CN108603301A - 黑化镀液和导电性基板的制造方法 - Google Patents

黑化镀液和导电性基板的制造方法 Download PDF

Info

Publication number: CN108603301A
Authority: CN; China
Prior art keywords: copper; layers; layer; conductive board; plating solution
Prior art date: 2016-01-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201780008167.4A

Other languages

English (en)

Chinese (zh)

Inventor

下地匠

志贺大树

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Metal Mining Co Ltd

Original Assignee

Sumitomo Metal Mining Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-01-29

Filing date

2017-01-20

Publication date

2018-09-28

2017-01-20 Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd

2018-09-28 Publication of CN108603301A publication Critical patent/CN108603301A/zh

Status Pending legal-status Critical Current

Links

238000007747 plating Methods 0.000 title claims abstract description 111
208000003351 Melanosis Diseases 0.000 title claims abstract description 90
238000004519 manufacturing process Methods 0.000 title claims description 20
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 46
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 23
229910001431 copper ion Inorganic materials 0.000 claims abstract description 23
229910001453 nickel ion Inorganic materials 0.000 claims abstract description 20
229910052802 copper Inorganic materials 0.000 claims description 213
239000010949 copper Substances 0.000 claims description 213
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 210
IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims description 11
230000008859 change Effects 0.000 claims description 4
239000010410 layer Substances 0.000 description 348
239000000243 solution Substances 0.000 description 97
239000002585 base Substances 0.000 description 92
239000012790 adhesive layer Substances 0.000 description 55
238000000034 method Methods 0.000 description 49
238000005530 etching Methods 0.000 description 36
239000000758 substrate Substances 0.000 description 26
238000003475 lamination Methods 0.000 description 25
238000002310 reflectometry Methods 0.000 description 20
230000008569 process Effects 0.000 description 19
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
229910052751 metal Inorganic materials 0.000 description 17
239000007789 gas Substances 0.000 description 16
239000002184 metal Substances 0.000 description 16
229910052759 nickel Inorganic materials 0.000 description 16
239000000463 material Substances 0.000 description 15
239000011347 resin Substances 0.000 description 15
229920005989 resin Polymers 0.000 description 15
229920002120 photoresistant polymer Polymers 0.000 description 13
239000004615 ingredient Substances 0.000 description 10
230000009257 reactivity Effects 0.000 description 10
239000001257 hydrogen Substances 0.000 description 9
229910052739 hydrogen Inorganic materials 0.000 description 9
229910052757 nitrogen Inorganic materials 0.000 description 9
238000004544 sputter deposition Methods 0.000 description 9
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
229910052799 carbon Inorganic materials 0.000 description 8
238000001035 drying Methods 0.000 description 8
239000001301 oxygen Substances 0.000 description 8
229910052760 oxygen Inorganic materials 0.000 description 8
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 7
230000003466 anti-cipated effect Effects 0.000 description 7
238000000151 deposition Methods 0.000 description 7
238000009713 electroplating Methods 0.000 description 7
238000011156 evaluation Methods 0.000 description 7
150000002431 hydrogen Chemical class 0.000 description 7
238000012986 modification Methods 0.000 description 7
230000004048 modification Effects 0.000 description 7
238000000059 patterning Methods 0.000 description 7
229910045601 alloy Inorganic materials 0.000 description 6
239000000956 alloy Substances 0.000 description 6
230000007613 environmental effect Effects 0.000 description 6
150000003839 salts Chemical class 0.000 description 6
229910052725 zinc Inorganic materials 0.000 description 6
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
230000002401 inhibitory effect Effects 0.000 description 5
238000007733 ion plating Methods 0.000 description 5
238000005259 measurement Methods 0.000 description 5
239000000203 mixture Substances 0.000 description 5
229920000139 polyethylene terephthalate Polymers 0.000 description 5
239000005020 polyethylene terephthalate Substances 0.000 description 5
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
230000015572 biosynthetic process Effects 0.000 description 4
238000002834 transmittance Methods 0.000 description 4
WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
239000004642 Polyimide Substances 0.000 description 3
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
239000000853 adhesive Substances 0.000 description 3
239000003795 chemical substances by application Substances 0.000 description 3
229910052804 chromium Inorganic materials 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
230000003628 erosive effect Effects 0.000 description 3
229910052742 iron Inorganic materials 0.000 description 3
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
239000007788 liquid Substances 0.000 description 3
229910052748 manganese Inorganic materials 0.000 description 3
239000012528 membrane Substances 0.000 description 3
229910001092 metal group alloy Inorganic materials 0.000 description 3
150000002739 metals Chemical class 0.000 description 3
229910052750 molybdenum Inorganic materials 0.000 description 3
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
-1 polyethylene terephthalate Polymers 0.000 description 3
229920001721 polyimide Polymers 0.000 description 3
229910052715 tantalum Inorganic materials 0.000 description 3
229910052718 tin Inorganic materials 0.000 description 3
229910052719 titanium Inorganic materials 0.000 description 3
229910052721 tungsten Inorganic materials 0.000 description 3
229910052720 vanadium Inorganic materials 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
239000004425 Makrolon Substances 0.000 description 2
239000004952 Polyamide Substances 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
229910021529 ammonia Inorganic materials 0.000 description 2
239000000908 ammonium hydroxide Substances 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
229910052786 argon Inorganic materials 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
239000008139 complexing agent Substances 0.000 description 2
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000011521 glass Substances 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
230000005764 inhibitory process Effects 0.000 description 2
238000012544 monitoring process Methods 0.000 description 2
229920002647 polyamide Polymers 0.000 description 2
229920000515 polycarbonate Polymers 0.000 description 2
239000011112 polyethylene naphthalate Substances 0.000 description 2
235000011121 sodium hydroxide Nutrition 0.000 description 2
229910017813 Cu—Cr Inorganic materials 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
229910018054 Ni-Cu Inorganic materials 0.000 description 1
229910003271 Ni-Fe Inorganic materials 0.000 description 1
229910018487 Ni—Cr Inorganic materials 0.000 description 1
229910018481 Ni—Cu Inorganic materials 0.000 description 1
229910018605 Ni—Zn Inorganic materials 0.000 description 1
240000001439 Opuntia Species 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
229910011212 Ti—Fe Inorganic materials 0.000 description 1
229910001080 W alloy Inorganic materials 0.000 description 1
QRSFFHRCBYCWBS-UHFFFAOYSA-N [O].[O] Chemical compound [O].[O] QRSFFHRCBYCWBS-UHFFFAOYSA-N 0.000 description 1
AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
150000001408 amides Chemical class 0.000 description 1
229910052789 astatine Inorganic materials 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
JSLMNNPQKHONFW-UHFFFAOYSA-N benzene naphthalene-1-carboxylic acid Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)O.C1=CC=CC=C1 JSLMNNPQKHONFW-UHFFFAOYSA-N 0.000 description 1
239000001569 carbon dioxide Substances 0.000 description 1
229910002092 carbon dioxide Inorganic materials 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
HPAXFNMMMBLYJU-UHFFFAOYSA-N copper sulfamic acid Chemical compound [Cu].S(N)(O)(=O)=O HPAXFNMMMBLYJU-UHFFFAOYSA-N 0.000 description 1
229960003280 cupric chloride Drugs 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000012217 deletion Methods 0.000 description 1
230000037430 deletion Effects 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
235000013399 edible fruits Nutrition 0.000 description 1
238000005868 electrolysis reaction Methods 0.000 description 1
239000003792 electrolyte Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
150000002148 esters Chemical class 0.000 description 1
GVINIKRAUKVLRA-UHFFFAOYSA-N ethane-1,2-diol;naphthalene-1,2-dicarboxylic acid Chemical compound OCCO.C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 GVINIKRAUKVLRA-UHFFFAOYSA-N 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
238000005286 illumination Methods 0.000 description 1
KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
230000001788 irregular Effects 0.000 description 1
238000010030 laminating Methods 0.000 description 1
230000000670 limiting effect Effects 0.000 description 1
229920002521 macromolecule Polymers 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
229910001000 nickel titanium Inorganic materials 0.000 description 1
239000003002 pH adjusting agent Substances 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
238000005546 reactive sputtering Methods 0.000 description 1
230000009467 reduction Effects 0.000 description 1
230000000630 rising effect Effects 0.000 description 1
239000013049 sediment Substances 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
230000003068 static effect Effects 0.000 description 1
239000000126 substance Substances 0.000 description 1
VYECFMCAAHMRNW-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O.NS(O)(=O)=O VYECFMCAAHMRNW-UHFFFAOYSA-N 0.000 description 1
239000001117 sulphuric acid Substances 0.000 description 1
235000011149 sulphuric acid Nutrition 0.000 description 1
230000000007 visual effect Effects 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Mechanical Engineering (AREA)
Laminated Bodies (AREA)
Electroplating Methods And Accessories (AREA)
Electroplating And Plating Baths Therefor (AREA)

CN201780008167.4A 2016-01-29 2017-01-20 黑化镀液和导电性基板的制造方法 Pending CN108603301A (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2016016592		2016-01-29
JP2016-016592		2016-01-29
PCT/JP2017/001987 WO2017130866A1 (ja)	2016-01-29	2017-01-20	黒化めっき液、導電性基板の製造方法

Publications (1)

Publication Number	Publication Date
CN108603301A true CN108603301A (zh)	2018-09-28

Family

ID=59398844

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201780008167.4A Pending CN108603301A (zh)	2016-01-29	2017-01-20	黑化镀液和导电性基板的制造方法

Country Status (5)

Country	Link
JP (1)	JP6806093B2 (ja)
KR (1)	KR102611763B1 (ja)
CN (1)	CN108603301A (ja)
TW (1)	TWI791427B (ja)
WO (1)	WO2017130866A1 (ja)

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Publication number	Priority date	Publication date	Assignee	Title
JPS61163289A (ja) *	1985-01-14	1986-07-23	Nippon Kagaku Sangyo Kk	ニツケル及びニツケル合金による黒色電気めつき浴
JPH0368795A (ja) *	1989-08-07	1991-03-25	K D K Kk	印刷回路用銅箔の製造方法
TW200425163A (en) *	2003-04-18	2004-11-16	Dainippon Printing Co Ltd	Electromagnetic shielding sheet, front plate for display, and method for producing electromagnetic shielding sheet
CN101270493A (zh) *	2007-03-23	2008-09-24	富士胶片株式会社	导电性材料的制造方法及制造装置
CN103345337A (zh) *	2013-07-15	2013-10-09	深圳南玻显示器件科技有限公司	柔性触摸屏及其制作方法
KR101416438B1 (ko) *	2013-12-17	2014-07-10	와이엠티 주식회사	메탈 메쉬, 이를 이용한 터치 스크린 센서 및 이의 제조방법
CN104321470A (zh) *	2012-04-19	2015-01-28	迪普索尔化学株式会社	铜-镍合金的电镀液以及镀覆方法
JP2015151594A (ja) *	2014-02-17	2015-08-24	住友金属鉱山株式会社	細線パターンの形成方法、及び導電性基板の製造方法

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Publication number	Priority date	Publication date	Assignee	Title
JP4086132B2 (ja)	2001-11-16	2008-05-14	株式会社ブリヂストン	透明導電性フィルムおよびタッチパネル

2017
- 2017-01-20 KR KR1020187021196A patent/KR102611763B1/ko active IP Right Grant
- 2017-01-20 JP JP2017564216A patent/JP6806093B2/ja active Active
- 2017-01-20 CN CN201780008167.4A patent/CN108603301A/zh active Pending
- 2017-01-20 WO PCT/JP2017/001987 patent/WO2017130866A1/ja active Application Filing
- 2017-01-25 TW TW106102784A patent/TWI791427B/zh active

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Publication number	Priority date	Publication date	Assignee	Title
JPS61163289A (ja) *	1985-01-14	1986-07-23	Nippon Kagaku Sangyo Kk	ニツケル及びニツケル合金による黒色電気めつき浴
JPH0368795A (ja) *	1989-08-07	1991-03-25	K D K Kk	印刷回路用銅箔の製造方法
TW200425163A (en) *	2003-04-18	2004-11-16	Dainippon Printing Co Ltd	Electromagnetic shielding sheet, front plate for display, and method for producing electromagnetic shielding sheet
CN101270493A (zh) *	2007-03-23	2008-09-24	富士胶片株式会社	导电性材料的制造方法及制造装置
CN104321470A (zh) *	2012-04-19	2015-01-28	迪普索尔化学株式会社	铜-镍合金的电镀液以及镀覆方法
CN103345337A (zh) *	2013-07-15	2013-10-09	深圳南玻显示器件科技有限公司	柔性触摸屏及其制作方法
KR101416438B1 (ko) *	2013-12-17	2014-07-10	와이엠티 주식회사	메탈 메쉬, 이를 이용한 터치 스크린 센서 및 이의 제조방법
JP2015151594A (ja) *	2014-02-17	2015-08-24	住友金属鉱山株式会社	細線パターンの形成方法、及び導電性基板の製造方法

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