KR19990037268A - 이방도전성 접착제 및 접착용 막 - Google Patents
이방도전성 접착제 및 접착용 막 Download PDFInfo
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- KR19990037268A KR19990037268A KR1019980044116A KR19980044116A KR19990037268A KR 19990037268 A KR19990037268 A KR 19990037268A KR 1019980044116 A KR1019980044116 A KR 1019980044116A KR 19980044116 A KR19980044116 A KR 19980044116A KR 19990037268 A KR19990037268 A KR 19990037268A
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Abstract
Description
Claims (13)
- 절연성 접착제 중에 도전입자가 분산된 이방(異方)도전성 접착제로서,상기 도전입자는 평균 입경(粒徑)이 상이한 2종 이상의 도전입자이고, 또한 이들 도전입자는 절연성 접착제에 불용(不溶)인 절연성 수지로 피복된 절연피복도전입자인 것을 특징으로 하는 이방도전성 접작제.
- 제1항에 있어서, 평균 입경이 상이한 2종 이상의 도전입자가 가압에 의해 변형되는 입자인 것을 특징으로 하는 이방도전성 접착제.
- 제1항 또는 제2항에 있어서, 평균 입경이 작은 도전입자의 경도(硬度)가, 평균 입경이 큰 도전입자와 동등하거나, 그 이상의 경도를 가지는 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 평균 입경이 작은 도전입자의 K값이 350㎏/㎟ 이상, 평균 입경이 큰 도전입자의 K값이 450㎏/㎟ 이하이고, 평균 입경이 작은 도전입자의 K값이 평균 입경이 큰 도전입자의 K값보다 상대적으로 큰 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 평균 입자경이 작은 도전입자의 함유 개수가 평균 입경이 큰 도전입자의 함유 개수보다 많은 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 평균 입경이 3±0.5㎛와 5±0.5㎛의 2종류의 도전입자가 분산되어 이루어지는 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제6항 중 어느 한 항에 있어서, IC칩과 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제7항 중 어느 한 항에 있어서, IC칩에 형성된 4000㎛2이하의 미소(微小)범프와 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제8항 중 어느 한 항에 기재된 이방도전성 접착제로 이루어지는 것을 특징으로 하는 이방도전성 접착용 막(膜).
- 제9항에 있어서, IC칩과 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착용 막.
- 제9항에 있어서, IC칩에 형성된 4000㎛2이하의 미소범프와 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착용 막.
- 제9항 내지 제11항 중 어느 한 항에 있어서, 단위 면적당의 막 중에 함유되는 평균 입경이 작은 도전입자의 함유량이 30000∼80000개/㎟의 범위이고, 평균 입경이 큰 도전입자의 함유량이 10000∼30000개/㎟의 범위인 것을 특징으로 하는 이방도전성 접착용 막.
- 제9항 내지 제12항 중 어느 한 항에 있어서, 막의 두께가 접속을 행하는 IC칩의 범프 높이와 회로기판 상의 배선패턴의 높이와를 합친 막에 대하여 1∼3배인 것을 특징으로 하는 이방도전성 접착용 막.
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JP29600597 | 1997-10-28 | ||
JP97-296005 | 1997-10-28 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170091686A (ko) * | 2015-01-13 | 2017-08-09 | 데쿠세리아루즈 가부시키가이샤 | 다층 기판 |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100574215B1 (ko) * | 1997-04-17 | 2006-04-27 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자 |
US6495069B1 (en) * | 1998-01-30 | 2002-12-17 | Peratech Limited Of A Company Of Great Britain And Northern Ireland | Polymer composition |
US6137164A (en) * | 1998-03-16 | 2000-10-24 | Texas Instruments Incorporated | Thin stacked integrated circuit device |
JP2000113919A (ja) * | 1998-08-03 | 2000-04-21 | Sony Corp | 電気的接続装置と電気的接続方法 |
EP1924130A3 (en) * | 1998-12-16 | 2010-11-17 | Ibiden Co., Ltd. | Conductive connecting pin and package substrate |
JP2000214804A (ja) * | 1999-01-20 | 2000-08-04 | Fuji Photo Film Co Ltd | 光変調素子及び露光装置並びに平面表示装置 |
JP2001031929A (ja) * | 1999-07-21 | 2001-02-06 | Sony Chem Corp | 接続構造体 |
JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
CN101037572A (zh) | 1999-08-25 | 2007-09-19 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
JP3738655B2 (ja) * | 2000-03-31 | 2006-01-25 | ソニーケミカル株式会社 | 異方性導電接着材料及び接続方法 |
US6703566B1 (en) * | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
TW554191B (en) * | 2000-12-16 | 2003-09-21 | Au Optronics Corp | Laminating structure and its forming method |
US6436345B1 (en) * | 2001-03-23 | 2002-08-20 | Chemtreat, Inc. | Method for generating chlorine dioxide |
US6923882B2 (en) * | 2001-03-26 | 2005-08-02 | Honeywell International Inc. | Compliant pre-form interconnect |
GB0113905D0 (en) | 2001-06-07 | 2001-08-01 | Peratech Ltd | Analytical device |
TW531868B (en) * | 2001-08-21 | 2003-05-11 | Au Optronics Corp | Soldering type anisotropic conductive film |
US7170062B2 (en) * | 2002-03-29 | 2007-01-30 | Oy Ajat Ltd. | Conductive adhesive bonded semiconductor substrates for radiation imaging devices |
US6777071B2 (en) | 2002-04-25 | 2004-08-17 | Micron Technology, Inc. | Electrical interconnect using locally conductive adhesive |
US6733613B2 (en) * | 2002-07-25 | 2004-05-11 | S. Kumar Khanna | Method for curing an anisotropic conductive compound |
US6909100B2 (en) | 2002-07-25 | 2005-06-21 | Ii-Vi Incorporated | Radiation detector assembly |
US6838022B2 (en) * | 2002-07-25 | 2005-01-04 | Nexaura Systems, Llc | Anisotropic conductive compound |
TWI270835B (en) * | 2002-10-29 | 2007-01-11 | Matsushita Electric Ind Co Ltd | Display device and generation method of image display particle |
JP4539813B2 (ja) * | 2003-08-19 | 2010-09-08 | ソニーケミカル&インフォメーションデバイス株式会社 | 絶縁被覆導電粒子 |
EP1542272B1 (en) * | 2003-10-06 | 2016-07-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
KR20050079399A (ko) * | 2004-02-05 | 2005-08-10 | 삼성전자주식회사 | 이방성도전필름 및 범프와, 이를 갖는 반도체 칩의 실장구조체 |
JP5099284B2 (ja) * | 2005-02-24 | 2012-12-19 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性接続シート材料 |
US20070023901A1 (en) * | 2005-07-29 | 2007-02-01 | Gerard Mahoney | Microelectronic bond pad |
JP4428355B2 (ja) * | 2006-03-30 | 2010-03-10 | Tdk株式会社 | 電子部品の評価方法 |
JP4830744B2 (ja) * | 2006-09-15 | 2011-12-07 | パナソニック株式会社 | 電子部品実装用接着剤及び電子部品実装構造体 |
JP4737177B2 (ja) * | 2006-10-31 | 2011-07-27 | 日立化成工業株式会社 | 回路接続構造体 |
JP4922800B2 (ja) * | 2007-03-19 | 2012-04-25 | 株式会社東芝 | 電子機器の製造方法 |
KR20100119830A (ko) * | 2007-05-15 | 2010-11-10 | 히다치 가세고교 가부시끼가이샤 | 회로 접속 재료 및 회로 부재의 접속 구조 |
CN101836266B (zh) * | 2007-10-22 | 2012-02-15 | 日本化学工业株式会社 | 包覆导电性粉体以及使用该包覆导电性粉体的导电性粘合剂 |
JPWO2009063827A1 (ja) * | 2007-11-12 | 2011-03-31 | 日立化成工業株式会社 | 回路接続材料、及び回路部材の接続構造 |
TWI334746B (en) * | 2008-03-31 | 2010-12-11 | Raydium Semiconductor Corp | Assembly structure |
US20090278213A1 (en) * | 2008-05-08 | 2009-11-12 | International Business Machines Corporation | Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array |
JP4877535B2 (ja) * | 2009-06-15 | 2012-02-15 | 住友電気工業株式会社 | プリント配線板における電極の接続構造、これに用いる導電性接着剤及び電子機器 |
KR101025620B1 (ko) * | 2009-07-13 | 2011-03-30 | 한국과학기술원 | 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 |
US9469790B2 (en) * | 2009-09-29 | 2016-10-18 | The Boeing Company | Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation |
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JP5650611B2 (ja) * | 2011-08-23 | 2015-01-07 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体 |
KR101447125B1 (ko) | 2011-12-22 | 2014-10-06 | 제일모직 주식회사 | 이방성 도전 필름 |
GB201212489D0 (en) | 2012-07-13 | 2012-08-29 | Conpart As | Improvements in conductive adhesives |
JP2014065766A (ja) * | 2012-09-24 | 2014-04-17 | Dexerials Corp | 異方性導電接着剤 |
CN103000779B (zh) * | 2012-09-24 | 2015-01-07 | 安徽三安光电有限公司 | 具有电流阻挡功能的垂直发光二极管及其制作方法 |
JP6358535B2 (ja) * | 2013-04-26 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 配線板間接続構造、および配線板間接続方法 |
US9365749B2 (en) | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
DE102013219688B3 (de) * | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung |
JP6106148B2 (ja) | 2013-11-27 | 2017-03-29 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
FR3038446B1 (fr) * | 2015-07-01 | 2017-07-21 | Hydromecanique & Frottement | Materiau composite conducteur elabore a partir de poudres revetues |
FR3042305B1 (fr) * | 2015-10-13 | 2019-07-26 | Arkema France | Procede de fabrication d'un materiau composite conducteur et materiau composite ainsi obtenu |
US10177265B2 (en) * | 2016-01-04 | 2019-01-08 | The Boeing Company | Bonding using conductive particles in conducting adhesives |
JP6945276B2 (ja) * | 2016-03-31 | 2021-10-06 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
US10411218B2 (en) * | 2017-10-30 | 2019-09-10 | Wuhun China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Quasi crystalline conductive particles between a substrate and IC chip |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JP2954241B2 (ja) * | 1989-09-13 | 1999-09-27 | 住友ベークライト株式会社 | 異方導電フィルム |
US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
-
1998
- 1998-10-21 KR KR1019980044116A patent/KR100539060B1/ko not_active IP Right Cessation
- 1998-10-21 US US09/176,167 patent/US5965064A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170091686A (ko) * | 2015-01-13 | 2017-08-09 | 데쿠세리아루즈 가부시키가이샤 | 다층 기판 |
US11901325B2 (en) | 2015-01-13 | 2024-02-13 | Dexerials Corporation | Multilayer substrate |
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KR100539060B1 (ko) | 2007-04-25 |
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