KR102611763B1 - 흑화 도금액 및 도전성 기판 제조방법 - Google Patents

흑화 도금액 및 도전성 기판 제조방법 Download PDF

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Publication number: KR102611763B1
Authority: KR; South Korea
Prior art keywords: layer; blackening; copper; conductive substrate; plating solution
Prior art date: 2016-01-29

Application number

KR1020187021196A

Other languages

English (en)

Korean (ko)

Other versions

KR20180103072A (ko

Inventor

다쿠미 시모지

다이키 시가

Original Assignee

스미토모 긴조쿠 고잔 가부시키가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-01-29

Filing date

2017-01-20

Publication date

2023-12-07

2017-01-20 Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤

2018-09-18 Publication of KR20180103072A publication Critical patent/KR20180103072A/ko

2023-12-07 Application granted granted Critical

2023-12-07 Publication of KR102611763B1 publication Critical patent/KR102611763B1/ko

Links

238000007747 plating Methods 0.000 title claims abstract description 125
239000000758 substrate Substances 0.000 title claims description 227
238000004519 manufacturing process Methods 0.000 title claims description 18
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 21
229910001431 copper ion Inorganic materials 0.000 claims abstract description 21
229910001453 nickel ion Inorganic materials 0.000 claims abstract description 18
VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims abstract description 12
229910052802 copper Inorganic materials 0.000 claims description 206
239000010949 copper Substances 0.000 claims description 206
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 203
238000000034 method Methods 0.000 claims description 103
230000008569 process Effects 0.000 claims description 46
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 24
150000001408 amides Chemical class 0.000 claims description 9
239000010410 layer Substances 0.000 description 409
239000000243 solution Substances 0.000 description 90
238000005530 etching Methods 0.000 description 39
239000010409 thin film Substances 0.000 description 27
239000010408 film Substances 0.000 description 22
230000015572 biosynthetic process Effects 0.000 description 18
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
229910052751 metal Inorganic materials 0.000 description 16
239000002184 metal Substances 0.000 description 16
229920005989 resin Polymers 0.000 description 15
239000011347 resin Substances 0.000 description 15
229910052759 nickel Inorganic materials 0.000 description 14
238000000059 patterning Methods 0.000 description 11
238000009713 electroplating Methods 0.000 description 10
239000000463 material Substances 0.000 description 10
238000004544 sputter deposition Methods 0.000 description 9
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
229910052799 carbon Inorganic materials 0.000 description 8
239000001257 hydrogen Substances 0.000 description 8
229910052739 hydrogen Inorganic materials 0.000 description 8
150000002431 hydrogen Chemical class 0.000 description 8
229910052757 nitrogen Inorganic materials 0.000 description 8
239000001301 oxygen Substances 0.000 description 8
229910052760 oxygen Inorganic materials 0.000 description 8
230000009257 reactivity Effects 0.000 description 8
229910045601 alloy Inorganic materials 0.000 description 7
239000000956 alloy Substances 0.000 description 7
-1 etc. Substances 0.000 description 7
238000002834 transmittance Methods 0.000 description 7
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
239000007789 gas Substances 0.000 description 6
229920000139 polyethylene terephthalate Polymers 0.000 description 6
239000005020 polyethylene terephthalate Substances 0.000 description 6
238000007740 vapor deposition Methods 0.000 description 6
229910052725 zinc Inorganic materials 0.000 description 6
150000003839 salts Chemical class 0.000 description 5
239000000126 substance Substances 0.000 description 5
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
239000000853 adhesive Substances 0.000 description 4
230000001070 adhesive effect Effects 0.000 description 4
238000011156 evaluation Methods 0.000 description 4
238000007733 ion plating Methods 0.000 description 4
238000005259 measurement Methods 0.000 description 4
WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
229910052804 chromium Inorganic materials 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
229910052742 iron Inorganic materials 0.000 description 3
230000001678 irradiating effect Effects 0.000 description 3
238000003475 lamination Methods 0.000 description 3
229910052748 manganese Inorganic materials 0.000 description 3
150000002739 metals Chemical class 0.000 description 3
229910052750 molybdenum Inorganic materials 0.000 description 3
229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
239000011112 polyethylene naphthalate Substances 0.000 description 3
229910052715 tantalum Inorganic materials 0.000 description 3
229910052718 tin Inorganic materials 0.000 description 3
229910052719 titanium Inorganic materials 0.000 description 3
229910052721 tungsten Inorganic materials 0.000 description 3
229910052720 vanadium Inorganic materials 0.000 description 3
VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
239000004642 Polyimide Substances 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
239000012790 adhesive layer Substances 0.000 description 2
229910021529 ammonia Inorganic materials 0.000 description 2
235000011114 ammonium hydroxide Nutrition 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
229910052786 argon Inorganic materials 0.000 description 2
239000012298 atmosphere Substances 0.000 description 2
239000002585 base Substances 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
239000011521 glass Substances 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
239000011261 inert gas Substances 0.000 description 2
229910001092 metal group alloy Inorganic materials 0.000 description 2
229910044991 metal oxide Inorganic materials 0.000 description 2
150000004706 metal oxides Chemical class 0.000 description 2
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
229940053662 nickel sulfate Drugs 0.000 description 2
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
229920002647 polyamide Polymers 0.000 description 2
229920000515 polycarbonate Polymers 0.000 description 2
239000004417 polycarbonate Substances 0.000 description 2
229920001721 polyimide Polymers 0.000 description 2
230000002265 prevention Effects 0.000 description 2
238000005546 reactive sputtering Methods 0.000 description 2
238000002310 reflectometry Methods 0.000 description 2
230000001629 suppression Effects 0.000 description 2
UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
229910017813 Cu—Cr Inorganic materials 0.000 description 1
229910017881 Cu—Ni—Fe Inorganic materials 0.000 description 1
MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
229910018054 Ni-Cu Inorganic materials 0.000 description 1
229910018487 Ni—Cr Inorganic materials 0.000 description 1
229910018481 Ni—Cu Inorganic materials 0.000 description 1
229910018605 Ni—Zn Inorganic materials 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
229910011212 Ti—Fe Inorganic materials 0.000 description 1
229910001080 W alloy Inorganic materials 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
239000001569 carbon dioxide Substances 0.000 description 1
229910002092 carbon dioxide Inorganic materials 0.000 description 1
229910002091 carbon monoxide Inorganic materials 0.000 description 1
230000008859 change Effects 0.000 description 1
238000004040 coloring Methods 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
229910000365 copper sulfate Inorganic materials 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
ZQLBQWDYEGOYSW-UHFFFAOYSA-L copper;disulfamate Chemical compound [Cu+2].NS([O-])(=O)=O.NS([O-])(=O)=O ZQLBQWDYEGOYSW-UHFFFAOYSA-L 0.000 description 1
229960003280 cupric chloride Drugs 0.000 description 1
150000001925 cycloalkenes Chemical class 0.000 description 1
229910001873 dinitrogen Inorganic materials 0.000 description 1
229910001882 dioxygen Inorganic materials 0.000 description 1
230000000694 effects Effects 0.000 description 1
KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000002932 luster Substances 0.000 description 1
239000012528 membrane Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
229910001000 nickel titanium Inorganic materials 0.000 description 1
239000003002 pH adjusting agent Substances 0.000 description 1
229920006254 polymer film Polymers 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
238000012546 transfer Methods 0.000 description 1
238000000870 ultraviolet spectroscopy Methods 0.000 description 1
239000012808 vapor phase Substances 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Mechanical Engineering (AREA)
Laminated Bodies (AREA)
Electroplating Methods And Accessories (AREA)
Electroplating And Plating Baths Therefor (AREA)

KR1020187021196A 2016-01-29 2017-01-20 흑화 도금액 및 도전성 기판 제조방법 KR102611763B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2016016592		2016-01-29
JPJP-P-2016-016592		2016-01-29
PCT/JP2017/001987 WO2017130866A1 (ja)	2016-01-29	2017-01-20	黒化めっき液、導電性基板の製造方法

Publications (2)

Publication Number	Publication Date
KR20180103072A KR20180103072A (ko)	2018-09-18
KR102611763B1 true KR102611763B1 (ko)	2023-12-07

Family

ID=59398844

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020187021196A KR102611763B1 (ko)	2016-01-29	2017-01-20	흑화 도금액 및 도전성 기판 제조방법

Country Status (5)

Country	Link
JP (1)	JP6806093B2 (ja)
KR (1)	KR102611763B1 (ja)
CN (1)	CN108603301A (ja)
TW (1)	TWI791427B (ja)
WO (1)	WO2017130866A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61163289A (ja) *	1985-01-14	1986-07-23	Nippon Kagaku Sangyo Kk	ニツケル及びニツケル合金による黒色電気めつき浴
JPH0368795A (ja) *	1989-08-07	1991-03-25	K D K Kk	印刷回路用銅箔の製造方法
JP4086132B2 (ja)	2001-11-16	2008-05-14	株式会社ブリヂストン	透明導電性フィルムおよびタッチパネル
TWI236023B (en) *	2003-04-18	2005-07-11	Dainippon Printing Co Ltd	Electromagnetic shielding sheet, front plate for display, and method for producing electromagnetic shielding sheet
JP5588597B2 (ja) *	2007-03-23	2014-09-10	富士フイルム株式会社	導電性材料の製造方法及び製造装置
MX355999B (es) *	2012-04-19	2018-05-08	Dipsol Chem	Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia.
CN103345337B (zh) *	2013-07-15	2016-08-17	深圳南玻显示器件科技有限公司	柔性触摸屏及其制作方法
KR101416438B1 (ko) *	2013-12-17	2014-07-10	와이엠티 주식회사	메탈 메쉬, 이를 이용한 터치 스크린 센서 및 이의 제조방법
JP2015151594A (ja) *	2014-02-17	2015-08-24	住友金属鉱山株式会社	細線パターンの形成方法、及び導電性基板の製造方法

2017
- 2017-01-20 KR KR1020187021196A patent/KR102611763B1/ko active IP Right Grant
- 2017-01-20 JP JP2017564216A patent/JP6806093B2/ja active Active
- 2017-01-20 CN CN201780008167.4A patent/CN108603301A/zh active Pending
- 2017-01-20 WO PCT/JP2017/001987 patent/WO2017130866A1/ja active Application Filing
- 2017-01-25 TW TW106102784A patent/TWI791427B/zh active

Also Published As

Publication number	Publication date
CN108603301A (zh)	2018-09-28
TWI791427B (zh)	2023-02-11
TW201739966A (zh)	2017-11-16
KR20180103072A (ko)	2018-09-18
JPWO2017130866A1 (ja)	2018-11-29
JP6806093B2 (ja)	2021-01-06
WO2017130866A1 (ja)	2017-08-03

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Date	Code	Title
2023-04-28	E902	Notification of reason for refusal
2023-10-16	E701	Decision to grant or registration of patent right
2023-12-05	GRNT	Written decision to grant

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KR102631091B1 (ko)	2024-01-29	흑화 도금액 및 도전성 기판 제조방법
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JP6597139B2 (ja)	2019-10-30	黒化めっき液、導電性基板
TWI706299B (zh)	2020-10-01	導電性基板、導電性基板之製造方法
WO2016190224A1 (ja)	2016-12-01	黒化めっき液、導電性基板
TWI762618B (zh)	2022-05-01	導電性基板
JP2017084265A (ja)	2017-05-18	導電性基板の製造方法
TWI716534B (zh)	2021-01-21	導電性基板