KR20100058914A - Method of processing substrate - Google Patents

Method of processing substrate Download PDF

Info

Publication number
KR20100058914A
KR20100058914A KR1020080117499A KR20080117499A KR20100058914A KR 20100058914 A KR20100058914 A KR 20100058914A KR 1020080117499 A KR1020080117499 A KR 1020080117499A KR 20080117499 A KR20080117499 A KR 20080117499A KR 20100058914 A KR20100058914 A KR 20100058914A
Authority
KR
South Korea
Prior art keywords
substrate
buffer
transfer
unit
transfer robot
Prior art date
Application number
KR1020080117499A
Other languages
Korean (ko)
Inventor
강동연
강호신
오두영
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080117499A priority Critical patent/KR20100058914A/en
Publication of KR20100058914A publication Critical patent/KR20100058914A/en

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A substrate treating method is provided to convey a substrate which is completed with the exposure toward a bake unit in short time by partially substituting the function of a first conveying robot with a second conveying robot. CONSTITUTION: A substrate processing apparatus(1000) comprises an index(100), a work processing part(500), a substrate transfer part(700), and a light exposing part(800). The index comprises a plurality of load ports, an index robot, and an index buffer. The work processing part comprises a plurality of units and a first transfer robot. The first transfer robot transfers substrate between units. The work processing part comprises a bake unit(50) performing the bake process.

Description

Substrate Processing Method {METHOD OF PROCESSING SUBSTRATE}

The present invention relates to a substrate processing method, and more particularly, to a method for transferring a substrate in a substrate processing apparatus having a plurality of processing units.

In general, a semiconductor substrate manufacturing process is performed by repeatedly depositing an insulating film and a conductive material, etching, coating a photo resist, coating, developing, and ashing processes. To form a pattern consisting of thin films.

A spinner device is one of semiconductor manufacturing devices, and is a device for applying and developing photoresist on a substrate. The spinner device includes an index robot, a buffer, processing units, a first transfer robot, and a second transfer robot from one side. The index robot transports the substrates provided to the processing units. In addition, the first transfer robot transfers the substrate between the buffer and the processing units and transfers the substrate between the processing units. In addition, the second transfer robot may move in a vertical direction with respect to the ground so that the substrate may be transferred between the process units stacked vertically.

On the other hand, in the case where the transfer steps of the first and second transfer robots are standardized, when the substrates are not smoothly transferred by any transfer robots at any step, transfer of the substrates between the processing units is delayed to increase the production yield of the substrates. Can be reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing method which can facilitate substrate transfer into a substrate processing apparatus.

In order to achieve the above object, the substrate processing method according to the present invention is as follows. The substrate in the first processing unit is taken out and transferred to the first buffer side using a first transfer robot, and the substrate is taken out of the first buffer using a second transfer robot and transferred to the second buffer side. And whether the substrate carried out from the second process unit is loaded on the first buffer or the second buffer side while transferring the substrate inside the first process unit to the second buffer side using second transfer robots. Check it.

When the substrate carried out from the second process unit is loaded on the first buffer or the second buffer side, the substrate carried out from the second process unit and loaded on the first buffer or the second buffer side is stored. It transfers to the 3rd process unit side using a 2nd transfer robot.

According to the substrate processing method according to the present invention, it is possible to prevent the second transfer robot partially replaces the function of the first transfer robot so that the substrate on which the exposure process is completed is delayed to the baking process. Therefore, it is possible to reduce the process processing time, it is possible to minimize the delay in the substrate input to the baking unit side to reduce the yield of the substrate manufacturing.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and effects of the present invention described above will be readily understood through embodiments related to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be applied and modified in various forms. Rather, the following embodiments are provided to clarify the technical spirit disclosed by the present invention, and furthermore, to fully convey the technical spirit of the present invention to those skilled in the art having an average knowledge in the field to which the present invention belongs. Therefore, the scope of the present invention should not be construed as limited by the embodiments described below. On the other hand, the drawings presented in conjunction with the following examples are somewhat simplified or exaggerated for clarity, the same reference numerals in the drawings represent the same components.

1 is a perspective view of a substrate processing apparatus used in a substrate processing method according to an embodiment of the present invention, Figure 2 is a substrate transfer for processing the substrate from the coating process to the exposure process using the substrate processing apparatus shown in FIG. It is a figure which shows a step. Prior to the description of the substrate processing method according to the embodiment of the present invention, the substrate processing apparatus used in the substrate processing method according to the embodiment of the present invention will be described with reference to FIGS.

1 and 2, the substrate processing apparatus 1000 is a device for performing a photolithography process on a substrate, and the substrate processing apparatus 1000 includes an index unit 100, a process processing unit 500, And a substrate transfer part 700 and an exposure part 800.

The index unit 100 includes a plurality of load ports 110, an index robot 200, and an index buffer 300. The load port 110 accommodates a substrate, and the substrate accommodated in the load port 110 is transferred to the first buffer 300 by the index robot 200. The index robot 200 moves along the first transport rail 811 extending horizontally with respect to the ground.

The process processor 500 includes a plurality of units that perform a predetermined process on the substrate and a first transfer robot 350 which transfers the substrate between the units. The processing unit 500 includes coating units 70 performing a coating process for coating a photoresist such as photoresist on a substrate. In addition, the processing unit 500 includes developing units 80 which perform a developing process on a substrate on which an exposure process is completed. In addition, the process processor 500 includes baking units 50 that perform a baking process on a substrate.

Meanwhile, the developing units 80 and the coating units 70 support a spin head 71 that rotates while supporting the substrate, and a nozzle 72 that discharges the chemical liquid to the side of the substrate supported on the spin head 71. Have Accordingly, the developing units 80 support the substrate on the spin head 71, and then provide a developer to the substrate to develop the substrate. The coating units 70 perform the development of the spin head. After supporting the substrate on the substrate 71, a photoresist may be provided to the substrate to proceed the coating process on the substrate.

In addition, each of the baking units 50 includes a baking plate 610 and a cooling plate 620. The bake plate 610 heats the substrate, and the cooling plate 620 cools the substrate heated in the bake plate 610 to an appropriate temperature.

The process processor 20 may be divided into a first process chamber 20a and a second process chamber 20b. The first processing chamber 20a and the second processing chamber 20b are stacked on top of each other so that the first processing chamber 20a is disposed above the second processing chamber 20b. The first processing chamber 20a is provided with coating units 70 performing the above-described coating process, and the developing unit 80 performing the above-described developing process is provided in the second processing chamber 20b. Is provided. That is, the coating units 70 and the baking units 50 are provided in the first processing chamber 20a, and the developing units 80 and the baking units 50 are provided in the second processing chamber 20b.

The first transfer robot 350 receives a substrate from the index buffer 300 and transfers the substrate to the units constituting the process processor 500. The first transport robot 350 extends horizontally with respect to the ground but moves along a second transport rail 812 extending in a direction perpendicular to the first transport rail 811.

The substrate transfer part 700 includes a first buffer 301, a second buffer 302, and a second transfer robot 400. The first buffer 301 is located at the same height as the first processing chamber 20a and serves as a buffer of the first processing chamber 20a. In addition, the second buffer 302 is provided at the same height as the second processing chamber 20a to serve as a buffer of the second processing chamber 20b.

The second transfer robot 400 transfers along the third transfer rail 813 extending in the horizontal and vertical directions with respect to the ground. Therefore, the second transfer robot 400 may move in the horizontal direction and the vertical direction with respect to the ground. As a result, the substrate may be transferred between the first buffer 301 and the second buffer 302.

The exposure unit 800 includes a plurality of exposure units (not shown) that perform an exposure process on the substrate on which the photoresist film is formed by the coating unit 70. The exposure unit 800 includes an interface unit 850, and substrates stacked on the first buffer 301 or the second buffer 302 by the application process are completed by the interface unit 850. It may be transferred to the exposure units.

The substrate on which the exposure unit 800 is exposed is transferred to the first buffer 301 or the second buffer 302 by the interface robot 850, and the first buffer 301 or the first substrate. The substrate transferred to the second buffer 302 is sequentially provided to the baking unit 50 and the developing unit 80 by the first transfer robot 350 or the first and second transfer robots 350 and 400. Transferred.

As described above, when the substrate in which the coating process is completed in the coating unit 70 is transferred to the exposure unit 800 side, the second transfer robot 400 may be responsible for the transfer of the substrate, for convenience the coating The process of transferring the substrate from the unit 70 to the exposure part 800 side is defined as a first substrate transfer process . In addition, when the substrate on which the exposure process is completed in the exposure unit 800 is transferred to the baking unit 50 and the developing unit 80, the second transfer robot 400 may be in charge of transferring the substrate. For convenience, the process of transferring the substrate from the exposure unit 800 to the baking unit 50 and the developing unit 80 is defined as a second substrate transfer process .

The first substrate transfer process will be described in more detail using the transfer step code shown in FIG. According to the first substrate transfer process, the steps of transferring the substrate from the coating unit 70 to the exposure unit 800 by the first and second transfer robots 350 and 400 are as follows.

The substrate is carried out from the coating unit 70 by the first transfer robot 350 according to the first transfer step S1, and by the first transfer robot 350 according to the second transfer step S2. The substrate carried out from the coating unit 70 is transferred to the first buffer 301. Subsequently, the substrate loaded in the first buffer 301 is provided to the exposure part 800 side by the interface robot 850 or the second transfer robot 302 according to the third transfer step S3. The substrate loaded in the first buffer 301 is transferred to the second buffer 302 and then transferred to the exposure part 800 by the interface robot 850.

In the meantime, during the first and second substrate transfer processes, a substrate on which the exposure process is completed by the exposure unit 800 is loaded on the side of the first buffer 301 or the second buffer 302. Check if it is.

When the substrate carried out from the exposure unit 800 is not loaded on the side of the first buffer 301 or the second buffer 302, the second transfer robot 400 may be configured as described above. It is in charge of substrate transfer according to the substrate transfer process. However, when the substrate carried out from the exposure unit 800 is loaded on the side of the first buffer 301 or the second buffer 302, the second transfer robot 400 may include the first and the second transfer robots. In addition to the two substrate transfer processes, it may be in charge of another substrate transfer process. The other substrate transfer process is defined as a third substrate transfer process for convenience, and the third substrate transfer process will be described in more detail with reference to FIG. 3.

3 is a view showing a substrate transfer step for substrate processing from an exposure process to a baking process using the substrate processing apparatus shown in FIG. 1. In more detail, it is a figure which shows the procedure of the 3rd board | substrate transfer process described with reference to FIG. 2 with respect to a board | substrate transfer from an exposure process to a baking process.

Referring to FIG. 3, the third substrate transfer process is as follows. The substrate on which the exposure is completed from the exposure unit 800 according to the first transfer step S11 is transferred to the first buffer 301 by the interface robot 850, and the first buffer is transferred according to the second transfer step S12. The substrate loaded on the 301 is carried out by the second transfer robot 400. Subsequently, the substrate carried out from the first buffer 301 by the second transfer robot 400 according to the third transfer step S13 is transferred to the baking unit 50 side, and the fourth transfer step S14. ) Is taken out from the baking unit 50 by the first transfer robot 350 and transferred to the developing unit 80.

That is, in the third substrate transfer process, the substrate on which exposure is completed using the second transfer robot 400 in order to inject the substrate on which the exposure has been completed from the exposure unit 800 to the baking unit 50 in the shortest time. Transfer to the baking unit 50 side. In order to be transferred to the baking unit 50 by the second transfer robot 400, the first transfer robot 350 is moved toward the outermost baking unit 50 closest to the second transfer robot 400. Not only may the substrate be input, but the substrate may be input by the second transfer robot 400.

As described above, when the substrate is transferred according to the first to fourth transfer steps S11, S12, S13, and S14 in accordance with the third substrate transfer process, the second transfer robot 400 may be configured to perform the first transfer. 1 Since the function of the transfer robot 350 may be partially replaced, the substrate in which the exposure process is completed in the exposure unit 800 may be transferred to the baking unit 50 in the shortest time.

4 is a flow chart showing the procedure of the substrate processing method according to an embodiment of the present invention.

2, 3, and 4, the order of the substrate processing method according to the embodiment of the present invention is as follows. First, the substrate is removed from the coating unit 70 using the first transfer robot 350 (S100), and it is checked whether the substrate on which the exposure process is completed is in the first buffer 301 or the second buffer 302 ( S110).

When the substrate on which the exposure process is completed is in the first buffer 301 or the second buffer 302, the exposure process is performed on the first buffer 301 or the second buffer 302 using the second transfer robot 400. The completed substrate is put into the baking unit 50 (S120). In addition, when the substrate on which the exposure process is completed is not in the first buffer 301 or the second buffer 302, the substrate, which has been removed from the coating unit 70 by using the first transfer robot 350, is first buffered. Transfer to step 301 (S130).

After that, it is checked whether the substrate on which the exposure process is completed is in the first buffer 301 or the second buffer 302 (S140). When the substrate on which the exposure process is completed is in the first buffer 301 or the second buffer 302, the exposure process is performed on the first buffer 301 or the second buffer 302 using the second transfer robot 400. The completed substrate is put into the baking unit 50 (S150). In addition, when the substrate on which the exposure process is completed is not present in the first buffer 301 or the second buffer 302, the substrate is transferred from the first buffer 301 to the second buffer 302 by using the second transfer robot 400. Transfer to).

That is, between the steps constituting the first substrate transfer process described with reference to FIG. 2 (S1, S2, and S3 in FIG. 2), the substrate on which the exposure process is completed is performed by the first buffer 301 or the second buffer 302. ) And when the substrate on which the exposure process is completed is in the first buffer 301 or the second buffer 302, the second transfer robot (according to the third substrate transfer process described with reference to FIG. 3). The substrate on which the exposure is completed is transferred to the baking unit 50 using 400. As a result, the substrate on which the exposure is completed can be transferred to the baking unit 50 in the shortest time.

Although described with reference to the above embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

1 is a perspective view of a substrate processing apparatus used in a substrate processing method according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a substrate transfer step for processing a substrate from an application process to an exposure process using the substrate processing apparatus shown in FIG. 1.

3 is a view showing a substrate transfer step for substrate processing from an exposure process to a baking process using the substrate processing apparatus shown in FIG. 1.

4 is a flow chart showing the procedure of the substrate processing method according to an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

50-Bake Unit 70-Dispensing Unit

80-Developing unit 100-Index unit

301-First buffer 302-Second buffer

350-1st transfer robot 400-2nd transfer robot

500-Process Processing Unit 700-Substrate Transfer Unit

800-exposed part 1000-substrate processing equipment

Claims (5)

Transporting the substrate inside the first process unit by using the first transfer robot and transferring the substrate to the first buffer side; Transporting the substrate from the first buffer to a second buffer side using a second transfer robot; While the substrate inside the first process unit is transferred to the second buffer side by using the first and second transfer robots, the substrate taken out from the second process unit on the first buffer or the second buffer side is Checking whether it is loaded; And When the substrate carried out from the second process unit is loaded on the first buffer or the second buffer side, the substrate carried out from the second process unit and loaded on the first buffer or the second buffer side is stored. Substrate processing method comprising the step of transferring to the third processing unit side using the second transfer robot. The method of claim 1, wherein the first process unit performs a coating process for applying a photosensitive liquid to the substrate, the second process unit performs an exposure process for the substrate, the third process unit is exposed to the substrate A substrate treatment method comprising performing a process. The method of claim 2, wherein the first processing unit and the third processing unit face each other, and the second processing unit is located at rear ends of the first and third processing units. The method of claim 3, wherein the first transfer robot moves horizontally with respect to the ground between the first process unit and the third process unit, and the second transfer robot is adjacent to the second process unit to the ground. Substrate processing method characterized in that the movement in the vertical direction with respect to. The method of claim 4, wherein the first buffer and the second buffer are disposed side by side in a direction perpendicular to the ground, and the second transfer robot transfers the substrate between the first buffer and the second buffer. Substrate processing apparatus.
KR1020080117499A 2008-11-25 2008-11-25 Method of processing substrate KR20100058914A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080117499A KR20100058914A (en) 2008-11-25 2008-11-25 Method of processing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080117499A KR20100058914A (en) 2008-11-25 2008-11-25 Method of processing substrate

Publications (1)

Publication Number Publication Date
KR20100058914A true KR20100058914A (en) 2010-06-04

Family

ID=42360288

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080117499A KR20100058914A (en) 2008-11-25 2008-11-25 Method of processing substrate

Country Status (1)

Country Link
KR (1) KR20100058914A (en)

Similar Documents

Publication Publication Date Title
JP7168699B2 (en) Substrate processing equipment
JP4527670B2 (en) Heat treatment apparatus, heat treatment method, control program, and computer-readable storage medium
KR101059174B1 (en) Method for manufacturing semiconductor device and resist coating and developing processing system
JP2006031025A (en) System and method for manufacturing flat panel display
JP5025231B2 (en) Substrate transfer processing equipment
KR20120025393A (en) Coating-developing apparatus, coating-developing method and storage medium
JP5023128B2 (en) Coating and developing apparatus and coating and developing method
JP2005294460A (en) Coating and developing device
KR101087463B1 (en) Substrate processing system, substrate conveyance method, and computer readable storage medium
JP2018029125A (en) Substrate processing apparatus and substrate processing method
KR20110093611A (en) Substrate processing method
KR20190083973A (en) Substrate processing apparatus, substrate processing method and computer storage medium
JP5378686B2 (en) Substrate processing equipment
KR20100058914A (en) Method of processing substrate
KR20110063009A (en) Robot for transferring substrate and apparatus for processing substrate including the same
KR101100833B1 (en) Appatus and method for processing substrate
JP4548735B2 (en) Substrate processing system
JP5362232B2 (en) Substrate processing equipment
KR102582058B1 (en) Substrate processing equipment and substrate transfer method
KR101036604B1 (en) Apparatus for treating substrate
JP5661584B2 (en) Substrate processing system, substrate transfer method, program, and computer storage medium
KR20180061447A (en) Substrate treating apparatus and substrate treating method
KR100695231B1 (en) Apparatus and method for treating a substrate
KR20120077880A (en) Substrate processing method for photolithography process
WO2011099221A1 (en) Substrate processing method

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application