KR200449179Y1 - An contact for handyphone - Google Patents

An contact for handyphone Download PDF

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Publication number
KR200449179Y1
KR200449179Y1 KR2020090017112U KR20090017112U KR200449179Y1 KR 200449179 Y1 KR200449179 Y1 KR 200449179Y1 KR 2020090017112 U KR2020090017112 U KR 2020090017112U KR 20090017112 U KR20090017112 U KR 20090017112U KR 200449179 Y1 KR200449179 Y1 KR 200449179Y1
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KR
South Korea
Prior art keywords
connection
mounting
terminal portion
bent
board
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KR2020090017112U
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Korean (ko)
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이영근
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주식회사 협진아이엔씨
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Telephone Set Structure (AREA)

Abstract

본 고안은 휴대폰용 접속단자에 관한 것으로서, 안테나 또는 배터리와 같은 휴대폰 기구물의 접촉시 접속가동단자부의 과도한 탄성 가동의 지지를 통하여 접속가동단자부의 과도한 동작으로 인한 소성 변형을 방지하며 보드에 정확한 실장이 이루어질 수 있도록 한 것이다.The present invention relates to a connection terminal for a mobile phone, which prevents plastic deformation due to excessive operation of the connection movable terminal portion by supporting an excessive elastic movement of the connection movable terminal portion when a mobile phone such as an antenna or a battery is contacted, .

즉, 본 고안은 접속단자에 있어서, 실장단자부의 단부에서 절곡 형성되어 접속가동단자부의 탄성 가동을 제한 지지하는 가동지지구와, 실장단자부에 절곡 형성되어 보드의 솔더를 흡수하는 솔더흡수부를 구비한 것이다.That is, the present invention has a movable support for bending at the end of the mounting terminal portion to limit the elastic movement of the connection movable terminal portion, and a solder absorber bent at the mounting terminal portion to absorb the solder of the board .

따라서, 본 고안은 접속가동단자부를 탄성 가동을 제한 지지하는 가동지지구를 구비함으로써 안테나 또는 배터리와 같은 휴대폰 기구물와의 접속에 의하여 탄성변형된 접속가동단자부를 지지하여 주어 접속가동단자부에 의한 지지력이 향상되며, 솔더흡수부를 형성함으로써 실장과정에 있어 불량이 방지되는 것이다.Therefore, the present invention has a movable support portion for restricting elastic movement of the connection movable terminal portion, thereby supporting the connection movable terminal portion resiliently deformed by connection with a cellular phone such as an antenna or a battery, thereby improving the supporting force by the connection movable terminal portion And the solder absorbing portion is formed, thereby preventing defects in the mounting process.

휴대폰, 접속단자 Mobile phone, connection terminal

Description

휴대폰용 접속단자{An contact for handyphone}An access for handyphone}

본 고안은 휴대폰용 접속단자에 관한 것으로서, 더욱 상세하게는 접속단자에 있어서, 실장단자부의 단부에서 절곡 형성되어 접속가동단자부의 탄성 가동을 제한 지지하는 가동지지구와, 실장단자부에 절곡 형성되어 보드의 솔더를 흡수하는 솔더흡수부를 구비하여서, 안테나 또는 배터리와 같은 휴대폰 기구물의 접촉시 접속가동단자부의 과도한 탄성 가동의 지지를 통하여 접속가동단자부의 과도한 동작으로 인한 소성 변형을 방지하며 보드에 정확한 실장이 이루어질 수 있도록 함을 목적으로 한 것이다.The present invention relates to a connection terminal for a mobile phone, and more particularly to a connection terminal which is bent at an end of a mounting terminal portion and which is bent at a mounting terminal portion to limit the elastic movement of the connection movable terminal portion, The solder absorbing portion for absorbing the solder is provided to prevent plastic deformation due to the excessive operation of the connection movable terminal portion by supporting excessive elastic movement of the connection movable terminal portion when the cellular phone such as the antenna or the battery is contacted, To be able to do so.

일반적으로, 휴대폰용 접속단자는 휴대폰케이스에 장착된 안테나 또는 배터리와 같은 휴대폰 기구물와 휴대폰의 보드가 전기적 접속을 할 수 있도록 하는 것이다.Generally, a connection terminal for a mobile phone is to make an electrical connection between a mobile phone device such as an antenna or a battery mounted on the mobile phone case and a board of the mobile phone.

이상과 같은 휴대폰용 접속단자는 통상 보드에 실장되는 판상의 실장단자부와 상기 실장단자부에서 경사지게 절곡된 접속가동단자부로 구성되는 것이다.The above-mentioned mobile phone connection terminal is generally composed of a plate-like mounting terminal portion mounted on a board and a connection movable terminal portion bent obliquely on the mounting terminal portion.

상기한 바와 같이 종래의 휴대폰용 접속단자는 휴대폰케이스에 장착된 안테나 또는 배터리와 같은 휴대폰 기구물가 접속가동단자부와 접속하여서 전기적 접속 이 이루어지는 것으로서, 상기 안테나 또는 배터리와 같은 휴대폰 기구물의 접속시 접속가동단자부가 탄성변형되어서 탄성력을 유지하며 접속되는 것이다.As described above, in the conventional mobile phone connection terminal, a mobile phone device such as an antenna or a battery mounted on a mobile phone case is connected to a connection movable terminal portion for electrical connection. When the mobile phone device such as the antenna or the battery is connected, Is elastically deformed to maintain the elastic force and is connected.

그러나, 상기한 바와 같은 종래의 접속단자는 그 접속이 실장단자부에서 절곡형성된 접속가동단자부의 탄성 변형력에 의하여만 접속되게 구성되어 있어서 휴대폰의 외부에서 가해지는 충격되는 외력에 의한 진동 등에 의하어 접속불량이 발생하거나, 안테나 또는 배터리와 같은 휴대폰 기구물의 지속적인 가압력에 의하여 접속가동단자부의 지지력이 약화되어 소성변형되는 문제점이 있었다.However, since the conventional connection terminal described above is configured such that the connection is connected only by the elastic deformation force of the connection movable terminal portion formed by bending at the mounting terminal portion, the connection failure is caused by the vibration caused by the external impact applied from the outside of the cellular phone, Or the supporting force of the connection movable terminal portion is weakened due to the continuous pressing force of the mobile phone device such as an antenna or a battery, resulting in plastic deformation.

그리고, 접속단자를 보드에 실장함에 있어 실장면에 용융된 솔더에 보드가 안착되는 과정에 보드의 솔더가 접속단자의 실장단자부에 완전히 흡수되지 않아 접소단자가 부상되어 실장상태가 흔들려 정확한 실장이 이루어지지 않는 제조불량이 발생하는 문제점이 있었다.In the process of mounting the connection terminal on the board, the solder of the board is not completely absorbed by the mounting terminal portion of the board in the process of mounting the board on the melted solder in the mounting surface, so that the terminal is floated, There is a problem that a manufacturing defect which does not occur occurs.

한편, 접속단자의 실장에 있어서 진공흡착판에 실장흡착공간이 확보되지 않아 자동화에 의한 작업이 용이하지 않은 문제점이 있었다.On the other hand, in the mounting of the connection terminals, there is a problem that the vacuum suction plate does not secure a suction space for mounting, which makes it difficult to carry out automation work.

이에, 본 고안은 상술한 바와 같은 종래 휴대폰의 접속단자가 그 탄성지지력이 약하며 진동 등에 의하여 접속불량을 유발하고, 보드에 실장과정에 부상 유상에 의한 실장불량이 발생하는 문제점과, 자동화가 용이하지 않은 문제점을 해결할 수 있도록 한 것이다.Accordingly, the present invention has the disadvantage that the connection terminal of the conventional mobile phone as described above is weak in its elastic supporting force, causes a connection failure due to vibration or the like, causes poor mounting due to floating phenomenon during mounting on the board, So that the problem can be solved.

즉, 본 고안은 접속단자에 있어서, 실장단자부의 단부에서 절곡 형성되어 접속가동단자부의 탄성 가동을 제한 지지하는 가동지지구와, 실장단자부에 절곡 형성되어 보드의 솔더를 흡수하는 솔더흡수부를 구비한 것이다.That is, the present invention has a movable support for bending at the end of the mounting terminal portion to limit the elastic movement of the connection movable terminal portion, and a solder absorber bent at the mounting terminal portion to absorb the solder of the board .

따라서, 본 고안은 접속가동단자부를 탄성 가동을 제한 지지하는 가동지지구를 구비함으로써 안테나 또는 배터리와 같은 휴대폰 기구물와의 접속에 의하여 탄성변형된 접속가동단자부를 지지하여 주어 접속가동단자부에 의한 지지력이 향상되며, 솔더흡수부를 형성함으로써 실장과정에 있어 불량이 방지되는 것이다.Therefore, the present invention has a movable support portion for restricting elastic movement of the connection movable terminal portion, thereby supporting the connection movable terminal portion resiliently deformed by connection with a cellular phone such as an antenna or a battery, thereby improving the supporting force by the connection movable terminal portion And the solder absorbing portion is formed, thereby preventing defects in the mounting process.

이하, 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

본 고안은 접속단자의 접속력과 지지력이 향상되도록 하고 보드 접속상태가 견고하게 이루어지도록 하며 솔더 흡수에 의하여 실장불량이 방지되도록 하며, 진공 흡착에 의한 자동화 실장이 가능하도록 한 것이다.The present invention improves the connecting force and the supporting force of the connection terminals, makes the connection state of the board solid, prevents the mounting failure by absorbing the solder, and enables automatic mounting by vacuum suction.

즉, 본 고안은 도 1 내지 3 에 도시된 바와 같이 보드에 실장되는 판상의 실장단자부와 상기 실장단자부의 일 측에서 반대 측을 향하여 상부로 만곡지게 절곡 형성되어 안테나 또는 배터리와 같은 휴대폰 기구물과 탄성 접속되는 접속가동단자부로 구성된 휴대폰용 접속단자에 있어서; 상기 접속가동단자부(200)는 실장단자부(100)와 평행하게 만곡절곡부(211)를 통하여 만곡지게 절곡되어 수평면의 실장흡착면(212)을 갖는 가동탄성부(210)와, 상기 가동탄성부(210)에서 산형으로 절곡형성하여 안테나 또는 배터리와 같은 휴대폰 기구물(510)과 접속되는 접속절곡 부(220)로 형성하고, 상기 실장단자부(100)의 접속절곡부(220)의 하부 측에는 실장단자부(100)에서 상부로 절곡 돌출되어서 하부로 절곡 형성되어 접속절곡부(220)의 하부를 지지하는 가동지지구(310)를 형성하며, 상기 실장단자부(100)에는 상부 측으로 요입되게 파형 절곡되어 보드(520)의 실장면에 솔더(540)를 흡착 흡수하여 보드(520)의 솔더로 인하여 실장단자부(100)가 부상되어 실장불량이 발생하는 것을 방지할 수 있게 하며 보드(520)와의 결속력을 높일 수 있게 한 하나 이상의 솔더흡수부(110)를 형성하여 구성한 것이다.1 to 3 and a mounting terminal portion that is bent on an upper side toward the opposite side from one side of the mounting terminal portion, 1. A connection terminal for a mobile phone, comprising: a connection movable terminal portion to be connected; The connection movable terminal unit 200 includes a movable elastic part 210 bent in a curved shape through a curved bent part 211 in parallel with the mounting terminal part 100 and having a mounting surface 212 mounted on a horizontal plane, And a connection bending part 220 connected to the mobile phone body 510 such as an antenna or a battery is formed at a lower side of the connection bending part 220 of the mounting terminal part 100, (310) that is bent upward and bent downward from the upper surface of the mounting terminal unit (100) to support a lower portion of the connection bending part (220), and the mounting terminal unit (100) The solder 540 can be absorbed and absorbed into the mounting surface of the mounting board 520 to prevent the mounting terminal unit 100 from floating due to the solder of the board 520 to prevent the mounting failure and to increase the bonding force with the board 520 Allows more than one solder absorption It is configured to form (110).

상기 가동지지구(310)는 도 1 내지 도 3 에 도시된 바와 같이 실장단자부(100)의 단부에서 상부로 절곡한 후 하부로 절곡하여 절곡단부가 실장단자부(100)의 내측을 향한 산형으로 형성하며, 가동지지구(310)의 절곡단부에 지지돌기(310a)를 돌출 형성하고, 실장단자부(100)에는 솔더(540)를 흡수하여 보드(520)와의 결속력을 유지하며 상기 지지돌기(310a)가 실장단자부(100)를 관통하여 보드(520)에 지지될 수 있게 천공 형성된 실장결속공(120)을 형성하며,상기 가동지지구(310)가 접속절곡부(220)를 지지함에 있어 탄성지지력을 갖도록 상기 지지돌기(310a)와 보드(520) 사이에 탄성공극(311)을 형성하여 실시할 수 있는 것이다.1 to 3, the movable support 310 is bent upward from an end of the mounting terminal unit 100 and then bent downward so that the bent end of the movable support 310 is formed into a mountain shape toward the inside of the mounting terminal unit 100 A supporting protrusion 310a is protruded from the bent end of the movable support 310 and the solder 540 is absorbed to the mounting terminal portion 100 to maintain the binding force with the board 520, The mounting bore 120 is formed to be penetrated through the mounting terminal portion 100 and supported by the board 520. The movable bore 310 supports the connecting bending portion 220 in a manner such that the elastic supporting force And an elastic gap 311 is formed between the support protrusion 310a and the board 520 so as to have the protrusion 310a.

한편, 상기 접속가동단자부(200)의 접속가동단자부(200)에는 휴대폰 기구물(510)과의 긴밀한 집중 접촉을 위한 접촉돌기(221)를 돌출형성하여 실시할 수 있는 것이다.The connection movable terminal part 200 of the connection movable terminal part 200 can be formed by protruding a contact protrusion 221 for intensive contact with the mobile phone body 510.

이하, 본 고안의 동작과정에 대하여 설명하면 다음과 같다.Hereinafter, an operation process of the present invention will be described.

상기한 바와 같이 휴대폰용 접속단자에 있어서; 접속가동단자부(200)는 실장단자부(100)와 평행하게 만곡절곡부(211)를 통하여 만곡 절곡되어 수평면의 실장흡착면(212)을 갖는 가동탄성부(210)와, 상기 가동탄성부(210)에서 산형으로 절곡형성하여 안테나 또는 배터리와 같은 휴대폰 기구물(510)과 접속되는 접속절곡부(220)로 형성하고, 상기 실장단자부(100)의 접속절곡부(220)의 하부 측에는 실장단자부(100)에서 상부로 절곡 돌출되어서 하부로 절곡 형성되어 접속절곡부(220)의 하부를 지지하는 가동지지구(310)를 형성하며, 상기 실장단자부(100)에는 상부 측으로 요입되게 파형 절곡되어 보드(520)의 실장면에 솔더를 흡착 흡수하여 보드(520)의 솔더로 인하여 실장단자부(100)가 부상되어 실장불량이 발생하는 것을 방지할 수 있게 하며 보드(520)와의 결속력을 높일 수 있게 한 하나 이상의 솔더흡수부(110)를 형성하여 구성한 본 고안을 적용하여 실시하게 되면, 도 3 에 도시된 바와 같이 안테나 또는 배터리와 같은 휴대폰 기구물(510)의 접촉시 1 차 적으로 접속가동단자부(200)의 가동탄성부(210)가 만곡절곡부(211)를 중심으로 탄성변형으로 하면서 탄성 접촉으로 유발한다.As described above, in a connection terminal for a mobile phone, The connection movable terminal portion 200 includes a movable elastic portion 210 bent in a curved shape through the curved bent portion 211 in parallel with the mounting terminal portion 100 and having a mounting surface 212 on the horizontal plane, And a connection bending part 220 connected to the mobile phone body 510 such as an antenna or a battery is formed at the lower side of the connection bending part 220 of the mounting terminal part 100. The mounting terminal part 100 The movable terminal 310 is bent to the upper part of the connection terminal unit 100 and bent downward so as to support the lower portion of the connection bending unit 220. The mounting terminal unit 100 is bent in a wave- The solder of the board 520 can be prevented from occurring due to the solder of the board 520 due to the solder of the board 520 and the bondability with the board 520 can be increased, The solder absorbing portion 110 is formed 3, when the mobile phone 510 such as an antenna or a battery is contacted, the movable elastic portion 210 of the connection movable terminal 200 is curved And is elastically deformed about the bent portion 211, resulting in elastic contact.

이때, 가동탄성부(210)의 탄성변형에 의한 탄성 접촉은 부드러운 탄성 접촉이 이루어지게 되는 것이고, 접속가동단자부(200)의 접속절곡부(220)가 회전 지점으로부터 멀게 형성되어 안테나 또는 배터리와 같은 휴대폰 기구물(510)과의 접촉시 슬립이 최소화되는 것이다.At this time, the elastic contact of the movable elastic portion 210 by the elastic deformation causes soft elastic contact, and the connection bending portion 220 of the connection movable terminal portion 200 is formed away from the rotation point, Thereby minimizing the slip upon contact with the mobile phone device 510. [

이상과 같이 가동탄성부(210)에 의한 일정량 이상의 변형이 이루어지면 가동지지구(310)가 접속절곡부(220)의 하부를 지지하여 줌으로써 접속가동단자 부(200)의 과도한 동작이 방지되어 소성 변형이 방지되고, 이때, 가동지지구(310)의 지지가 절곡단부에 형성한 실장단자부(100)와의 탄성공극(311)에 의하여 탄성지지력을 유발하여 접속절곡부(220)를 안정되게 지지하여 안테나 또는 배터리와 같은 휴대폰 기구물(510)과의 접촉이 긴밀하게 이루어지는 것이다.As described above, when the movable support 310 supports the lower portion of the connection bending portion 220, the connection movable terminal portion 200 is prevented from being excessively operated when the movable support portion 310 deforms by a predetermined amount or more by the movable elastic portion 210, The support of the movable support 310 induces an elastic supporting force by the elastic air gap 311 with the mounting terminal portion 100 formed at the bent end to stably support the connection bent portion 220 The contact with the mobile phone device 510 such as an antenna or a battery is closely performed.

또한, 실장단자부(100)에 하나 이상의 솔더흡수부(110)을 형성하여 실시하게 되면, 보드(520)에 실장 함에 있어서 솔더(540)가 상기 솔더흡수부(110)로 흡수 유입되어 실장단자부(100)가 솔더(540)의 상면에 부상 유동되는 것이 방지되어 안정되고 정확한 실장이 이루어지는 것이다.The solder 540 is absorbed into the solder absorbing part 110 when the board terminal 520 is mounted on the board 520 and the mounting terminal part 100 is prevented from floating on the upper surface of the solder 540, so that stable and accurate mounting can be achieved.

또한, 상기 솔더흡수부(110)와 실장결속부(120)를 형성하여 실시하게 되면, 솔더(540)와의 결속력이 증대되어 실장단자부(100)가 더욱 견고하게 보드(520)에 실장되게 되는 것이다.When the solder absorbing part 110 and the mounting coupling part 120 are formed and the bonding force with the solder 540 is increased, the mounting terminal part 100 is more firmly mounted on the board 520 .

한편, 본 고안을 보드(520)에 실장할 때에는 도 4 에 도시된 바와 같이 진공흡착판(530)에 의하여 가동탄성부(210)에 형성된 실장흡착면(212)를 진공 흡착하여 자동화 실장이 이루어지는 것이다.Meanwhile, when the present invention is mounted on the board 520, the mounting suction surface 212 formed on the movable elastic portion 210 is vacuum-absorbed by the vacuum suction plate 530 as shown in FIG. 4 to perform automatic mounting .

따라서, 본 고안은 접속가동단자부를 탄성 가동을 제한 지지하는 가동지지구를 구비함으로써 안테나 또는 배터리와 같은 휴대폰 기구물와의 접속에 의하여 탄성변형된 접속가동단자부를 지지하여 주어 접속가동단자부에 의한 지지력이 향상되는 것이다.Therefore, the present invention has a movable support portion for restricting elastic movement of the connection movable terminal portion, thereby supporting the connection movable terminal portion resiliently deformed by connection with a cellular phone such as an antenna or a battery, thereby improving the supporting force by the connection movable terminal portion .

그리고, 실장단자부에 솔더흡수부를 형성함으로써 실장과정에 있어 솔더가 솔더흡수부로 흡수되어 실장단자부가 솔더에 의한 부상 유동이 방지되어 실장이 안정적이고 명확하게 이루어지는 것이다.By forming the solder absorbing portion in the mounting terminal portion, the solder is absorbed into the solder absorbing portion during the mounting process, and the mounting terminal portion is prevented from floating by the solder, so that the mounting is stably and clearly performed.

그리고, 수평면의 실장흡착면을 형성함으로써 진공흡착판에 의한 자동화 실장이 용이하게 이루어지는 것이다.In addition, automatization mounting by the vacuum adsorption plate is facilitated by forming the mounting suction surface on the horizontal plane.

도 1 은 본 고안에 따른 일 실시 예를 보인 사시도.1 is a perspective view showing an embodiment according to the present invention.

도 2 는 본 고안에 따른 일 실시 예를 보인 측면도.2 is a side view showing an embodiment according to the present invention;

도 3 은 본 고안에 따른 일 실시 예의 사용 상태를 보인 측 단면 예시도.FIG. 3 is a side cross-sectional view showing a use state of an embodiment according to the present invention. FIG.

도 4 는 본 고안에 실시 예를 진공흡착판에 의한 실장과정 예시도.Fig. 4 is an exemplary view showing a mounting process of a vacuum adsorption plate according to an embodiment of the present invention; Fig.

<도면의 주요부분에 대한 부호의 설명>Description of the Related Art

100 : 실장단자부 110 : 솔더흡수부 120 : 실장결속공100: mounting terminal part 110: solder absorbing part 120: mounting bonding ball

200 : 접속가동단자부200: connection movable terminal portion

210 : 가동탄성부 211 : 만곡절곡부 212 : 실장흡착면210: movable elastic portion 211: curved bent portion 212: mounting suction surface

220 : 접속절곡부 221 : 접촉돌기220: connection bent portion 221: contact projection

310 : 가동지지구 311 : 탄성공극310: movable region 311: elastic gap

510 : 휴대폰 기구물 520 : 보드 530 : 진공흡착판510: mobile phone hardware 520: board 530: vacuum suction plate

540 : 솔더540: solder

Claims (2)

보드에 실장되는 판상의 실장단자부와 상기 실장단자부의 일 측에서 반대 측을 향하여 상부로 만곡지게 절곡 형성되어 휴대폰 기구물과 탄성 접속되는 접속가동단자부로 구성된 휴대폰용 접속단자에 있어서;1. A connection terminal for a mobile phone, comprising: a plate-like mounting terminal portion mounted on a board; and a connection movable terminal portion bent and bent upward from the one side of the mounting terminal portion toward the opposite side and elastically connected to the mobile phone structure; 상기 접속가동단자부(200)는 실장단자부(100)와 평행하게 만곡절곡부(211)를 통하여 만곡지게 절곡되어 수평면의 실장흡착면(212)을 갖는 가동탄성부(210)와, 상기 가동탄성부(210)에서 산형으로 절곡형성하여 안테나 또는 배터리와 같은 휴대폰 기구물(510)과 접속되는 접속절곡부(220)로 형성하고, 상기 실장단자부(100)의 접속절곡부(220)의 하부 측에는 실장단자부(100)에서 상부로 절곡 돌출되어서 하부로 절곡 형성되어 접속절곡부(220)의 하부를 지지하는 가동지지구(310)를 형성하며, 상기 실장단자부(100)에는 상부 측으로 요입되게 파형 절곡되어 보드(520)의 실장면에 솔더(540)를 흡착 흡수하여 보드(520)의 솔더로 인하여 실장단자부(100)가 부상되어 실장불량이 발생하는 것을 방지할 수 있게 하며 보드(520)와의 결속력을 높일 수 있게 한 하나 이상의 솔더흡수부(110)를 형성하여 구성하고,The connection movable terminal unit 200 includes a movable elastic part 210 bent in a curved shape through a curved bent part 211 in parallel with the mounting terminal part 100 and having a mounting surface 212 mounted on a horizontal plane, And a connection bending part 220 connected to the mobile phone body 510 such as an antenna or a battery is formed at a lower side of the connection bending part 220 of the mounting terminal part 100, (310) that is bent upward and bent downward from the upper surface of the mounting terminal unit (100) to support a lower portion of the connection bending part (220), and the mounting terminal unit (100) The solder 540 can be absorbed and absorbed into the mounting surface of the mounting board 520 to prevent the mounting terminal unit 100 from floating due to the solder of the board 520 to prevent the mounting failure and to increase the bonding force with the board 520 At least one solder absorber &lt; RTI ID = 0.0 &gt; (110) 상기 가동지지구(310)는 실장단자부(100)의 단부에서 상부로 절곡한 후 하부로 절곡하여 절곡단부가 실장단자부(100)의 내측을 향한 산형으로 형성하며, 가동지지구(310)의 절곡단부에 지지돌기(310a)를 돌출 형성하고, 실장단자부(100)에는 솔더(540)를 흡수하여 보드(520)와의 결속력을 유지하며 상기 지지돌기(310a)가 실장단자부(100)를 관통하여 보드(520)에 지지될 수 있게 천공 형성된 실장결속공(120)을 형성하며,상기 가동지지구(310)가 접속절곡부(220)를 지지함에 있어 탄성지지력을 갖도록 상기 지지돌기(310a)와 보드(520) 사이에 탄성공극(311)을 형성하고,The movable support 310 is bent upward from the end of the mounting terminal portion 100 and then bent downward so that the bent end portion is formed in a mountain shape toward the inside of the mounting terminal portion 100, The supporting protrusions 310a protrude from the mounting terminal portion 100 and the solder 540 is absorbed by the mounting terminal portion 100 to maintain the binding force with the board 520. The supporting protrusions 310a penetrate through the mounting terminal portion 100, The supporting protrusions 310a and the board 310 may be formed to have an elastic supporting force in supporting the connection bending portion 220. The supporting bosses 310 may be formed of a metal, The elastic pores 311 are formed between the first and second electrodes 520, 상기 접속가동단자부(200)의 접속가동단자부(200)에는 휴대폰 기구물(510)과의 긴밀한 집중 접촉을 위한 접촉돌기(221)를 돌출한 것을 특징으로 하는 한 것을 특징으로 하는 휴대폰용 접속단자.Characterized in that a contact protrusion (221) protrudes from the connection terminal portion (200) of the connection movable terminal portion (200) for intensive contact with the mobile phone body (510). 삭제delete
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KR101190016B1 (en) 2011-10-21 2012-10-12 김선기 Elastic conductive contact terminal
KR101254188B1 (en) * 2012-11-20 2013-04-18 주식회사 이노폴이 Antenna contact
KR101309404B1 (en) * 2011-11-16 2013-09-17 황용태 A connecting apparatus for a terminal
KR101398159B1 (en) * 2013-12-06 2014-05-22 주식회사 스위치코리아 Terminal unit intenna clip
CN106162465A (en) * 2016-08-30 2016-11-23 歌尔股份有限公司 Shell fragment and loudspeaker monomer
KR101770753B1 (en) * 2016-03-16 2017-08-23 이권구 C clip
WO2017196151A1 (en) * 2016-05-13 2017-11-16 주식회사 모다이노칩 Contactor, and electronic device provided with same
WO2017196150A1 (en) * 2016-05-13 2017-11-16 주식회사 모다이노칩 Contactor, and electronic device provided with same
KR101842211B1 (en) * 2016-05-13 2018-05-14 주식회사 모다이노칩 Contactor for preventing electric shock and electronic device having the same
US11974400B2 (en) 2019-06-14 2024-04-30 Samsung Display Co., Ltd. Supporter for electronic component

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JP2006019242A (en) * 2004-07-02 2006-01-19 Lg Electronics Inc Connector of portable electric apparatus
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JP2003123876A (en) * 2001-10-19 2003-04-25 Wada Kogyo Kk Contact terminal
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101190016B1 (en) 2011-10-21 2012-10-12 김선기 Elastic conductive contact terminal
KR101309404B1 (en) * 2011-11-16 2013-09-17 황용태 A connecting apparatus for a terminal
KR101254188B1 (en) * 2012-11-20 2013-04-18 주식회사 이노폴이 Antenna contact
KR101398159B1 (en) * 2013-12-06 2014-05-22 주식회사 스위치코리아 Terminal unit intenna clip
KR101770753B1 (en) * 2016-03-16 2017-08-23 이권구 C clip
WO2017196151A1 (en) * 2016-05-13 2017-11-16 주식회사 모다이노칩 Contactor, and electronic device provided with same
WO2017196150A1 (en) * 2016-05-13 2017-11-16 주식회사 모다이노칩 Contactor, and electronic device provided with same
KR101842211B1 (en) * 2016-05-13 2018-05-14 주식회사 모다이노칩 Contactor for preventing electric shock and electronic device having the same
KR101842212B1 (en) * 2016-05-13 2018-05-14 주식회사 모다이노칩 Contactor for preventing electric shock and electronic device having the same
CN106162465A (en) * 2016-08-30 2016-11-23 歌尔股份有限公司 Shell fragment and loudspeaker monomer
US11974400B2 (en) 2019-06-14 2024-04-30 Samsung Display Co., Ltd. Supporter for electronic component

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