KR20110132079A - Flexible pcb using carbon nano tube and manufacturing method thereof - Google Patents

Flexible pcb using carbon nano tube and manufacturing method thereof Download PDF

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Publication number
KR20110132079A
KR20110132079A KR1020100051894A KR20100051894A KR20110132079A KR 20110132079 A KR20110132079 A KR 20110132079A KR 1020100051894 A KR1020100051894 A KR 1020100051894A KR 20100051894 A KR20100051894 A KR 20100051894A KR 20110132079 A KR20110132079 A KR 20110132079A
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South Korea
Prior art keywords
manufacturing
pattern
circuit board
carbon nanotube
carbon nanotubes
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KR1020100051894A
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Korean (ko)
Inventor
윤석한
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에스티플렉스 주식회사
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Priority to KR1020100051894A priority Critical patent/KR20110132079A/en
Publication of KR20110132079A publication Critical patent/KR20110132079A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B3/0095—Manufacture or treatments or nanostructures not provided for in groups B82B3/0009 - B82B3/009
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention relates to a manufacturing technology of a flexible printed circuit board using carbon nanotubes, and transfers a base substrate made of an insulating film to pass through a CNT toner filled with CNT powder, which is a carbon nanotube material, and a circuit designed pattern through laser printing. A method of manufacturing a flexible printed circuit board comprising a circuit printing step of transferring and fixing CNT powder to a surface of a base substrate to form a carbon nanotube pattern, and a flexible printed circuit board using carbon nanotubes manufactured by such a manufacturing technique. It features.
The present invention uses a carbon nanotube as a circuit pattern material, but by forming a carbon nanotube pattern using a laser printing method to manufacture a flexible circuit board, CAD / CAM process-> circuit printing process compared to the conventional manufacturing process of FPCB -> It can not only reduce the manufacturing process and equipment, but also reduce the manufacturing cost and manufacturing overhead by simplifying the hot press process, improve the ease of wiring and the accuracy of the pattern, and improve productivity. Can be.

Description

FLEXIBLE PCB USING CARBON NANO TUBE AND MANUFACTURING METHOD THEREOF

The present invention relates to a manufacturing technology of a flexible circuit board, and more particularly, using a carbon nanotube as a circuit pattern material, but by forming a carbon nanotube pattern by using a laser printing method to manufacture a flexible circuit board manufacturing process and equipment. The present invention relates to a flexible circuit board using carbon nanotubes and a method of manufacturing the same, which can reduce manufacturing costs and reduce manufacturing overheads.

In general, a flexible circuit board (hereinafter referred to as "FPCB") is a circuit board that forms a circuit by coating copper foil (copper) on a thin insulating film (polyimide, etc.) having a thickness of 10 μm. It has the advantage that three-dimensional wiring is possible, and since the device can be made smaller and lighter, the demand is continuously increasing.

Looking at the manufacturing process of the conventional FPCB schematically, as shown in Figure 1, the circuit design process (S1) by CAD / CAM, copper plating step of laminating the copper foil on the insulating film (S2), D / F process (Dry film is attached Step; S3), exposure step (S4) for irradiating UV, etching step (S5) for forming a circuit, D / F peeling step (S6), hot press for attaching a cover lay It comprises a process (S7).

Here, in performing the etching process, chemical substances such as sodium carbonate or potassium carbonate are generally used. However, there is a problem in that a purification facility and cost are added, and there is a problem of polluting the environment, and a circuit through etching is not formed uniformly. There was a problem that the defective rate reaches about 20%.

In addition, there is a problem that the manufacturing process is complicated, as a result of which the initial production equipment cost is high and the management cost is high.

Moreover, when FPCB is applied to electronic products, there is a problem of lowering energy efficiency of electronic products due to heat generated from FPCB.

The present invention has been made in view of the above-described problems, and by using a laser printing method to form a circuit pattern by printing carbon nanotubes on a flexible circuit board can reduce the manufacturing process and manufacturing cost of the flexible circuit board manufacturing cost And to provide a flexible circuit board using a carbon nanotube to reduce the manufacturing overhead costs and its manufacturing method.

The present invention can simplify the CAD / CAM process-> circuit printing process-> hot press process compared to the existing manufacturing process of the FPCB, reducing the defect rate that can occur in the etching process during the existing FPCB manufacturing process and discharge of environmentally harmful substances The present invention provides a flexible circuit board using carbon nanotubes and a method for manufacturing the same, which can reduce the purification cost.

The present invention can improve the heat dissipation effect that affects the reliable life of electronic components such as chips mounted on the FPCB, and the size of the heat sink for heat dissipation of components (Chip, CPU, etc.) of electronic products The present invention provides a flexible circuit board using carbon nanotubes and a method for manufacturing the same, which can help reduce the amount of carbon dioxide.

In the flexible circuit board using the carbon nanotubes of the present invention, CNT powder, which is carbon nanotube material, is printed on the surface of a base substrate made of an insulating film by laser printing according to a circuit designed pattern, thereby transferring and fixing the carbon nanotubes. It is characterized by having a circuit pattern layer.

In addition, the method of manufacturing a flexible circuit board using the carbon nanotubes of the present invention, while transferring the base substrate of the insulating film through a transfer roller to pass through the CNT toner filled with CNT powder of carbon nanotube material, laser printing It characterized in that it comprises a circuit printing step of forming a carbon nanotube pattern by transferring and fixing the CNT powder on the surface of the base substrate as the circuit designed pattern through.

The present invention uses a carbon nanotube as a circuit pattern material, but by forming a carbon nanotube pattern using a laser printing method to manufacture a flexible circuit board, CAD / CAM process-> circuit printing process compared to the conventional manufacturing process of FPCB -> It can not only reduce the manufacturing process and equipment, but also reduce the manufacturing cost and manufacturing overhead by simplifying the hot press process, improve the ease of wiring and the accuracy of the pattern, and improve productivity. Can be.

According to the present invention, carbon nanotubes can be used to reduce power consumption and increase energy efficiency due to excellent electrical conductivity, and can lead to an increase in lifespan of electronic components such as chips through heat dissipation due to excellent thermal conductivity. It can provide usefulness, help to reduce the size of heat sink for heat dissipation of electronic parts (Chip, CPU, etc.) and enable the production of miniaturized and light weight products.

The present invention can reduce the pattern defect rate that can occur in the etching process in the existing FPCB manufacturing process and can reduce the purification cost according to the generation and discharge of environmentally harmful substances.

1 is a block diagram showing a conventional FPCB manufacturing process.
Figure 2 is a cross-sectional view showing an FPCB using carbon nanotubes according to the present invention.
Figure 3 is a block diagram showing a FPCB manufacturing process according to the present invention.
Figure 4 is a view showing for explaining the circuit pattern formation principle of the laser printing method according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 2, the flexible circuit board 100 using carbon nanotubes according to an embodiment of the present invention has a base substrate 110 made of an insulating film such as polyimide, and a surface of the base substrate 110. A circuit pattern layer 120 formed of a carbon nanotube pattern formed by transferring and fixing CNT powder, which is a carbon nanotube material, on a base substrate 110 in a circuit designed pattern through laser printing using a laser printer. Is done.

In this case, the circuit pattern layer 120 is formed above the coverlay layer 130 is formed to protect the circuit pattern layer 120 by the carbon nanotube material.

The carbon nanotube material may be composed of a mixture of carbon nanotubes (CNT) and polymer resins. In this case, carbon nanotubes are carbon allotrope composed of carbon, and one carbon atom has three different carbon atoms. It is a material that forms a tube shape by combining with a hexagonal honeycomb pattern, and has excellent electrical conductivity, so it is an alternative to the existing conductive pattern by copper, and can provide the effect of reducing power consumption and increasing energy efficiency. Since the thermal conductivity is excellent, it can contribute to the increase of component life by the heat dissipation effect, and the polymer resin has a feature of forming a film and exhibits an adhesive function.

Table 1 below is a data comparing the characteristics of the carbon nanotubes used as the circuit pattern material in the present invention and copper used as the circuit pattern material of the conventional FPCB.

[Table 1]

Figure pat00001

As shown in Table 1, it shows that the electrical and thermal properties of the carbon nanotubes used in the present invention is very superior to copper, which is compared with the conventional manufacturing of flexible circuit boards using carbon nanotubes according to the present invention. It can improve energy efficiency by reducing the power consumption of applied electronic products while increasing the conductive characteristics, and it also shows the heat dissipation function of the FPCB itself, which can lead to longer life of components.

On the other hand, Figure 3 is a block diagram showing the FPCB manufacturing process according to the present invention, Figure 4 is a view showing a circuit pattern formation principle of the laser printing method according to the present invention, the carbon according to the present invention as described above The method for manufacturing the flexible circuit board 100 using nanotubes includes a circuit design step (S11) by CAD / CAM, a circuit printing step (S12) to form a carbon nanotube pattern, and a cover that is a circuit protection film. It comprises a hot press step (S13) for attaching a lay (Cover lay).

The circuit printing step (S12), which is the core of the present invention, will be described in more detail so that the CNT toner 10 filled with CNT powder 20, which is carbon nanotube material, is transferred by transferring the base substrate 110 made of an insulating film. However, CNT powder is transferred to and adhered to the surface of the base substrate 110 according to the pattern of the circuit design, which is completed in the circuit design step (S11), which is completed in the previous step through the laser printing using the laser printing method. Forming a circuit pattern layer.

In other words, the laser printing method and the circuit printing step (S12) using the CNT toner 10 filled with the CNT powder 20, which is a carbon nanotube material, when the laser reaches the photo conductor drum 40, the drum 40 charges negative (-) charges to the entire drum 40 through a charge roller 50, and in this state, a transition is formed only to the portion where the laser touches.

The CNT powder filled in the negatively charged CNT toner 10 transferred through the agitator roller 11 and the magnetic developer roller 30 is included in the drum having the portion where the laser is transferred. The CNT powder is transferred to the surface of the base substrate 110 to which the CNT powder 20 is transferred according to the pattern of the circuit design, and the transferred CNT powder is pressed by the high temperature and high pressure while passing through the fixing roller 60 to be completely fixed.

At this time, the CNT powder is bonded while forming a film on the surface of the base substrate 110 by the action of the polymer resin, thereby forming a conductive circuit pattern by the functional and physical properties of the carbon nanotubes.

Here, the circuit pattern layer of the carbon nanotube pattern formed on the base substrate 110 by laser printing of the CNT powder 20 is pressed and adhered to the CNT powder by transfer and high temperature and high pressure according to the circuit design pattern. It is possible to provide a uniform wiring compared to a circuit pattern formed by performing an existing wiring process and to improve a defective rate.

After the CNT powder is laser printed to form a carbon nanotube pattern circuit pattern layer on the base substrate 110, the coverlay, which is a circuit protection film, is attached to the circuit pattern layer through hot pressing, as shown in FIG. 2. The flexible circuit board 100 using the same carbon nanotubes can be manufactured.

10: CNT toner 20: CNT powder
100: flexible circuit board 110: base substrate
120: circuit pattern layer (carbon nanotube pattern)

Claims (4)

CNT powder, which is a carbon nanotube material, is printed on a surface of a base substrate made of an insulating film according to a circuit designed pattern, and has a circuit pattern layer formed by a carbon nanotube pattern formed by transferring and fixing the carbon nanotubes. Flexible circuit board using.
The method of claim 1,
The carbon nanotube material is a flexible circuit board using carbon nanotubes, characterized in that the mixture of carbon nanotubes and polymer resin.
In the method of manufacturing a flexible circuit board,
Transfer base material made of insulating film to pass CNT toner filled with CNT powder, which is carbon nanotube material, and transfer and fix CNT powder to the surface of base material according to the circuit design pattern through laser printing. A method of manufacturing a flexible circuit board using carbon nanotubes, comprising the step of forming a circuit printing.
The method of claim 3, wherein
The carbon nanotube material, CNT powder is a manufacturing method of a flexible circuit board using carbon nanotubes, characterized in that the carbon nanotubes and a polymer resin composition.
KR1020100051894A 2010-06-01 2010-06-01 Flexible pcb using carbon nano tube and manufacturing method thereof KR20110132079A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105120602A (en) * 2015-07-30 2015-12-02 柳州市美源科技股份有限公司 Small and medium-sized PCB components mixed installing technology
CN106455311A (en) * 2016-10-31 2017-02-22 中国科学院理化技术研究所 Method for manufacturing double-sided flexible circuit by laser printing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105120602A (en) * 2015-07-30 2015-12-02 柳州市美源科技股份有限公司 Small and medium-sized PCB components mixed installing technology
CN106455311A (en) * 2016-10-31 2017-02-22 中国科学院理化技术研究所 Method for manufacturing double-sided flexible circuit by laser printing
CN106455311B (en) * 2016-10-31 2018-12-04 中国科学院理化技术研究所 Method for manufacturing double-sided flexible circuit by laser printing

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