CN214753717U

CN214753717U - Heat radiator

Info

Publication number: CN214753717U
Application number: CN202120453324.6U
Authority: CN
Inventors: 姜方鸿
Original assignee: Hunan Honggong Intelligent Technology Co Ltd
Current assignee: Hunan Honggong Intelligent Technology Co Ltd
Priority date: 2021-03-02
Filing date: 2021-03-02
Publication date: 2021-11-16
Anticipated expiration: 2031-03-02

Abstract

The utility model discloses a radiator, which comprises a housin, semiconductor refrigerating plant, heat-proof device and heat abstractor, the casing is equipped with the installation cavity, semiconductor refrigerating plant, heat abstractor, the installation cavity is all located to second radiator fan and second heat radiation fins module, wherein, semiconductor refrigerating plant locates in the heat-proof device, semiconductor refrigerating plant's cold junction and hot junction expose respectively in heat-proof device's relative both sides, the cold junction is used for being connected with external heat source, dispel the heat to external heat source with the heat that absorbs external heat source, the heat transfer that the cold junction during operation produced is to the hot junction, heat abstractor hugs closely the hot junction, with heat conduction to the external world with the hot junction, the realization dispels the heat to the hot junction. The reverse heat exchange between the hot end and the cold end in the semiconductor refrigerating device can be effectively reduced, and therefore the heat dissipation efficiency of the cold end is improved.

Description

Heat radiator

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a radiator.

Background

The heat dissipation mode of electronic components mainly has initiative heat dissipation and passive heat dissipation, and the initiative heat dissipation is applicable to the heat dissipation of the electronic components that the heat flux density is lower, and the passive heat dissipation mainly divide into: air-cooled heat dissipation, liquid-cooled heat dissipation, heat pipe heat dissipation and semiconductor refrigeration heat dissipation.

The semiconductor refrigeration heat dissipation type radiator mainly comprises a semiconductor refrigeration piece, a first heat dissipation fan and a second heat dissipation fan, wherein the first heat dissipation fan and the second heat dissipation fan are respectively arranged on two opposite sides of the semiconductor refrigeration piece, the first heat dissipation fan is used for conducting heat of an electronic component to a cold end of the semiconductor refrigeration piece, and the second heat dissipation fan is used for conducting heat of a hot end of the semiconductor refrigeration piece to the external environment.

However, the conventional semiconductor refrigeration heat radiator has the problem that reverse heat exchange between the hot end and the cold end of the semiconductor refrigeration sheet is too large, so that the heat radiation efficiency of the cold end is low, and therefore, structural improvement on the conventional semiconductor refrigeration heat radiator is urgently needed.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a radiator, it can effectively reduce the reverse heat exchange of the hot junction and the cold junction in the semiconductor refrigerating device to help improving the radiating efficiency of cold junction.

The purpose of the utility model is realized by adopting the following technical scheme:

a heat sink, comprising:

a housing having a mounting cavity;

the semiconductor refrigerating device is arranged in the mounting cavity and is provided with a cold end and a hot end, the cold end is used for being connected with an external heat source, and heat generated by the cold end during working is transferred to the hot end;

the semiconductor refrigerating device is arranged in the heat insulation device, and the cold end and the hot end are respectively exposed out of two opposite sides of the heat insulation device;

and the heat dissipation device is arranged in the mounting cavity, is tightly attached or close to the hot end and is used for conducting the heat of the hot end to the outside so as to dissipate the heat of the hot end.

Furthermore, the heat dissipation device is a first heat dissipation fin module, the first heat dissipation fin module includes a first support bottom plate and a plurality of first fins arranged on the first support bottom plate at intervals, and the first support bottom plate is attached to or close to the hot end.

Furthermore, the heat dissipation device is a first heat dissipation fan, and the first heat dissipation fan and the hot end are arranged at intervals and used for diffusing the heat of the hot end to the outside; or the heat dissipation device is a water-cooling radiator clinging to the hot end.

Furthermore, the heat dissipation device comprises a first heat dissipation fin module and a first heat dissipation fan, wherein the first heat dissipation fin module comprises a first bearing bottom plate and a plurality of first fins arranged on the first bearing bottom plate at intervals, and the first bearing bottom plate is tightly attached to the hot end; the first heat dissipation fan and the first fins are arranged at intervals, and the first heat dissipation fan is used for diffusing the heat of the first heat dissipation fin module to the outside;

or, the heat sink includes a first heat dissipation fin module and a water-cooled heat sink, the first heat dissipation fin module includes a first support bottom plate and a plurality of first fins arranged on the first support bottom plate at intervals, and the first support bottom plate is tightly attached to the hot end; the water-cooling radiator is closely attached to the first fins and used for absorbing heat of the first radiating fin module.

Furthermore, a first heat-conducting coating is arranged in the mounting cavity, and two sides of the first heat-conducting coating are respectively attached to the hot end and the first radiating fin module.

Further, a second cooling fan is further arranged in the installation cavity, and the second cooling fan and the cold end are arranged at intervals and used for conducting heat of an external heat source to the cold end in a convection mode.

Furthermore, a second heat dissipation fin module is arranged in the installation cavity and located between the cold end and the second heat dissipation fan, the second heat dissipation fin module is tightly attached to the cold end, and the second heat dissipation fin module and the second heat dissipation fan are arranged at intervals.

Furthermore, a second heat-conducting coating is arranged in the mounting cavity, and two opposite sides of the second heat-conducting coating are respectively tightly attached to the cold end and the second heat-radiating fin module.

Furthermore, the second heat dissipation fin module comprises a second supporting base plate and a plurality of second fins arranged on the second supporting base plate at intervals, the second supporting base plate is tightly attached to the cold end, and the second fins and the second heat dissipation fan are arranged at intervals.

Furthermore, the housing comprises a first cover body and a second cover body, the first cover body is detachably connected with the first side surface of the heat insulation device, the first cover body is provided with a plurality of first heat dissipation holes communicated with the interior of the first cover body, and the cold end and the second heat dissipation fan are both positioned in the first cover body; the second cover body is detachably connected with the second side face of the heat insulation device, a plurality of second heat dissipation holes communicated with the interior of the second cover body are formed in the second cover body, and the hot end and the heat dissipation device are both located in the second cover body.

Compared with the prior art, the beneficial effects of the utility model reside in that:

this radiator is through addding heat-proof device, and locate semiconductor refrigerating plant in the middle of this heat-proof device, live and realize playing heat retaining and heat-proof effect to semiconductor refrigerating plant with covering semiconductor refrigerating plant, avoid the heat at hot junction to lead to the endothermic refrigeration effect of cold junction to reduce through air reverse transfer to the cold junction, or, reduce from the hot junction through semiconductor refrigerating plant self and the heat of reverse transfer to the cold junction, simultaneously, utilize heat abstractor to carry out heat conduction to the hot junction and realize in time dispelling the heat and cooling to the hot junction, thereby can realize reducing the reverse heat exchange between the hot junction in the semiconductor refrigerating plant and the cold junction, help improving the radiating efficiency of cold junction.

Drawings

Fig. 1 is a schematic structural view of a heat sink according to the present invention;

FIG. 2 is a cross-sectional view of the heat sink shown in FIG. 1;

fig. 3 is an exploded view of the heat sink shown in fig. 1.

In the figure: 10. a housing; 11. a first cover body; 111. a first heat dissipation hole; 12. a second cover body; 121. a second heat dissipation hole; 13. a support plate; 14. a first connecting column; 15. fastening a nut; 16. a second connecting column; 17. positioning a nut; 20. a semiconductor refrigeration device; 30. a thermal insulation device; 40. a first thermally conductive coating; 50. a first heat sink fin module; 51. a first supporting base plate; 52. a first fin; 60. a first heat dissipation fan; 70. a second thermally conductive coating; 80. a second heat sink fin module; 81. a second supporting bottom plate; 82. a second fin; 90. a second heat dissipation fan.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

Referring to fig. 1-3, a heat sink according to a preferred embodiment of the present invention is shown, which includes a housing 10, a semiconductor refrigeration device 20, a heat insulation device 30, a heat dissipation device, a second heat dissipation fin module 80 and a second heat dissipation fan 90, wherein the housing 10 is provided with a mounting cavity, the semiconductor refrigeration device 20, the heat insulation device 30, the heat dissipation device, the second heat dissipation fin module 80 and the second heat dissipation fan 90 are all disposed in the mounting cavity, the semiconductor refrigeration device 20 is disposed in the heat insulation device 30, a cold end and a hot end of the semiconductor refrigeration device 20 are respectively exposed at two opposite sides of the heat insulation device 30, the cold end is used for connecting with an external heat source to absorb heat of the external heat source and dissipate the heat from the external heat source, the heat generated by the cold end is transferred to the hot end, and the heat dissipation device is tightly attached or attached to the hot end to conduct the heat of the hot end to the outside, the heat dissipation of the hot end is realized.

This radiator is through addding heat-proof device 30, and locate this heat-proof device 30 in the middle of with semiconductor refrigerating plant 20, live and realize playing heat preservation thermal-insulated effect to semiconductor refrigerating plant 20 with covering semiconductor refrigerating plant 20, avoid the heat at hot junction to lead to the endothermic refrigeration effect of cold junction to reduce through the reverse transfer of air to the cold junction, or, reduce from the hot junction through semiconductor refrigerating plant 20 self and the heat of reverse transfer to the cold junction, simultaneously, utilize heat abstractor to carry out heat conduction to the hot junction and realize in time dispelling the heat and cooling to the hot junction, thereby can realize reducing the reverse heat exchange between the hot junction in semiconductor refrigerating plant 20 and the cold junction, help improving the radiating efficiency of cold junction.

With continued reference to fig. 2 and 3, in this embodiment, for easy installation, the casing 10 includes a first casing 11 and a second casing 12, the heat insulation device 30 is provided with a first connecting column 14 and a second connecting column 16, wherein each of four corner positions of the heat insulation device 30 is provided with a first connecting column 14, four second connecting columns 16 are surrounded by four first connecting columns 14, a first end of each first connecting column 14 and a first end of each second connecting column 16 extend out of a first side of the heat insulation device 30, a second end of each first connecting column 14 and a second end of each second connecting column 16 extend out of a second side of the heat insulation device 30, the first casing 11 is installed on the first side of the heat insulation device 30, and the first ends of the first connecting columns 14 penetrate through the top of the first casing 11 and are connected with fastening nuts 15 to fix the first casing 11 and the heat insulation device 30, and the cold ends, The second cooling fin module 80 and the second cooling fan 90 are both located in the first housing 11, and the first housing 11 is provided with a plurality of first cooling holes 111 communicated with the inside thereof, so that heat of an external heat source can be guided into the first housing 11 through the first cooling holes 111.

The second cover body 12 is installed on the second side of the heat insulation device 30, the second end of the first connection column 14 passes through the second cover body 12 and is connected with the fastening nut 15, so as to fix the second cover body 12 with the heat insulation device 30, the hot end and the heat dissipation device are both located in the second cover body 12, the second cover body 12 is provided with a plurality of second heat dissipation holes 121 communicated with the inside of the second cover body, so that the heat inside can be diffused to the outside through the second heat dissipation holes 121.

Of course, in other embodiments, both first cover 11 and second cover 12 may be attached to heat insulation apparatus 30 by riveting.

Of course, a supporting plate 13 for supporting the heat insulation device 30, the first cover 11, the second cover 12, and the like may be additionally provided, and the first connecting column 14 and the second connecting column 16 may be provided on the supporting plate 13.

In the present embodiment, the semiconductor refrigeration device 20 is a refrigeration element formed by the peltier effect, and has a sheet-like structure, and one surface of the semiconductor refrigeration device 20 is a cold end and the other surface is a hot end.

In the present embodiment, two semiconductor cooling devices 20 are provided to improve the heat dissipation effect, and two semiconductor cooling devices 20 are spaced apart from each other, but in other embodiments, one or three or more semiconductor cooling devices 20 may be provided.

In the present embodiment, the heat insulating device 30 is a plate made of a heat insulating material, and the heat insulating material may be PTFE (polytetrafluoroethylene), ceramic, or the like.

Referring to fig. 2 and 3, in the present embodiment, the heat dissipation device includes a first heat dissipation fin module 50 and a first heat dissipation fan 60, the first heat dissipation fin module 50 includes a first supporting base plate 51 and a plurality of first fins 52 spaced on the first supporting base plate 51, the first supporting base plate 51 passes through the second connection column 16 and is tightly attached to the hot end, so as to improve heat conduction efficiency, so that heat at the hot end can be rapidly conducted to the first heat dissipation fin module 50, in order to position the first heat dissipation fin module 50, a fastening nut 15 is disposed on the second connection column 16, the fastening nut 15 abuts against the first supporting base plate 51 or the first fins 52, so that the first heat dissipation fin module 50 is reliably attached to the hot end.

The first heat dissipation fan 60 is spaced from the first fins 52, and the first heat dissipation fan 60 is configured to diffuse heat of the first heat dissipation fin module 50 to the outside, so as to perform efficient heat dissipation and cooling on the hot end, thereby facilitating improvement of heat dissipation and cooling effects of the cold end on an external heat source. Specifically, the second connecting column 16 is provided with a positioning nut 17 spaced apart from the first radiator fin module 50, the second end of the second connecting column 16 passes through the first radiator fan 60 and is connected to another fastening nut 15, and the fastening nut 15 and the positioning nut 17 are used to reliably position the first radiator fan 60.

In other embodiments, the heat dissipation apparatus may also include a first heat dissipation fin module 50 and a water-cooled heat sink (not shown in the drawings), where the first heat dissipation fin module 50 includes a first supporting base plate 51 and a plurality of first fins 52 spaced on the first supporting base plate 51, and the first supporting base plate 51 is tightly attached to the hot end; the water-cooled radiator is closely attached to the first fins 52 and used for absorbing heat of the first radiating fin module 50, and the structure can also realize efficient heat dissipation and cooling of the hot end.

In other embodiments, the heat dissipation device may specifically include the first cooling fin module 50 alone, or the first cooling fan 60 or the water-cooled heat sink alone.

With continued reference to fig. 2 and fig. 3, in order to further improve the heat dissipation effect, a first heat conductive coating 40 is disposed between the hot end and the first heat sink fin module 50, and two opposite sides of the first heat conductive coating 40 are respectively attached to the hot end and the first supporting base plate 51, so that the hot end is in close contact with the first heat sink fin module 50, thereby improving the heat conduction efficiency therebetween and improving the heat dissipation effect. In this embodiment, the first thermal conductive coating 40 may be made of silicone grease, graphite, or the like.

With continued reference to fig. 2 and fig. 3, the heat sink further includes a second heat dissipation fan 90 disposed in the mounting cavity, and the second heat dissipation fan 90 is disposed at an interval from the cold end and is used for conducting heat of the external heat source to the cold end in a convection manner, which is helpful for improving a heat dissipation effect of the external heat source. Specifically, the second heat dissipation fan 90 passes through the second connection column 16, and the second heat dissipation fan 90 is vertically positioned by the positioning nut 17 and the fastening nut 15 provided on the second connection column 16, so that the second heat dissipation fan 90 is mounted in the mounting cavity.

In this embodiment, a second heat dissipation fin module 80 located between the cold end and the second heat dissipation fan 90 is further disposed in the mounting cavity, the second heat dissipation fin module 80 is tightly attached to the cold end, and the second heat dissipation fin module 80 and the second heat dissipation fan 90 are disposed at an interval to further improve a heat dissipation effect on an external heat source.

In this embodiment, the second heat sink fin module 80 includes a second supporting base plate 81 and a plurality of second fins 82 disposed on the second supporting base plate 81 at intervals, the second supporting base plate 81 passes through the second connecting column 16 and clings to the cold end, the second fins 82 are disposed at intervals with the second heat sink fan 90, in order to position the second heat sink fin module 80, a fastening nut 15 is disposed on the second connecting column 16, and the fastening nut 15 abuts against the second supporting base plate 81 or the second fins 82, so that the second heat sink fin module 80 is reliably attached to the cold end.

In this embodiment, the second heat conducting coating 70 is further disposed in the mounting cavity, and two opposite sides of the second heat conducting coating 70 are respectively tightly attached to the cold end and the second heat dissipating fin module 80, so that the cold end and the second heat dissipating fin module 80 are in close contact with each other, the heat conduction efficiency between the cold end and the second heat dissipating fin module 80 is improved, and the heat dissipating effect is improved. In this embodiment, the second thermal conductive coating 70 may be made of silicone grease, graphite, or the like.

The working principle of the radiator is as follows:

internal heat dissipation: the hot end of the semiconductor refrigeration device 20 generates heat energy, the heat energy is rapidly conducted to the first heat dissipation fin module 50 through the first heat conduction coating 40, and then the heat energy on the first heat dissipation fin module 50 is diffused to the surrounding environment through strong convection wind made by the first heat dissipation fan 60 to dissipate heat of the hot end, so that internal heat dissipation of the radiator is realized;

external heat dissipation: the heat energy of the external heat source is conducted to the second heat dissipation fin module 80 through the strong convection wind generated by the second heat dissipation fan 90, and then rapidly conducted to the cold end through the second heat conduction coating 70 to be absorbed by the cold end, so that the heat dissipation of the external heat source is realized, and the heat energy generated when the cold end works is transferred to the hot end, and the above cycle is repeated.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A heat sink, comprising:

a housing having a mounting cavity;

2. The heat sink of claim 1, wherein the heat dissipation device is a first heat dissipation fin module, the first heat dissipation fin module comprises a first supporting base plate and a plurality of first fins spaced on the first supporting base plate, and the first supporting base plate is attached to or close to the hot end.

3. The heat sink as claimed in claim 1, wherein the heat dissipating device is a first heat dissipating fan, and the first heat dissipating fan is spaced from the hot end and is configured to dissipate heat from the hot end to the outside; or the heat dissipation device is a water-cooling radiator clinging to the hot end.

4. The heat sink of claim 1, wherein the heat dissipation device comprises a first heat dissipation fin module and a first heat dissipation fan, the first heat dissipation fin module comprises a first supporting bottom plate and a plurality of first fins spaced on the first supporting bottom plate, and the first supporting bottom plate is tightly attached to the hot end; the first heat dissipation fan and the first fins are arranged at intervals, and the first heat dissipation fan is used for diffusing the heat of the first heat dissipation fin module to the outside;

5. The heat sink of claim 2 or 4, wherein a first thermal conductive coating is further disposed in the mounting cavity, and two sides of the first thermal conductive coating are respectively attached to the hot end and the first cooling fin module.

6. The heat sink of claim 1, wherein a second heat sink fan is further disposed within said mounting cavity, said second heat sink fan being spaced from said cold end and adapted to convectively transfer heat from an external heat source to said cold end.

7. The heat sink of claim 6, wherein a second cooling fin module is disposed in the mounting cavity between the cold end and the second cooling fan, the second cooling fin module being proximate to the cold end, the second cooling fin module being spaced apart from the second cooling fan.

8. The heat sink of claim 7, wherein a second thermally conductive coating is disposed in the mounting cavity, opposite sides of the second thermally conductive coating abutting the cold end and the second finstock module, respectively.

9. The heat sink of claim 7 wherein said second cooling fin module comprises a second supporting base plate and a plurality of second fins spaced on said second supporting base plate, said second supporting base plate being attached to said cold end, said second fins being spaced from said second cooling fan.

10. The heat sink of claim 6, wherein the housing comprises a first cover and a second cover, the first cover is detachably connected to the first side of the heat insulation device, the first cover is provided with a plurality of first heat dissipation holes communicated with the interior of the first cover, and the cold end and the second heat dissipation fan are both located in the first cover; the second cover body is detachably connected with the second side face of the heat insulation device, a plurality of second heat dissipation holes communicated with the interior of the second cover body are formed in the second cover body, and the hot end and the heat dissipation device are both located in the second cover body.