KR102058034B1 - 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛 - Google Patents

리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛 Download PDF

Info

Publication number
KR102058034B1
KR102058034B1 KR1020170163556A KR20170163556A KR102058034B1 KR 102058034 B1 KR102058034 B1 KR 102058034B1 KR 1020170163556 A KR1020170163556 A KR 1020170163556A KR 20170163556 A KR20170163556 A KR 20170163556A KR 102058034 B1 KR102058034 B1 KR 102058034B1
Authority
KR
South Korea
Prior art keywords
pin
substrate
head
unit
lift pin
Prior art date
Application number
KR1020170163556A
Other languages
English (en)
Korean (ko)
Other versions
KR20190064188A (ko
Inventor
박종범
Original Assignee
피에스케이홀딩스 (주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피에스케이홀딩스 (주) filed Critical 피에스케이홀딩스 (주)
Priority to KR1020170163556A priority Critical patent/KR102058034B1/ko
Priority to TW106145553A priority patent/TWI649832B/zh
Publication of KR20190064188A publication Critical patent/KR20190064188A/ko
Application granted granted Critical
Publication of KR102058034B1 publication Critical patent/KR102058034B1/ko

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020170163556A 2017-11-30 2017-11-30 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛 KR102058034B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170163556A KR102058034B1 (ko) 2017-11-30 2017-11-30 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛
TW106145553A TWI649832B (zh) 2017-11-30 2017-12-25 舉升銷單元及支撐基板的單元

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170163556A KR102058034B1 (ko) 2017-11-30 2017-11-30 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛

Publications (2)

Publication Number Publication Date
KR20190064188A KR20190064188A (ko) 2019-06-10
KR102058034B1 true KR102058034B1 (ko) 2019-12-20

Family

ID=66213818

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170163556A KR102058034B1 (ko) 2017-11-30 2017-11-30 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛

Country Status (2)

Country Link
KR (1) KR102058034B1 (zh)
TW (1) TWI649832B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102504269B1 (ko) * 2021-11-11 2023-02-28 피에스케이 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
US12062525B2 (en) 2021-11-11 2024-08-13 Psk, Inc. Support unit, and apparatus for treating substrate with the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220305601A1 (en) * 2019-06-19 2022-09-29 Lam Research Corporation Use of vacuum during transfer of substrates
TW202142733A (zh) * 2020-01-06 2021-11-16 荷蘭商Asm Ip私人控股有限公司 反應器系統、抬升銷、及處理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100666764B1 (ko) 2001-10-16 2007-01-09 동경 엘렉트론 주식회사 피처리체 승강기구 및 이를 사용한 처리장치
JP2007208054A (ja) 2006-02-02 2007-08-16 Ulvac Japan Ltd 静電気除去装置及び静電気除去方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4919971B2 (ja) * 2005-12-28 2012-04-18 シャープ株式会社 プラズマ処理装置及びプラズマ処理装置を用いて製造された表示パネル用基板
US20090314211A1 (en) * 2008-06-24 2009-12-24 Applied Materials, Inc. Big foot lift pin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100666764B1 (ko) 2001-10-16 2007-01-09 동경 엘렉트론 주식회사 피처리체 승강기구 및 이를 사용한 처리장치
JP2007208054A (ja) 2006-02-02 2007-08-16 Ulvac Japan Ltd 静電気除去装置及び静電気除去方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102504269B1 (ko) * 2021-11-11 2023-02-28 피에스케이 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
WO2023085662A1 (ko) * 2021-11-11 2023-05-19 피에스케이 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
US12062525B2 (en) 2021-11-11 2024-08-13 Psk, Inc. Support unit, and apparatus for treating substrate with the same

Also Published As

Publication number Publication date
KR20190064188A (ko) 2019-06-10
TW201926537A (zh) 2019-07-01
TWI649832B (zh) 2019-02-01

Similar Documents

Publication Publication Date Title
JP7245881B2 (ja) 基板処理装置
TWI573218B (zh) Reaction chamber and semiconductor processing device
TWI428188B (zh) 液體處理裝置
JP5312923B2 (ja) 基板処理装置
KR102058034B1 (ko) 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛
JP7320874B2 (ja) 基板処理装置及び基板処理方法
US20150323250A1 (en) Substrate processing apparatus, deposit removing method of substrate processing apparatus and recording medium
KR102444876B1 (ko) 기판 처리 장치
JP2008066339A (ja) 半導体装置の製造装置
KR101939225B1 (ko) 배플 어셈블리 및 이를 갖는 기판 처리 장치
TWI545671B (zh) 基板冷卻單元及基板處理設備
KR101399904B1 (ko) 기판 세정장치
US11139152B2 (en) Substrate processing apparatus
TWI686885B (zh) 升降銷總成、具有升降銷總成之基板處理裝置及用於將一基板與該基板安放於其上之一基板支撐件分離之方法
TWI794668B (zh) 對準裝置以及包括該對準裝置的基板處理裝置
CN107851571B (zh) 基板处理方法及基板处理装置
JP3915314B2 (ja) 枚葉式の処理装置
JP3162272B2 (ja) プラズマ処理方法
KR102334531B1 (ko) 기판 처리 장치 및 기판 처리 방법
TWI555075B (zh) 基板處理設備及基板處理方法
KR102212998B1 (ko) 기판 처리 장치
KR20150116003A (ko) 기판 처리 장치, 기판 처리 설비, 그리고 기판 처리 방법
KR20210039526A (ko) 기판 처리 장치 및 기판 처리 방법
KR101461060B1 (ko) 기판 처리 장치 및 방법
KR102548570B1 (ko) 기판 처리 장치 및 도어 어셈블리 구동 방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant