KR102244425B1 - 반송 장치, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

반송 장치, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

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Publication number
KR102244425B1
KR102244425B1 KR1020180110836A KR20180110836A KR102244425B1 KR 102244425 B1 KR102244425 B1 KR 102244425B1 KR 1020180110836 A KR1020180110836 A KR 1020180110836A KR 20180110836 A KR20180110836 A KR 20180110836A KR 102244425 B1 KR102244425 B1 KR 102244425B1
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KR
South Korea
Prior art keywords
resin
holding member
tablet
gas
shaped
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KR1020180110836A
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English (en)
Korean (ko)
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KR20190058280A (ko
Inventor
신야 나카지마
마사아키 사자나미
다카시 다나베
후유히코 오가와
Original Assignee
토와 가부시기가이샤
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Publication of KR20190058280A publication Critical patent/KR20190058280A/ko
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Publication of KR102244425B1 publication Critical patent/KR102244425B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020180110836A 2017-11-21 2018-09-17 반송 장치, 수지 성형 장치 및 수지 성형품의 제조 방법 KR102244425B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017223512A JP6923423B2 (ja) 2017-11-21 2017-11-21 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JPJP-P-2017-223512 2017-11-21

Publications (2)

Publication Number Publication Date
KR20190058280A KR20190058280A (ko) 2019-05-29
KR102244425B1 true KR102244425B1 (ko) 2021-04-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180110836A KR102244425B1 (ko) 2017-11-21 2018-09-17 반송 장치, 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (4)

Country Link
JP (1) JP6923423B2 (zh)
KR (1) KR102244425B1 (zh)
CN (1) CN109808132B (zh)
TW (1) TWI706908B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110576569B (zh) * 2019-09-18 2022-01-11 江门市江海区长河塑胶厂有限公司 一种塑料瓶的包胶工艺
JP7121763B2 (ja) * 2020-02-14 2022-08-18 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7465843B2 (ja) * 2021-04-08 2024-04-11 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012187902A (ja) 2011-03-14 2012-10-04 Apic Yamada Corp 樹脂封止方法および樹脂封止装置
JP6212609B1 (ja) * 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752187A (ja) * 1993-08-10 1995-02-28 Fujitsu Miyagi Electron:Kk 半導体チップ樹脂封止装置
JP4037564B2 (ja) * 1999-07-14 2008-01-23 第一精工株式会社 半導体装置封止装置
JP3617803B2 (ja) * 2000-05-24 2005-02-09 東芝三菱電機産業システム株式会社 均熱装置
JP2002067071A (ja) * 2000-08-30 2002-03-05 Matsushita Electric Works Ltd 樹脂成型方法及び樹脂成型装置
JP2002127186A (ja) * 2000-10-25 2002-05-08 Matsushita Electric Works Ltd トランスファー成形装置用の材料供給装置
JP4153769B2 (ja) 2002-10-16 2008-09-24 第一精工株式会社 樹脂封止装置
WO2008073485A2 (en) * 2006-12-12 2008-06-19 Quantum Leap Packaging, Inc. Plastic electronic component package
JP4553944B2 (ja) * 2008-01-10 2010-09-29 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP5081267B2 (ja) * 2010-03-25 2012-11-28 パナソニック株式会社 回路部品内蔵モジュールおよび回路部品内蔵モジュールの製造方法
JP5411094B2 (ja) * 2010-08-27 2014-02-12 Ｔｏｗａ株式会社 樹脂封止済基板の冷却装置、冷却方法及び搬送装置、並びに樹脂封止装置
JP5953600B2 (ja) * 2011-08-12 2016-07-20 アピックヤマダ株式会社 樹脂供給装置、樹脂モールド装置および樹脂供給方法
JP5627619B2 (ja) * 2012-02-28 2014-11-19 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止体の製造方法
JP5985402B2 (ja) * 2013-01-08 2016-09-06 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
CN105283294B (zh) * 2013-05-29 2017-08-25 山田尖端科技株式会社 树脂模制装置和树脂模制方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012187902A (ja) 2011-03-14 2012-10-04 Apic Yamada Corp 樹脂封止方法および樹脂封止装置
JP6212609B1 (ja) * 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法

Also Published As

Publication number Publication date
JP6923423B2 (ja) 2021-08-18
CN109808132A (zh) 2019-05-28
TWI706908B (zh) 2020-10-11
CN109808132B (zh) 2021-06-08
KR20190058280A (ko) 2019-05-29
JP2019093593A (ja) 2019-06-20
TW201925064A (zh) 2019-07-01

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