KR20010004648A - The equipment and construction system radiation of heat electron machine - Google Patents
The equipment and construction system radiation of heat electron machine Download PDFInfo
- Publication number
- KR20010004648A KR20010004648A KR1019990025351A KR19990025351A KR20010004648A KR 20010004648 A KR20010004648 A KR 20010004648A KR 1019990025351 A KR1019990025351 A KR 1019990025351A KR 19990025351 A KR19990025351 A KR 19990025351A KR 20010004648 A KR20010004648 A KR 20010004648A
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- KR
- South Korea
- Prior art keywords
- heat sink
- insertion groove
- cooling plate
- heat
- electronic device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
본 발명은 전자기기의 내부에 설치하여 전자 기기에서 발생되는 열을 냉각시켜 주는 방열판에 관한 것으로, 방열판 자체를 조립식으로 구성하여 전자기기의 크기와 용량에 상관없이 필요에 타라 적적하게 조립하여 사용할 수 있도록 하는데 그 목적이 있는 것이다.The present invention relates to a heat sink installed inside the electronic device to cool the heat generated by the electronic device. The heat sink itself may be configured to be assembled and used appropriately regardless of the size and capacity of the electronic device. The purpose is to make it.
일반적으로 각종 전자 기기에는 전자기기가 작동되면서 열을 발산시키게 되는 바, 종래에는 단순히 전자기기의 내부에 열전도가 빠른 금속의 방열판을 설치하거나 전기를 이용한 휀을 설치하여 기기에서 발생되는 열기를 냉각시킬 수 있도록 하였다.In general, various electronic devices emit heat while an electronic device is operated. In the related art, simply install a heat sink made of metal having high heat conductivity or an electric fan to cool the heat generated by the device. To make it possible.
그러나 상기 전자의 방법은 전자 기기마다 그 용량과 형태에 맞는 고유의 방열판을 제작하여야 함으로서 작업 공정이 복잡하고 힘들어 작업시간이 오래 걸리는 단점이 있으며, 전자기기의 모델이 다른 것으로 개발될 경우 기존의 방열판을 폐기하여야 함으로서 불필요한 지출을 초래하였으며, 이로 인하여 재고로 남아 있는 방열판을 폐기하여야 함으로서 원자재를 낭비하게 되는 문제점이 있었다.However, the former method has a disadvantage in that a work process is complicated and difficult due to the need to manufacture a unique heat sink according to its capacity and shape for each electronic device. It was necessary to dispose of the waste, which caused unnecessary expenses, and thus, there was a problem in that raw materials were wasted due to the waste heat sink remaining in stock.
또한 상기 전자의 방법은 한번 방열판이 제작되면 그 크기나 폭이 한정되어 있기 때문에 사용할 수 있는 기간이 새로운 제품이 나오기 전까지 한정이 되어 있기 때문에 방열판 원자재를 대량으로 보관할 수가 없는 단점이 있으며, 이로 인하여 제품을 제작할 때마다 방열판을 구입하여야 함으로서 제품의 제작시간이 오래 걸리게 되는 문제점이 있었다.In addition, the former method has a disadvantage that the raw material of the heat sink can not be stored in large quantities because the size and width of the heat sink are limited since the size and width of the former are limited until a new product is released. There was a problem that takes a long time to manufacture the product by having to purchase a heat sink each time to manufacture.
한편 상기 후자와 같은 휀을 이용한 방열기기는 별도의 전원을 요하게 됨으로서 에너지를 낭비하게 되는 요인이 되었으며, 부피가 큼으로서 소형의 전자기기에는 사용할 수가 없었으며, 또한 휀 자체를 수입에 의존함으로서 불필요한 외화를 낭비하게 되는 문제점이 있었다.On the other hand, heat sinks using the latter type, such as the need for a separate power source, was a factor in wasting energy, and because of its bulkiness, it was not possible to use it in small electronic devices. There was a problem of wasting.
본 발명은 상기와 같은 문제점을 해결하기 위하여 발명한 것으로서, 열전도가 빠른 금속의 방열판을 조립식으로 구성하여 전자기기의 용량과 크기에 상관없이 필요에 따라 간간하게 연결 조립하여 사용할 수 있도록 한 것으로서, 방열판을 무한대로 설치하여 전열면적을 극대화 할 수가 있으며, 또한 방열판을 임의대로 조절함으로서 작업의 편리성을 도모할 수 있도록 한 것으로서 이하 본 발명을 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.The present invention has been invented to solve the above problems, as a heat dissipation plate made of a fast thermal conductivity of the metal to be assembled and used as intermittently as needed, regardless of the capacity and size of the electronic device, heat sink It is possible to maximize the heat transfer area by installing indefinitely, and to facilitate the operation by adjusting the heat sink arbitrarily as follows, the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 조립상태를 보인 정면도1 is a front view showing the assembled state of the present invention
도 2는 본 발명의 조립된 상태를 보인 정면도Figure 2 is a front view showing the assembled state of the present invention
도 3은 본 발명 보조방열판의 사시도Figure 3 is a perspective view of the auxiliary heat sink of the present invention
** 도면의 주요 부분에 대한 부호의 설명 **** Description of symbols for the main parts of the drawing **
(1) 받침방열판 본체 (2)(6) 삽입홈 (3)(7) 냉각판(1) Base of heat sink (2) (6) Insertion groove (3) (7) Cooling plate
(4) 보조방열판 (5) 돌출부(4) Auxiliary heat sink (5) Protrusion
수개의 냉각판이 돌출 형성되어 있는 공지의 방열판에 있어서, 방열판 본체의 상부에 일정한 간격으로 냉각판을 돌출 형성하되 각 냉각판에는 양측에 미세한 돌기가 형성된 삽입홈을 형성하고, 이 삽입홈에는 보조방열판을 분해 조립할 수 있도록 삽입 체결하여서 된 것이다.In a known heat sink in which several cooling plates are protruded, a cooling plate is formed at a predetermined interval on the upper portion of the heat sink body, and each cooling plate is formed with insertion grooves having fine projections on both sides thereof, and the auxiliary heat sink is provided in the insertion groove. It is made by inserting and fastening to disassemble and assemble.
즉 방열판 받침본체(1)의 상부에 삽입홈(2)이 형성되어 있는 냉각판(3)을 일정한 간격으로 돌출 형성하고, 삽입홈(2)에는 보조방열판(4)을 삽입 체결하되 보조방열판(4)의 하단부에는 냉각판(3)의 삽입홈(2)에 삽입될 수 있도록 체결용 돌출부(5)를 돌출형성하고, 상단부에는 삽입홈(6)이 형성된 냉각판(7)을 돌출 형성하여서 된 것이다.That is, the cooling plate 3 having the insertion groove 2 formed on the upper portion of the heat sink base body 1 protrudes at regular intervals, and the auxiliary heat sink 4 is inserted into the insertion groove 2 to be fastened to the auxiliary heat sink ( The lower end of 4) protrudes the fastening protrusion 5 for insertion into the insertion groove 2 of the cooling plate 3, and the upper end protrudes the cooling plate 7 having the insertion groove 6 formed thereon. It is.
상기와 같이 된 본 발명의 조립방법을 설명하면 다음과 같다Referring to the assembly method of the present invention as described above is as follows.
받침 방열판본체(1)를 전자기기의 내부에 설치한 다음 내부 공간이나 방열량을 계산하여 받침본체(1)의 상부에 돌출 형성되어 있는 냉각판(3)의 삽입홈(2)에 보조방열판(4)을 삽입하여 체결한다.The auxiliary heat sink (4) is installed in the insertion groove (2) of the cooling plate (3) protruding from the upper part of the support body (1) by installing the support heat sink main body (1) inside the electronic device, and then calculating the internal space or the heat dissipation amount. Insert and tighten).
이때 냉각판(3)의 삽입홈(2)내부 양측에 돌출 형성되어 있는 미세한 돌기와 보조방열판(4)의 하단 돌출부(5)의 양옆에 형성되어 있는 돌기가 억지 끼워맞춤방식으로 압착되면서 결합되기 때문에 보조방열판(4)이 견고하게 고정할 수가 있는 것이다.At this time, because the minute projections formed on both sides of the insertion groove (2) of the cooling plate 3 and the projections formed on both sides of the lower protrusion (5) of the auxiliary heat dissipation plate (4) are combined while being pressed by the interference fit method. The auxiliary heat sink 4 can be fixed firmly.
상기와 같은 상태에서 받침방열판본체(1)에 삽입 체결되어 있는 보조방열판(4)의 냉각판(7)에 다른 보조방열판을 계속 체결하여 고정하면 되는 것이다.What is necessary is just to fasten and fix another auxiliary heat radiating plate to the cooling plate 7 of the auxiliary heat radiating plate 4 which is inserted and fastened to the support heat radiating plate main body 1 in the above state.
한편 받침 방열판 본체(1)나 보조방열판(4)에 형성되어 있는 돌기들은 방열판의 면적을 최대로 함으로서 방열의 효과를 극대화 시킬 수 있도록 한 것이다.On the other hand, the protrusions formed on the support heat sink body 1 or the auxiliary heat sink 4 are to maximize the area of the heat sink to maximize the effect of heat dissipation.
이상과 같이 본 발명은 열전도가 빠른 금속의 방열판을 조립식으로 구성하여 전자기기의 용량과 크기에 상관없이 필요에 따라 간간하게 연결 조립하여 사용할 수 있도록 한 것으로서, 구조가 간단하여 제작이 용이하고 하나의 방열판으로서 무한대로 설치하여 전열면적을 극대화 할 수가 있으며, 또한 방열판을 임의대로 조절함으로서 작업의 편리성을 도모할 수 있도록 한 유용한 발명인 것이다.As described above, the present invention is to assemble the heat dissipation plate of the metal with high thermal conductivity in a prefabricated manner so that it can be connected and assembled simply as needed regardless of the capacity and size of the electronic device, the structure is simple and easy to manufacture It is a useful invention to maximize the heat transfer area by installing infinitely as a heat sink, and to facilitate the work by arbitrarily adjusting the heat sink.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990025351A KR20010004648A (en) | 1999-06-29 | 1999-06-29 | The equipment and construction system radiation of heat electron machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990025351A KR20010004648A (en) | 1999-06-29 | 1999-06-29 | The equipment and construction system radiation of heat electron machine |
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| Publication Number | Publication Date |
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| KR20010004648A true KR20010004648A (en) | 2001-01-15 |
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| KR1019990025351A KR20010004648A (en) | 1999-06-29 | 1999-06-29 | The equipment and construction system radiation of heat electron machine |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100826039B1 (en) * | 2005-12-28 | 2008-04-28 | 샤프 가부시키가이샤 | Heat sink and electronic equipment |
| CN102548360A (en) * | 2010-11-22 | 2012-07-04 | 三星电机株式会社 | Heat sink |
| KR20130007238U (en) * | 2012-06-08 | 2013-12-18 | 릉-홍 장 | Combinational chassis featuring heat dissipation |
-
1999
- 1999-06-29 KR KR1019990025351A patent/KR20010004648A/en active IP Right Grant
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100826039B1 (en) * | 2005-12-28 | 2008-04-28 | 샤프 가부시키가이샤 | Heat sink and electronic equipment |
| CN102548360A (en) * | 2010-11-22 | 2012-07-04 | 三星电机株式会社 | Heat sink |
| KR101287755B1 (en) * | 2010-11-22 | 2013-07-18 | 삼성전기주식회사 | Heat sink |
| KR20130007238U (en) * | 2012-06-08 | 2013-12-18 | 릉-홍 장 | Combinational chassis featuring heat dissipation |
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