KR20020036791A - 탄성표면파장치의 제조방법 및 탄성표면파장치 - Google Patents
탄성표면파장치의 제조방법 및 탄성표면파장치 Download PDFInfo
- Publication number
- KR20020036791A KR20020036791A KR1020017016632A KR20017016632A KR20020036791A KR 20020036791 A KR20020036791 A KR 20020036791A KR 1020017016632 A KR1020017016632 A KR 1020017016632A KR 20017016632 A KR20017016632 A KR 20017016632A KR 20020036791 A KR20020036791 A KR 20020036791A
- Authority
- KR
- South Korea
- Prior art keywords
- acoustic wave
- surface acoustic
- wave elements
- package
- elements
- Prior art date
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13012—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13144—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H2009/0019—Surface acoustic wave multichip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (7)
- 각각이 빗살형상 전극 및 접속단자를 구비한 복수의 탄성표면파소자를 소정의 다이 부착면 상에 병치되고, 상기 복수의 탄성표면파소자 각각의 상기 접속단자와 상기 다이 부착면 상의 소정위치를 접합재를 사이에 두고 접합하는 접합공정을 구비한 탄성표면파장치의 제조방법에 있어서,상기 접합공정이 상기 접합재에 초음파를 인가하여 상기 접합재를 용융시키는 공정을 포함하고,상기 접합공정에 있어서 초음파 인가방향이 상기 탄성표면파소자가 병치되는 방향과 대략 직교하는 방향으로 정해지는 것을 특징으로 하는 탄성표면파장치의 제조방법.
- 제 1 항에 있어서,상기 접합공정에 앞서, 복수의 압전성 기판 상에 각각 빗살형상 전극을 형성하여 복수의 탄성표면파소자를 제작하는 공정을 마련한 것을 특징으로 하는 탄성표면파장치의 제조방법.
- 제 1 항 또는 제 2 항에 있어서,상기 접합공정이 상기 탄성표면파소자를 흡착유지한 상태에서 상기 접합재에 초음파를 인가하는 공정을 포함하는 것을 특징으로 하는 탄성표면파장치의 제조방법.
- 제 1 항, 제 2 항 또는 제 3 항에 기재한 제조방법에 의해 제조되는 것을 특징으로 하는 탄성표면파장치.
- 압전성 기판 상에 형성된 빗살형상 전극 및 이 빗살형상 전극에 연결되는 접속단자를 각각이 구비하는 복수의 탄성표면파소자와; 각각의 상기 접속단자가 접합재를 사이에 두고 접합되는 다이 부착면을 갖고, 상기 복수의 탄성표면파소자가 병치되어 수용되는 패키지를 구비하고,상기 접합재는 상기 탄성표면파소자가 병치되는 방향과 비교해서 이것에 대략 직교하는 방향으로 연신된 형상을 가진 것을 특징으로 하는 탄성표면파장치.
- 제 5 항에 있어서,상기 복수의 탄성표면파소자는 주파수 특성이, 다른 탄성표면파소자와는 상이한 탄성표면파소자를 포함하는 것을 특징으로 하는 탄성표면파장치.
- 제 5 항 또는 제 6 항에 있어서,상기 접속단자가 상기 탄성표면파소자가 병치되는 방향을 따라 짧고 세로로 긴 형상으로 형성되어 있는 것을 특징으로 하는 탄성표면파장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000138098 | 2000-05-11 | ||
JPJP-P-2000-00138098 | 2000-05-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020036791A true KR20020036791A (ko) | 2002-05-16 |
KR100614711B1 KR100614711B1 (ko) | 2006-08-21 |
Family
ID=18645762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020017016632A KR100614711B1 (ko) | 2000-05-11 | 2001-05-09 | 탄성표면파장치의 제조방법 및 탄성표면파장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6731045B2 (ko) |
EP (1) | EP1292022B1 (ko) |
KR (1) | KR100614711B1 (ko) |
CN (1) | CN1219355C (ko) |
DE (1) | DE60140535D1 (ko) |
WO (1) | WO2001089084A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012114713A (ja) * | 2010-11-25 | 2012-06-14 | Toshiba Corp | 超音波プローブ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62105514A (ja) * | 1985-11-01 | 1987-05-16 | Kokusai Denshin Denwa Co Ltd <Kdd> | 弾性表面波フイルタバンク |
JPS62173814A (ja) * | 1986-01-28 | 1987-07-30 | Alps Electric Co Ltd | 弾性表面波素子搭載ユニツト |
JPH02170611A (ja) * | 1988-12-22 | 1990-07-02 | Clarion Co Ltd | 弾性表面波装置 |
JP3194849B2 (ja) * | 1995-05-30 | 2001-08-06 | 日本無線株式会社 | 弾性表面波デバイス製造方法 |
JPH10223694A (ja) | 1997-02-05 | 1998-08-21 | Toshiba Corp | ボンディング装置 |
JP3982876B2 (ja) * | 1997-06-30 | 2007-09-26 | 沖電気工業株式会社 | 弾性表面波装置 |
JP3794792B2 (ja) * | 1997-07-22 | 2006-07-12 | Tdk株式会社 | 回路基板 |
JPH11122072A (ja) * | 1997-10-14 | 1999-04-30 | Fujitsu Ltd | 弾性表面波装置 |
-
2001
- 2001-05-09 WO PCT/JP2001/003864 patent/WO2001089084A1/ja active Application Filing
- 2001-05-09 KR KR1020017016632A patent/KR100614711B1/ko active IP Right Grant
- 2001-05-09 DE DE60140535T patent/DE60140535D1/de not_active Expired - Lifetime
- 2001-05-09 CN CNB018011853A patent/CN1219355C/zh not_active Expired - Lifetime
- 2001-05-09 EP EP01929997A patent/EP1292022B1/en not_active Expired - Lifetime
-
2002
- 2002-01-11 US US10/042,196 patent/US6731045B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1292022A1 (en) | 2003-03-12 |
US20020057037A1 (en) | 2002-05-16 |
DE60140535D1 (de) | 2009-12-31 |
EP1292022A4 (en) | 2008-09-17 |
CN1372716A (zh) | 2002-10-02 |
US6731045B2 (en) | 2004-05-04 |
WO2001089084A1 (fr) | 2001-11-22 |
EP1292022B1 (en) | 2009-11-18 |
CN1219355C (zh) | 2005-09-14 |
KR100614711B1 (ko) | 2006-08-21 |
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