KR102418431B1 - 팩토리 인터페이스에서 기판 캐리어를 퍼징하기 위한 시스템들, 장치, 및 방법들 - Google Patents
팩토리 인터페이스에서 기판 캐리어를 퍼징하기 위한 시스템들, 장치, 및 방법들 Download PDFInfo
- Publication number
- KR102418431B1 KR102418431B1 KR1020177014152A KR20177014152A KR102418431B1 KR 102418431 B1 KR102418431 B1 KR 102418431B1 KR 1020177014152 A KR1020177014152 A KR 1020177014152A KR 20177014152 A KR20177014152 A KR 20177014152A KR 102418431 B1 KR102418431 B1 KR 102418431B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- substrate carrier
- carrier
- nozzle arrays
- purging
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462068617P | 2014-10-24 | 2014-10-24 | |
US62/068,617 | 2014-10-24 | ||
PCT/US2015/057005 WO2016065200A1 (en) | 2014-10-24 | 2015-10-22 | Systems, apparatus, and methods for purging a substrate carrier at a factory interface |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170074975A KR20170074975A (ko) | 2017-06-30 |
KR102418431B1 true KR102418431B1 (ko) | 2022-07-07 |
Family
ID=55761591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177014152A KR102418431B1 (ko) | 2014-10-24 | 2015-10-22 | 팩토리 인터페이스에서 기판 캐리어를 퍼징하기 위한 시스템들, 장치, 및 방법들 |
Country Status (6)
Country | Link |
---|---|
US (2) | US10510570B2 (ja) |
JP (1) | JP6686014B2 (ja) |
KR (1) | KR102418431B1 (ja) |
CN (1) | CN107078080B (ja) |
TW (1) | TWI688026B (ja) |
WO (1) | WO2016065200A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016065200A1 (en) * | 2014-10-24 | 2016-04-28 | Applied Materials, Inc | Systems, apparatus, and methods for purging a substrate carrier at a factory interface |
JP6511783B2 (ja) * | 2014-11-21 | 2019-05-15 | Tdk株式会社 | ガスパージユニットおよびガスパージ装置 |
JP2017216383A (ja) * | 2016-06-01 | 2017-12-07 | Tdk株式会社 | ガスパージノズル及びフロントパージユニット |
JP6969645B2 (ja) * | 2016-06-01 | 2021-11-24 | Tdk株式会社 | ガスパージノズル及びフロントパージユニット |
US10269926B2 (en) * | 2016-08-24 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Purging deposition tools to reduce oxygen and moisture in wafers |
US10115607B2 (en) * | 2016-09-16 | 2018-10-30 | Applied Materials, Inc. | Method and apparatus for wafer outgassing control |
US10159169B2 (en) | 2016-10-27 | 2018-12-18 | Applied Materials, Inc. | Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods |
US10446428B2 (en) | 2017-03-14 | 2019-10-15 | Applied Materials, Inc. | Load port operation in electronic device manufacturing apparatus, systems, and methods |
WO2018203384A1 (ja) * | 2017-05-02 | 2018-11-08 | ミライアル株式会社 | 基板収納容器 |
KR102360219B1 (ko) | 2017-06-23 | 2022-02-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들 |
US10388547B2 (en) | 2017-06-23 | 2019-08-20 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for processing substrates |
US10872789B2 (en) * | 2017-09-28 | 2020-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer cooling system |
US10763134B2 (en) | 2018-02-27 | 2020-09-01 | Applied Materials, Inc. | Substrate processing apparatus and methods with factory interface chamber filter purge |
KR20200022682A (ko) * | 2018-08-23 | 2020-03-04 | 세메스 주식회사 | 버퍼 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법 |
US11244844B2 (en) | 2018-10-26 | 2022-02-08 | Applied Materials, Inc. | High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods |
US11373891B2 (en) * | 2018-10-26 | 2022-06-28 | Applied Materials, Inc. | Front-ducted equipment front end modules, side storage pods, and methods of operating the same |
JP6597875B2 (ja) * | 2018-12-07 | 2019-10-30 | Tdk株式会社 | ガスパージユニットおよびガスパージ装置 |
US20200207559A1 (en) * | 2018-12-28 | 2020-07-02 | Int Tech Co., Ltd. | Dust-free system and method of manufacturing panel |
FR3101001B1 (fr) * | 2019-09-25 | 2022-05-27 | Pfeiffer Vacuum | Station et procédé de nettoyage d’une enceinte de transport pour le convoyage et le stockage atmosphérique de substrats semi-conducteurs |
WO2021236552A1 (en) * | 2020-05-16 | 2021-11-25 | eLux Inc. | System and method for the selective harvest of emissive elements |
US11810805B2 (en) * | 2020-07-09 | 2023-11-07 | Applied Materials, Inc. | Prevention of contamination of substrates during gas purging |
US11545379B2 (en) * | 2020-07-31 | 2023-01-03 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing equipment |
KR102528195B1 (ko) * | 2020-12-16 | 2023-05-03 | 주식회사 싸이맥스 | 에어커튼 장치 |
KR102315216B1 (ko) * | 2021-05-13 | 2021-10-20 | 주식회사 엘에스텍 | 반도체 제조 설비용 에어 커튼 장치 |
US20230054047A1 (en) * | 2021-08-23 | 2023-02-23 | Brillian Network & Automation Integrated System Co., Ltd. | Purge controlling system |
KR20230120307A (ko) * | 2022-02-09 | 2023-08-17 | 주식회사 저스템 | Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101366135B1 (ko) * | 2013-10-10 | 2014-02-25 | 주식회사 엘에스테크 | 포스트 퍼지 장치 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3880343B2 (ja) | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | ロードポート、基板処理装置および雰囲気置換方法 |
US6899145B2 (en) * | 2003-03-20 | 2005-05-31 | Asm America, Inc. | Front opening unified pod |
JP4027837B2 (ja) | 2003-04-28 | 2007-12-26 | Tdk株式会社 | パージ装置およびパージ方法 |
JP4585514B2 (ja) * | 2004-06-21 | 2010-11-24 | 株式会社ライト製作所 | ロードポート |
JP4301456B2 (ja) * | 2005-11-30 | 2009-07-22 | Tdk株式会社 | 密閉容器の蓋開閉システム |
JP4278676B2 (ja) | 2005-11-30 | 2009-06-17 | Tdk株式会社 | 密閉容器の蓋開閉システム |
KR20070049138A (ko) * | 2007-01-16 | 2007-05-10 | 가부시키가이샤 라이트세이사쿠쇼 | 로드 포트 |
JP4309935B2 (ja) | 2007-07-31 | 2009-08-05 | Tdk株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
JP4264115B2 (ja) | 2007-07-31 | 2009-05-13 | Tdk株式会社 | 被収容物の処理方法及び当該方法に用いられる蓋開閉システム |
JP2012094720A (ja) * | 2010-10-27 | 2012-05-17 | Sony Corp | 固体撮像装置、半導体装置、固体撮像装置の製造方法、半導体装置の製造方法、及び電子機器 |
JP5494734B2 (ja) | 2011-08-15 | 2014-05-21 | Tdk株式会社 | パージ装置及び該パージ装置を有するロードポート装置 |
KR101294143B1 (ko) * | 2011-12-28 | 2013-08-08 | 우범제 | 웨이퍼 처리 장치 및 이를 이용한 웨이퍼 처리 방법 |
JP2013161924A (ja) | 2012-02-03 | 2013-08-19 | Tokyo Electron Ltd | 基板収容容器のパージ装置及びパージ方法 |
US20140157722A1 (en) * | 2012-12-04 | 2014-06-12 | Tdk Corporation | Lid opening/closing system for closed container, and substrate processing method using the same |
JP2015142008A (ja) | 2014-01-29 | 2015-08-03 | Tdk株式会社 | ロードポート装置 |
WO2016065200A1 (en) * | 2014-10-24 | 2016-04-28 | Applied Materials, Inc | Systems, apparatus, and methods for purging a substrate carrier at a factory interface |
-
2015
- 2015-10-22 WO PCT/US2015/057005 patent/WO2016065200A1/en active Application Filing
- 2015-10-22 CN CN201580056350.2A patent/CN107078080B/zh not_active Expired - Fee Related
- 2015-10-22 KR KR1020177014152A patent/KR102418431B1/ko active IP Right Grant
- 2015-10-22 US US14/920,785 patent/US10510570B2/en active Active
- 2015-10-22 JP JP2017522159A patent/JP6686014B2/ja active Active
- 2015-10-23 TW TW104134921A patent/TWI688026B/zh not_active IP Right Cessation
-
2019
- 2019-10-29 US US16/667,025 patent/US10903102B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101366135B1 (ko) * | 2013-10-10 | 2014-02-25 | 주식회사 엘에스테크 | 포스트 퍼지 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP6686014B2 (ja) | 2020-04-22 |
TWI688026B (zh) | 2020-03-11 |
KR20170074975A (ko) | 2017-06-30 |
JP2017535949A (ja) | 2017-11-30 |
CN107078080B (zh) | 2021-05-04 |
WO2016065200A1 (en) | 2016-04-28 |
US20160118279A1 (en) | 2016-04-28 |
US10903102B2 (en) | 2021-01-26 |
CN107078080A (zh) | 2017-08-18 |
US10510570B2 (en) | 2019-12-17 |
US20200066560A1 (en) | 2020-02-27 |
TW201618219A (zh) | 2016-05-16 |
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GRNT | Written decision to grant |