KR20120077880A - Substrate processing method for photolithography process - Google Patents
Substrate processing method for photolithography process Download PDFInfo
- Publication number
- KR20120077880A KR20120077880A KR1020100139997A KR20100139997A KR20120077880A KR 20120077880 A KR20120077880 A KR 20120077880A KR 1020100139997 A KR1020100139997 A KR 1020100139997A KR 20100139997 A KR20100139997 A KR 20100139997A KR 20120077880 A KR20120077880 A KR 20120077880A
- Authority
- KR
- South Korea
- Prior art keywords
- bake
- substrates
- modules
- temperature
- module
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a substrate processing method for a photolithography process having a coating process and a developing process in a semiconductor manufacturing process.
As is well known, an apparatus for performing a photolithography process includes a coating chamber for applying a resist to a wafer, a developing module for performing a developing process on an exposed wafer, and a processing module having an interface for inline connection with the exposure apparatus. Has Recently, however, in addition to the processes described above, a greater number of processes are required before and after exposure.
In the photolithography process, it can be seen that there are a plurality of steps of heating the process wafer such as soft bake, post-exposure bake, and hard bake. These bake stages take place in the bake modules, with each baking module being somewhat different in operating temperature. The operating temperature of each bake module is determined at the beginning of the process line conditioning phase and operated with the value entered in the main controller. When necessary, the heating signal is supplied to the differentiated temperature controller from the main controller. The controller maintains a constant temperature by flowing a certain amount of current to the heater of the baking module.
In the photolithography apparatus having such a configuration, the substrate is processed based on a process recipe in which a work order is set. The baking temperature of the process recipe of the preceding job substrates and the process recipe of the subsequent job substrates are different from each other. In this case, it was possible to adjust the temperature of the bake module or to insert a trailing job board. This causes uptime losses for the bake module's temperature readjustment time.
It is an object of the present invention to provide a substrate processing method in a spinner apparatus capable of more efficiently operating a continuous process according to a temperature change of a baking process.
It is an object of the present invention to provide a substrate processing method in spinner equipment for minimizing process problems occurring while waiting in a previous step unit during a change in bake temperature.
The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.
In order to solve the above problems, the substrate processing method for the photolithography process according to the present invention comprises the steps of checking the baking temperature through the process recipe of the preceding substrates and the following substrates; If the baking temperature of the preceding substrates and the subsequent substrates are different, setting the temperature of the baking modules for each of the preceding substrates and the subsequent substrates.
According to an embodiment of the present disclosure, in the temperature setting step, the bake modules may be divided into a first group of bake modules for baking the preceding substrates and a second group of bake modules for baking the subsequent substrates. It is set to the baking temperature of the process recipe.
According to the present invention, it has a special effect that can efficiently operate the continuous progress of the substrates by minimizing the environmental temperature setting time of the baking.
According to the present invention, it is easy to determine the input of the following job substrates in the continuous progress of the substrates of the preceding job and the substrates of the following job.
According to the present invention, when the temperature setting of the preceding job and the following job is different, the baking can be separately operated, and thus, the substrate can be continuously added during the temperature setting time.
1 is a view showing a conveyor apparatus according to the present invention.
1 is a perspective view of a photolithography facility used in a substrate processing method according to an embodiment of the present invention.
2 is a view showing a coating treatment unit in the installation of FIG.
3 is a view illustrating a developing unit in the installation of FIG. 1.
Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention. The problem, the problem solving means, and effects to be solved by the present invention described above will be easily understood through embodiments related to the accompanying drawings. Each drawing is partly or exaggerated for clarity. In adding reference numerals to the components of each drawing, it should be noted that the same components are shown with the same reference numerals as much as possible, even if displayed on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
Figure 1 Figure 3 is a diagram schematically showing a
1 is a perspective view of a
The
The wafer W is moved in the state accommodated in the
(Index part)
The
The
The
The
(Process Processing Unit)
In the
The
The
The
The
The
The
The developing
The developing
The developing
The
The
The developing
The
As described above, the bake modules in the coating and developing processes provide the first group of
(Interface part)
The
In the
The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.
Description of the Related Art
100: index portion
200: process processing unit
700: interface unit
900 exposure apparatus
Claims (2)
Confirming the bake temperature through the process recipe of the preceding and following substrates;
If the baking temperatures of the preceding substrates and the subsequent substrates are different, setting the temperature of the baking modules for each of the preceding substrates and the trailing substrates.
In the temperature setting step, the bake modules are divided into a first group of bake modules for baking the preceding substrates and a second group of bake modules for baking the subsequent substrates to set the bake temperatures of the corresponding process recipes. A substrate processing method for a photolithography process, characterized in that.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100139997A KR20120077880A (en) | 2010-12-31 | 2010-12-31 | Substrate processing method for photolithography process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100139997A KR20120077880A (en) | 2010-12-31 | 2010-12-31 | Substrate processing method for photolithography process |
Publications (1)
Publication Number | Publication Date |
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KR20120077880A true KR20120077880A (en) | 2012-07-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020100139997A KR20120077880A (en) | 2010-12-31 | 2010-12-31 | Substrate processing method for photolithography process |
Country Status (1)
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KR (1) | KR20120077880A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101412641B1 (en) * | 2012-10-31 | 2014-06-30 | 세메스 주식회사 | unit for handling a substrate, apparatus for treating substrates, and unit for supporting a substrate |
-
2010
- 2010-12-31 KR KR1020100139997A patent/KR20120077880A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101412641B1 (en) * | 2012-10-31 | 2014-06-30 | 세메스 주식회사 | unit for handling a substrate, apparatus for treating substrates, and unit for supporting a substrate |
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