KR102576310B1 - 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법 - Google Patents

경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법 Download PDF

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KR102576310B1
KR102576310B1 KR1020207015352A KR20207015352A KR102576310B1 KR 102576310 B1 KR102576310 B1 KR 102576310B1 KR 1020207015352 A KR1020207015352 A KR 1020207015352A KR 20207015352 A KR20207015352 A KR 20207015352A KR 102576310 B1 KR102576310 B1 KR 102576310B1
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South Korea
Prior art keywords
layer
resin layer
curable resin
cured
mass
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KR1020207015352A
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English (en)
Korean (ko)
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KR20200138151A (ko
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요스케 고마
아키노리 사토
다카시 아쿠츠
야스히코 가키우치
나오야 오카모토
다다토모 야마다
다케히토 나카야마
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린텍 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Table Devices Or Equipment (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
KR1020207015352A 2018-03-30 2018-10-02 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법 KR102576310B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-068725 2018-03-30
JP2018068725 2018-03-30
PCT/JP2018/036813 WO2019187249A1 (ja) 2018-03-30 2018-10-02 硬化封止体の反り防止用積層体、及び、硬化封止体の製造方法

Publications (2)

Publication Number Publication Date
KR20200138151A KR20200138151A (ko) 2020-12-09
KR102576310B1 true KR102576310B1 (ko) 2023-09-07

Family

ID=68059072

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207015352A KR102576310B1 (ko) 2018-03-30 2018-10-02 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법
KR1020207025463A KR20200136383A (ko) 2018-03-30 2019-03-28 점착성 적층체, 점착성 적층체의 사용 방법, 및 경화 수지막을 가지는 경화 봉지체의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207025463A KR20200136383A (ko) 2018-03-30 2019-03-28 점착성 적층체, 점착성 적층체의 사용 방법, 및 경화 수지막을 가지는 경화 봉지체의 제조 방법

Country Status (5)

Country Link
JP (2) JP7240378B2 (ja)
KR (2) KR102576310B1 (ja)
CN (2) CN111886309B (ja)
TW (2) TWI801426B (ja)
WO (2) WO2019187249A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115348997A (zh) * 2020-03-25 2022-11-15 大日本印刷株式会社 发泡性粘接片和物品的制造方法
JP7517341B2 (ja) 2020-07-31 2024-07-17 東レ株式会社 積層体の製造方法
JP2022107395A (ja) * 2021-01-08 2022-07-21 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物及び電子部品装置
CN113320255B (zh) * 2021-04-23 2023-06-02 刘显志 一种适用于有机固体废弃物堆肥发酵的聚氨酯层压复合膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005255829A (ja) 2004-03-11 2005-09-22 Nitto Denko Corp 加熱剥離型粘着シートおよび被着体の加工方法
JP2017092335A (ja) * 2015-11-13 2017-05-25 日東電工株式会社 半導体パッケージの製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594853A (ja) 1982-07-01 1984-01-11 Mitsubishi Electric Corp 太陽熱暖房給湯システム
US5750234A (en) * 1996-06-07 1998-05-12 Avery Dennison Corporation Interior automotive laminate with thermoplastic low gloss coating
JP3594853B2 (ja) 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2003264205A (ja) * 2002-03-08 2003-09-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP3804805B2 (ja) * 2004-05-17 2006-08-02 日東電工株式会社 加熱剥離型粘着シート
US7785938B2 (en) * 2006-04-28 2010-08-31 Semiconductor Energy Laboratory Co., Ltd Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
JP2009152490A (ja) * 2007-12-21 2009-07-09 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP4939574B2 (ja) * 2008-08-28 2012-05-30 日東電工株式会社 熱硬化型ダイボンドフィルム
JP5599157B2 (ja) * 2009-04-24 2014-10-01 株式会社きもと 粘着シート
CN102470652B (zh) * 2009-09-15 2016-03-16 三井化学株式会社 表面保护膜
JP2011102383A (ja) * 2009-10-14 2011-05-26 Nitto Denko Corp 熱硬化型ダイボンドフィルム
JP5589388B2 (ja) * 2010-01-06 2014-09-17 住友ベークライト株式会社 熱硬化性接着剤組成物および半導体装置
JP5681377B2 (ja) * 2010-04-20 2015-03-04 日東電工株式会社 半導体装置の製造方法、及び、フリップチップ型半導体装置
WO2011132648A1 (ja) * 2010-04-20 2011-10-27 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
JP2012184324A (ja) * 2011-03-04 2012-09-27 Nitto Denko Corp 薄膜基板固定用粘接着シート
WO2013011850A1 (ja) * 2011-07-15 2013-01-24 日東電工株式会社 電子部品の製造方法および該製造方法に用いる粘着シート
JP5937398B2 (ja) * 2012-03-26 2016-06-22 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP5937397B2 (ja) * 2012-03-26 2016-06-22 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
US9573164B2 (en) * 2013-03-15 2017-02-21 Akzo Nobel Coatings International B.V. Dry primer film composite and use thereof
WO2014157626A1 (ja) * 2013-03-28 2014-10-02 三菱化学株式会社 積層型半導体装置の層間充填材用の組成物、積層型半導体装置、および積層型半導体装置の製造方法
CN105482726B (zh) * 2014-09-17 2019-05-07 晟碟信息科技（上海）有限公司 切片胶带和剥离方法
TWI688633B (zh) * 2014-09-22 2020-03-21 日商琳得科股份有限公司 具有樹脂層的工件固定片
CN107075323A (zh) * 2014-11-13 2017-08-18 Dic株式会社 双面粘胶带、物品及分离方法
DE112016000628T5 (de) * 2015-02-06 2017-11-02 Asahi Glass Company, Limited Folie, Verfahren zu ihrer Herstellung und Verfahren zum Herstellen eines Halbleiter-Bauelements unter Verwendung der Folie
JP6471643B2 (ja) * 2015-08-06 2019-02-20 Ａｇｃ株式会社 ガラス積層体およびその製造方法
JP7220135B2 (ja) * 2018-11-01 2023-02-09 信越化学工業株式会社 積層体の製造方法、及び基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005255829A (ja) 2004-03-11 2005-09-22 Nitto Denko Corp 加熱剥離型粘着シートおよび被着体の加工方法
JP2017092335A (ja) * 2015-11-13 2017-05-25 日東電工株式会社 半導体パッケージの製造方法

Also Published As

Publication number Publication date
JPWO2019189530A1 (ja) 2021-04-01
KR20200136383A (ko) 2020-12-07
CN111886309A (zh) 2020-11-03
CN111902508B (zh) 2023-09-15
TW201942282A (zh) 2019-11-01
KR20200138151A (ko) 2020-12-09
JP7240378B2 (ja) 2023-03-15
WO2019189530A1 (ja) 2019-10-03
TWI801426B (zh) 2023-05-11
WO2019187249A1 (ja) 2019-10-03
JPWO2019187249A1 (ja) 2021-04-01
JP7340515B2 (ja) 2023-09-07
CN111902508A (zh) 2020-11-06
TWI835785B (zh) 2024-03-21
CN111886309B (zh) 2022-06-10
TW201941966A (zh) 2019-11-01

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