KR20050009797A - 셀로우 트렌치 소자 분리막을 갖는 고전압 트랜지스터의구조 - Google Patents
셀로우 트렌치 소자 분리막을 갖는 고전압 트랜지스터의구조 Download PDFInfo
- Publication number
- KR20050009797A KR20050009797A KR1020030048868A KR20030048868A KR20050009797A KR 20050009797 A KR20050009797 A KR 20050009797A KR 1020030048868 A KR1020030048868 A KR 1020030048868A KR 20030048868 A KR20030048868 A KR 20030048868A KR 20050009797 A KR20050009797 A KR 20050009797A
- Authority
- KR
- South Korea
- Prior art keywords
- isolation layer
- trench isolation
- shallow trench
- high voltage
- voltage transistor
- Prior art date
Links
- 238000002955 isolation Methods 0.000 title claims abstract description 42
- 239000012535 impurity Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 abstract 1
- 230000007257 malfunction Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (3)
- 반도체 기판에 소자의 활성 영역과 비활성 영역을 구분하기 위한 셀로우 트렌치 소자 분리막;상기 기판 상부에 게이트 절연막을 개재하여 형성된 게이트 전극;상기 기판의 활성 영역내에 제 1도전형 불순물이 주입된 웰;상기 게이트 전극의 측면 양쪽 웰내에 제 2도전형 불순물이 주입된 소오스 및 드레인 영역; 및상기 게이트 전극의 측면 양쪽 웰내에서 상기 셀로우 트렌치 소자 분리막과 설정된 간격을 두고 상기 소오스 및 드레인 영역을 감싸도록 제 2도전형 불순물이 주입된 드리프트 영역을 구비한 것을 특징으로 하는 셀로우 트렌치 소자 분리막을 갖는 고전압 트랜지스터의 구조.
- 제 1 항에 있어서, 상기 드리프트 영역의 폭은 고전압 트랜지스터의 설정된 채널 폭에 따라 조정되는 것을 특징으로 하는 고전압 트랜지스터의 구조.
- 제 1 항에 있어서, 상기 셀로우 트렌치 소자 분리막과 드리프트 영역 사이의 설정된 간격은 상기 셀로우 트렌치 소자 분리막 사이의 간격에서 고전압 트랜지스터의 설정된 채널 폭을 뺀 것을 특징으로 하는 고전압 트랜지스터의 구조.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030048868A KR100954422B1 (ko) | 2003-07-16 | 2003-07-16 | 셀로우 트렌치 소자 분리막을 갖는 고전압 트랜지스터의구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030048868A KR100954422B1 (ko) | 2003-07-16 | 2003-07-16 | 셀로우 트렌치 소자 분리막을 갖는 고전압 트랜지스터의구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050009797A true KR20050009797A (ko) | 2005-01-26 |
KR100954422B1 KR100954422B1 (ko) | 2010-04-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030048868A KR100954422B1 (ko) | 2003-07-16 | 2003-07-16 | 셀로우 트렌치 소자 분리막을 갖는 고전압 트랜지스터의구조 |
Country Status (1)
Country | Link |
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KR (1) | KR100954422B1 (ko) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100657130B1 (ko) * | 2005-12-27 | 2006-12-13 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 그 제조 방법 |
KR100847827B1 (ko) * | 2006-12-29 | 2008-07-23 | 동부일렉트로닉스 주식회사 | 고전압 트랜지스터의 제조 방법 |
US7705409B2 (en) | 2007-02-02 | 2010-04-27 | Samsung Electronics Co., Ltd. | High voltage transistors |
KR101009398B1 (ko) * | 2007-12-31 | 2011-01-19 | 주식회사 동부하이텍 | 고 전압 트랜지스터 및 그의 제조 방법 |
KR101102964B1 (ko) * | 2005-12-29 | 2012-01-10 | 매그나칩 반도체 유한회사 | 고전압 트랜지스터 |
CN113745161A (zh) * | 2021-09-06 | 2021-12-03 | 武汉新芯集成电路制造有限公司 | 高压半导体器件及其制作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020009842A1 (en) * | 2000-01-03 | 2002-01-24 | Ming-Tsung Tung | High-voltage device and method for manufacturing high-voltage device |
US6501139B1 (en) * | 2001-03-30 | 2002-12-31 | Matrix Semiconductor, Inc. | High-voltage transistor and fabrication process |
-
2003
- 2003-07-16 KR KR1020030048868A patent/KR100954422B1/ko active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100657130B1 (ko) * | 2005-12-27 | 2006-12-13 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 그 제조 방법 |
KR101102964B1 (ko) * | 2005-12-29 | 2012-01-10 | 매그나칩 반도체 유한회사 | 고전압 트랜지스터 |
KR100847827B1 (ko) * | 2006-12-29 | 2008-07-23 | 동부일렉트로닉스 주식회사 | 고전압 트랜지스터의 제조 방법 |
US7705409B2 (en) | 2007-02-02 | 2010-04-27 | Samsung Electronics Co., Ltd. | High voltage transistors |
KR101009398B1 (ko) * | 2007-12-31 | 2011-01-19 | 주식회사 동부하이텍 | 고 전압 트랜지스터 및 그의 제조 방법 |
CN113745161A (zh) * | 2021-09-06 | 2021-12-03 | 武汉新芯集成电路制造有限公司 | 高压半导体器件及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100954422B1 (ko) | 2010-04-26 |
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