KR102480524B1 - 검사 장치의 제어 방법 및 검사 장치 - Google Patents
검사 장치의 제어 방법 및 검사 장치 Download PDFInfo
- Publication number
- KR102480524B1 KR102480524B1 KR1020200118336A KR20200118336A KR102480524B1 KR 102480524 B1 KR102480524 B1 KR 102480524B1 KR 1020200118336 A KR1020200118336 A KR 1020200118336A KR 20200118336 A KR20200118336 A KR 20200118336A KR 102480524 B1 KR102480524 B1 KR 102480524B1
- Authority
- KR
- South Korea
- Prior art keywords
- inspection
- aligner
- alignment
- substrate
- control unit
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
- G01R31/318511—Wafer Test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31907—Modular tester, e.g. controlling and coordinating instruments in a bus based architecture
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2019-173443 | 2019-09-24 | ||
JP2019173443A JP7458161B2 (ja) | 2019-09-24 | 2019-09-24 | 検査装置の制御方法および検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210035745A KR20210035745A (ko) | 2021-04-01 |
KR102480524B1 true KR102480524B1 (ko) | 2022-12-22 |
Family
ID=74880770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200118336A KR102480524B1 (ko) | 2019-09-24 | 2020-09-15 | 검사 장치의 제어 방법 및 검사 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11385286B2 (ja) |
JP (1) | JP7458161B2 (ja) |
KR (1) | KR102480524B1 (ja) |
CN (1) | CN112635341B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022149765A (ja) | 2021-03-25 | 2022-10-07 | サトーホールディングス株式会社 | 情報処理システム、情報処理装置、情報処理方法、及び、プログラム |
JP2023082554A (ja) | 2021-12-02 | 2023-06-14 | 株式会社東京精密 | 筐体及びプローバ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130057839A1 (en) * | 2011-09-05 | 2013-03-07 | Canon Kabushiki Kaisha | Lithography system and manufacturing method of commodities |
US20180275192A1 (en) * | 2015-09-30 | 2018-09-27 | Tokyo Electron Limited | Wafer Inspection Method and Wafer Inspection Device |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2501613B2 (ja) * | 1988-03-08 | 1996-05-29 | 東京エレクトロン株式会社 | ウエハプロ―バ |
JPH0682738B2 (ja) * | 1990-10-20 | 1994-10-19 | トーワ株式会社 | Icリードピンの外観検査方法および検査台 |
JPH0922927A (ja) * | 1995-07-05 | 1997-01-21 | Tokyo Electron Ltd | 位置決め装置および検査装置 |
JP3424011B2 (ja) * | 1997-11-19 | 2003-07-07 | 東京エレクトロン株式会社 | プローブ方法及びプローブ装置 |
JP4740405B2 (ja) * | 2000-11-09 | 2011-08-03 | 東京エレクトロン株式会社 | 位置合わせ方法及びプログラム記録媒体 |
EP1339100A1 (en) * | 2000-12-01 | 2003-08-27 | Ebara Corporation | Inspection method and apparatus using electron beam, and device production method using it |
JP4130101B2 (ja) * | 2002-07-25 | 2008-08-06 | 株式会社東京精密 | プローバ装置およびプローバ装置を備えた検査装置 |
JP2004200383A (ja) * | 2002-12-18 | 2004-07-15 | Tokyo Seimitsu Co Ltd | 位置合わせ方法 |
JP2004296921A (ja) * | 2003-03-27 | 2004-10-21 | Canon Inc | 位置検出装置 |
CN1820346B (zh) * | 2003-05-09 | 2011-01-19 | 株式会社荏原制作所 | 基于带电粒子束的检查装置及采用了该检查装置的器件制造方法 |
US7349575B2 (en) * | 2003-06-27 | 2008-03-25 | Nippon Avionics Co., Ltd. | Pattern inspection method and apparatus, and pattern alignment method |
JP4383945B2 (ja) * | 2004-04-06 | 2009-12-16 | キヤノン株式会社 | アライメント方法、露光方法、及び露光装置 |
JP4736821B2 (ja) * | 2006-01-24 | 2011-07-27 | 株式会社日立製作所 | パターン形成方法およびパターン形成装置 |
JP5137336B2 (ja) * | 2006-05-29 | 2013-02-06 | 株式会社日本マイクロニクス | 可動式プローブユニット機構及び電気検査装置 |
US7494830B2 (en) * | 2007-04-06 | 2009-02-24 | Taiwan Semiconductor Manufacturing Company | Method and device for wafer backside alignment overlay accuracy |
CN101779270B (zh) * | 2007-08-10 | 2013-06-12 | 株式会社尼康 | 基板贴合装置及基板贴合方法 |
JP2010245508A (ja) * | 2009-03-16 | 2010-10-28 | Micronics Japan Co Ltd | ウェハアライメント装置及びウェハアライメント方法 |
JP5456394B2 (ja) * | 2009-07-09 | 2014-03-26 | 国立大学法人神戸大学 | 複合半透膜 |
WO2011016096A1 (ja) * | 2009-08-07 | 2011-02-10 | 株式会社アドバンテスト | 試験装置および試験方法 |
JP2012204695A (ja) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法 |
JP6652361B2 (ja) * | 2015-09-30 | 2020-02-19 | 東京エレクトロン株式会社 | ウエハ検査装置及びウエハ検査方法 |
JP6827385B2 (ja) | 2017-08-03 | 2021-02-10 | 東京エレクトロン株式会社 | 検査システム |
-
2019
- 2019-09-24 JP JP2019173443A patent/JP7458161B2/ja active Active
-
2020
- 2020-09-11 US US17/018,128 patent/US11385286B2/en active Active
- 2020-09-14 CN CN202010959217.0A patent/CN112635341B/zh active Active
- 2020-09-15 KR KR1020200118336A patent/KR102480524B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130057839A1 (en) * | 2011-09-05 | 2013-03-07 | Canon Kabushiki Kaisha | Lithography system and manufacturing method of commodities |
US20180275192A1 (en) * | 2015-09-30 | 2018-09-27 | Tokyo Electron Limited | Wafer Inspection Method and Wafer Inspection Device |
Also Published As
Publication number | Publication date |
---|---|
JP2021052065A (ja) | 2021-04-01 |
US11385286B2 (en) | 2022-07-12 |
US20210088588A1 (en) | 2021-03-25 |
CN112635341B (zh) | 2024-07-19 |
JP7458161B2 (ja) | 2024-03-29 |
KR20210035745A (ko) | 2021-04-01 |
CN112635341A (zh) | 2021-04-09 |
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