute to the increase of component life by the heat dissipation effect, and the polymer resin has a feature of forming a film and exhibits an adhesive function.
Table 1 below is a data comparing the characteristics of the carbon nanotubes used as the circuit pattern material in the present invention and copper used as the circuit pattern material of the conventional FPCB.
[Table 1]
As shown in Table 1, it shows that the electrical and thermal properties of the carbon nanotubes used in the present invention is very superior to copper, which is compared with the conventional manufacturing of flexible circuit boards using carbon nanotubes according to the present invention. It can improve energy efficiency by reducing the power consumption of applied electronic products while increasing the conductive characteristics, and it also shows the heat dissipation function of the FPCB itself, which can lead to longer life of components.
On the other hand, Figure 3 is a block diagram showing the FPCB manufacturing process according to the present invention, Figure 4 is a view showing a circuit pattern formation principle of the laser printing method according to the present invention, the carbon according to the present invention as described above The method for manufacturing the
The circuit printing step (S12), which is the core of the present invention, will be described in more detail so that the
In other words, the laser printing method and the circuit printing step (S12) using the
The CNT powder filled in the negatively charged
At this time, the CNT powder is bonded while forming a film on the surface of the
Here, the circuit pattern layer of the carbon nanotube pattern formed on the
After the CNT powder is laser printed to form a carbon nanotube pattern circuit pattern layer on the
10: CNT toner 20: CNT powder
100: flexible circuit board 110: base substrate
120: circuit pattern layer (carbon nanotube pattern)
Claims (4)
The carbon nanotube material is a flexible circuit board using carbon nanotubes, characterized in that the mixture of carbon nanotubes and polymer resin.
Transfer base material made of insulating film to pass CNT toner filled with CNT powder, which is carbon nanotube material, and transfer and fix CNT powder to the surface of base material according to the circuit design pattern through laser printing. A method of manufacturing a flexible circuit board using carbon nanotubes, comprising the step of forming a circuit printing.
The carbon nanotube material, CNT powder is a manufacturing method of a flexible circuit board using carbon nanotubes, characterized in that the carbon nanotubes and a polymer resin composition.
Priority Applications (1)
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KR1020100051894A KR20110132079A (en) | 2010-06-01 | 2010-06-01 | Flexible pcb using carbon nano tube and manufacturing method thereof |
Applications Claiming Priority (1)
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KR1020100051894A KR20110132079A (en) | 2010-06-01 | 2010-06-01 | Flexible pcb using carbon nano tube and manufacturing method thereof |
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KR20110132079A true KR20110132079A (en) | 2011-12-07 |
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KR1020100051894A KR20110132079A (en) | 2010-06-01 | 2010-06-01 | Flexible pcb using carbon nano tube and manufacturing method thereof |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105120602A (en) * | 2015-07-30 | 2015-12-02 | 柳州市美源科技股份有限公司 | Small and medium-sized PCB components mixed installing technology |
CN106455311A (en) * | 2016-10-31 | 2017-02-22 | 中国科学院理化技术研究所 | Method for manufacturing double-sided flexible circuit by laser printing |
-
2010
- 2010-06-01 KR KR1020100051894A patent/KR20110132079A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105120602A (en) * | 2015-07-30 | 2015-12-02 | 柳州市美源科技股份有限公司 | Small and medium-sized PCB components mixed installing technology |
CN106455311A (en) * | 2016-10-31 | 2017-02-22 | 中国科学院理化技术研究所 | Method for manufacturing double-sided flexible circuit by laser printing |
CN106455311B (en) * | 2016-10-31 | 2018-12-04 | 中国科学院理化技术研究所 | Method for manufacturing double-sided flexible circuit by laser printing |
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