KR200198116Y1 - Pcb assembly for an electronic product - Google Patents
Pcb assembly for an electronic product Download PDFInfo
- Publication number
- KR200198116Y1 KR200198116Y1 KR2019980008487U KR19980008487U KR200198116Y1 KR 200198116 Y1 KR200198116 Y1 KR 200198116Y1 KR 2019980008487 U KR2019980008487 U KR 2019980008487U KR 19980008487 U KR19980008487 U KR 19980008487U KR 200198116 Y1 KR200198116 Y1 KR 200198116Y1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- electronic product
- chassis member
- electronic
- assembly
- Prior art date
Links
- 239000003792 electrolyte Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 7
- 230000007257 malfunction Effects 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
전자제품 내에 설치되며, 다수의 전자부품이 장착된 회로기판과, 회로기판을 지지하는 샤시부재를 포함하는 전자제품용 회로기판 조립체에 있어서, 샤시부재는 회로기판이 안착되는 안착부를 가지며, 안착부에는 그 표면으로부터 인입형성된 홈이 복수개 마련된 것을 특징으로 하는 전자제품용 회로기판 조립체가 개시된다.A circuit board assembly for an electronic product installed in an electronic product and including a circuit board on which a plurality of electronic components are mounted, and a chassis member for supporting the circuit board, wherein the chassis member has a seating portion on which the circuit board is mounted. Disclosed is a circuit board assembly for an electronic product, characterized in that a plurality of recesses formed from the surface thereof are provided.
Description
본 고안은 전자제품 내에 설치되는 회로기판 조립체에 관한 것이다.The present invention relates to a circuit board assembly installed in an electronic product.
일반적으로 텔레비젼, 모니터 등의 전자제품 내에는 콘덴서, 다이오드, 트랜지스터 등과 같은 전자부품들을 설치하기 위한 회로기판(PCB; printed circuit board)을 포함하는 조립체가 마련된다. 이러한 회로기판 조립체의 일예가 도 1에 도시되어 있다.BACKGROUND ART In general, electronic products such as televisions and monitors are provided with an assembly including a printed circuit board (PCB) for installing electronic components such as a capacitor, a diode, a transistor, and the like. One example of such a circuit board assembly is shown in FIG. 1.
도 1을 살펴보면, 회로기판 조립체는 회로기판(10)과 샤시부재(30)를 포함한다. 상기 회로기판(10)에는 콘덴서(22), 다이오드(24) 등 다수의 전자부품이 납땜에 의해 장착된다. 상기 샤시부재(30)는 회로기판(10)을 전자제품(미도시) 내에서 지지하기 위한 것으로, 회로기판(10)의 테두리부(14)가 안착되는 안착부(32)를 가진다. 상기 안착부(32)는 연속된 면을 가지며, 이러한 안착부(32)에 샤시부재(10)의 테두리부(14)가 안착되어 나사(12)에 의해 결합됨으로써, 회로기판(10)이 샤시부재(30)에 고정되어 회로기판 조립체를 이룬다. 이 회로기판 조립체는 별도의 지지수단에 의해 전자제품 내에 지지된다.Referring to FIG. 1, the circuit board assembly includes a circuit board 10 and a chassis member 30. On the circuit board 10, a plurality of electronic components such as a capacitor 22 and a diode 24 are mounted by soldering. The chassis member 30 supports the circuit board 10 in an electronic product (not shown), and has a seating portion 32 on which the edge portion 14 of the circuit board 10 is seated. The seating portion 32 has a continuous surface, and the rim portion 14 of the chassis member 10 is seated on the seating portion 32 and is coupled by a screw 12, whereby the circuit board 10 is chassis. It is fixed to the member 30 to form a circuit board assembly. The circuit board assembly is supported in the electronics by separate supporting means.
그런데, 상기와 같은 구성을 가지는 종래의 회로기판 조립체는, 콘덴서(22) 등의 전자부품이 과부하 등에 의해 파손될 경우, 도 2에 도시된 바와 같이 파손된 콘덴서(22) 등의 전자부품에서 나오는 전해액(A)이 샤시부재(30)의 안착부(32)와 회로기판(10)의 틈사이로 흘러들게 되며, 모세관 현상에 의해 안착부(32)와 회로기판(10)의 틈새를 타고 회로기판(10)의 테두리부(14) 전체에 퍼지게 된다. 이와 같이 샤시부재(30)의 안착부(32)를 타고 퍼진 전해액(A)은 서로 전기적으로 직접 연결되지 말아야 하는 전자부품 예를 들어, 한쌍의 다이오드(24) 다리부를 전기적으로 직접 연결시킴으로써, 회로기판(10)의 기능이 상실되고, 전자제품이 오동작을 일으키게 되는 원인이 된다.By the way, in the conventional circuit board assembly having the above-described configuration, when the electronic component such as the capacitor 22 is damaged by overload or the like, the electrolyte solution from the electronic component such as the damaged capacitor 22, as shown in FIG. (A) flows into the gap between the seating portion 32 of the chassis member 30 and the circuit board 10, and the circuit board (R) is driven through the gap between the seating portion 32 and the circuit board 10 by a capillary phenomenon. It spreads to the whole edge part 14 of 10). In this way, the electrolyte A spread through the seating portion 32 of the chassis member 30 may be electrically connected directly to each other by, for example, an electronic component that should not be directly connected to each other. The function of the substrate 10 is lost, which causes the electronic products to malfunction.
본 고안은 위와 같은 문제점을 해결하기 위해 안출된 것으로, 전해액이 회로기판과 안착부 틈새로 스며들더라도 회로기판 테두리부 전체로 퍼지는 것을 억제하도록 샤시부재의 구조가 개선된 전자제품용 회로기판 조립체를 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, and even if the electrolyte is permeated into the gap between the circuit board and the seating portion, the circuit board assembly for electronic products with improved structure of the chassis member to suppress the spread of the entire circuit board border portion The purpose is to provide.
도 1은 종래의 전자제품용 회로기판 조립체의 개략적인 사시도.1 is a schematic perspective view of a circuit board assembly for a conventional electronic product.
도 2는 도 1의 Ⅱ-Ⅱ선을 따라 절개해 보인 단면도.2 is a cross-sectional view taken along the line II-II of FIG.
도 3은 본 고안의 바람직한 실시예에 따른 전자제품용 회로기판 조립체의 개략적인 사시도.3 is a schematic perspective view of a circuit board assembly for an electronic product according to a preferred embodiment of the present invention;
도 4는 도 3의 Ⅳ-Ⅳ선을 따라 절개해 보인 단면도.4 is a cross-sectional view taken along the line IV-IV of FIG. 3.
< 도면의 주요부분에 대한 부호의 설명 ><Description of Symbols for Major Parts of Drawings>
110..회로기판 114..테두리부110. Circuit board 114. Border
122..콘덴서 124..다이오드122 condensers 124 diodes
130..샤시부재 130a..홈130. Chassis member 130a. Groove
135..안착부 A..전해액135..Mounting A .. Electrolyte
상기 목적을 달성하기 위한 본 고안에 따른 전자제품용 회로기판 조립체는 전자제품 내에 설치되며, 다수의 전자부품이 장착된 회로기판과, 상기 회로기판을 지지하는 샤시부재를 포함하는 전자제품용 회로기판 조립체에 있어서, 상기 샤시부재는 상기 회로기판이 안착되는 안착부를 가지며, 상기 안착부에는 그 표면으로부터 인입형성된 홈이 복수개 마련된 것을 특징으로 한다.The circuit board assembly for an electronic product according to the present invention for achieving the above object is installed in an electronic product, the circuit board for an electronic product including a circuit board on which a plurality of electronic components are mounted, and a chassis member for supporting the circuit board. In the assembly, the chassis member has a seating portion on which the circuit board is seated, characterized in that the seating portion is provided with a plurality of grooves formed from the surface.
이하 첨부된 도면을 참조하여 본 고안의 바람직한 실시예에 따른 전자제품용 회로기판 조립체를 상세히 설명하기로 한다.Hereinafter, a circuit board assembly for an electronic product according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 3을 참조하면, 본 실시예에 따른 회로기판 조립체는 회로기판(110)과, 상기 회로기판(110)을 지지하는 샤시부재(130)를 포함하여 구성된다.Referring to FIG. 3, the circuit board assembly according to the present embodiment includes a circuit board 110 and a chassis member 130 supporting the circuit board 110.
상기 회로기판(110)에는 예를 들어 콘덴서(122), 다이오드(124) 등의 전자부품이 다수개 설치된다. 상기 전자부품들은 납땜 등에 의해 회로기판(110)에 전기적으로 결합된다. 상기 샤시부재(130)는 회로기판(110)을 고정시키기 위한 것으로, 전자제품(미도시) 내에 설치된다. 샤시부재(130)는 회로기판(110)이 안착되는 안착부(135)를 가진다. 상기 안착부(135)는 샤시부재(130)의 상면(138)으로부터 인입되어 형성되며, 내측면(134)과 안착면(132)을 가진다. 이러한 안착부(135)에 회로기판(110)의 테두리부(114)가 안착되어 나사(112)에 의해 체결됨으로써, 회로기판(110)이 샤시부재(130)에 고정된다. 여기서, 상기 테두리부(114)는 상기 안착면(132)에 밀착지지되고, 내측면(134)에는 접촉 또는 비접촉으로 지지될 수도 있다.The circuit board 110 is provided with a plurality of electronic components, such as a capacitor 122, a diode 124, for example. The electronic components are electrically coupled to the circuit board 110 by soldering or the like. The chassis member 130 is for fixing the circuit board 110 and is installed in an electronic product (not shown). The chassis member 130 has a mounting portion 135 on which the circuit board 110 is mounted. The seating part 135 is formed by being drawn from the upper surface 138 of the chassis member 130, and has an inner side surface 134 and a seating surface 132. The edge portion 114 of the circuit board 110 is seated on the seating part 135 and fastened by the screw 112, thereby fixing the circuit board 110 to the chassis member 130. Here, the edge portion 114 is in close contact with the seating surface 132, the inner surface 134 may be supported by contact or non-contact.
한편, 상기 안착부(135)에는 본 고안의 특징적 구조인 홈(130a)이 형성된다. 상기 홈(130a)은 안착부(135)의 내측면(134) 및 안착면(132)으로부터 인입형성되며, 소정간격으로 다수개가 마련된다.On the other hand, the seating portion 135 is formed with a groove 130a which is a characteristic structure of the present invention. The groove 130a is formed to be pulled out from the inner surface 134 and the seating surface 132 of the seating part 135, and a plurality of grooves 130a are provided at predetermined intervals.
이와 같은 구조를 가지는 회로기판 조립체에 있어서, 콘덴서(122) 등의 전자부품이 과부하 등에 의해 파손될 경우, 도 4에 도시된 바와 같이 파손된 콘덴서(122) 등의 전자부품에서 나오는 전해액(A)이 샤시부재(130)의 안착부(135)와 회로기판(110)의 틈새로 흘러들게 된다. 그리고, 틈새로 흘러들어온 전해액(A)은 모세관 현상에 의해 안착부(135)와 회로기판(110)의 틈새를 타고 회로기판(110) 테두리부(114)로 퍼지다가 안착부(135)에 마련된 홈(130a)으로 흘러가게 되어, 더 이상 퍼지지 않게 된다. 이와 같이, 안착부(135)에 마련된 홈(30a)에 의해 전해액(A)이 안착부(135)와 회로기판(110) 틈새로 퍼지는 것이 방지됨으로써, 전해액(A)에 의해 전기적으로 직접 연결되지 말아야 하는 전자부품 예를 들어, 한 쌍의 다이오드(124) 다리부가 전해액(A)에 의해 전기적으로 직접 연결되는 것이 방지된다. 따라서, 종래와 같이 전해액(A)에 의해 회로기판의 기능이 상실되거나, 전자제품이 오동작을 일으키는 현상을 방지할 수 있다.In the circuit board assembly having such a structure, when an electronic component such as the capacitor 122 is broken by an overload or the like, the electrolyte A from the electronic component such as the broken capacitor 122 is broken as shown in FIG. 4. It flows into the gap between the seating part 135 of the chassis member 130 and the circuit board 110. In addition, the electrolyte A flowing into the gap spreads through the gap between the seating part 135 and the circuit board 110 by the capillary phenomenon to the edge portion 114 of the circuit board 110 and is provided at the seating part 135. As it flows into the groove 130a, it no longer spreads. As such, the electrolyte A is prevented from spreading through the gap between the mounting part 135 and the circuit board 110 by the groove 30a provided in the seating part 135, thereby not being electrically connected directly by the electrolyte A. Electronic components that should not be rolled, for example, prevent the electrical direct connection of the pair of diode 124 legs by the electrolyte A. FIG. Therefore, it is possible to prevent the phenomenon in which the function of the circuit board is lost by the electrolyte solution A or the electronic product malfunctions as in the prior art.
본 고안은 비록 첨부된 도면을 참조하여 한정된 실시예에 대해서만 설명되었으나, 당해 기술분야에서 통상의 지식을 지닌 자라면 본 고안의 청구범위 내에서 다른 실시예가 있을 수 있는 것으로 이해되어야만 한다.Although the present invention has been described for a limited embodiment only with reference to the accompanying drawings, it should be understood that those of ordinary skill in the art may have other embodiments within the scope of the present invention.
상술한 바와 같은 본 고안의 전자제품용 회로기판 조립체에 따르면, 파손된 전자부품으로부터 나온 전해액이 샤시부재와 회로기판 틈새로 흘러들어오더라도, 회로기판 테두리부로 계속해서 퍼지는 것을 방지함으로써, 회로기판의 기능저하 또는 전자제픔의 오동작을 방지할 수 있다.According to the circuit board assembly for electronic products of the present invention as described above, even if the electrolyte solution from the damaged electronic components flows into the gap between the chassis member and the circuit board, the circuit board is prevented from continuously spreading to the edge of the circuit board. It can prevent malfunction or malfunction of electronic products.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980008487U KR200198116Y1 (en) | 1998-05-21 | 1998-05-21 | Pcb assembly for an electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019980008487U KR200198116Y1 (en) | 1998-05-21 | 1998-05-21 | Pcb assembly for an electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990041571U KR19990041571U (en) | 1999-12-15 |
| KR200198116Y1 true KR200198116Y1 (en) | 2000-10-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019980008487U KR200198116Y1 (en) | 1998-05-21 | 1998-05-21 | Pcb assembly for an electronic product |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200198116Y1 (en) |
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1998
- 1998-05-21 KR KR2019980008487U patent/KR200198116Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR19990041571U (en) | 1999-12-15 |
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