KR101733531B1

KR101733531B1 - A heat dissipation system having a heat dissipation tube of a multilayer structure film

Info

Publication number: KR101733531B1
Application number: KR1020150137288A
Authority: KR
Inventors: 안성준; 김정훈; 김덕관
Original assignee: 아리투스주식회사
Priority date: 2015-09-30
Filing date: 2015-09-30
Publication date: 2017-05-08
Also published as: KR20170038229A

Abstract

The present invention relates to a heat dissipation system having a heat dissipation tube of a multilayer structure film, and more particularly, to a heat dissipation system using a multilayer structure of a film to minimize contact resistance, maximize heat dissipation effect, To a heat dissipation tube capable of coping with various electronic devices.
The present invention has the following effects.
In other words, by expanding the heat radiation tube in the endothermic process, it is possible to minimize the contact resistance by increasing the degree of adhesion with the heat source and maximize heat dissipation performance by being able to transfer heat in multiple directions. In addition, Can respond accordingly. In addition, due to the nature of the material, it is easy to manufacture and the production cost can be lowered compared with the heat dissipation parts of the conventional metal containers.

Description

A heat dissipation system having a heat dissipation tube of a multi-

The present invention relates to a heat dissipation system having a heat dissipation tube of a multilayer structure film, and more particularly, to a heat dissipation system using a multilayer structure of a film to minimize contact resistance, maximize heat dissipation effect, To a heat dissipation tube capable of coping with various electronic devices.

The performance required in electronic devices is increased, but as the thickness is thinner, the heat generated by the device is rapidly increasing. Such heat generation is accompanied with a malfunction of the device and a life span is rapidly lowered, and measures for heat radiation are urgently required.

For example, in the case of a smart phone, a heat generation sharply deteriorates with a malfunction of the device, and in the case of an electric vehicle, the heat rapidly occurs during charging, resulting in deterioration of charging efficiency and deterioration of battery life.

In order to prevent this, a heat pipe, a vapor chamber and the like are often used as heat dissipating parts. The heat dissipation principle of these is circulated through the latent heat of the gas or liquid in the working fluid inside the container, and has a high heat transfer performance, and is applied to various fields. However, existing heatpipes have reached the limit of production thickness. They also have a two-dimensional heat transfer structure that dissipates heat through a selected plane in the heat generating element. However, since the actual heat source has a three-dimensional shape, in order to more effectively dissipate heat, a method of radiating heat through a large number of surfaces along a three-dimensional shape is required.

Due to the ease of application, graphite is used as a heat dissipation component for various electronic devices, but has a limitation in thermal properties. Therefore, it does not have a heat transfer performance capable of coping with rapid performance change.

In addition, such containers of heat-radiating parts use metal materials having high thermal conductivity such as aluminum and copper, but the following problems occur in the case of a heat-radiating device made of metal.

1. Thin manufacturing and flexible limits

When bending or warping occurs, the metal can not return to its original shape under a certain elasticity abnormality, and when the yielding abnormality occurs, the metal is bent or broken. Due to such material characteristics, it is limited to be applied to a curved surface or a flexible electronic device as a heat dissipation part.

2. Material modification in bonding process for container manufacturing

When the container is bonded at a high temperature and a high pressure, the material is loosened and the brittleness is increased. This causes a problem in the stability of the container.

3. Use of heat transfer material to reduce contact resistance and its problems

The heat dissipation device is mounted on a heat source requiring heat control. The most important factor that hinders heat dissipation is contact resistance. Apply thermal grease or a thermal pad between the heat source and the heat sink to reduce the contact resistance. These materials solidify during long-term use, rather acting as an obstacle to heat dissipation.

4. Problems of insulation and corrosion

A metallic material such as aluminum or copper may be used as a container of the heat dissipating device. However, metal materials may corrode when exposed to ambient air, or they may cause transitional corrosion when they come into contact with metal housing of electronic equipment. Therefore, a manufacturing process of coating an insulating material on the outer surface may be added to overcome the problems of insulation and corrosion.

Korean Patent Publication No. 2004-0051219 (Jun. 18, 2004)

SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems described above and to solve the above problems and to provide a heat dissipating device capable of maximizing heat dissipation performance by minimizing contact resistance by increasing the degree of close contact with a heat source, And a heat dissipation system having a heat dissipation tube of a multilayer structure film which can cope with various shapes of an applied device by using one film material.

In order to solve the above problems,
A heat radiating tube (200) which is seated on one surface of the heat generating element (300) and in which the edges of two sheets of the multilayer film are joined to form an internal space (150); A housing 400 formed on the opposite side of the heat generating element 300 with a predetermined space from the heat dissipating tube 200; The two multilayer films 100a and 100b are formed to include an insulating layer 130a and a heat dissipation layer 120a. The heat transfer material 151 is filled in the internal space 150 of the heat dissipating tube 200, And an adhesive layer 110a are stacked in this order and are formed of an upper multilayer film 100a and a lower multilayer film 100b having edges bonded to each other to face the adhesive layers 110a and 110b, And the heat radiating tube 200 is closely contacted with the housing 400 when the heat radiating tube 200 is heated and inflated. The heat radiating tube 200 may have a shape in which the internal space 150 is formed in a wavy shape 1200 or a radial shape The chamber 2160 is provided at the central portion of the radial type when the flow path of the radial type 2200 is formed and when the radiating tube 200 is attached to the upper surface of the heat generating element 300, The heat dissipation layer 120b of the film 100b transfers heat from the heat generating element 300 to the heat transfer material 151 to induce thermal expansion The heat dissipation layer 120a of the upper multilayer film 100a is formed by a first heat dissipation function for emitting heat of the heat transfer material 151 to the outside and a second heat dissipation operation for dissipating the heat transfer material 151) is moved to a place where the temperature is low, thereby generating a secondary heat radiation function for distributing the heat,
The multi-layer film (100a) further includes a porous layer (140) below the adhesive layer (110a) to induce circulation of the heat transfer material (151) by capillary action. And a heat dissipation system.

delete

The present invention has the following effects.

In other words, by expanding the heat radiation tube in the endothermic process, it is possible to minimize the contact resistance by increasing the degree of adhesion with the heat source and maximize heat dissipation performance by being able to transfer heat in multiple directions. In addition, Can respond accordingly. In addition, due to the nature of the material, it is easy to manufacture and the production cost can be lowered compared with the heat dissipation parts of the conventional metal containers.

1 is a cross-sectional view illustrating a heat dissipation tube mounted on a heating element in a heat dissipation system having a heat dissipation tube of a multilayer structure film according to an embodiment of the present invention.
2 is a perspective view showing the structure of a multilayer film according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a heat dissipation tube according to an embodiment of the present invention.
4 is a three-dimensional view showing a state in which the heat radiation tube according to the embodiment of the present invention expands when the heat is absorbed.
5 is a perspective view illustrating a process of manufacturing a heat radiation tube according to an embodiment of the present invention.
6 is a perspective view of a wave-like heat radiation tube 1200 according to another embodiment of the present invention.
7 is a perspective view of a radial heat dissipating tube 2200 according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, it should be noted that the same components or parts among the drawings denote the same reference numerals as much as possible.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted so as to avoid obscuring the subject matter of the present invention.

The terms "about "," substantially ", etc. used to the extent that they are used herein are intended to approximate the numerical values when the manufacturing and material tolerances inherent in the meanings mentioned are presented, Absolute numbers are used to prevent unauthorized exploitation by unauthorized intruders of the mentioned disclosure.

The present invention is summarized as follows.

That is, the heat-dissipating tube 200, which is seated on one surface of the heat-generating element 300 and has the inner space 150 formed by joining two edges of the multilayer film 100a, A housing 400 formed on the opposite side of the element 300 and a liquid heat transfer material 151 filled in the internal space 150 of the heat dissipation tube 200. The two multilayer films 100a, The upper multilayer film 100a and the lower multilayer film 100b which are formed to have the heat dissipation layer 120a and the adhesion layer 110a stacked and the edges of which are adhered to the adhesion layers 110a and 110b, The heat radiating tube 200 is heated and expanded when the liquid heat transfer material 151 is heated to closely contact the housing 400 to perform heat transfer. will be.

FIG. 1 is a cross-sectional view illustrating a heat dissipation tube 200 mounted on a heating element 300 in a heat dissipation system having a heat dissipation tube of a multilayer structure film according to an embodiment of the present invention.

1, the upper side of FIG. 1 is a state before the heat radiation tube 200 absorbs heat from the heat generating element 300, and the lower side is a state where the heat radiation tube 200 absorbs heat from the heat generating element 300, (400). The heat dissipation system having the heat dissipation tube of the multilayer structure film includes the heat dissipation tube 200 attached to the heat dissipation element 300 and the housing 400 covering the heat dissipation tube 200. The heat dissipation tube 200 effectively transfers the heat from the heat generating element 300 to the housing 400 and the outside air. Referring to FIG. 3, the inner space 150 of the heat dissipating tube 200 is filled with a heat transfer material 151 made of a liquid. Although the material of the heat transfer material 151 is not limited, the latent heat of vaporization is large, and the larger the surface tension, the more excellent the effect is. Various heat transfer materials can be used, and examples thereof include refrigerants, water, methanol, ethanol, and acetone. But are not limited to these materials.

When the heat transfer material 151 is heated by the heat of the heat generating element 300, the volume of the heat dissipating tube 200 expands to the housing 400 due to thermal expansion and vaporization of the liquid. That is, the thickness of the heat radiation tube 200 is changed from 'd1' to 'd2' due to expansion. Therefore, the expanded heat radiation tube 200 fills a space of height 'h' to the housing 400. The thickness d2 of the expanded heat radiation tube 200 may be larger than h in the absence of the housing 400. The thickness d2 of the expanded heat radiation tube 200 may be greater than the height h of the housing 400, (200) and surrounds the heating element (300). That is, due to the expansion of the heat-dissipating tube 200 and the constraining of the housing 400, the outer surface of the heat-generating element 300 is wrapped and tightly contacted. Accordingly, the contact surface between the heat generating element 300 and the heat dissipating tube 200 is increased and the contact resistance is reduced, so that heat is efficiently transferred.

2 is a three-dimensional view showing a configuration of a multilayer film 100a according to an embodiment of the present invention.

As shown in FIG. 2, the multilayer film 100a is a structure in which a metal thin film or a film made of a polymer compound or a synthetic material is laminated. The lowermost end of the multilayer film 100a is an adherent layer 110a and the two multilayer films 100a and 100b are adhered to each other while facing the adhering layers 110a and 110b when the heat radiating tube 200 is manufactured, ).

A heat dissipation layer 120a is disposed on an upper end of the adhesion layer 110a. The heat dissipation layer 120b of the lower multilayer film 100a transfers heat from the heat generating element 300 to the heat transfer material 151 to induce thermal expansion and the heat dissipation layer 120a of the upper multilayer film 100a The heat of the heat transfer material 151 is released. Also, when the temperature difference of the internal space 150 is generated due to the endothermic heat, the heat transfer material 151 moves to a place where the temperature is low, and secondary heat dissipation occurs due to heat distribution. This heat dissipation effect is an example in the case where the heat generating element 300 is provided in the lower portion, and the direction is not limited. For example, if there is a heat source in the upper multilayer film 100a, the heat from the upper portion may be absorbed to cause a primary heat radiation effect to the outside of the lower multilayer film 100b and a secondary heat radiation effect due to the movement of the heat transfer material 151 have. The heat dissipation layer 120a is formed by laminating a metal thin film or a film made of a polymer compound or a synthetic material with a good thermal conductivity so that the primary heat dissipation can be smoothly performed. Depending on the use of the maker and the designer, the construction of the laminate can be made freely.

In addition, an insulating layer 130a may be added to the upper end of the heat dissipation layer 120a. This prevents corrosion due to exposure to the outside air, prevents transition corrosion due to contact when the housing 400 of the electronic device is made of metal, and performs insulation when mounted on an electronic device.

3 is a cross-sectional view illustrating a heat radiating tube section 201 according to an embodiment of the present invention.

3, two upper and lower multilayer films 100a and 100b face the adhesive layers 110a and 110b and an inner space 150 is formed therebetween. In this case, if the porous layers 140a and 140b are formed on the surfaces of the adhesive layers 110a and 110b, the movement of the heat transfer material 151 is facilitated by the capillary force, thereby maximizing the efficiency of the secondary heat dissipation operation . Therefore, it is preferable that the porous layer 140a is composed of a porous material (powder, mesh) or the like which can easily cause capillary phenomenon.

FIG. 4 is a three-dimensional view showing a state in which the heat radiation tube 200 according to the embodiment of the present invention expands when the heat is absorbed.

As shown in FIG. 4, the multilayer films 100a and 100b constituting the heat-radiating tube 200 are characterized by being laminated with thin films, which are flexible and expand when the heat is absorbed. This expansion increases the degree of contact with the heat generating element 300, thereby widening the contact surface, and significantly reducing the contact resistance, which is the main cause of heat transfer disturbance, thereby enhancing the heat radiation efficiency. In addition, since it is flexible, it can be manufactured in a thin shape without restriction on the shape of a heat source, and thus it can be applied to electronic apparatuses that become slimmer in recent years.

5 is a perspective view illustrating a process of manufacturing a heat radiation tube according to an embodiment of the present invention.

The adhesive layers 110a and 110b of the upper and lower multilayer films 100a and 100b shown in FIG. 3 are opposed to each other and the joining portions 111 formed at the edges of the upper and lower adhesive layers 110a and 110b are opened And they are pressed and bonded. The heat transfer material 151 such as distilled water or acetone is injected through the injection port 112 formed at this time. Thereafter, heat is applied from the outside of the container to discharge an unnecessary amount to adjust the proper amount of the heat transfer material 151 and to seal the injection port.

As described above, since the manufacturing method is simple, it is possible to cope with various types of demands on the side of the consumer and the manufacturing cost can be lowered accordingly.

1 to 5 correspond to preferred embodiments of the present invention.

6 is a perspective view of a wave-like heat radiation tube 1200 according to another embodiment of the present invention.

As shown in FIG. 6, the inner space 1150 can be formed in a wavy flow path by changing the design of the bonding portion 1111. Accordingly, when the heat transfer material 151 from the heat source is vaporized, the heat transfer material 151 circulates the inner space 1150 formed by the flow path by the volume expansion force, thereby increasing the efficiency of the secondary heat radiation operation. The cross section of the flow path is not limited in shape and size, and can be designed differently depending on the application and performance.

7 is a perspective view of a radial heat dissipating tube 2200 according to another embodiment of the present invention.

As shown in Fig. 7, the inner space 2150 may be formed in a radial flow path and the chamber 2160 may be provided by changing the design of the joint portion 2111. [ Therefore, when a heat source is attached to the chamber 2160 and the heat transfer material 151 is circulated through the internal space 2150 of a radial flow path by the volume expansion force when the heat transfer material is vaporized, ). The position of the chamber 2160 is not limited to the center, but may be designed differently depending on the application, performance, and position of the heat source.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be clear to those who have knowledge.

100a: upper multilayer film
110a: adhesion layer
111:
112: inlet
120a:
130a: insulating layer
140a: porous layer
100b: lower multilayer film
110b: adhesion layer
120b:
130b: insulating layer
140b: porous layer
150: interior space
151: Heat transfer material
200: heat-radiating tube
201: heat radiation tube section
300: heating element
400: housing
1200: Wave type heat radiation tube
2200: Radial heat radiating tube
2160: chamber

Claims

A heat radiating tube (200) which is seated on one surface of the heat generating element (300) and in which the edges of two sheets of the multilayer film are joined to form an internal space (150);
A housing 400 formed on the opposite side of the heat generating element 300 with a predetermined space from the heat dissipating tube 200;
And a liquid heat transfer material 151 filled in the inner space 150 of the heat dissipation tube 200,

The two multilayer films (100a, 100b)
The insulating layer 130a, the heat dissipation layer 120a, and the adhesion layer 110a are stacked in this order.
The upper multilayer film 100a and the lower multilayer film 100b having the edges bonded to each other with the adhering layers 110a and 110b facing each other,
When the liquid heat transfer material 151 is heated and expanded, the heat radiation tube 200 is closely contacted with the housing 400 to perform heat transfer.

The heat dissipation tube (200)
The inner space 150 forms a flow path with a wavy shape 1200 or a radial shape 2200,
When the flow path of the radial type 2200 is formed, a chamber 2160 is provided at the center of the radial type,

When the heat radiation tube 200 is attached to the upper surface of the heat generating element 300,
The heat dissipation layer 120b of the lower multilayer film 100a transfers heat from the heat generating element 300 to the heat transfer material 151 to induce thermal expansion and the heat dissipation layer 120a of the upper multilayer film 100a A first heat dissipation function for dissipating heat of the heat transfer material 151,
And the heat transfer material 151 is moved to a lower temperature region due to the temperature difference of the internal space 150 caused by the endothermic heat to generate a secondary heat radiation effect for distributing the heat
A heat dissipation system comprising a heat dissipation tube of a multilayer structure film.

The method according to claim 1,
The multi-layer film 100a may be formed,
Further comprising a porous layer 140 underneath the attachment layer 110a,
And induces the circulation of the heat transfer material (151) by the capillary phenomenon
A heat dissipation system comprising a heat dissipation tube of a multilayer structure film.

delete