KR20090055073A - 체적탄성파 공진기의 패키지 및 그 패키징 방법 - Google Patents
체적탄성파 공진기의 패키지 및 그 패키징 방법 Download PDFInfo
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- KR20090055073A KR20090055073A KR1020070121801A KR20070121801A KR20090055073A KR 20090055073 A KR20090055073 A KR 20090055073A KR 1020070121801 A KR1020070121801 A KR 1020070121801A KR 20070121801 A KR20070121801 A KR 20070121801A KR 20090055073 A KR20090055073 A KR 20090055073A
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (3)
- 기판(10) 위에 완성된 FBAR(20)의 상면을 상기 FBAR(20)를 에워싸도록 패터닝된 본딩 패드(24) 및 실링 패드(24a)의 상면 접착층(24b)에 접착된 캡(30)이 완전히 커버하고, 상기 기판(10)을 관통하는 기판 VIA(10c)를 통해 상기 FBAR(20)의 본딩 패드(24)에 외부 회로장치와 연결되는 신호라인(40)이 직접 접착되는 것을 특징으로 하는 체적탄성파 공진기의 패키지.
- 제 1 항에 있어서, 상기 캡(30)은 실리콘(Si), 고저항 실리콘(HRS), 유리, 세라믹 중 어느 하나로 된 것을 특징으로 하는 체적탄성파 공진기의 패키지.
- 기판(10) 위에 완성된 FBAR(20)를 에워싸는 실링 패드(24a)를 패터닝하는 단계(S30)와;상기 기판(10) 위에 완성된 FBAR(20)를 에워싸는 본딩 패드(24)와 실링 패드(24a)에 접착층(24b)을 형성하고 상기 접착층(24b)에 캡(30)을 접착하여 상기 FBAR(20)의 상면을 완전히 커버하는 단계(S32);상기 기판(10)의 저면에서부터 상기 FBAR(20)의 본딩 패드(24)의 저면까지 통하는 기판 VIA(10c)를 형성하는 단계(S34); 및상기 본딩 패드(24)에 외부 회로장치와 연결되는 신호라인(40)을 직접 접착하는 단계(S36);로 이루어지는 것을 특징으로 하는 체적탄성파 공진기의 패키징 방법.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070121801A KR100916182B1 (ko) | 2007-11-28 | 2007-11-28 | 체적탄성파 공진기의 패키지 및 그 패키징 방법 |
US12/325,138 US20090134957A1 (en) | 2007-11-28 | 2008-11-28 | Film bulk acoustic resonator package and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070121801A KR100916182B1 (ko) | 2007-11-28 | 2007-11-28 | 체적탄성파 공진기의 패키지 및 그 패키징 방법 |
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Publication Number | Publication Date |
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KR20090055073A true KR20090055073A (ko) | 2009-06-02 |
KR100916182B1 KR100916182B1 (ko) | 2009-09-08 |
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KR1020070121801A KR100916182B1 (ko) | 2007-11-28 | 2007-11-28 | 체적탄성파 공진기의 패키지 및 그 패키징 방법 |
Country Status (2)
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US (1) | US20090134957A1 (ko) |
KR (1) | KR100916182B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107204751A (zh) * | 2016-03-17 | 2017-09-26 | 三星电机株式会社 | 电子元件封装件及制造该电子元件封装件的方法 |
US10211808B2 (en) | 2016-02-04 | 2019-02-19 | Samsung Electro-Mechanics Co., Ltd. | Acoustic wave filter device and package and method of manufacturing the same |
CN112039458A (zh) * | 2019-07-19 | 2020-12-04 | 中芯集成电路(宁波)有限公司上海分公司 | 体声波谐振器的封装方法及封装结构 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101708893B1 (ko) * | 2010-09-01 | 2017-03-08 | 삼성전자주식회사 | 체적 음향 공진기 구조 및 제조 방법 |
KR101959204B1 (ko) * | 2013-01-09 | 2019-07-04 | 삼성전자주식회사 | 무선 주파수 필터 및 무선 주파수 필터의 제조방법 |
US9862592B2 (en) * | 2015-03-13 | 2018-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | MEMS transducer and method for manufacturing the same |
KR101942734B1 (ko) * | 2017-05-18 | 2019-01-28 | 삼성전기 주식회사 | 체적 음향 공진기 |
JP2020053966A (ja) | 2018-09-24 | 2020-04-02 | スカイワークス グローバル プライベート リミテッド | バルク弾性波デバイスにおける多層***フレーム |
US11522513B2 (en) | 2019-02-27 | 2022-12-06 | Skyworks Global Pte. Ltd. | Bulk acoustic wave resonator structure |
US11316494B2 (en) | 2019-06-14 | 2022-04-26 | Skyworks Global Pte. Ltd. | Bulk acoustic wave device with floating raised frame |
CN112039459B (zh) * | 2019-07-19 | 2024-03-08 | 中芯集成电路(宁波)有限公司上海分公司 | 体声波谐振器的封装方法及封装结构 |
CN112039455B (zh) * | 2019-07-19 | 2023-09-29 | 中芯集成电路(宁波)有限公司上海分公司 | 体声波谐振器的封装方法及封装结构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6713314B2 (en) * | 2002-08-14 | 2004-03-30 | Intel Corporation | Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
JP2005109221A (ja) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | ウェーハレベルパッケージ及びその製造方法 |
KR100541087B1 (ko) * | 2003-10-01 | 2006-01-10 | 삼성전기주식회사 | 마이크로 디바이스를 위한 웨이퍼 레벨 패키지 및 제조방법 |
JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
US7183622B2 (en) * | 2004-06-30 | 2007-02-27 | Intel Corporation | Module integrating MEMS and passive components |
EP1804376B1 (en) * | 2004-07-20 | 2009-04-01 | Murata Manufacturing Co., Ltd. | Piezoelectric filter |
KR100716231B1 (ko) * | 2005-08-05 | 2007-05-10 | 주식회사 엠에스솔루션 | 체적탄성파 공진기의 패키지 및 그 패키징 방법 |
US7508286B2 (en) * | 2006-09-28 | 2009-03-24 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | HBAR oscillator and method of manufacture |
-
2007
- 2007-11-28 KR KR1020070121801A patent/KR100916182B1/ko active IP Right Grant
-
2008
- 2008-11-28 US US12/325,138 patent/US20090134957A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10211808B2 (en) | 2016-02-04 | 2019-02-19 | Samsung Electro-Mechanics Co., Ltd. | Acoustic wave filter device and package and method of manufacturing the same |
CN107204751A (zh) * | 2016-03-17 | 2017-09-26 | 三星电机株式会社 | 电子元件封装件及制造该电子元件封装件的方法 |
US10749098B2 (en) | 2016-03-17 | 2020-08-18 | Samsung Electro-Mechanics Co., Ltd. | Electronic element package and method for manufacturing the same |
CN112039458A (zh) * | 2019-07-19 | 2020-12-04 | 中芯集成电路(宁波)有限公司上海分公司 | 体声波谐振器的封装方法及封装结构 |
CN112039458B (zh) * | 2019-07-19 | 2023-11-24 | 中芯集成电路(宁波)有限公司上海分公司 | 体声波谐振器的封装方法及封装结构 |
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Publication number | Publication date |
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US20090134957A1 (en) | 2009-05-28 |
KR100916182B1 (ko) | 2009-09-08 |
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