KR102130386B1 - 반도체 제조 장치 및 반도체 장치의 제조 방법 - Google Patents
반도체 제조 장치 및 반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR102130386B1 KR102130386B1 KR1020180105215A KR20180105215A KR102130386B1 KR 102130386 B1 KR102130386 B1 KR 102130386B1 KR 1020180105215 A KR1020180105215 A KR 1020180105215A KR 20180105215 A KR20180105215 A KR 20180105215A KR 102130386 B1 KR102130386 B1 KR 102130386B1
- Authority
- KR
- South Korea
- Prior art keywords
- die
- lighting device
- area
- illuminates
- center
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005286 illumination Methods 0.000 claims abstract description 53
- 238000003384 imaging method Methods 0.000 claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 76
- 238000007689 inspection Methods 0.000 claims description 55
- 238000012986 modification Methods 0.000 description 14
- 230000004048 modification Effects 0.000 description 14
- 238000012545 processing Methods 0.000 description 12
- 239000011295 pitch Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005282 brightening Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Die Bonding (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-178969 | 2017-09-19 | ||
JP2017178969A JP7010633B2 (ja) | 2017-09-19 | 2017-09-19 | 半導体製造装置および半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190032195A KR20190032195A (ko) | 2019-03-27 |
KR102130386B1 true KR102130386B1 (ko) | 2020-07-06 |
Family
ID=65770976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180105215A KR102130386B1 (ko) | 2017-09-19 | 2018-09-04 | 반도체 제조 장치 및 반도체 장치의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7010633B2 (zh) |
KR (1) | KR102130386B1 (zh) |
CN (1) | CN109524320B (zh) |
TW (1) | TWI678746B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7151642B2 (ja) * | 2019-06-28 | 2022-10-12 | 住友電気工業株式会社 | 面発光レーザ、その製造方法およびその検査方法 |
JP7377655B2 (ja) * | 2019-09-19 | 2023-11-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP7437987B2 (ja) * | 2020-03-23 | 2024-02-26 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
CN112992692B (zh) * | 2021-05-19 | 2021-07-20 | 佛山市联动科技股份有限公司 | 一种全自动切割引线的方法及*** |
JP2022182232A (ja) * | 2021-05-28 | 2022-12-08 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101431917B1 (ko) | 2012-12-27 | 2014-08-27 | 삼성전기주식회사 | 반도체 패키지의 검사장비 |
JP2017117916A (ja) | 2015-12-24 | 2017-06-29 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5538003A (en) * | 1978-09-08 | 1980-03-17 | Hitachi Ltd | Rectilinear pattern detecting device |
JP2003185593A (ja) | 2001-12-21 | 2003-07-03 | Nec Electronics Corp | ウェーハ外観検査装置 |
US20080024794A1 (en) | 2004-06-04 | 2008-01-31 | Yoko Miyazaki | Semiconductor Surface Inspection Apparatus and Method of Illumination |
TWI412736B (zh) * | 2009-12-04 | 2013-10-21 | Delta Electronics Inc | 基板內部缺陷檢查裝置及方法 |
US8766192B2 (en) * | 2010-11-01 | 2014-07-01 | Asm Assembly Automation Ltd | Method for inspecting a photovoltaic substrate |
WO2012081587A1 (ja) * | 2010-12-14 | 2012-06-21 | 株式会社ニコン | 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイス |
JP5277266B2 (ja) * | 2011-02-18 | 2013-08-28 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ及び半導体製造方法 |
JP2013197226A (ja) * | 2012-03-19 | 2013-09-30 | Hitachi High-Tech Instruments Co Ltd | ダイボンディング方法及びダイボンダ |
JP2014060249A (ja) * | 2012-09-18 | 2014-04-03 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ、および、ダイの位置認識方法 |
TWI570823B (zh) * | 2013-08-14 | 2017-02-11 | 新川股份有限公司 | 半導體製造裝置以及半導體裝置的製造方法 |
WO2016088721A1 (ja) * | 2014-12-05 | 2016-06-09 | 株式会社 アルバック | 基板監視装置、および、基板監視方法 |
JP6669523B2 (ja) * | 2016-02-15 | 2020-03-18 | ファスフォードテクノロジ株式会社 | ダイボンダおよび半導体装置の製造方法 |
JP6683500B2 (ja) * | 2016-02-24 | 2020-04-22 | 株式会社ディスコ | 検査装置及びレーザー加工装置 |
-
2017
- 2017-09-19 JP JP2017178969A patent/JP7010633B2/ja active Active
-
2018
- 2018-09-03 TW TW107130824A patent/TWI678746B/zh active
- 2018-09-04 KR KR1020180105215A patent/KR102130386B1/ko active IP Right Grant
- 2018-09-18 CN CN201811090665.0A patent/CN109524320B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101431917B1 (ko) | 2012-12-27 | 2014-08-27 | 삼성전기주식회사 | 반도체 패키지의 검사장비 |
JP2017117916A (ja) | 2015-12-24 | 2017-06-29 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN109524320B (zh) | 2023-03-24 |
TW201929113A (zh) | 2019-07-16 |
JP2019054203A (ja) | 2019-04-04 |
KR20190032195A (ko) | 2019-03-27 |
JP7010633B2 (ja) | 2022-01-26 |
TWI678746B (zh) | 2019-12-01 |
CN109524320A (zh) | 2019-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102130386B1 (ko) | 반도체 제조 장치 및 반도체 장치의 제조 방법 | |
TWI624887B (zh) | 半導體製造裝置及半導體裝置的製造方法 | |
KR102100889B1 (ko) | 다이 본딩 장치 및 반도체 장치의 제조 방법 | |
KR102219591B1 (ko) | 반도체 제조 장치 및 반도체 장치의 제조 방법 | |
JP7225337B2 (ja) | 半導体製造装置および半導体装置の製造方法 | |
JP7029900B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
CN113436986B (zh) | 芯片贴装装置及半导体器件的制造方法 | |
KR102304880B1 (ko) | 반도체 제조 장치 및 반도체 장치의 제조 방법 | |
TWI823297B (zh) | 黏晶裝置及半導體裝置的製造方法 | |
JP7502108B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
JP2023100562A (ja) | 半導体製造装置、検査装置および半導体装置の製造方法 | |
JP2023100561A (ja) | 半導体製造装置、検査装置および半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |