JPH0334916Y2 - - Google Patents
Info
- Publication number
- JPH0334916Y2 JPH0334916Y2 JP7729985U JP7729985U JPH0334916Y2 JP H0334916 Y2 JPH0334916 Y2 JP H0334916Y2 JP 7729985 U JP7729985 U JP 7729985U JP 7729985 U JP7729985 U JP 7729985U JP H0334916 Y2 JPH0334916 Y2 JP H0334916Y2
- Authority
- JP
- Japan
- Prior art keywords
- fin
- metal substrate
- heat
- fins
- generating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は電気素子用放熱器に関し、詳しくは、
ダイオード、トランジスタ、サイリスタ等の発熱
部品を取付け、金属製基板に固着したフイン間を
一方から他方に空気を流通させ、発熱部品の内部
で発生した熱を放熱する空冷式の電気素子用放熱
器に関するものである。[Detailed description of the invention] [Field of industrial application] The present invention relates to a heatsink for electric elements.
Related to an air-cooled heat radiator for electric devices that radiates heat generated inside the heat-generating parts by attaching heat-generating parts such as diodes, transistors, and thyristors, and circulating air from one side to the other between fins fixed to a metal substrate. It is something.
多数の流路を設けたフインを金属製基板に固着
し、該フインの流路内を一方から他方に空気を流
通させて、発熱部品から発生した熱を放熱する空
冷式の電気素子用放熱器としては、金属製基板に
フインを直接ロウ付等によつて固着したものが、
従来から提供されている。しかしながら、従来品
のように、フインを金属製基板に直接固着したも
のであると、発熱部品を取付けるための取付孔を
金属基板に穿設したとき、フインまで穿孔されて
放熱性能が低下する他、フインにバリや切り粉が
付き、それらを除去するのが容易ではなかつた。
このような欠点を解消するためには、金属製基板
の肉厚を発熱部品取付用のネジの長さと同等以上
にすればよいが、金属製基板を必要以上に肉厚に
しても放熱性能は向上しないばかりか、材料が無
駄になり、しかも、重量がかさむという欠点があ
る。
An air-cooled heat radiator for electric elements that radiates heat generated from heat-generating components by fixing fins with a large number of flow paths to a metal substrate and circulating air from one side to the other through the flow paths of the fins. The fins are directly fixed to the metal substrate by brazing, etc.
It has been provided for a long time. However, if the fins are directly fixed to the metal substrate as in conventional products, when the mounting holes for attaching the heat-generating components are drilled in the metal substrate, the fins will also be drilled, resulting in a decrease in heat dissipation performance. , burrs and chips were attached to the fins, and it was not easy to remove them.
In order to eliminate these drawbacks, the thickness of the metal board can be made equal to or greater than the length of the screws for installing heat-generating components, but even if the thickness of the metal board is made thicker than necessary, the heat dissipation performance will be affected. Not only is there no improvement, materials are wasted, and the weight is increased.
本考案は、金属製基板に金属製のフイン支持用
突起部を所定の間隔に設け、フインはフイン支持
用突起部に固着することによつて、発熱部品を取
付けるための取付孔がフインにまで達せず、放熱
性能が低下することがなく、取付孔の穿孔、バリ
や切り粉の除去が容易であり、材料の節減と軽量
化を図つた電気素子用放熱器を提供するものであ
る。
In this invention, metal fin supporting protrusions are provided on a metal substrate at predetermined intervals, and the fins are fixed to the fin supporting protrusions, so that the mounting holes for attaching heat generating components extend to the fins. To provide a heat radiator for an electric element, which does not cause heat dissipation performance to deteriorate, makes it easy to drill mounting holes, and remove burrs and chips, and which saves materials and reduces weight.
本考案の電気素子用放熱器は発熱部品を取付け
る金属製基板に、フインを固着してたものであつ
て、上記金属製基板には所定間隔に金属製のフイ
ン支持用突起部を設けてある。また、金属製基板
には発熱部品用取付孔を穿設してあつて、上記フ
イン支持用突起部の上端にフインを固着してある
ことを特徴としている。
The heat sink for electrical elements of the present invention has fins fixed to a metal substrate on which heat-generating components are mounted, and the metal substrate is provided with protrusions for supporting metal fins at predetermined intervals. . Further, the metal substrate is characterized in that a mounting hole for a heat generating component is formed, and a fin is fixed to the upper end of the fin supporting projection.
本考案の電気素子用放熱器は、金属製基板に金
属製のフイン支持用突起部を所定の間隔に設け、
金属製基板に取付孔を穿設し、フインはフイン支
持用突起部に固着してあり、上記金属製基板にト
ランジスタ等の発熱部品を取付けて、発熱部品か
ら発生する熱を放熱する。金属製基板にはフイン
支持用突起部を所定の間隔に設けてあるから、発
熱部品を取付けるための取付孔を金属製基板のい
ずれの位置に穿設しても、該取付孔がフインにま
で穿孔それることがなく、金属製基板を肉厚にす
る必要もない。また、金属製基板に取付孔を穿設
し、フインはフイン支持用突起部に固着するか
ら、取付孔を穿孔し易く、バリや切り粉も取り除
き易い。
The heat sink for electric elements of the present invention has metal fin supporting protrusions provided at predetermined intervals on a metal substrate,
Attachment holes are formed in the metal substrate, the fins are fixed to the fin supporting protrusions, heat generating components such as transistors are attached to the metal substrate, and heat generated from the heat generating components is radiated. The metal board is provided with protrusions for supporting the fins at predetermined intervals, so no matter where on the metal board a mounting hole is drilled for attaching a heat-generating component, the mounting hole will not reach the fin. There is no need to deviate the holes, and there is no need to make the metal substrate thicker. Further, since the mounting holes are formed in the metal substrate and the fins are fixed to the fin supporting protrusions, it is easy to drill the mounting holes, and it is also easy to remove burrs and chips.
次に本考案の実施例を添附の図面において説明
する。
Embodiments of the present invention will now be described with reference to the accompanying drawings.
第１図は分解斜視図、第２図は一部分を切除し
た斜視図、第３図は一部分の断面図、第４図及び
第５図は別の実施例を示す金属製基板の斜視図で
ある。 FIG. 1 is an exploded perspective view, FIG. 2 is a partially cutaway perspective view, FIG. 3 is a partially sectional view, and FIGS. 4 and 5 are perspective views of a metal substrate showing another embodiment. .
本考案に係る電子素子用放熱器は、第１図及び
第２図に示す如く、金属製基板１とフイン２とで
構成してあり、金属製基板１及びフイン２は、例
えば、アルミニウム合金、銅等の熱良導部材から
なる。金属製基板１には、トランジスタ、ダイオ
ード等の発熱部品３が複数取付けられ、また、フ
イン２には多数の流路４が設けてあり、このフイ
ン２が上記金属製基板１上に固着される。金属製
基板１の上面には金属製のフイン支持用突起部５
を所定の間隔に設けてある。このフイン支持用突
起部５は金属製基板１と同じ材料の熱良導部材か
らなり、押出成形により一体に形成したものを例
示してあるが、その数や間隔等は例示したものに
限定されない。しかし、フイン支持用突起部５
は、金属製基板１の下面に発熱部品３をネジ６で
取付けた際、該ネジ６がフイン２に接触しないよ
うな高さになつている。また、金属製基板１には
発熱部品３の取付孔７が穿設してある。この取付
孔７は発熱部品３を取付けるためネジ６が螺挿さ
れるもので、発熱部品３の取付位置であれば、フ
イン支持用突起部５間の金属製基板１であつて
も、金属製基板１からフイン支持用突起部５に達
するように穿設してもよい。このフイン支持用突
起部５の上端にフイン２を固着してある。フイン
２をフイン支持用突起部５に固着するには、ブレ
ージングシート８を介装して多数のフインユニツ
トを順次重ね合せロウ付けにより行つたものを例
示してある。しかし、フイン２の形状や大きさ、
特に流路４の形状等は図示したものに限定されな
い。発熱部品３を金属製基板１に取付けるには、
第２図及び第３図に示す如く、それを金属製基板
１の下面に当接し、発熱部品３側からネジ６を取
付孔７に螺挿すればよい。そして、フイン２の各
流路４内に空気を流通させて、上記発熱部品３か
ら発生する熱を金属製基板１及びフイン２の全面
から放熱するようになつているものである。 As shown in FIGS. 1 and 2, the heat sink for electronic devices according to the present invention is composed of a metal substrate 1 and fins 2, and the metal substrate 1 and fins 2 are made of aluminum alloy, for example, Made of a material with good thermal conductivity such as copper. A plurality of heat generating components 3 such as transistors and diodes are attached to the metal substrate 1, and a large number of channels 4 are provided in the fins 2, and the fins 2 are fixed onto the metal substrate 1. . A metal fin support protrusion 5 is provided on the upper surface of the metal substrate 1.
are provided at predetermined intervals. The fin supporting protrusions 5 are made of a heat-conducting member made of the same material as the metal substrate 1, and are integrally formed by extrusion molding, but the number and spacing thereof are not limited to those shown in the example. . However, the fin supporting protrusion 5
is set at a height such that when the heat generating component 3 is attached to the lower surface of the metal substrate 1 with screws 6, the screws 6 do not come into contact with the fins 2. Further, a mounting hole 7 for a heat generating component 3 is bored in the metal substrate 1. This mounting hole 7 is used to screw a screw 6 into which the heat generating component 3 is attached. The holes may be formed so as to reach the fin support protrusions 5 from the fin support projections 1 . The fin 2 is fixed to the upper end of the fin supporting projection 5. In order to fix the fins 2 to the fin supporting protrusions 5, a brazing sheet 8 is interposed between the fins and a large number of fin units are successively stacked and brazed. However, the shape and size of Fin 2,
In particular, the shape of the flow path 4 and the like are not limited to those shown in the drawings. To attach the heat generating component 3 to the metal substrate 1,
As shown in FIGS. 2 and 3, it is sufficient to abut the lower surface of the metal substrate 1 and screw the screw 6 into the mounting hole 7 from the heat generating component 3 side. Air is made to flow through each flow path 4 of the fin 2, so that the heat generated from the heat generating component 3 is radiated from the entire surface of the metal substrate 1 and the fin 2.
本考案は上述したものに限定されない。フイン
支持用突起部５はその上端にフインが固着できる
ものであれば、第４図に示す如く、略円筒状のも
のでもよい。また、第５図に示すように、断面略
正方形のフイン支持用突起５でも、図示していな
いが、その他の形状のフイン支持用突起であつて
もよいし、その箇数も問わない。 The present invention is not limited to what has been described above. The fin supporting protrusion 5 may have a substantially cylindrical shape as shown in FIG. 4, as long as the fin can be fixed to the upper end thereof. Further, as shown in FIG. 5, the fin supporting protrusions 5 having a substantially square cross section may be used, or may be fin supporting protrusions having other shapes (not shown), and the number thereof is not limited.
本考案の電子素子用放熱器は、その金属製基板
１の下面にトランジスタ等の発熱部品３をネジ６
で取付ける。そしてフイン２の各流路４内を一方
から他方に空気を流通させて、発熱部品３の内部
で発生した熱を金属製基板１、フイン支持用突起
部５を介してフイン２に伝達し放熱するものであ
る。本考案においては、発熱部品３の取付孔７を
金属製基板１の任意位置に穿設しても、該取付孔
７がフイン２にまで穿孔されず、金属製基板１を
特別肉厚にする必要もない。また、金属製基板１
に取付孔７を穿設し、フイン２はフイン支持用突
起部５の上端に固着するから、取付孔７を穿孔す
るのが簡単であり、その近傍に生じたバリの除
去、切り粉を取り除くのも容易である。 In the heat sink for electronic devices of the present invention, a heat generating component 3 such as a transistor is attached to the bottom surface of the metal substrate 1 using screws 6.
Install it with Then, air is circulated from one side to the other through each flow path 4 of the fin 2, and the heat generated inside the heat generating component 3 is transferred to the fin 2 via the metal substrate 1 and the fin support protrusion 5, and the heat is radiated. It is something to do. In the present invention, even if the mounting hole 7 for the heat-generating component 3 is drilled at an arbitrary position on the metal substrate 1, the mounting hole 7 is not drilled all the way to the fin 2, and the metal substrate 1 is made to have a special thickness. There's no need. In addition, metal substrate 1
Since the fin 2 is fixed to the upper end of the fin supporting protrusion 5, it is easy to drill the mounting hole 7, and remove any burrs or chips that may have formed near the fin. It is also easy.
以上のように本考案によれば、金属製基板の任
意位置に発熱部品を取付ることができ、金属製基
板を特別肉厚としなくてもそれを取付けるための
取付孔がフインに穿孔されないから、放熱性能が
低下せず、材料を節減でき、しかも、軽量にな
る。また、取付孔の穿孔が容易であり、穿孔によ
り生じたバリや切り粉の除去も容易に行うことが
できる電気素子用放熱器である。
As described above, according to the present invention, a heat-generating component can be mounted at any position on a metal board, and the metal board does not have to be particularly thick because a mounting hole for mounting it is not drilled in the fin. , heat dissipation performance does not deteriorate, materials can be saved, and it is also lightweight. Further, the heat radiator for an electric element allows easy drilling of mounting holes, and allows easy removal of burrs and chips generated by the drilling.
図面は本考案に係る電気素子用放熱器の一実施
例を示し、第１図は分解斜視図、第２図は一部分
を切除した斜視図、第３図は一部分の断面図、第
４図及び第５図は別の実施例を示す金属製基板の
斜視図である。
図中１は金属製基板、２はフイン、３は発熱部
品、５はフイン支持用突起部、７は取付孔を示
す。
The drawings show an embodiment of the heat sink for electric devices according to the present invention, in which FIG. 1 is an exploded perspective view, FIG. 2 is a partially cutaway perspective view, FIG. 3 is a partially sectional view, and FIGS. FIG. 5 is a perspective view of a metal substrate showing another embodiment. In the figure, 1 is a metal substrate, 2 is a fin, 3 is a heat generating component, 5 is a protrusion for supporting the fin, and 7 is a mounting hole.
Claims (1)
着してなる電気素子用放熱器において、上記金属
製基板には、所定間隔に金属製のフイン支持用突
起部と、発熱部品用取付孔とが設けられており、
上記フイン支持用突起部の上端にフインを固着し
てなることを特徴とする電気素子用放熱器。 In a heatsink for an electric element, in which fins are fixed to a metal substrate on which a heat generating component is mounted, the metal substrate is provided with protrusions for supporting metal fins and mounting holes for the heat generating component at predetermined intervals. has been
A heat sink for an electric element, characterized in that a fin is fixed to the upper end of the fin support projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7729985U JPH0334916Y2 (en) | 1985-05-24 | 1985-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7729985U JPH0334916Y2 (en) | 1985-05-24 | 1985-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61192454U JPS61192454U (en) | 1986-11-29 |
| JPH0334916Y2 true JPH0334916Y2 (en) | 1991-07-24 |
Family
ID=30620240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7729985U Expired JPH0334916Y2 (en) | 1985-05-24 | 1985-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334916Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5094045B2 (en) * | 2005-11-09 | 2012-12-12 | 大成プラス株式会社 | Electronic circuit device having cooling function and manufacturing method thereof |
-
1985
- 1985-05-24 JP JP7729985U patent/JPH0334916Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61192454U (en) | 1986-11-29 |
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