KR102408472B1 - 기판액 처리 방법 및 기판액 처리 장치 - Google Patents

기판액 처리 방법 및 기판액 처리 장치 Download PDF

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Publication number
KR102408472B1
KR102408472B1 KR1020170084066A KR20170084066A KR102408472B1 KR 102408472 B1 KR102408472 B1 KR 102408472B1 KR 1020170084066 A KR1020170084066 A KR 1020170084066A KR 20170084066 A KR20170084066 A KR 20170084066A KR 102408472 B1 KR102408472 B1 KR 102408472B1
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KR
South Korea
Prior art keywords
liquid
substrate
processing
wafer
rotation speed
Prior art date
Application number
KR1020170084066A
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English (en)
Korean (ko)
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KR20180005609A (ko
Inventor
가즈키 고사이
다카히사 오츠카
가즈요시 시노하라
히로유키 스즈키
요스케 하치야
히로유키 히가시
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20180005609A publication Critical patent/KR20180005609A/ko
Application granted granted Critical
Publication of KR102408472B1 publication Critical patent/KR102408472B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020170084066A 2016-07-06 2017-07-03 기판액 처리 방법 및 기판액 처리 장치 KR102408472B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-134313 2016-07-06
JP2016134313A JP6765878B2 (ja) 2016-07-06 2016-07-06 基板液処理方法及び基板液処理装置

Publications (2)

Publication Number Publication Date
KR20180005609A KR20180005609A (ko) 2018-01-16
KR102408472B1 true KR102408472B1 (ko) 2022-06-10

Family

ID=60949766

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170084066A KR102408472B1 (ko) 2016-07-06 2017-07-03 기판액 처리 방법 및 기판액 처리 장치

Country Status (3)

Country Link
JP (1) JP6765878B2 (ja)
KR (1) KR102408472B1 (ja)
CN (1) CN107591345B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010242A (ja) * 2008-06-25 2010-01-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2013201418A (ja) * 2012-02-24 2013-10-03 Ebara Corp 基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901650B2 (ja) 2007-08-31 2012-03-21 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
KR101447759B1 (ko) * 2008-12-16 2014-10-06 도쿄엘렉트론가부시키가이샤 도포 처리 방법 및 도포 처리 장치
JP6223839B2 (ja) * 2013-03-15 2017-11-01 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP6118758B2 (ja) * 2014-05-01 2017-04-19 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP6341035B2 (ja) * 2014-09-25 2018-06-13 東京エレクトロン株式会社 基板液処理方法、基板液処理装置、及び記憶媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010242A (ja) * 2008-06-25 2010-01-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2013201418A (ja) * 2012-02-24 2013-10-03 Ebara Corp 基板処理方法

Also Published As

Publication number Publication date
CN107591345A (zh) 2018-01-16
JP6765878B2 (ja) 2020-10-07
CN107591345B (zh) 2023-04-18
KR20180005609A (ko) 2018-01-16
JP2018006647A (ja) 2018-01-11

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