CN105120602A - Small and medium-sized PCB components mixed installing technology - Google Patents
Small and medium-sized PCB components mixed installing technology Download PDFInfo
- Publication number
- CN105120602A CN105120602A CN201510457476.2A CN201510457476A CN105120602A CN 105120602 A CN105120602 A CN 105120602A CN 201510457476 A CN201510457476 A CN 201510457476A CN 105120602 A CN105120602 A CN 105120602A
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- China
- Prior art keywords
- components
- parts
- plug
- type
- pcb board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a small and medium-sized PCB components mixed installing technology. The technology comprises the following steps of (1) changing the installing way of those components with relatively small volumes from a plug-in way into a surface mounting way according to the size of a PCB; (2) arranging surface mounting type components in a chip packaging way and redesigning the layout of a printed circuit board according to component circuit connection directions; (3) adopting a chip mounter to make surface mounting type components mounted on set parts on the bottom of the PCB and located on the same welding face as pins of plug-in type components do and further fixed through adhesive; (4) making the adhesive cured through high temperature and then firmly fixing the surface mounting type components; (5) making the plug-in type components plugged in set parts of the PCB; (6) sending the PCB to a crest welder for welding and finishing circuit connection of plug-in type components and surface mounting type components in the PCB. The mixed installing technology can make the installation difficulties lowered, improve the production efficiency, and further lower electronic substrate, welding equipment and operation costs.
Description
Technical field
The present invention relates to a kind of element mounting process of electronic product, particularly relate to a kind of small-medium size pcb board components and parts Mixed loading technology.
Background technology
Small size or super-small pcb board is widely used at present in electronic product is produced, because pcb board area is little, production operation limited space, plug-in type components and parts operation density is higher, task difficulty is larger; And adopting surface-adhered type components and parts to need surface to carry out two sides welding (Surface Mount Component, needs to carry out surface soldered with Reflow Soldering, and plug-in type components and parts need to carry out bottom surface welding with wave-soldering), production efficiency is lower.
1. generally adopt chip mounter to mount for the installation of Surface Mount Component, on small size pcb board, adopt surface mount process reflow soldering again, and the installation of some superelevation components and parts, surface mount process reflow soldering but cannot complete, after must treating that Surface Mount Component, has welded by surface mount process reflow soldering, carry out part mate again, carry out device welding finally by crest welder;
2. need to use chip mounter, reflow machine, crest welder three kinds of equipment, equipment use density is higher, does not meet the requirement of production energy-conserving and environment-protective.
Summary of the invention
The technical problem to be solved in the present invention is, for the many actual job problems existed in current surface mount and artificial plug-in unit procedure for producing technique, under the prerequisite of existing procedure for producing technique, there is provided a kind of small-medium size pcb board components and parts Mixed loading technology, to overcome the above-mentioned deficiency existing for prior art.
The technical scheme that the present invention takes is: a kind of small-medium size pcb board components and parts Mixed loading technology, comprises the steps:
1) change surface-adhered type, namely according to large young pathbreaker's part components and parts of pcb board into by plug-in type: the components and parts that partial ohmic, electric capacity or diode equal-volume are less are surface-adhered type, the comparatively large or superelevation components and parts of volume are left plug-in type;
2) paster packaged type used instead by surface-adhered type components and parts, and moves towards to redesign printed circuit board layout according to element circuitry connection
;
3) adopt chip mounter surface-adhered type components and parts to be mounted on setting position bottom pcb board, make the pin of itself and plug-in type components and parts be in same solder side, be fixed with red glue;
4) after making red adhesive curing by high temperature, surface-adhered type components and parts are firmly fixed;
5) plug-in type components and parts are plugged on pcb board setting position;
6) above-mentioned pcb board is sent to crest welder welding, complete plug-in type and be connected with the circuit of surface-adhered type components and parts in pcb board.
Owing to adopting technique scheme, a kind of small-medium size pcb board components and parts Mixed loading technology of the present invention has following beneficial effect:
1. adopt a kind of small-medium size pcb board components and parts Mixed loading technology of the present invention, can solve that the higher and task difficulty of small size pcb board element closeness is comparatively large, surface mount process cannot weld the production problems such as superelevation device, before contrast, pure manual plug-in unit technique can reduce operator number, reduces personnel cost and improves production efficiency;
2. original technique needs to use chip mounter, reflow machine, crest welder three kinds of equipment, adopts a kind of small-medium size pcb board element Mixed loading technology of the present invention, only needs to use chip mounter and crest welder, reduces energy consumption;
3. original technique electric substrate must design by double sided board layout, adopts this Mixed loading technology only to need single sided board layout to design, can reduce material and the cost of electric substrate (PCB).
Be further described below in conjunction with the technical characteristic of embodiment to a kind of small-medium size pcb board components and parts Mixed loading technology of the present invention.
accompanying drawing explanation(nothing).
Embodiment
Embodiment one
A kind of small-medium size pcb board components and parts Mixed loading technology, comprises the steps:
1) change surface-adhered type, namely according to large young pathbreaker's part components and parts of pcb board into by plug-in type: the components and parts that partial ohmic, electric capacity or diode equal-volume are less are surface-adhered type, the comparatively large or superelevation components and parts of volume are left plug-in type;
2) paster packaged type used instead by surface-adhered type components and parts, and moves towards to redesign printed circuit board layout according to element circuitry connection
;
3) adopt chip mounter surface-adhered type components and parts to be mounted on setting position bottom pcb board, make the pin of itself and plug-in type components and parts be in same solder side, be fixed with red glue;
4) after making red adhesive curing by high temperature, surface-adhered type components and parts are firmly fixed;
5) plug-in type components and parts are plugged on pcb board setting position;
6) above-mentioned pcb board is sent to crest welder welding, complete plug-in type and be connected with the circuit of surface-adhered type components and parts in pcb board.
Embodiment two
Adopt a kind of small-medium size pcb board components and parts Mixed loading technology of the present invention, be applied to the installation (original technique 10 elements are plug-in type) of the Rear Fog Lamp pcb board of our company:
1) wherein 6 components and parts (resistance, diode) surface-adhered type will be used instead, and move towards to redesign printed circuit board layout according to the circuit that element connects;
2) adopt chip mounter 6 surface-adhered type components and parts to be mounted on setting position bottom pcb board, make the pin of itself and plug-in type components and parts be in same solder side, be fixed with red glue;
4) after making red adhesive curing by high temperature, surface-adhered type components and parts are firmly fixed;
5) plug-in type components and parts are plugged on pcb board setting position;
6) above-mentioned pcb board is sent to crest welder welding, complete plug-in type and be connected with the circuit of surface-adhered type components and parts in pcb board.
With the beneficial effect compared with original technique:
1. former scheme two-panel design can change one side design into, and material cost is reduced to 300/m2 by former double sided board 400/m2, and material cost reduces 25%; Save pcb board space of planes, increase components and parts clearance space, reduce package density and difficulty;
2. most of components and parts are fixed on bottom pcb board by red glue by Mixed loading technology, and plug-in unit operation reduces, and improve operating efficiency, reduce task difficulty; Reduce leakage that artificial part mate easily occurs to insert or the problem of misplug, improve plug-in unit quality and efficiency;
3. operation is reduced to 4 plug-in components by 10 plug-in components before, and 6 attachments are completed by machine, and operation intensity reduces about 60%; Former part mate personnel are reduced to 2 people by former scheme 4 people, and personnel cost reduces 50%;
4. can production equipment and production operation before compatibility, use existing welding equipment to produce, can continue to use crest welder to carry out weld job, without the need to using solder reflow device, before contrast, scheme improves production efficiency does not but increase equipment cost.
Claims (1)
1. a small-medium size pcb board components and parts Mixed loading technology, is characterized in that: comprise the steps:
1) change surface-adhered type, namely according to large young pathbreaker's part components and parts of pcb board into by plug-in type: the components and parts that partial ohmic, electric capacity or diode equal-volume are less are surface-adhered type, the comparatively large or superelevation components and parts of volume are left plug-in type;
2) paster packaged type used instead by surface-adhered type components and parts, and moves towards to redesign printed circuit board layout according to element circuitry connection
;
3) adopt chip mounter surface-adhered type components and parts to be mounted on setting position bottom pcb board, make the pin of itself and plug-in type components and parts be in same solder side, be fixed with red glue;
4) after making red adhesive curing by high temperature, surface-adhered type components and parts are firmly fixed;
5) plug-in type components and parts are plugged on pcb board setting position;
6) above-mentioned pcb board is sent to crest welder welding, complete plug-in type and be connected with the circuit of surface-adhered type components and parts in pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510457476.2A CN105120602A (en) | 2015-07-30 | 2015-07-30 | Small and medium-sized PCB components mixed installing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510457476.2A CN105120602A (en) | 2015-07-30 | 2015-07-30 | Small and medium-sized PCB components mixed installing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105120602A true CN105120602A (en) | 2015-12-02 |
Family
ID=54668421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510457476.2A Pending CN105120602A (en) | 2015-07-30 | 2015-07-30 | Small and medium-sized PCB components mixed installing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105120602A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609976A (en) * | 2016-01-21 | 2016-05-25 | 上海斐讯数据通信技术有限公司 | MMCX connector, patch device and patch method of patch device |
| CN108668463A (en) * | 2018-04-04 | 2018-10-16 | 深圳珈伟光伏照明股份有限公司 | A kind of welding method of axial direction potted element |
| CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110132079A (en) * | 2010-06-01 | 2011-12-07 | 에스티플렉스 주식회사 | Flexible pcb using carbon nano tube and manufacturing method thereof |
| CN103002670A (en) * | 2012-11-27 | 2013-03-27 | 陕西航空电气有限责任公司 | Wave crest soldering technique of printed circuit board |
| CN103732002A (en) * | 2012-10-12 | 2014-04-16 | 深圳维盛半导体科技有限公司 | Method for setting PCB of wired keyboard |
| CN104507271A (en) * | 2014-12-29 | 2015-04-08 | 深圳市凯健奥达科技有限公司 | Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA |
-
2015
- 2015-07-30 CN CN201510457476.2A patent/CN105120602A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110132079A (en) * | 2010-06-01 | 2011-12-07 | 에스티플렉스 주식회사 | Flexible pcb using carbon nano tube and manufacturing method thereof |
| CN103732002A (en) * | 2012-10-12 | 2014-04-16 | 深圳维盛半导体科技有限公司 | Method for setting PCB of wired keyboard |
| CN103002670A (en) * | 2012-11-27 | 2013-03-27 | 陕西航空电气有限责任公司 | Wave crest soldering technique of printed circuit board |
| CN104507271A (en) * | 2014-12-29 | 2015-04-08 | 深圳市凯健奥达科技有限公司 | Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609976A (en) * | 2016-01-21 | 2016-05-25 | 上海斐讯数据通信技术有限公司 | MMCX connector, patch device and patch method of patch device |
| CN105609976B (en) * | 2016-01-21 | 2019-10-22 | 上海斐讯数据通信技术有限公司 | A kind of MMCX connector, paster apparatus and its pasting method |
| CN108668463A (en) * | 2018-04-04 | 2018-10-16 | 深圳珈伟光伏照明股份有限公司 | A kind of welding method of axial direction potted element |
| CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
| CN111545856B (en) * | 2020-05-15 | 2022-03-22 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
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| PB01 | Publication | ||
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Application publication date: 20151202 |