KR101744149B1 - Apparatus for inspecting substrate - Google Patents

Apparatus for inspecting substrate Download PDF

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Publication number
KR101744149B1
KR101744149B1 KR1020160023119A KR20160023119A KR101744149B1 KR 101744149 B1 KR101744149 B1 KR 101744149B1 KR 1020160023119 A KR1020160023119 A KR 1020160023119A KR 20160023119 A KR20160023119 A KR 20160023119A KR 101744149 B1 KR101744149 B1 KR 101744149B1
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South Korea
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light
substrate
transmitting substrate
optical axis
pattern
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KR1020160023119A
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Korean (ko)
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이제선
이영우
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이영우
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/201—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials by measuring small-angle scattering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/205—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials using diffraction cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The present invention relates to a substrate inspection apparatus for inspecting defects of a light transmitting substrate having a lower pattern disposed on a lower side thereof, and includes a camera, an illumination unit, a pattern image removing member, and a reflection member. The camera captures defects located on the light-transmissive substrate. The illumination unit is coaxially installed on the optical axis of the camera, and irradiates the light toward the light-transmissible substrate at an angle to the light-transmissive substrate. The pattern image removing member is disposed on the upper side of the light transmitting substrate and away from the optical axis of the illumination unit. The pattern image removing member is coupled to the lower surface of the light reflecting surface and has a reflectivity higher than that of the light transmitting substrate. And a light beam cross section for blocking light emitted from the light source. The reflecting member reflects the light reflected by the light reflecting surface and the light transmitting substrate back to the light reflecting surface and the light transmitting substrate.

Description

Apparatus for inspecting substrate

The present invention relates to a substrate inspection apparatus, and more particularly, to a substrate inspection apparatus for removing an image of a lower pattern that may cause an error in inspection results in the process of inspecting defects located on a light-transmissive substrate.

In the display panel, defects such as scratches and protrusions may occur on the surface of the substrate in the manufacturing process or the handling process. The substrate is inspected for defects through inspection using not only a visual inspection but also a substrate inspection apparatus including a camera and an optical system.

Conventionally, a defect inspection for a glass substrate was carried out separately before a glass substrate, a color filter substrate and a thin film transistor substrate were bonded together, and the glass substrate containing defects was subjected to defective treatment. However, in recent years, there has been an increasing demand for defect inspection placed on a glass substrate in a state in which a glass substrate, a color filter substrate, and a thin film transistor substrate are bonded together in order to simplify the process and meet the requirements for making the display panel thinner.

FIG. 1 is a view schematically showing an example of a conventional substrate inspecting apparatus, and FIG. 2 is a view schematically showing an image taken by the substrate inspecting apparatus of FIG.

1 and 2, a pattern substrate 12 on which a pattern 3 is formed is disposed under the glass substrate 11, and the pattern substrate 12 may be a color filter substrate, a thin film transistor substrate, or the like.

The conventional substrate inspecting apparatus includes a camera 21 for photographing defects located on a glass substrate 11, a lens 21 for detecting the position of the light L1, which is coaxially installed on the optical axis LA of the camera, And a reflecting member 23 for reflecting the light reflected by the glass substrate 11 and incident on the glass substrate 11. [ It is possible to detect defects on the glass substrate 11 by acquiring images of the glass substrate 11 and the pattern substrate 12. [

However, when the conventional substrate inspecting apparatus is used, the pattern 3 formed on the pattern substrate 12 and the defects 1 and 2 located on the glass substrate 11 are overlapped and displayed on one image, (1, 2) located on the substrate 11 can not be properly detected.

That is, light L2 reflected by the upper surface 11a of the glass substrate 11, light L3 transmitted through the glass substrate 11 and reflected by the lower surface 11b of the glass substrate 11, All of the light L3 reflected by the glass substrate 12 is incident on the camera 21 again so that the defects 1 located on the upper surface 11a of the glass substrate as shown in the defect detection image A1 shown in FIG. The defects 2 located on the lower surface 11b of the substrate and the pattern 3 formed on the pattern substrate 12 are all displayed in one defect detection image A1.

In this case, the pattern 3 in the defect detection image A1 forms the background, and the discrimination force for the defect 1 on the upper surface of the glass substrate and the defect 2 on the lower surface of the glass substrate are remarkably reduced, There is a problem that frequent errors are generated in the defect detection.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve such conventional problems, and it is an object of the present invention to provide a defect inspection apparatus and a defect inspection method thereof, which can prevent light reflected from a lower pattern disposed under a light- And inserting a sufficient amount of light into the camera, thereby improving the inspection accuracy of a defect located in the light-transmitting substrate.

In order to achieve the above object, a substrate inspection apparatus of the present invention is a substrate inspection apparatus for inspecting defects of a light-transmitting substrate having a lower pattern disposed on a lower side thereof, and a camera for photographing a defect located on the light- ; An illumination unit that is coaxially installed on an optical axis of the camera and irradiates light toward the light-transmitting substrate with a predetermined angle with respect to the light-transmitting substrate; A light-reflecting surface which is disposed above the light-transmitting substrate and is away from the optical axis of the illumination portion, the light-reflecting surface having a reflectance greater than that of the light-transmitting substrate; A pattern image removing member having a light section that blocks reflected light; A reflecting member for reflecting the light reflected from the light reflecting surface and the light transmitting substrate to the light reflecting surface and the light transmitting substrate; And a method of inspecting a defect located on the upper surface of the light-transmitting substrate or a method of inspecting a defect located on the upper and lower surfaces of the light-transmitting substrate, And a linear motion unit for linearly moving the pattern image removing member in a direction away from the optical axis, wherein the light reflected by the lower pattern is blocked by the light cross section and is not incident on the reflecting member, An image of the lower pattern disposed on the lower side of the light transmitting substrate is removed from the image and only the image of the defect located on the light transmitting substrate is displayed and an end portion of the light emitting section adjacent to the optical axis on the light receiving section is reflected by the light reflecting surface And the light guide plate is formed so as to protrude from an end portion of the illumination portion adjacent to the optical axis toward the optical axis of the illumination portion And that is characterized.

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In the substrate inspection apparatus according to the present invention, the reflection member may include a retroreflector.

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The substrate inspection apparatus according to the present invention may further include a tilting member that includes a reflection mirror and adjusts an angle of the reflection mirror so that light incident on the reflection mirror can be directed to the light reflection surface .

According to the substrate inspection apparatus of the present invention, it is possible to improve the inspection accuracy of defects located on the light-transmitting substrate.

Further, according to the substrate inspection apparatus of the present invention, it is possible to minimize the loss of light quantity and sufficiently secure the amount of light required to acquire a defect detection image.

Further, according to the substrate inspection apparatus of the present invention, various inspection conditions such as a method of inspecting defects located on the upper surface of the light-transmitting substrate, a method of inspecting defects located on the upper surface and lower surface of the light-transmitting substrate, and the like can be set.

Further, according to the substrate inspection apparatus of the present invention, it is possible to completely remove the noise image generated by the end portion of the light reflection surface.

1 is a view schematically showing an example of a conventional substrate inspection apparatus,
FIG. 2 is a view schematically showing an image taken by the substrate inspection apparatus of FIG. 1,
3 is a schematic view of a substrate inspection apparatus according to an embodiment of the present invention,
FIG. 4 is a view schematically showing an image taken by the substrate inspection apparatus of FIG. 2,
Fig. 5 is a view showing a state in which the pattern image removing member of the substrate inspection apparatus of Fig. 3 is linearly moved,
FIG. 6 is a view schematically showing an image taken by the substrate inspection apparatus of FIG. 5; FIG.

Hereinafter, embodiments of a substrate inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a view schematically showing a substrate inspection apparatus according to an embodiment of the present invention, FIG. 4 is a view schematically showing an image taken by the substrate inspection apparatus of FIG. 2, FIG. 6 is a view schematically showing an image taken by the substrate inspection apparatus of FIG. 5; FIG. 6 is a view showing a state in which the pattern image removing member of the substrate inspection apparatus is linearly moved;

3 to 6, the substrate inspection apparatus 100 according to the present embodiment removes an image of a lower pattern that may cause an error in the inspection result in the process of inspecting defects located on the transparent substrate, A camera 110, an illumination unit 120, a pattern image removal member 130, a reflection member 140, and a linear motion unit (not shown).

The light-transmissive substrate 11 on which the defects 1 and 2 are inspected by the substrate inspection apparatus 100 of the present invention may be a glass substrate or a plastic substrate. The pattern substrate 12 on which the lower pattern 3 is formed may be a color filter substrate, a thin film transistor substrate, or the like. A case where the lower pattern 3 disposed on the lower side of the light-transmitting substrate 11 is formed on the pattern substrate 12 will be described as an example.

The camera 110 photographs the defects (1, 2) located on the light-transmissive substrate 11.

The light reflected by the light transmitting substrate 11 and the light reflecting surface 131 is incident on the camera 110 and images the defects 1,2 located on the light transmitting substrate 11 using the incident light. It is possible to identify the defects 1,2 which may exist in the light-transmitting substrate 11 in the obtained image, using the difference of the gray-level due to the difference in the amount of incident light.

A line camera may be used as the camera 110 of the present embodiment, and various image capturing means used in the substrate inspecting apparatus may be used.

The illumination unit 120 irradiates the light L1 toward the light-transmissive substrate 11.

The illumination unit 120 may use an LED light source and may be disposed coaxially with the entrance of the camera 110 so that the optical axis LA of the camera 110 and the optical axis LA of the illumination unit 120 coincide with each other do. The optical axis LA of the illumination unit 120 is disposed at an angle to the light transmitting substrate 11 so that the light L1 irradiated by the illumination unit 120 is incident on the light transmitting substrate 11 in an oblique direction.

The pattern image removing member 130 is disposed above the light transmitting substrate 11 from the optical axis LA of the illumination unit and has a light reflecting surface 131 and a light receiving surface 132.

The light reflection surface 131 is provided at an upper portion of the pattern image removing member 130 and reflects the light L1 incident from the illumination unit 120 to the reflection member 140 and reflects the light incident from the reflection member 140 again And reflects it to the camera 110. The light reflection surface 131 has a reflectivity higher than that of the light-transmissive substrate 11, and a metal surface, a mirror surface, or the like can be used.

The light-receiving surface 132 is coupled to the lower portion of the light-reflecting surface 131 and shields the light reflected by the pattern substrate 12 through the light-transmitting substrate 11.

The structure and function of the pattern image removing member 130 will be described with reference to FIGS. 3 and 4, for example, in the case of inspecting the defect 1 located on the top surface of the transparent substrate 11. FIG.

A part of the light L1 irradiated from the illumination unit 120 is reflected on the upper surface of the light transmitting substrate 11 and the remaining part of the light L1 irradiated from the illumination unit is transmitted through the light transmitting substrate 11 . A part of the light transmitted through the light-transmitting substrate 11 is reflected by the lower surface of the light-transmitting substrate 11 (L3), and the remaining part of the light transmitted through the light-transmitting substrate 11 is incident on the pattern substrate 12 . The light incident on the pattern substrate 12 is reflected by the surface of the pattern substrate 12 (L4).

When the light L3 reflected by the lower surface of the light transmitting substrate 11 and the light L4 reflected by the surface of the pattern substrate 12 are both incident on the reflecting member 140 without being blocked, The defect 1 located on the upper surface of the light-transmitting substrate 11, the defect 2 located on the lower surface of the light-transmitting substrate 11 and the lower pattern 3 of the pattern substrate 12 The displayed defect detection image A1 can be obtained by the camera 110. [

In this case, the discrimination power for the defect 1 on the upper surface of the light-transmissive substrate 11 is remarkably reduced due to the lower pattern 3 in the defect detection image A1, and the defect 1 located on the upper surface of the light- There is a problem that frequent errors occur.

3, the pattern image removing member 130 of the present embodiment includes light L3 reflected at the lower surface of the light-transmissive substrate 11 and light L4 reflected at the surface of the pattern substrate 12, As shown in Fig.

When the light L3 reflected from the lower surface of the light transmitting substrate 11 and the light L4 reflected from the surface of the pattern substrate 12 are blocked by the light receiving end face 132 and are not incident on the reflecting member 140 The camera 110 can acquire the defect detection image A2 in which only the defect 1 positioned on the upper surface of the transparent substrate 11 is displayed as shown in Fig. 4 (b).

The image for the lower pattern 3 on the defect detection image A2 and the defect 2 on the lower surface of the light transmitting substrate are removed so that the discriminating power for the defect 1 on the upper surface of the transparent substrate 11 is remarkably improved .

In addition, the amount of light required to acquire an image from the camera 110 can be sufficiently secured due to the light reflecting surface 131 provided on the pattern image removing member 130.

First, if the reflectivity of the light-transmissive substrate 11 is not high, it is difficult to secure the amount of light required to acquire a defect detection image with the light reflected from the light-transmissive substrate 11. Thus, by providing the light reflection surface 131 having a reflectance higher than that of the light-transmissive substrate 11 above the pattern image removing member 130, the light from the illumination unit 120 can be emitted to the camera 110 while minimizing light loss. As shown in FIG. Therefore, the amount of light required to acquire the defect detection image A2 can be sufficiently secured.

Secondly, the light L3 reflected from the lower surface of the light-transmitting substrate 11 and the light L4 reflected from the surface of the pattern substrate 12 are blocked by the pattern image removing member 130. The light L2 reflected from the upper surface of the light transmitting substrate is reflected by the reflecting member 140 and is incident on the pattern image removing member 130. When the light is blocked by the pattern image removing member 130, The amount of incident light is significantly reduced. In this case, the amount of light required to acquire the defect detection image A2 is insufficient, and the defect detection image A2 is entirely darkened, so that the defect 1 can not be identified.

The pattern image removing member 130 of the present embodiment is provided with the light reflection surface 131 so that the light reflected by the reflection member 140 and then incident on the light reflection surface 131 can be reflected and the light reflection surface 131 Is again incident on the camera 110, it is possible to secure a sufficient amount of light necessary for obtaining a clear defect detection image A2.

On the other hand, the end portion 132a adjacent to the optical axis LA of the illuminating portion on the light-receiving surface 132 protrudes from the light reflecting surface 131 toward the optical axis LA of the illumination portion from the end portion 131a adjacent to the optical axis LA of the illumination portion Or the like.

If the end portion 132a of the light-receiving surface 132 and the end portion 131a of the light-reflecting surface 131 are coincident with each other, a part of the light L3 reflected by the lower surface of the light- Some of the light L4 reflected from the surface of the light emitting surface 131 may not be blocked by the light receiving surface 132 but may be scattered by the end 131a of the light reflecting surface 131, So that noise can be generated.

Therefore, the end portion 132a of the light-receiving surface 132 is formed to protrude from the end portion 131a of the light-reflecting surface 131 toward the optical axis LA of the illumination portion, L3 reflected from the surface of the pattern substrate 12 and the light L4 reflected from the surface of the pattern substrate 12 are prevented from being directed to the end 131a of the light reflection surface 131 to generate a noise image generated by the end 131a of the light reflection surface 131 It can be completely removed.

The reflection member 140 reflects the light reflected by the light reflection surface 131 and the light transmission substrate 11 back to the light reflection surface 131 and the light transmission substrate 11.

A part of the light irradiated from the illumination unit 120 is reflected by the transparent substrate 11 and is incident on the reflection member 140 and another part of the light emitted from the illumination unit 120 is reflected by the reflection surface 131, 140, respectively. The light incident on the reflecting member 140 is reflected by the light reflecting surface 131 and the light transmitting substrate 11 and the light incident on the light reflecting surface 131 and the light transmitting substrate 11 is reflected by the light reflecting surface 131 and light It may be reflected by the transparent substrate 11 and incident on the camera 110 again.

The reflective member 140 of this embodiment may use a retroreflector that reflects light in the same direction as the incident direction, but a reflective mirror may also be used.

As described above, in the substrate inspection apparatus 100 of the present embodiment, the light L4 reflected by the lower pattern 3 is blocked by the light-receiving end face 132 and is not incident on the reflecting member 140, The light reflected by the light-transmissive substrate 11 is incident on the camera 110. The image of the lower pattern 3 disposed on the lower side of the light transmitting substrate 11 is removed from the image for inspecting the defect and only the defect 1 located on the upper surface of the light transmitting substrate 11 is displayed on the image The discrimination power of defects can be improved.

When a reflecting mirror is used as the reflecting member 140, a tilting member (not shown) capable of adjusting the angle of the reflecting mirror can be added. The angle of the reflection mirror can be adjusted using a tilting member so that the light incident on the reflection mirror can be directed to the light reflection surface 131 again without loss of light according to the principle that the incident angle and the reflection angle become the same in the reflection mirror. This can maximize optical efficiency.

In addition, even if a tilting member capable of adjusting the angle of the reflection mirror is not used, the same effect as described above can be obtained by finely adjusting the inclination of the pattern image removing member 130.

The linear motion unit (not shown) linearly moves the pattern image removal member 130 in a direction approaching the optical axis LA of the illumination unit or away from the optical axis LA of the illumination unit.

The configuration and function of the linear motion unit will be described with reference to FIGS. 5 and 6, taking as an example the case of inspecting the defects 1,2 on the upper and lower surfaces of the transparent substrate 11. FIG.

When the pattern image removing member 130 is disposed at the position shown in FIG. 3, the light L3 reflected by the lower surface of the light-transmitting substrate 11 and the light L4 reflected by the surface of the pattern substrate 12, It is possible to acquire the defect detection image A2 in which only the defect 1 located on the upper surface of the transparent substrate 11 is displayed by the light-receiving surface 132 being blocked by the light-

5, when the pattern image removing member 130 is moved a predetermined distance to the left, only the light L4 reflected from the surface of the pattern substrate 12 is blocked by the light-receiving end face 132, The light L2 reflected from the upper surface of the light transmitting substrate 11 and the light L3 reflected from the lower surface of the light transmitting substrate 11 may be incident on the reflecting member 140. [

6 (b), the defect 1 located on the upper surface of the transparent substrate 11 and the defect 2 located on the lower surface of the transparent substrate 11 are displayed in the defect detection state The image A3 can be acquired by the camera 110. [ Since the image of the lower pattern 3 is removed from the defect detection image A3, the discrimination power for the defects 1,2 on the upper surface and the lower surface of the transparent substrate 11 can be remarkably improved.

As described above, the linear motion unit is a method of inspecting the defect 1 located on the upper surface of the light-transmitting substrate 11 or a method of inspecting the defects 1, 2 located on the upper and lower surfaces of the light- The pattern image removing member 130 can be linearly moved.

The linear motion unit of the present embodiment may be implemented by a combination of a pneumatic cylinder operated by air pressure, a combination of a rotary motor and a ball screw, a combination of a linear motor and a linear guide member, or a manual transfer structure using a screw principle And these configurations will be apparent to those skilled in the art, so that detailed description thereof will be omitted.

In this embodiment, either the method of inspecting the defect 1 located on the upper surface of the transparent substrate 11 or the method of inspecting the defects 1 and 2 located on the upper surface and the lower surface of the transparent substrate 11 The pattern image removing member 130 may be rotated while rotating the pattern image removing member 130 by using the rotation unit. The pattern image removing member 130 may include a linear motion unit for linearly moving the pattern image removing member 130, May be changed.

The substrate inspecting apparatus according to this embodiment configured as described above blocks light reflected from a lower pattern disposed on the lower side of the light transmitting substrate and removes a lower pattern image from the defect detecting image, It is possible to obtain an effect of improving the inspection accuracy of defects.

Further, the substrate inspecting apparatus according to this embodiment configured as described above can provide a light reflection surface on the pattern image removing member, thereby minimizing the loss of the light amount and sufficiently securing the light amount necessary for acquiring the defect detection image Can be obtained.

The substrate inspecting apparatus according to the present embodiment configured as described above is provided with a linear motion unit for linearly moving the pattern image removing member so that a method of inspecting defects located on the upper surface of the light transmitting substrate, It is possible to set various inspection conditions such as a method of inspecting defects located on the upper and lower surfaces.

In addition, the substrate inspecting apparatus according to the present embodiment configured as described above is formed such that the end portion of the light-receiving end surface adjacent to the optical axis of the illumination portion is protruded from the end portion of the light incidence surface. Thus, the noise image generated by the end portion of the light- It is possible to obtain an effect that can be removed.

The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

100: substrate inspection apparatus
110: camera
120:
130: pattern image removal member
140: reflective member

Claims (6)

A substrate inspection apparatus for inspecting a defect in a light-transmitting substrate having a lower pattern disposed on a lower side thereof,
A camera for photographing a defect located on the light-transmitting substrate;
An illumination unit that is coaxially installed on an optical axis of the camera and irradiates light toward the light-transmitting substrate with a predetermined angle with respect to the light-transmitting substrate;
A light-reflecting surface which is disposed above the light-transmitting substrate and is away from the optical axis of the illumination portion, the light-reflecting surface having a reflectance greater than that of the light-transmitting substrate; A pattern image removing member having a light section that blocks reflected light;
A reflecting member for reflecting the light reflected from the light reflecting surface and the light transmitting substrate to the light reflecting surface and the light transmitting substrate; And
Transmitting substrate and a method of inspecting defects located on the upper surface and the lower surface of the light-transmitting substrate, the method comprising the steps of: bringing an optical axis of the illuminating unit closer to an optical axis of the illuminating unit, And a linear motion unit for linearly moving the pattern image removing member in a direction away from the pattern image removing member,
Wherein the light reflected by the lower pattern is blocked by the light-receiving surface and is not incident on the reflective member, the image of the lower pattern disposed on the lower side of the transparent substrate is removed from the image for inspecting the defect, Only the image of the defect located at the position of the defect is displayed,
Wherein an end portion of the light section adjacent to the optical axis of the light section is formed to protrude from the light reflection surface toward an optical axis of the illumination section rather than an end adjacent to the optical axis of the illumination section. delete delete The method according to claim 1,
Wherein the reflective member comprises a retroreflector. delete The method according to claim 1,
Wherein the reflective member comprises a reflective mirror,
Further comprising a tilting member for adjusting the angle of the reflection mirror so that light incident on the reflection mirror can be directed to the light reflection surface.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117747467A (en) * 2024-02-01 2024-03-22 无锡卓海科技股份有限公司 Defect detection device of wafer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496913B1 (en) * 1996-12-24 2005-09-30 에이에스엠엘 네델란즈 비.브이. Optical height measuring instrument, surface inspection apparatus provided with the height measuring instrument and lithography apparatus provided with the inspection apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496913B1 (en) * 1996-12-24 2005-09-30 에이에스엠엘 네델란즈 비.브이. Optical height measuring instrument, surface inspection apparatus provided with the height measuring instrument and lithography apparatus provided with the inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117747467A (en) * 2024-02-01 2024-03-22 无锡卓海科技股份有限公司 Defect detection device of wafer

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