KR102408472B1 - 기판액 처리 방법 및 기판액 처리 장치 - Google Patents
기판액 처리 방법 및 기판액 처리 장치 Download PDFInfo
- Publication number
- KR102408472B1 KR102408472B1 KR1020170084066A KR20170084066A KR102408472B1 KR 102408472 B1 KR102408472 B1 KR 102408472B1 KR 1020170084066 A KR1020170084066 A KR 1020170084066A KR 20170084066 A KR20170084066 A KR 20170084066A KR 102408472 B1 KR102408472 B1 KR 102408472B1
- Authority
- KR
- South Korea
- Prior art keywords
- liquid
- substrate
- processing
- wafer
- rotation speed
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-134313 | 2016-07-06 | ||
JP2016134313A JP6765878B2 (ja) | 2016-07-06 | 2016-07-06 | 基板液処理方法及び基板液処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180005609A KR20180005609A (ko) | 2018-01-16 |
KR102408472B1 true KR102408472B1 (ko) | 2022-06-10 |
Family
ID=60949766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170084066A KR102408472B1 (ko) | 2016-07-06 | 2017-07-03 | 기판액 처리 방법 및 기판액 처리 장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6765878B2 (ja) |
KR (1) | KR102408472B1 (ja) |
CN (1) | CN107591345B (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010242A (ja) * | 2008-06-25 | 2010-01-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP2013201418A (ja) * | 2012-02-24 | 2013-10-03 | Ebara Corp | 基板処理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4901650B2 (ja) | 2007-08-31 | 2012-03-21 | 東京エレクトロン株式会社 | 液処理装置、液処理方法および記憶媒体 |
KR101447759B1 (ko) * | 2008-12-16 | 2014-10-06 | 도쿄엘렉트론가부시키가이샤 | 도포 처리 방법 및 도포 처리 장치 |
JP6223839B2 (ja) * | 2013-03-15 | 2017-11-01 | 東京エレクトロン株式会社 | 基板液処理方法、基板液処理装置および記憶媒体 |
JP6118758B2 (ja) * | 2014-05-01 | 2017-04-19 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
JP6341035B2 (ja) * | 2014-09-25 | 2018-06-13 | 東京エレクトロン株式会社 | 基板液処理方法、基板液処理装置、及び記憶媒体 |
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2016
- 2016-07-06 JP JP2016134313A patent/JP6765878B2/ja active Active
-
2017
- 2017-07-03 KR KR1020170084066A patent/KR102408472B1/ko active IP Right Grant
- 2017-07-05 CN CN201710543742.2A patent/CN107591345B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010242A (ja) * | 2008-06-25 | 2010-01-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP2013201418A (ja) * | 2012-02-24 | 2013-10-03 | Ebara Corp | 基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107591345A (zh) | 2018-01-16 |
JP6765878B2 (ja) | 2020-10-07 |
CN107591345B (zh) | 2023-04-18 |
KR20180005609A (ko) | 2018-01-16 |
JP2018006647A (ja) | 2018-01-11 |
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