CN209199912U - A kind of radiation shell and metal-oxide-semiconductor component - Google Patents
A kind of radiation shell and metal-oxide-semiconductor component Download PDFInfo
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- CN209199912U CN209199912U CN201822070883.XU CN201822070883U CN209199912U CN 209199912 U CN209199912 U CN 209199912U CN 201822070883 U CN201822070883 U CN 201822070883U CN 209199912 U CN209199912 U CN 209199912U
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Abstract
The utility model provides a kind of radiation shell and metal-oxide-semiconductor component, is related to technical field of electronic equipment.A kind of radiation shell, including heat sink body.Heat sink body is arranged at intervals with multiple panel mounting portions.At least two panel mounting portions in multiple panel mounting portions are relatively arranged on the both ends of heat sink body.Multiple panel mounting portions are used to install for the dispersion of metal-oxide-semiconductor.At least two panel mounting portions are relatively arranged on the both ends of heat sink body, at least ensure that part metal-oxide-semiconductor has certain spacing distance after dispersion installation, reduce the concentration fever of metal-oxide-semiconductor.A kind of metal-oxide-semiconductor component, including multiple metal-oxide-semiconductors and radiation shell, multiple metal-oxide-semiconductors are connected to multiple panel mounting portions.Metal-oxide-semiconductor has longer service life, and damage frequency substantially reduces, and maintenance cost substantially reduces.
Description
Technical field
The utility model relates to technical field of electronic equipment, in particular to a kind of radiation shell and metal-oxide-semiconductor component.
Background technique
Metal-oxide-semiconductor is metal (metal)-oxide (oxide)-semiconductor (semiconductor) field effect transistor,
Or claim to be metal-insulator (insulator)-semiconductor.Metal-oxide-semiconductor belongs to power device, especially applies in inversion electricity
Metal-oxide-semiconductor on the products such as source, solar controller, discharge instrument, ups power, controller for electric vehicle, temperature is very when normal work
Height can seriously affect the service life of metal-oxide-semiconductor if metal-oxide-semiconductor heat dissipation is bad.
Utility model content
The purpose of this utility model is to provide a kind of radiation shells, can be improved electronic heater members (such as metal-oxide-semiconductor)
Radiating efficiency, extend the service life of electronic device.
The another object of the utility model is to provide a kind of metal-oxide-semiconductor component, can make multiple metal-oxide-semiconductor dispersed arrangements,
The radiating efficiency for improving metal-oxide-semiconductor, extends the service life of metal-oxide-semiconductor.
The embodiments of the present invention are achieved in that
A kind of radiation shell, including heat sink body, heat sink body are arranged at intervals with multiple panel mounting portions.Multiple panel installations
At least two panel mounting portions in portion are relatively arranged on the both ends of heat sink body.
In some embodiments of the utility model, heat sink body is additionally provided with the first radiation tooth.First radiation tooth and more
A panel mounting portion is relatively arranged on the two sides on heat sink body thickness direction.Multiple first radiation tooths are arranged at intervals at heat dissipation master
Body.
In some embodiments of the utility model, radiation shell further includes the fixing piece for compressing heating device.Heat dissipation
Main body is additionally provided with and the matched fixing groove of fixing piece.
In some embodiments of the utility model, radiation shell further includes heat dissipation accessory body.Along the width direction of heat sink body
On, at least side in the two sides of heat sink body is connected with heat dissipation accessory body.In the width direction of heat sink body, two panel peaces
Dress portion is relatively arranged on the both ends of heat sink body.
In some embodiments of the utility model, heat dissipation accessory body is arranged at intervals with multiple second radiation tooths.Multiple second
The free end of radiation tooth extends towards one end far from heat sink body.
In some embodiments of the utility model, the second radiation tooth is in bar shaped.Certainly, the first radiation tooth and the second heat dissipation
The concrete shape of tooth can with no restriction, and the two can also be using the other shapes, such as annular, waveform etc. in addition to bar shaped
Deng.
In some embodiments of the utility model, the second heat dissipation tooth surface is provided with multiple protrusions.
In some embodiments of the utility model, heat dissipation accessory body and heat sink body are integrally formed.
A kind of metal-oxide-semiconductor component, including multiple metal-oxide-semiconductors and any one of the above radiation shell, multiple metal-oxide-semiconductors are connected to multiple faces
Plate mounting portion.
In some embodiments of the utility model, metal-oxide-semiconductor component further includes control panel.Control panel and multiple metal-oxide-semiconductors electricity
Property connection.Control panel is connected to panel mounting portion.In the width direction of control panel, at least it is distributed at the both ends of control panel
Metal-oxide-semiconductor.
The utility model embodiment at least have the following advantages that or the utility model has the advantages that
The utility model embodiment provides a kind of radiation shell, including heat sink body.Heat sink body is arranged at intervals with multiple faces
Plate mounting portion.At least two panel mounting portions in multiple panel mounting portions are relatively arranged on the both ends of heat sink body.Generally,
The electronic device (such as metal-oxide-semiconductor) that can be generated heat in use process is fixed on heat sink body, by heat sink body by electronic device
The heat generated in the course of work sheds, excessive to avoid calorific value, and electronic device temperature is excessively high, quickly causes electronic device
Damage.Inventors have found that currently, metal-oxide-semiconductor in the market is all fixed on the same position, on the same direction substantially, so that MOS
Pipe fever is concentrated, the long-term high concentration of heat, so that metal-oxide-semiconductor easily damages.Therefore, heat dissipation provided by the embodiment of the utility model
Shell provides multiple panel mounting portions, so that the dispersion of metal-oxide-semiconductor is installed.At least two panel mounting portions are relatively arranged on heat dissipation master
The both ends of body at least ensure that part metal-oxide-semiconductor has certain spacing distance after dispersion installation, reduce the concentration hair of metal-oxide-semiconductor
Heat.
The utility model embodiment also provides a kind of metal-oxide-semiconductor component comprising multiple metal-oxide-semiconductors and above-mentioned radiation shell, it is multiple
Metal-oxide-semiconductor is connected to multiple panel mounting portions.The dispersion installation of multiple metal-oxide-semiconductors is slowed down significantly after metal-oxide-semiconductor installs concentratedly, when use
The concentration fever phenomenon of appearance.Concentrate fever that can cause to influence each other between different metal-oxide-semiconductors, so that metal-oxide-semiconductor calorific value is bigger,
Metal-oxide-semiconductor heat is more difficult to shed, and metal-oxide-semiconductor is easier to damage.Therefore, the metal-oxide-semiconductor after dispersion installation can be such that metal-oxide-semiconductor has longer
Service life, damage frequency substantially reduce, and maintenance cost substantially reduces.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of radiation shell provided by the embodiment of the utility model；
Fig. 2 is that metal-oxide-semiconductor provided by the embodiment of the utility model and control panel are mounted on structural representation later on radiation shell
Figure；
Fig. 3 is the structural schematic diagram of mounting plate provided by the embodiment of the utility model；
Fig. 4 is the enlarged diagram at the position IV in Fig. 1.
Icon: 100- radiation shell；110- heat sink body；112- panel mounting portion；114- sticking part；116- first is clamped
Portion；The second clamping portion 118-；120- fixing piece；122- fixing groove；The first radiation tooth of 124-；130- mounting plate；132- screw；
134- mounting hole；150- heat dissipation accessory body；The second radiation tooth of 152-；154- protrusion.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the utility model embodiment, it should be noted that if there is term " on ", "left", "right", " water
It is flat ", the orientation or positional relationships of the instructions such as "inner" be to be based on the orientation or positional relationship shown in the drawings or the utility model
Product using when the orientation or positional relationship usually put, be merely for convenience of describing the present invention and simplifying the description, without
It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore not
It can be construed as a limitation of the present invention.In addition, term " first ", " second " etc. are only used for distinguishing description, and cannot understand
For indication or suggestion relative importance.
In addition, "horizontal" only refers to that its direction is more horizontal with respect to for "vertical", it is not to indicate that the structure is certain
It fully horizontally, but can be slightly tilted.
In the description of the utility model embodiment, " multiple " represent at least two.
In the description of the utility model embodiment, it is also necessary to which explanation is unless specifically defined or limited otherwise, if
Term " setting ", " connection " occur shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.For the ordinary skill in the art, it can manage as the case may be
Solve the concrete meaning of above-mentioned term in the present invention.
Embodiment
Fig. 1 is please referred to, Fig. 1 show the structural schematic diagram of radiation shell 100.The present embodiment provides a kind of radiation shell 100,
It primarily can be used for radiating to electronic device, to ensure the good operation of electronic device, extend electronic device uses the longevity
Life.
Radiation shell 100 mainly includes heat sink body 110 and heat dissipation accessory body 150.Heat dissipation accessory body 150 is scattered as further increasing
The structure feature of thermal effect can also be not provided with heat dissipation accessory body 150 in other embodiments.
Generally, the electronic device (such as metal-oxide-semiconductor) that can be generated heat in use process is fixed on heat sink body 110, is passed through
Heat sink body 110 sheds the heat generated in the electronic device course of work, excessive to avoid calorific value, electronic device temperature mistake
Height quickly causes the damage of electronic device.Inventors have found that currently, metal-oxide-semiconductor in the market is all fixed on the same position substantially
It sets, on the same direction, so that metal-oxide-semiconductor fever is concentrated, the long-term high concentration of heat, so that metal-oxide-semiconductor easily damages.Therefore, originally
Heat sink body 110 in utility model embodiment is arranged at intervals with multiple panel mounting portions 112.In multiple panel mounting portions 112
At least two panel mounting portions 112 be relatively arranged on the both ends of heat sink body 110.As shown in Figure 1, in the present embodiment, setting
Two panel mounting portions 112, and two panel mounting portions 112 be symmetrically disposed on heat sink body 110 both ends it is (horizontal in Fig. 1
Left and right ends on direction).Metal-oxide-semiconductor can disperse to be mounted on two panel mounting portions 112, reduce the concentration fever of metal-oxide-semiconductor.
Certainly, in other embodiments, panel mounting portion 112 or other quantity and other distribution modes.
Panel mounting portion 112 is mainly used for providing place for installation electronic device.The specific structure of panel mounting portion 112 can
It is adaptively adjusted with the electronic device installed as needed.By taking metal-oxide-semiconductor and control panel (generally pcb board) as an example, face
Plate mounting portion 112 is designed to flowering structure:
Fig. 1 and Fig. 2 are please referred to, Fig. 2 show metal-oxide-semiconductor and control panel is mounted on structural representation later on radiation shell 100
Figure.
Panel mounting portion 112 includes sticking part 114 and the first clamping portion 116 and the second clamping portion 118 that are oppositely arranged.Such as
Shown in Fig. 1, the first clamping portion 116 and the second clamping portion 118 are oppositely arranged, and the first clamping portion 116 and the second clamping portion 118 are
It is substantially L-shaped.Sticking part 114 has inclined mounting surface, arranges convenient for the fitting of metal-oxide-semiconductor.Due to two panel mounting portions 112
It is symmetrical arranged, two clamping portions having also are respectively superposed, therefore one group of clamping portion is only observed in Fig. 1.In other realities
It applies in example, since the distributing position of panel mounting portion 112 is different, while needing to consider the fixation to control panel again, need user
Position, quantity and the shape of clamping portion are adjusted according to the actual situation.
Generally, electric vehicle (including electro-tricycle, electric four-wheel vehicle, electric car etc.), power inverter be at least
Including controller interconnected and radiation shell provided in this embodiment 100.Controller generally includes that control panel (refers generally to again
Pcb board) and multiple spaced metal-oxide-semiconductors.Control panel and metal-oxide-semiconductor are electrically connected (the two generally uses soldering and welding), control
Plate is mounted on panel mounting portion 112 with metal-oxide-semiconductor and (usually first control panel and metal-oxide-semiconductor is welded, then the two is installed on face
Plate mounting portion 112, naturally it is also possible to be welded again after first fixing the two respectively).Electric vehicle also has other certainly
Market common conventional parts, such as lighting system, energy resource system, braking system etc., details are not described herein again.
Control board ends are respectively engaged in the first clamping portion 116 and the second clamping portion 118, and metal-oxide-semiconductor is laid in sticking part
On 114.Since calorific value is larger during the work time for metal-oxide-semiconductor, in order to improve the heat transfer efficiency between metal-oxide-semiconductor and sticking part 114,
And then the heat of metal-oxide-semiconductor is made to shed more quickly, metal-oxide-semiconductor can be made to be tightly attached on sticking part 114 using some fixing means, together
When also ensure the connective stability of metal-oxide-semiconductor.Such as the multiple tablettings of setting can be spaced on sticking part 114, each or two
A tabletting compresses a metal-oxide-semiconductor；Or metal-oxide-semiconductor can also be made to fix using bonding agent；Or it is opened on sticking part 114
If screw hole, metal-oxide-semiconductor is compressed using nut when bolt is tightened into screw hole, as long as the quantity of screw hole is enough, user can be with
The position of selection installation metal-oxide-semiconductor for greater flexibility can be realized by movable screw bolt and nut and is fixed.In the present embodiment
Metal-oxide-semiconductor is fastened in the following ways:
Radiation shell 100 further includes the fixing piece 120 for compressing heating device (i.e. above-mentioned metal-oxide-semiconductor).Heat sink body 110 is also
Equipped with the matched fixing groove 122 of fixing piece 120.As shown in Fig. 2, fixing piece 120 is L-shaped, fixation is protruded into 120 one end of fixing piece
In slot 122, the other end compresses metal-oxide-semiconductor above metal-oxide-semiconductor.In the present embodiment, fixing piece 120 uses spring pressuring plate, other implementations
Can also not have the structure or material of elasticity using other in example, as long as fixing piece 120 can be made to compress metal-oxide-semiconductor.Gu
The one end for determining to compress metal-oxide-semiconductor on part 120 is arranged at intervals with multiple compression teeth (not marking in figure), compresses the setting one side energy of tooth
Enough guarantee that there is stress distribution more evenly on fixing piece 120, so that fixing piece 120 has superior comprehensive mechanical property,
On the other hand the heat-dissipating space of metal-oxide-semiconductor is also improved, improves the heat dissipation effect of metal-oxide-semiconductor.
Heat sink body 110 is additionally provided with the first radiation tooth 124.First radiation tooth 124 is oppositely arranged with panel mounting portion 112
Two sides on 110 thickness direction of heat sink body.Multiple first radiation tooths 124 (are 10, in other embodiments in the present embodiment
Can be other quantity) it is arranged at intervals at the back side of heat sink body 110.As shown in Figure 1, in the present embodiment, the first radiation tooth 124
It is in a strip shape, in other embodiments, other shapes, such as annulus can also be set by the first radiation tooth 124 according to specific requirements
Shape, S-shaped, W type either other there is no protrusion of regular shape etc..First radiation tooth 124 of strip also has its special
Heat dissipation advantage, for example, heat dissipation area is increased, and when air flows through the first 124 surface of radiation tooth of strip, regular item
Shape can play the role of guiding air circulation, to accelerate air in the circulating rate on 124 surface of the first radiation tooth, Jin Erti
High rate of heat dispation.
When needing fixed heat sink body 110, it can be installed by mounting plate 130 (see Fig. 2).Certainly, other are implemented
Heat sink body 110 can also be fixed by other modes when in use in example, peace can not be used in other embodiments
Loading board 130.A mounting plate 130 is illustrated only in Fig. 2, but is also provided in the present embodiment in the other end of heat sink body 110
Another mounting plate 130 opposite with mounting plate 130 in Fig. 2.Two mounting plates 130, which jointly stablize heat sink body 110, to be supported.
If (such as can be radiated with the installation site of appropriate adjustment mounting plate 130 only with a mounting plate 130 in other embodiments
The intermediate position of main body 110), allow to stablize support heat sink body 110.
In order to improve the heat dissipation effect of heat sink body 110, along the thickness direction of heat sink body 110, the two of mounting plate 130
End extends in opposite direction and protrudes from heat sink body 110.First radiation tooth 124 is along one far from panel mounting portion 112
Side freely extends, but its extended height must not exceed mounting plate 130 in the extended height of the side.Such setting can guarantee
The back side (i.e. one side where the first radiation tooth 124) of heat sink body 110 may be at vacant state, improve heat sink body 110
Heat dissipation effect.
Referring to figure 3., Fig. 3 show the structural schematic diagram of mounting plate 130.In the present embodiment, mounting plate 130 can pass through
Screw 132 is connected on heat sink body 110.Certainly, the two can also be carried out using other connection types in other embodiments
Connection.Mounting hole 134 is additionally provided on mounting plate 130.User by mounting hole 134 and match fixedly connected part (such as
Fixture block, bolt add block) mounting plate 130 is fixed on the fixation position in application scenarios (such as phase on controller for electric vehicle
Answer position).After mounting plate 130 is fixed, first radiation tooth 124 at 110 back side of heat sink body (refers to not in vacant state naturally
Can directly be abutted with the mounting surface on controller), to improve rate of the heat sink body 110 from backside radiator.Since heat dissipation is led
110 back side of body is provided with the first radiation tooth 124, and therefore, mounting plate 130 protrudes from the first radiation tooth 124, refers to along the first heat dissipation
The direction that the height of tooth 124 freely extends, mounting plate 130 protrude from the first radiation tooth 124, just can guarantee that radiation shell 100 is whole
After fixation, the first radiation tooth 124 still is able in vacant state.
Referring again to Fig. 1, in order to further increase the heat dissipation effect of radiation shell 100, along the width direction of heat sink body 110
On, at least side in the two sides of heat sink body 110 is connected with heat dissipation accessory body 150, as shown in Figure 1, in the present embodiment, heat dissipation master
The two sides of body 110 are respectively connected with heat dissipation accessory body 150.The accessory body 150 that radiates is arranged in this two sides, is that fitting is provided with due to two sides
(in the width direction of heat sink body 110, two panel mounting portions 112 are relatively arranged on the two of heat sink body 110 in portion 114
End), transmission range of the heat between metal-oxide-semiconductor and heat dissipation accessory body 150 can be shortened in this way, improve heat dissipation effect.Therefore, it radiates
The setting position of accessory body 150 can be adjusted correspondingly according to the different installation sites of specific different heating device, certainly,
Also it can choose and do not adjust.The setting of heat dissipation accessory body 150 increases heat dissipation area, therefore can significantly improve the heat dissipation of metal-oxide-semiconductor
Efficiency.
The accessory body 150 that radiates can use various shape and various structures, can increase radiation shell 100 to a certain extent
Heat dissipation area illustrates one of implementation in the present embodiment:
Heat dissipation accessory body 150 is arranged at intervals with multiple second radiation tooths 152 (see Fig. 1), the freedom of multiple second radiation tooths 152
End extends that (extending direction understood in combination with Fig. 1, the second radiation tooth 152 of two sides towards one end far from heat sink body 110
Freely extend along the direction far from other side heat dissipation accessory body 150 respectively).Further, the second radiation tooth 152 is in bar shaped.Certainly,
The concrete shape of first radiation tooth 124 and the second radiation tooth 152 can with no restriction, and the two can also be using in addition to bar shaped
Other shapes, such as annular, waveform etc..Certainly, the second radiation tooth 152 of strip also has its special heat dissipation advantage,
For example, increasing heat dissipation area, and when air flows through the second 152 surface of radiation tooth of strip, regular strip can be risen
To the effect of guidance air circulation, to accelerate air in the circulating rate on 152 surface of the second radiation tooth, and then heat dissipation speed is improved
Rate.
Referring to figure 4., Fig. 4 show the enlarged diagram at the position IV in Fig. 1.Radiation shell 100 in order to further increase
Heat dissipation area, to enhance its heat dissipation effect, 152 surface of the second radiation tooth is provided with multiple raised 154.The shape of protrusion 154 can
Be it is various, beyond all doubt, multiple raised the 154 of interval can increase the heat dissipation on 152 surface of the second radiation tooth
Area, to improve the heat-sinking capability of the second radiation tooth 152.The setting form of the present embodiment protrusions 154 is continuous wave
Shape, as shown in Figure 4.Continuous wave is opened up on respective surface on each first radiation tooth 124 and each second radiation tooth 152
Unrestrained protrusion 154.
It should be noted that heat dissipation accessory body 150 can be integrated molding with heat sink body 110 and be also possible to seperated connection.
Using being integrally formed in the present embodiment, avoiding heat, there are more accumulation of heat in the seperated junction of the two, for a long time
Heat history may reduce the heat-sinking capability of radiation shell 100.
The working principle of radiation shell 100 is:
Control panel is mounted on panel mounting portion 112 with metal-oxide-semiconductor and (usually first control panel and metal-oxide-semiconductor is welded, then will
The two is installed on panel mounting portion 112).Control board ends are respectively engaged in the first clamping portion 116 and the second clamping portion 118,
Two groups of metal-oxide-semiconductors are laid on two sticking parts 114.Since calorific value is larger during the work time for metal-oxide-semiconductor, in order to improve metal-oxide-semiconductor
With the heat transfer efficiency between sticking part 114, and then the heat of metal-oxide-semiconductor is made to shed more quickly, metal-oxide-semiconductor is made using fixing piece 120
It is tightly attached on sticking part 114, while also ensuring the connective stability of metal-oxide-semiconductor.Two mounting plates 130 are relatively arranged on heat dissipation master
The both ends of body 110, after mounting plate 130 is fixed, first radiation tooth 124 at 110 back side of heat sink body is in vacant state naturally
(referring to will not directly abut with the mounting surface of controller), to improve rate of the heat sink body 110 from backside radiator.Meanwhile edge
In the width direction of heat sink body 110, the two sides of heat sink body 110 are respectively connected with heat dissipation accessory body 150, increase heat dissipation area,
Therefore the radiating efficiency of metal-oxide-semiconductor can be significantly improved.100 ventilation effect of radiation shell provided in this embodiment is more preferable, heat dissipation area
Bigger, metal-oxide-semiconductor can disperse to be mounted on radiation shell 100, higher to the radiating efficiency of metal-oxide-semiconductor, can greatly improve electronic device
Heat dissipation effect, to extend the service life of electric device.The whole material of radiation shell 100 can select copper, aluminium etc. to radiate
Preferable metal material can also select some preferable nonmetallic materials of heat dissipation, such as carbon fiber.
The present embodiment additionally provides a kind of metal-oxide-semiconductor component comprising multiple metal-oxide-semiconductors and above-mentioned radiation shell 100, multiple MOS
Pipe is connected to multiple panel mounting portions 112 (being 2 in the present embodiment).The dispersion installation of multiple metal-oxide-semiconductors slows down metal-oxide-semiconductor significantly
The concentration fever phenomenon occurred when installing concentratedly.Concentrate fever that can cause to influence each other between different metal-oxide-semiconductors, so that metal-oxide-semiconductor
Calorific value is bigger, and metal-oxide-semiconductor heat is more difficult to shed, and metal-oxide-semiconductor is easier to damage.Therefore, the metal-oxide-semiconductor after dispersion installation can make MOS
Pipe has longer service life, and damage frequency substantially reduces, and maintenance cost substantially reduces.
Further, metal-oxide-semiconductor component further includes control panel.Control panel and multiple metal-oxide-semiconductors are electrically connected.Control panel is connected to
Panel mounting portion 112.In the width direction of control panel, metal-oxide-semiconductor at least is distributed at the both ends of control panel.
User sells as a whole after can installing metal-oxide-semiconductor and radiation shell 100, can also be by MOS
Pipe, control panel and radiation shell 100 are sold as a whole after installing, voluntarily installed by subsequent buyer or
It is post-processed.
The above is only the preferred embodiments of the utility model, are not intended to limit the utility model, for this field
Technical staff for, various modifications and changes may be made to the present invention.Within the spirit and principle of the utility model,
Any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of radiation shell, which is characterized in that including heat sink body, the heat sink body is arranged at intervals with multiple panel installations
Portion, at least two panel mounting portions in the multiple panel mounting portion are relatively arranged on the both ends of the heat sink body.
2. radiation shell according to claim 1, which is characterized in that the heat sink body is additionally provided with the first radiation tooth, institute
State the two sides that the first radiation tooth is relatively arranged on the heat sink body thickness direction with the multiple panel mounting portion, Duo Gesuo
It states the first radiation tooth and is arranged at intervals at the heat sink body.
3. radiation shell according to claim 1, which is characterized in that the radiation shell further includes for compressing heating device
Fixing piece, the heat sink body are additionally provided with and the matched fixing groove of the fixing piece.
4. radiation shell according to claim 1-3, which is characterized in that the radiation shell further includes heat dissipation accessory body,
In the width direction of the heat sink body, at least side in the two sides of the heat sink body is connected with the heat dissipation accessory body；
In the width direction of the heat sink body, two panel mounting portions are relatively arranged on the both ends of the heat sink body.
5. radiation shell according to claim 4, which is characterized in that the heat dissipation accessory body is arranged at intervals with multiple second heat dissipations
Tooth, the free end of the multiple second radiation tooth extend towards one end far from the heat sink body.
6. radiation shell according to claim 5, which is characterized in that second radiation tooth is in bar shaped.
7. radiation shell according to claim 5, which is characterized in that the second heat dissipation tooth surface is provided with multiple protrusions.
8. radiation shell according to claim 4, which is characterized in that the heat dissipation accessory body and heat sink body one at
Type.
9. a kind of metal-oxide-semiconductor component, which is characterized in that including multiple metal-oxide-semiconductors and such as the described in any item heat dissipations of claim 1-8
Shell, the multiple metal-oxide-semiconductor are connected to the multiple panel mounting portion.
10. metal-oxide-semiconductor component according to claim 9, which is characterized in that the metal-oxide-semiconductor component further includes control panel, described
Control panel and the multiple metal-oxide-semiconductor are electrically connected, and the control panel is connected to the panel mounting portion, along the width of the control panel
It spends on direction, is at least distributed with the metal-oxide-semiconductor at the both ends of the control panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822070883.XU CN209199912U (en) | 2018-12-10 | 2018-12-10 | A kind of radiation shell and metal-oxide-semiconductor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822070883.XU CN209199912U (en) | 2018-12-10 | 2018-12-10 | A kind of radiation shell and metal-oxide-semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209199912U true CN209199912U (en) | 2019-08-02 |
Family
ID=67428538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822070883.XU Active CN209199912U (en) | 2018-12-10 | 2018-12-10 | A kind of radiation shell and metal-oxide-semiconductor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209199912U (en) |
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2018
- 2018-12-10 CN CN201822070883.XU patent/CN209199912U/en active Active
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