KR101724090B1 - Electromagnetic shielding film - Google Patents

Electromagnetic shielding film Download PDF

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Publication number
KR101724090B1
KR101724090B1 KR1020150111641A KR20150111641A KR101724090B1 KR 101724090 B1 KR101724090 B1 KR 101724090B1 KR 1020150111641 A KR1020150111641 A KR 1020150111641A KR 20150111641 A KR20150111641 A KR 20150111641A KR 101724090 B1 KR101724090 B1 KR 101724090B1
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KR
South Korea
Prior art keywords
layer
shielding
shielding layer
conductive adhesive
electromagnetic wave
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Application number
KR1020150111641A
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Korean (ko)
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KR20170017542A (en
Inventor
엄상용
Original Assignee
대상에스티 주식회사
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Priority to KR1020150111641A priority Critical patent/KR101724090B1/en
Publication of KR20170017542A publication Critical patent/KR20170017542A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Abstract

The present disclosure relates to an electromagnetic wave shielding film for shielding electromagnetic waves, comprising: a conductive adhesive layer comprising a pressure-sensitive adhesive of 80 to 85 weight ratio of a thermoplastic resin and 15 to 20 weight ratio of a thermosetting resin; A shielding layer made of a metal thin film positioned on the upper surface of the conductive adhesive layer; And an insulating layer disposed on the upper surface of the shielding layer.

Description

ELECTROMAGNETIC SHIELDING FILM

The present disclosure relates generally to electromagnetic wave shielding films, and more particularly to an electromagnetic wave shielding film having a shielding layer of a metal thin film.

Herein, the background art relating to the present disclosure is provided, and these are not necessarily meant to be known arts.

In general, a circuit board on which chips, electronic parts, and the like are mounted is mounted inside the electronic device. During the operation of such an electronic device, electromagnetic waves are generated on the circuit board. Such electromagnetic waves cause various problems such as causing signal distortion to components mounted on the circuit board or harmful effects on the human body.

An electromagnetic wave shielding film is attached to a circuit board in order to shield the electromagnetic wave from the circuit board.

1 is a view showing the structure of a conventional general electromagnetic wave shielding film.

A conventional electromagnetic wave shielding film 10 has a structure including an insulating layer 11, a metal thin film 12, and a conductive adhesive layer 13. A metal material is coated on the lower surface of the insulating layer 11 to form a metal thin film 12 and a conductive paste is applied to the lower surface of the metal thin film 12 to form a conductive adhesive layer 13.

The electromagnetic wave shielding film 10 is adhered on the circuit board by the conductive adhesive layer 13.

When an electromagnetic wave is generated in the circuit pattern of the circuit board, the electromagnetic wave is transmitted to the metal thin film 12 through the conductive adhesive layer 13, and the electromagnetic wave is blocked by the metal thin film 12 without being released to the outside.

Background Art [0002] With the recent miniaturization and integration of electronic devices, flexible circuit boards are increasingly applied to electronic devices. With the application of the flexible circuit board, the electromagnetic wave shielding film is demanded to be resistant to deformation due to bending. Particularly, there is a demand for a property that the metal thin film is not peeled off from the insulating layer and the conductive adhesive layer when the electromagnetic wave shielding film is bent. In addition, as electronic devices have become smaller, thinner, and lighter, electromagnetic shielding films have been required to be thinner. Further, the electromagnetic wave shielding film is required to have an improved shielding efficiency while thinning the electromagnetic wave shielding film.

The present disclosure seeks to provide an electromagnetic wave shielding film which satisfies the characteristics of a recently required electromagnetic wave shielding film.

This will be described later in the Specification for Enforcement of the Invention.

SUMMARY OF THE INVENTION Herein, a general summary of the present disclosure is provided, which should not be construed as limiting the scope of the present disclosure. of its features).

According to one aspect of the present disclosure, an electromagnetic shielding film for shielding electromagnetic waves includes a pressure-sensitive adhesive composed of a thermoplastic resin at a weight ratio of 80 to 85 and a thermosetting resin at a weight ratio of 15 to 20 A conductive adhesive layer; A shielding layer made of a metal thin film positioned on the upper surface of the conductive adhesive layer; And an insulating layer disposed on an upper surface of the shielding layer.

This will be described later in the Specification for Enforcement of the Invention.

FIG. 1 is a view showing the structure of a conventional general electromagnetic wave shielding film,
2 is a view showing an example of an electromagnetic wave shielding film according to the present disclosure,
3 is a view showing a problem of an electromagnetic wave shielding film using a pressure-sensitive adhesive manufactured from a mixing ratio,
4 is a flowchart showing an example of a method of manufacturing an electromagnetic wave shielding film according to the present disclosure;

The present disclosure will now be described in detail with reference to the accompanying drawings.

2 is a view showing an example of an electromagnetic wave shielding film according to the present disclosure.

The electromagnetic wave shielding film 100 according to the present disclosure may include an insulating layer 110, a shielding layer 120, and a conductive adhesive layer 130. A shielding layer 120 is formed on the upper surface of the conductive adhesive layer 130 and an insulating layer 110 is formed on the upper surface of the shielding layer 120 to form an insulating layer 110, a shielding layer 120, ) Can be stacked in this order. Although not shown, the conductive adhesive layer 130 and the insulating layer 110 may be formed on the lower surface of the conductive adhesive layer 130 and on the upper surface of the insulating layer 110 to protect the conductive adhesive layer 130 and the insulating layer 110. The release substrate can be removed when the electromagnetic wave shielding film 100 is attached to the circuit board and used.

The insulating layer 110 may include a light shielding layer 111 and a protective layer 112. The light-shielding layer 111 may be formed by a composition for forming a light-shielding layer 111 including a black ink and a pressure-sensitive adhesive as a layer that functions to block light. The pressure-sensitive adhesive is a material for attaching the light-shielding layer 111 to the shielding layer 120. In the present disclosure, a pressure-sensitive adhesive is prepared by mixing a thermoplastic resin and a thermosetting resin in order to improve the adhesive strength between the light-shielding layer 111 and the shielding layer 120 made of a metal thin film. The thermoplastic resin may be selected from the group consisting of dibutylamine, methyl methacrylate, 2-hydroxyethyl methacrylate (2-HEMA), isopropyl alcohol, acrylonitrile, lauryl methacrylate 2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, n-butyl acrylate, ethyl acrylate, vinyl acetate, isobornyl acrylate, vinyl chloride vinylchloride, octadecylmethacrylate, and the like. The thermosetting resin may be at least one of maleic acid, itaconic acid, glycidymethacrylate, acrylic acid, isophrone diisocyanate, and acrylamide. It is also preferable to mix 80 to 85 parts by weight of the thermoplastic resin with 15 to 20 parts by weight of the thermosetting resin. The adhesive strength between the light shielding layer 111 and the shielding layer 120 may be problematic. 3 shows that the metal thin film of the shielding layer 120 is peeled from the light shielding layer 111 when the mixing ratio of the thermoplastic resin and the thermosetting resin of the pressure sensitive adhesive is made deviating from the present disclosure. 3 (a) shows a case where only thermoplastic water is used as a pressure sensitive adhesive, and Fig. 3 (b) shows a case where only thermosetting water is used. If necessary, a curing agent or a resin for a binder may be added to the pressure-sensitive adhesive. Although the thickness of the light shielding layer 111 is not particularly limited, it is preferably formed to a thickness of 2 to 10 um in order to reduce the light shielding effect and the thickness of the entire electromagnetic shielding film. As the black ink, a known black pigment such as the trade name M880 Black may be used. As the binder resin, a polyurethane resin, a polyester resin, a polyvinyl resin, an acrylic resin, a polyvinyl pyrrolidone resin, The curing agent may be appropriately selected and used according to need. The protective layer 112 is formed on the upper surface of the light shielding layer 111 and protects the light shielding layer 111 from scratches or external impacts. The protective layer 112 may be formed of an epoxy resin, a urethane resin or the like, but it is preferable that the surface hardness of the protective layer 112 is pencil hardness H to H4. To this end, a layer made of epoxy resin or urethane resin, Of a hard coating agent or silica-based filler is preferably added. If the surface hardness of the protective layer 112 is less than H in pencil hardness, the surface hardness tends to be damaged. If the surface hardness is larger than 4H, the bending property may be deteriorated. The thickness of the protective layer 112 is preferably 1 to 5 um in consideration of the total thickness of the electromagnetic wave shielding film 100 and the role of the protective layer 112.

The metal thin film of the shielding layer 120 is formed of any one selected from the group consisting of Ni, Fe, Zn, Pb, Cu, Au and Ag. And may be formed by an alloy including one or more than two. Copper tends to be oxidized when it comes into contact with the atmosphere, and since gold is expensive, silver which is cheaper and more reliable is preferable. The thickness of the shielding layer 120 may be suitably selected according to the electromagnetic wave shielding effect and the repeated bending or sliding resistance, but a thickness of 0.1 to 0.5 mu m is preferable. When the thickness is less than 0.1 탆, sufficient electromagnetic wave shielding effect can not be obtained. If the thickness is more than 0.5 탆, flexibility may become a problem. As a method for forming the metal thin film of the shielding layer 120, vacuum deposition, sputtering, CVD, metal organic (MO), plating, or the like can be used. However, considering mass production, vacuum deposition is preferable, The shielding layer 120 can be obtained.

The conductive adhesive layer 130 may be formed of a composition for forming the conductive adhesive layer 130 including conductive powder and a pressure-sensitive adhesive. The pressure-sensitive adhesive may be the same pressure-sensitive adhesive as that contained in the light-shielding layer 111 to improve adhesion with the shielding layer 120 made of a metal thin film. In the composition for forming the conductive adhesive layer 130, in addition to improving the adhesive force between the conductive adhesive layer 130 and the shielding layer 120 made of a metal thin film, the adhesive may adhere the electromagnetic wave shielding film 100 to the circuit board It is also used for the purpose. The characteristics of the pressure-sensitive adhesive are the same as those described in the light-shielding layer 111. The thickness of the conductive adhesive layer 130 is not particularly limited, but it is preferably 5 to 20 μm in consideration of the adhesiveness and the total thickness of the electromagnetic wave shielding film. As the binder and the curing agent, a binder and a curing agent used in the shielding layer 111 may be used. The conductive powder may be at least one metal powder selected from the group consisting of Ni, Fe, Zn, Pb, Cu, Au and Ag.

4 is a flowchart showing an example of a method of manufacturing an electromagnetic wave shielding film according to the present disclosure.

(S10) forming a conductive adhesive layer on one surface of the release substrate; Forming a shielding layer on the upper surface of the conductive adhesive layer (S20); And forming an insulating layer on the upper surface of the shielding layer (S30). The order of the manufacturing method can be changed. For example, an insulating layer may be formed on one surface of the release substrate, a shielding layer may be formed on the upper surface of the insulating layer, and then a conductive adhesive layer may be formed on the upper surface of the shielding layer. Alternatively, a conductive adhesive layer may be formed on one side of the shielding layer of the metal thin film, and an insulating layer may be formed on the other side of the shielding layer of the metal thin film, using the shielding layer of the metal thin film as a base without using the release substrate.

A known coating method may be used for forming the conductive adhesive layer on one side of the release substrate (S10). The conductive adhesive layer composition may be formed by using a coating method appropriately selected as required, for example, from a comma roll coating, a gravure coating, a knife coating, a spray coating, a dip coating, a spin coating, a screen coating, an ink jet printing, The conductive adhesive layer can be formed on one side of the substrate.

The step of forming the metal thin film as the shielding layer on the conductive adhesive layer includes the steps of forming a metal thin film on the conductive adhesive layer by depositing nickel (Ni), iron (Fe), zinc (Zn), lead (Pb), copper (Cu) Ag), and the like may be vacuum-deposited.

In addition, an insulating layer may be formed on the shielding layer through various coating methods as described above.

Various embodiments of the present disclosure will be described below.

(1) An electromagnetic wave shielding film for shielding electromagnetic waves, comprising: a conductive adhesive layer comprising a pressure-sensitive adhesive composed of a thermoplastic resin of 80 to 85 parts by weight and a thermosetting resin of 15 to 20 parts by weight; A shielding layer made of a metal thin film positioned on the upper surface of the conductive adhesive layer; And an insulating layer located on the upper surface of the shielding layer of the metal thin film.

(2) The thermoplastic resin may be selected from the group consisting of dibutylamine, methyl methacrylate, 2-hydroxyethyl methacrylate (2-HEMA), isopropyl alcohol, acrylonitrile, 2-hydroxypropylacrylate, n-butyl acrylate, ethyl acrylate, vinyl acetate, isobornyl acrylate, isobornyl acrylate, isobornyl acrylate and isobornyl acrylate. , Vinylchloride, octadecylmethacrylate, and the like.

(3) The electromagnetic wave shielding film according to (3), wherein the thermosetting resin is at least one of maleic acid, itaconic acid, glycidymethacrylate, acrylic acid, isophrone diisocyanate and acrylamide.

(4) The electromagnetic wave shielding film of claim 1, wherein the insulating layer comprises a protective layer and a light shielding layer.

(5) The electromagnetic wave shielding film according to any one of (1) to (5), wherein the light shielding layer comprises a pressure-sensitive adhesive of 80 to 85 weight ratio of a thermoplastic resin and 15 to 20 weight ratio of a thermosetting resin.

(6) The electromagnetic wave shielding film according to (6), wherein the conductive adhesive layer comprises a conductive material

(7) The electromagnetic wave shielding film according to (7), wherein the conductive material is one of copper (Cu), aluminum (Al), nickel (Ni) and silver (Ag).

According to the electromagnetic wave shielding film of the present disclosure, an excellent electromagnetic wave shielding film can be obtained in which the shielding layer of the metal thin film is not easily peeled off from the insulating layer and the conductive adhesive layer when bent.

According to the electromagnetic wave shielding film of the present disclosure, it is possible to obtain an electromagnetic wave shielding film which is thin and excellent in shielding property.

Insulation layer: 11, 110
Shielding layer: 12, 120
Conductive adhesive layer: 13, 130

Claims (9)

An electromagnetic wave shielding film for shielding electromagnetic waves,
A conductive adhesive layer comprising a pressure-sensitive adhesive composed of a thermoplastic resin of 80 to 85 parts by weight and a thermosetting resin of 15 to 20 parts by weight;
A shielding layer made of a metal thin film positioned on the upper surface of the conductive adhesive layer; And,
And an insulating layer disposed on an upper surface of the shielding layer, the insulating layer including a protective layer and a shielding layer, wherein the shielding layer is in contact with the shielding layer
Wherein the light-shielding layer comprises a pressure-sensitive adhesive comprising 80 to 85 parts by weight of a thermoplastic resin and 15 to 20 parts by weight of a thermosetting resin. The method according to claim 1,
The thermoplastic resin may be selected from the group consisting of dibutylamine, methyl methacrylate, 2-hydroxyethyl methacrylate (2-HEMA), isopropyl alcohol, acrylonitrile, lauryl methacrylate 2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, n-butyl acrylate, ethyl acrylate, vinyl acetate, isobornyl acrylate, vinyl chloride vinylchloride, octadecylmethacrylate, and the like. The method according to claim 1,
Wherein the thermosetting resin is at least one of maleic acid, itaconic acid, glycidymethacrylate, acrylic acid, isophrone diisocyanate, and acrylamide. delete delete delete delete The method according to claim 1,
Wherein the conductive adhesive layer comprises a conductive material. The method of claim 8,
Wherein the conductive material is at least one of copper (Cu), aluminum (Al), nickel (Ni), and silver (Ag).
KR1020150111641A 2015-08-07 2015-08-07 Electromagnetic shielding film KR101724090B1 (en)

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Publication number Priority date Publication date Assignee Title
CN108668517A (en) * 2017-04-01 2018-10-16 中国科学院化学研究所 Electromagnetic shielding film and preparation method thereof
CN109130383B (en) * 2018-07-25 2019-09-10 深圳市弘海电子材料技术有限公司 A kind of bilayer electromagnetic shielding film and preparation method thereof
KR101984433B1 (en) * 2018-10-25 2019-05-30 김태우 LED Converter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046200B1 (en) 2010-06-23 2011-07-05 에스디플렉스(주) Method for manufacturing electromagnetic interference shielding film and electromagnetic interference shielding film manufactured by the method
KR101272397B1 (en) 2013-04-11 2013-06-07 장성대 Multi-functional thin layer sheet with excellent thermal diffusion properties, electromagnetic wave shielding function and impact absorbing function and method for preparinbg the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101326266B1 (en) * 2011-12-30 2013-11-11 주식회사 솔루에타 Method for producing conductive non-woven fabric and Multi-fuctional Electro Magnetic Interference shield tape using conductive non-woven fabric
KR101361529B1 (en) * 2012-01-12 2014-02-25 한화엘앤씨 주식회사 Electromagnetic wave shield film and printed circuited board attached said film and the manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046200B1 (en) 2010-06-23 2011-07-05 에스디플렉스(주) Method for manufacturing electromagnetic interference shielding film and electromagnetic interference shielding film manufactured by the method
KR101272397B1 (en) 2013-04-11 2013-06-07 장성대 Multi-functional thin layer sheet with excellent thermal diffusion properties, electromagnetic wave shielding function and impact absorbing function and method for preparinbg the same

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