KR102226222B1 - 레이저 가공 장치 - Google Patents

레이저 가공 장치 Download PDF

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Publication number
KR102226222B1
KR102226222B1 KR1020150124908A KR20150124908A KR102226222B1 KR 102226222 B1 KR102226222 B1 KR 102226222B1 KR 1020150124908 A KR1020150124908 A KR 1020150124908A KR 20150124908 A KR20150124908 A KR 20150124908A KR 102226222 B1 KR102226222 B1 KR 102226222B1
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KR
South Korea
Prior art keywords
processing
laser
dimensional image
laser beam
basic
Prior art date
Application number
KR1020150124908A
Other languages
English (en)
Korean (ko)
Other versions
KR20160030365A (ko
Inventor
주니치 구키
유사쿠 이토
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160030365A publication Critical patent/KR20160030365A/ko
Application granted granted Critical
Publication of KR102226222B1 publication Critical patent/KR102226222B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Dicing (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020150124908A 2014-09-09 2015-09-03 레이저 가공 장치 KR102226222B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-183552 2014-09-09
JP2014183552A JP6411822B2 (ja) 2014-09-09 2014-09-09 レーザー加工装置

Publications (2)

Publication Number Publication Date
KR20160030365A KR20160030365A (ko) 2016-03-17
KR102226222B1 true KR102226222B1 (ko) 2021-03-09

Family

ID=55358698

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150124908A KR102226222B1 (ko) 2014-09-09 2015-09-03 레이저 가공 장치

Country Status (7)

Country Link
US (1) US9895768B2 (zh)
JP (1) JP6411822B2 (zh)
KR (1) KR102226222B1 (zh)
CN (1) CN105397281B (zh)
DE (1) DE102015216858A1 (zh)
SG (1) SG10201506677UA (zh)
TW (1) TWI653112B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6870974B2 (ja) * 2016-12-08 2021-05-12 株式会社ディスコ 被加工物の分割方法
JP6898551B2 (ja) * 2017-03-31 2021-07-07 株式会社東京精密 レーザ加工装置及びレーザ加工方法
JP6898550B2 (ja) * 2017-03-31 2021-07-07 株式会社東京精密 レーザ加工装置及びレーザ加工方法
JP6866217B2 (ja) * 2017-04-21 2021-04-28 株式会社ディスコ 切削装置
JP6938212B2 (ja) 2017-05-11 2021-09-22 株式会社ディスコ 加工方法
JP6570592B2 (ja) * 2017-09-29 2019-09-04 株式会社牧野フライス製作所 工作機械の機上測定方法および制御装置
CN111347157B (zh) 2018-12-21 2023-04-28 松下知识产权经营株式会社 激光焊接装置以及激光焊接方法
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
JP7382762B2 (ja) * 2019-08-27 2023-11-17 株式会社ディスコ レーザー加工装置の加工結果の良否判定方法
CN113903676A (zh) * 2020-06-22 2022-01-07 长鑫存储技术有限公司 镭射机台自动化运行方法及***
JP7475782B2 (ja) * 2020-06-29 2024-04-30 株式会社ディスコ 加工装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286763A (ja) * 2005-03-31 2006-10-19 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
JP2009000928A (ja) * 2007-06-22 2009-01-08 Toshiba Corp レーザ割断装置及び基板の製造方法
JP2012026429A (ja) * 2010-07-27 2012-02-09 Ebara Corp インデューサ又は羽根車のキャビテーション挙動安定性を予測評価する方法
JP2012093166A (ja) * 2010-10-26 2012-05-17 Mitsutoyo Corp 干渉対物レンズユニット及び当該干渉対物レンズユニットを備えた光干渉測定装置
JP2013122396A (ja) * 2011-12-09 2013-06-20 Hitachi Ltd 配管応力算出方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3071758B2 (ja) * 1998-05-20 2000-07-31 ヤマザキマザック株式会社 ３次元レーザ加工機及び３次元レーザ加工機における加工プログラムの作成制御方法
WO2002051579A1 (de) * 2000-12-22 2002-07-04 Linde Aktiengesellschaft Prozessgas und verfahren zum laserbearbeiten
US20030160149A1 (en) * 2002-02-22 2003-08-28 Dwyer Patrick H. Method and apparatus for real time synchronous control of laser beams and multi-axis machines
JP2006289388A (ja) 2005-04-06 2006-10-26 Disco Abrasive Syst Ltd レーザー加工装置
JP5192213B2 (ja) * 2007-11-02 2013-05-08 株式会社ディスコ レーザー加工装置
JP6261844B2 (ja) * 2012-02-20 2018-01-17 株式会社ディスコ レーザー加工方法およびレーザー加工装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286763A (ja) * 2005-03-31 2006-10-19 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
JP2009000928A (ja) * 2007-06-22 2009-01-08 Toshiba Corp レーザ割断装置及び基板の製造方法
JP2012026429A (ja) * 2010-07-27 2012-02-09 Ebara Corp インデューサ又は羽根車のキャビテーション挙動安定性を予測評価する方法
JP2012093166A (ja) * 2010-10-26 2012-05-17 Mitsutoyo Corp 干渉対物レンズユニット及び当該干渉対物レンズユニットを備えた光干渉測定装置
JP2013122396A (ja) * 2011-12-09 2013-06-20 Hitachi Ltd 配管応力算出方法

Also Published As

Publication number Publication date
TWI653112B (zh) 2019-03-11
JP2016055314A (ja) 2016-04-21
US20160067819A1 (en) 2016-03-10
JP6411822B2 (ja) 2018-10-24
DE102015216858A1 (de) 2016-03-10
US9895768B2 (en) 2018-02-20
KR20160030365A (ko) 2016-03-17
TW201609296A (zh) 2016-03-16
CN105397281B (zh) 2019-08-16
SG10201506677UA (en) 2016-04-28
CN105397281A (zh) 2016-03-16

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