KR20060104932A - 압전부재, 액츄에이터 장치, 액체분사 헤드 및 액체분사장치 - Google Patents
압전부재, 액츄에이터 장치, 액체분사 헤드 및 액체분사장치 Download PDFInfo
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- KR20060104932A KR20060104932A KR20060027935A KR20060027935A KR20060104932A KR 20060104932 A KR20060104932 A KR 20060104932A KR 20060027935 A KR20060027935 A KR 20060027935A KR 20060027935 A KR20060027935 A KR 20060027935A KR 20060104932 A KR20060104932 A KR 20060104932A
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- 239000007788 liquid Substances 0.000 claims abstract description 29
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- 238000000034 method Methods 0.000 claims description 26
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 22
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 13
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- 230000000052 comparative effect Effects 0.000 description 13
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
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- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
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- 238000005530 etching Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
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- 238000005192 partition Methods 0.000 description 1
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- -1 polyphenylen Polymers 0.000 description 1
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- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 150000003608 titanium Chemical class 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
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- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
온도 상승률 (°C/sec) | (100) 면 강도(cps) | 정면 표면의 방위각(%) | 수직 표면의 방위각(%) | 변위상수 (pC/N) | |
예 | 120 | 446 | 86 | 87 | 157 |
비교예 1 | 10 | 444 | 84 | 70 | 136 |
비교예 2 | 1 | 387 | 84 | 78 | 144 |
비교예 3 | 3(확산로) | 374 | 92 | 69 | 131 |
Claims (7)
- 하부 전극, 압전층 및 상부 전극을 포함하는 압전부재로서,상기 압전층의 정면 표면에 존재하는 (100), (110) 및 (111) 면에 대한, 상기 동일한 정면 표면에 존재하는 (100) 면의 비율이 70% 이상이고,상기 압전층의 정면에 직교하는 수직 평면에 존재하는 (100), (110), (210), (111) 및 (211) 면에 대한, 상기 동일한 수직 평면에 존재하는 (100), (110) 및 (210) 면의 비율이 80% 이상인 것을 특징으로 하는 압전부재.
- 제 1항에 있어서,상기 압전층은 다수의 압전 필름을 서로의 위에 적층함으로써 형성되는 것을 특징으로 하는 압전부재.
- 제 2항에 있어서,첫 번째 타입의 (100) 면의 비율이, 두 번째 타입의 (100) 면 및 첫 번째 타입의 (100) 면의 합의 10% 이상이고,첫 번째 타입의 (100) 면이 상기 압전층의 정면 표면에 직교하는 수직 평면에 존재하고,두 번째 타입의 (100) 면이 상기 압전층의 정면 표면에 직교하는 수직 평면 에 소정 각도인 표면에 존재하는 것을 특징으로 하는 압전부재.
- 제 1항에 있어서,상기 압전층은 납-지르코네이트(zirconate)-타이타네이트(titanate)로 이루어지는 것을 특징으로 하는 압전부재.
- 다수의 압전부재와 기판 사이에 진동 플레이트가 구비되고,제 1항 내지 제 4항 중 어느 한 항의 압전부재가 상기 기판 상에 구비되는 것을 특징으로 하는 액츄에이터 장치.
- 노즐 오리피스로부터 액체를 분사하는 액체 분사수단으로서, 제 5항에 기재된 액츄에이터 장치를 포함하는 것을 특징으로 하는 액체분사 헤드.
- 제 6항에 기재된 액체분사 헤드를 포함하는 것을 특징으로 하는 액체 분사 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005093051A JP5297576B2 (ja) | 2005-03-28 | 2005-03-28 | 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
JPJP-P-2005-00093051 | 2005-03-28 |
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KR20060104932A true KR20060104932A (ko) | 2006-10-09 |
KR100830626B1 KR100830626B1 (ko) | 2008-05-20 |
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KR20060027935A KR100830626B1 (ko) | 2005-03-28 | 2006-03-28 | 압전부재, 액츄에이터 장치, 액체분사 헤드 및 액체분사장치 |
Country Status (5)
Country | Link |
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US (1) | US7651199B2 (ko) |
EP (1) | EP1707367B2 (ko) |
JP (1) | JP5297576B2 (ko) |
KR (1) | KR100830626B1 (ko) |
CN (1) | CN1841803B (ko) |
Families Citing this family (7)
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JP5297576B2 (ja) * | 2005-03-28 | 2013-09-25 | セイコーエプソン株式会社 | 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
KR20100057596A (ko) * | 2007-07-03 | 2010-05-31 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 존재 검출을 위한 박막 검출기 |
JP5540654B2 (ja) * | 2009-11-03 | 2014-07-02 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
US9761785B2 (en) | 2011-10-17 | 2017-09-12 | The United States Of America As Represented By The Secretary Of The Army | Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing |
JP6273829B2 (ja) | 2013-09-13 | 2018-02-07 | 株式会社リコー | 電気機械変換素子とその製造方法、及び電気機械変換素子を有する液滴吐出ヘッド、液滴吐出ヘッドを有する液滴吐出装置 |
CN111703207B (zh) * | 2020-05-13 | 2021-09-14 | 苏州锐发打印技术有限公司 | 带单层内电极的压电喷墨打印器件 |
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JP3890634B2 (ja) | 1995-09-19 | 2007-03-07 | セイコーエプソン株式会社 | 圧電体薄膜素子及びインクジェット式記録ヘッド |
JP4182329B2 (ja) | 2001-09-28 | 2008-11-19 | セイコーエプソン株式会社 | 圧電体薄膜素子およびその製造方法、ならびにこれを用いた液体吐出ヘッド及び液体吐出装置 |
JP2003133604A (ja) * | 2001-10-26 | 2003-05-09 | Seiko Epson Corp | 圧電体薄膜素子およびその製造方法、ならびにこれを用いたインクジェット記録ヘッド及びインクジェットプリンタ |
WO2003052840A1 (fr) * | 2001-12-18 | 2003-06-26 | Matsushita Electric Industrial Co., Ltd. | Element piezoelectrique, tete d'impression a jet d'encre, capteur de vitesse angulaire, procede de fabrication, et appareil d'enregistrement a jet d'encre |
JP4530615B2 (ja) | 2002-01-22 | 2010-08-25 | セイコーエプソン株式会社 | 圧電体素子および液体吐出ヘッド |
JP3956134B2 (ja) † | 2002-01-29 | 2007-08-08 | セイコーエプソン株式会社 | 圧電体素子の製造方法、及び液体吐出ヘッドの製造方法 |
CN1514808B (zh) * | 2002-02-19 | 2010-10-06 | 松下电器产业株式会社 | 压电体及其制造方法、具有该压电体的压电元件、喷墨头及喷墨式记录装置 |
JP3555682B2 (ja) | 2002-07-09 | 2004-08-18 | セイコーエプソン株式会社 | 液体吐出ヘッド |
KR100672883B1 (ko) * | 2003-01-31 | 2007-01-24 | 캐논 가부시끼가이샤 | 압전 소자 |
US7215067B2 (en) | 2003-02-07 | 2007-05-08 | Canon Kabushiki Kaisha | Ferroelectric thin film element, piezoelectric actuator and liquid discharge head |
KR100628812B1 (ko) * | 2003-05-21 | 2006-09-26 | 제이에프이 미네랄 가부시키가이샤 | 압전단결정 소자와 그 제조방법 |
JP5297576B2 (ja) * | 2005-03-28 | 2013-09-25 | セイコーエプソン株式会社 | 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
JP2006278489A (ja) * | 2005-03-28 | 2006-10-12 | Seiko Epson Corp | 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
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2005
- 2005-03-28 JP JP2005093051A patent/JP5297576B2/ja active Active
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2006
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- 2006-03-27 CN CN2006100674245A patent/CN1841803B/zh active Active
- 2006-03-28 US US11/390,222 patent/US7651199B2/en active Active
- 2006-03-28 KR KR20060027935A patent/KR100830626B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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JP5297576B2 (ja) | 2013-09-25 |
CN1841803B (zh) | 2010-04-07 |
US20060268073A1 (en) | 2006-11-30 |
EP1707367A2 (en) | 2006-10-04 |
KR100830626B1 (ko) | 2008-05-20 |
US7651199B2 (en) | 2010-01-26 |
EP1707367B2 (en) | 2017-05-10 |
JP2006278562A (ja) | 2006-10-12 |
EP1707367A3 (en) | 2009-04-08 |
EP1707367B1 (en) | 2014-01-15 |
CN1841803A (zh) | 2006-10-04 |
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