KR200200517Y1 - The cooling device of heat protect board for electronic machine - Google Patents
The cooling device of heat protect board for electronic machine Download PDFInfo
- Publication number
- KR200200517Y1 KR200200517Y1 KR2020000014800U KR20000014800U KR200200517Y1 KR 200200517 Y1 KR200200517 Y1 KR 200200517Y1 KR 2020000014800 U KR2020000014800 U KR 2020000014800U KR 20000014800 U KR20000014800 U KR 20000014800U KR 200200517 Y1 KR200200517 Y1 KR 200200517Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- heat
- cooling device
- metal
- thermal conductivity
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
본 고안은 전자기기나 통신기기의 냉각판의 냉각장치에 관한 것으로, 방열판 본체(1)의 저면에 방열판과 같은 길이 방향으로 길게 수개의 체결홈(2)을 형성하고, 이 체결홈(2)에 열전도가 빠른 보조방열금속(3)을 고정하여서 된 것으로서, 구조가 간단하여 제작이 용이하고 방열판의 저면에 열전도율이 빠른 금속이 일체로 부착되어 있기 방열의 효과를 최대로 할수가 있으며, 소형의 방열판으로 고온의 온도를 낮출수가 있기 때문에 온도한게치를 낮출수가 있는 유용한 고안인 것이다.The present invention relates to a cooling device for a cooling plate of an electronic device or a communication device, and has a plurality of fastening grooves 2 formed on the bottom of the heat sink body 1 in the same length direction as the heat sink, and the fastening grooves 2 are provided. It is made by fixing the secondary heat-dissipating metal (3) which has high thermal conductivity on it. It is easy to manufacture due to its simple structure, and the metal with fast thermal conductivity is attached to the bottom of the heat sink to maximize the effect of heat dissipation. It is a useful design that can lower the temperature limit because the heat sink can lower the temperature of the high temperature.
Description
본 고안은 전자기기나 통신기기의 냉각판의 냉각장치에 관한 것으로, 냉각판의 저면에 열전도가 빠른 다른 금속판을 결합하여 열전도가 빠르게 함으로서 냉각판의 일부분에만 전달되는 열기를 냉각판 전체에 분포되게 함으로서 빠르게 냉각되도록 하는데 그 목적이 있는 것이다.The present invention relates to a cooling device for a cooling plate of an electronic device or a communication device, and combines another metal plate with high thermal conductivity to the bottom of the cooling plate to accelerate heat conduction so that heat transmitted to only a portion of the cooling plate is distributed throughout the cooling plate. Its purpose is to allow it to cool quickly.
일반적으로 각종 전자기기에는 부품에서 발생되는 열을 냉각시키기 위하여 방열판이 설치되고 있는 바, 종래에 일반적으로 사용되어온 방열판은 발열체의 부착 위치에 따라 온도차가 크게 나는 단점이 있으며, 이로 인하여 부품을 냉각시키는 냉각속도가 느려 작업시간이 오래 걸리므로서 부품에 무리한 온도를 유지함으로 서 부품의 수명을 단축시키게 되는 요인이 되었다.In general, the heat sink is installed in various electronic devices to cool the heat generated from the components, heat sinks that have been generally used in the prior art has a disadvantage that the temperature difference is large depending on the attachment position of the heating element, thereby cooling the components It takes a long time because the cooling speed is slow, This is a factor that shortens the life of components.
또한 종래의 방열판은 알루미늄으로 되어 있기 때문에 방열판에 부착된 부품이 가열되었을 경우 방열판이 이 온도를 흡수하여 냉각시켜야 하나 방열판 자체가 알루미늄으로 구성되어 있기 때문에 열전달이 느려 냉각속도가 늣고 시간이 오래걸리는 문제점이 있었다.In addition, since the heat sink is made of aluminum, the heat sink must absorb and cool this temperature when the components attached to the heat sink are heated, but since the heat sink itself is made of aluminum, the heat transfer is slow and the cooling rate is slow and takes a long time. There was this.
상기와 같이 열전달이 느림으로 인하여 방열판의 냉각효과를 높이기 위하여 방열판의 크기를 큰것이나 온도한계치가 높은 것을 사용함으로서 기기의 내부를 불필요하게 방열판이 차지하게 되어 기기 자체의 크기가 불필요하게 크게 제작되는 문제점이 있었다.Due to the slow heat transfer as described above, in order to increase the cooling effect of the heat sink, the heat sink is unnecessarily occupied by the inside of the device by using a large heat sink or a high temperature limit. There was this.
본 고안은 상기와 같은 문제점을 해결하기 위하여 고안한 것으로서, 방열판의 저면에 체결홈을 형성하고 이 체결홈에 열 전도율이 빠른 보조방열 금속을 부착하여 방열판의 일부분에 열이 발생할 경우 이 열을 방열판 전체에 분포되게하여 방열시킬수 있도록한 것으로서, 이하 본 고안을 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.The present invention is devised to solve the above problems, and forms a fastening groove on the bottom of the heat sink, and attaches a secondary heat-radiating metal having a high thermal conductivity to the fastening groove to generate heat when a part of the heat sink is generated. As it is distributed to the whole so as to be able to dissipate, the present invention will be described in detail by the accompanying drawings as follows.
도 1 은 본 고안의 사시도1 is a perspective view of the present invention
도 2 는 본 고안의 사용상태를 보인 요부 확대 단면도Figure 2 is an enlarged cross-sectional view showing the main use state of the present invention
** 도면의 주요 부분에 대한 부호의 설명 **** Description of symbols for the main parts of the drawing **
1: 방열판본체 2. 체결홈 3.보조방열금속1: heat sink body 2. fastening groove 3. auxiliary heat-resistant metal
본체의 일면에 수개의 냉각판이 돌출되어 있는 방열판에 있어서, 방열판 본체(1)의 저면에 방열판과 같은 길이 방향으로 길게 수개의 체결홈(2)을 형성하고, 이 체결홈(2)에 열전도가 빠른 보조방열금속(3)을 고정하여서 된 것이다.In the heat sink in which several cooling plates protrude on one surface of a main body, several fastening grooves 2 are formed in the bottom surface of the heat sink main body 1 in the same longitudinal direction as the heat sink, and heat conduction is carried out in this fastening groove 2. It is by fastening the fast auxiliary radiant metal (3).
상기와 같이 된 본 고안의 작동을 설명하면 다음과 같다.Referring to the operation of the present invention made as described above are as follows.
알루미늄으로 된 방열판본체(1)의 저면에 체결홈(2)을 형성한 후 이 체결홈(2)에 열전도가 빠른 다른 보조방열금속(COPER PLATE)(3)을 삽입하여 고정하면 되는 것이다.After forming the fastening grooves 2 on the bottom surface of the heat sink body body 1 made of aluminum, the fastening grooves 2 may be fastened by inserting another fast radiating metal (COPER PLATE) 3 having high thermal conductivity.
상기와 같이 방열판 본체(1)의 저면에 열전도가 빠른 보조방열금속(3)이 일체로 부착되어 있기 때문에 소형중계기의 내부에 설치되어 있는 부품에 의하여 방열판의 일부분에서 열이 발생할 경우 방열판 본체(1)의 저면에 부착된 보조방열금속(3)이 이열을 흡수하여 다른 부분으로 빠른 속도로 전달함으로서 열을 쉽게 냉각시킬수가 있는 것이다.As described above, since the secondary heat-dissipating metal 3 having rapid thermal conductivity is integrally attached to the bottom of the heat sink body 1, when heat is generated from a part of the heat sink by a component installed inside the small repeater, the heat sink body 1 Auxiliary heat-radiating metal (3) attached to the bottom of the) absorbs this heat and transfers it to other parts at high speed so that the heat can be easily cooled.
즉 방열기본체(1)의 일부분에서 발생된 열을 방열기본체(1)의 저면에 부착된 보조방열금속(3)에 의하여 방열판 전체에 분포됨으로서 방열의 효과를 최대로 할수 있도록 한 것이다.That is, the heat generated from a part of the heat dissipation main body 1 is distributed to the entire heat dissipation plate by the auxiliary heat dissipation metal 3 attached to the bottom surface of the heat dissipation main body 1 to maximize the effect of heat dissipation.
이상과 같이 본 고안은 방열판의 저면에 체결홈을 형성하고 이 체결홈에 열 전도율이 빠른 보조방열 금속을 부착하여 방열판의 일부분에 열이 발생할 경우 이 열을 방열판 전체에 분포되게 하여 방열시킬 수 있도록 한 것으로서, 구조가 간단하여 제작이 용이하고 방열판의 저면에 열전도율이 빠른 금속이 일체로 부착되어 있기 방열의 효과를 최대로 할수가 있으며, 소형의 방열판으로 고온의 온도를 낮출수가 있기 때문에 온도한게치를 낮출수가 있는 유용한 고안인 것이다.As described above, the present invention forms a fastening groove on the bottom of the heat sink, and attaches an auxiliary heat dissipation metal having a high thermal conductivity to the fastening groove so that heat is distributed to the entire heat sink to radiate heat when a part of the heat sink is generated. As a simple structure, it is easy to manufacture, and a metal with fast thermal conductivity is integrally attached to the bottom of the heat sink to maximize the effect of heat dissipation. It is a useful design that can be lowered.
Claims (2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020000028319A KR20010107096A (en) | 2000-05-25 | 2000-05-25 | The cooling method and device of heat protect board for eiectronic machine |
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KR1020000028319A Division KR20010107096A (en) | 2000-05-25 | 2000-05-25 | The cooling method and device of heat protect board for eiectronic machine |
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KR200200517Y1 true KR200200517Y1 (en) | 2000-10-16 |
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KR2020000014800U KR200200517Y1 (en) | 2000-05-25 | 2000-05-25 | The cooling device of heat protect board for electronic machine |
KR1020000028319A KR20010107096A (en) | 2000-05-25 | 2000-05-25 | The cooling method and device of heat protect board for eiectronic machine |
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Application Number | Title | Priority Date | Filing Date |
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KR1020000028319A KR20010107096A (en) | 2000-05-25 | 2000-05-25 | The cooling method and device of heat protect board for eiectronic machine |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020021845A (en) * | 2000-09-18 | 2002-03-23 | 송규섭 | Heat sink for cooling |
KR100427058B1 (en) * | 2001-06-26 | 2004-04-13 | 주식회사 이트로닉스 | Repeater of communication using outdoor |
KR200476160Y1 (en) | 2013-03-04 | 2015-02-03 | 체-유안 우 | Heat dissipation structure of electronic shield cover |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011099788A2 (en) * | 2010-02-10 | 2011-08-18 | 주식회사 케이엠더블유 | Heat sink structure |
KR102160057B1 (en) * | 2020-04-13 | 2020-09-25 | 이은미 | Heatproof and moistureproof and waterproof type led module and manufacturing method thereof |
-
2000
- 2000-05-25 KR KR2020000014800U patent/KR200200517Y1/en not_active IP Right Cessation
- 2000-05-25 KR KR1020000028319A patent/KR20010107096A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020021845A (en) * | 2000-09-18 | 2002-03-23 | 송규섭 | Heat sink for cooling |
KR100427058B1 (en) * | 2001-06-26 | 2004-04-13 | 주식회사 이트로닉스 | Repeater of communication using outdoor |
KR200476160Y1 (en) | 2013-03-04 | 2015-02-03 | 체-유안 우 | Heat dissipation structure of electronic shield cover |
Also Published As
Publication number | Publication date |
---|---|
KR20010107096A (en) | 2001-12-07 |
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