CN106003959A - Electromagnetic shielding film and preparation method thereof - Google Patents
Electromagnetic shielding film and preparation method thereof Download PDFInfo
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- CN106003959A CN106003959A CN201610326386.4A CN201610326386A CN106003959A CN 106003959 A CN106003959 A CN 106003959A CN 201610326386 A CN201610326386 A CN 201610326386A CN 106003959 A CN106003959 A CN 106003959A
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- electromagnetic shielding
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- release membrance
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
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- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention relates to the technical field of shielding films, in particular to an electromagnetic shielding film and a preparation method thereof. The electromagnetic shielding film comprises a carrier film, an insulation layer, a metal layer, a conductive adhesive layer and a release film sequentially from bottom to top, wherein the lower surface and the upper surface of the insulation layer are attached to the upper surface of the carrier film and the lower surface of the metal layer respectively. The electromagnetic shielding film has the advantages of simple structure, good electromagnetic shielding effect and low cost. Compared with vacuum coating and magnetron sputtering, the preparation method has the advantages that the production efficiency is high, coating related equipment can be avoided, production space is reduced, and investment and production cost are saved.
Description
Technical field
The present invention relates to screened film technical field, be specifically related to a kind of electromagnetic shielding film and preparation method thereof.
Background technology
In recent years, the electronic equipment of PC, mobile phone and digital equipment etc. presents miniaturization and light-weighted trend, and this electronics sets
Standby is the most universal, also causes the impact of electromagnetic wave in work unit or family, along with the development of electronic industry, electromagnetic interference
Threaten more and more higher.
Existing electromagnetic shielding film is made up of insulating barrier, metal level and conductive adhesive layer.Wherein, metal level at present substantially by
Evaporation or magnetron sputtering realize, and costly, simultaneously need to occupy bigger production space, this results in these equipment prices
Enterprise needs to put into bigger production cost.
Summary of the invention
In order to overcome shortcoming and defect present in prior art, it is an object of the invention to provide a kind of electromagnetic shielding
Film, this electromagnetic shielding film simple in construction, effectiveness is good, low cost.
Another object of the present invention is to provide the preparation method of a kind of electromagnetic shielding film, this preparation method is compared to vacuum
Plated film sputters with observing and controlling, and production efficiency is high, and can exempt the relevant device of plated film, reduces producing space simultaneously, saves and put into
And production cost.
The purpose of the present invention is achieved through the following technical solutions: a kind of electromagnetic shielding film, including setting gradually from the bottom up
Carrier film, insulating barrier, metal level, conductive adhesive layer and mould release membrance, upper with carrier film respectively of the lower surface of insulating barrier, upper surface
The lower surface laminating of surface and metal level, the lower surface of conductive adhesive layer, upper surface respectively with upper surface and the mould release membrance of metal level
Lower surface laminating.
Preferably, described carrier film is PET film.The present invention is by using PET film as carrier film, and its light transmittance is high.
Described mould release membrance is off-type force at the PET mould release membrance of 5-10gf, PE mould release membrance, OPP mould release membrance, BOPET mould release membrance
With any one in BOPP mould release membrance.The present invention is by using above-mentioned mould release membrance, and it is release effective.
The thickness of described carrier film is 20-100 μm.Preferably, the thickness of described carrier film can be 20 μm, 40 μm, 60 μ
M, 80 μm or 100 μm.Being more highly preferred to, the thickness of described carrier film is 60 μm.
The thickness of described insulating barrier is 2-10 μm.Preferably, the thickness of described insulating barrier can be 2 μm, 4 μm, 6 μm, 8 μm
Or 10 μm.Being more highly preferred to, the thickness of described insulating barrier is 6 μm.
The thickness of described metal level is 0.2-1.5 μm.Preferably, the thickness of described metal level can be 0.2 μm, 0.5 μm,
0.8 μm, 1.2 μm or 1.5 μm.Being more highly preferred to, the thickness of described metal level is 0.8 μm.
The thickness of described conductive adhesive layer is 7-15 μm.Preferably, the thickness of described conductive adhesive layer can be 7 μm, 9 μm, 11 μ
M, 13 μm or 15 μm.Being more highly preferred to, the thickness of described conductive adhesive layer is 11 μm.
The thickness of described mould release membrance is 20-100 μm.Preferably, the thickness of described mould release membrance can be 20 μm, 40 μm, 60 μ
M, 80 μm or 100 μm.Being more highly preferred to, the thickness of described mould release membrance is 60 μm.
Preferably, described insulating barrier is prepared by coatings is coated, and coatings is made up of the raw material of following weight portion:
Resin 100 parts and light absorbent 0.5-5 part.The present invention is added with the insulating barrier of light absorbent by employing, and its insulation effect is good.
Be more highly preferred to, described resin be in acrylic resin, epoxy resin, polyurethane resin and polyester resin at least
A kind of.
Being more highly preferred to, described light absorbent is at least one in white carbon black, graphite and iron oxide black, described light absorbent
Particle diameter less than 6 μm.
Preferably, described metal level is prepared by copper ink is coated, and copper ink is by copper nitrate and aminoquinoxaline class
Compound reacts the copper chelate obtained.Copper ink is to be reacted the copper chelating obtained by copper nitrate and aminoquinoxaline compounds
Thing, compared with plated film, copper chelate the metal level formed is more preferable with bilevel degree of adhesion, strengthens the resist bending of screened film
Property and folding resistance.
Preferably, described conductive adhesive layer is prepared by electrically-conducting paint is coated, and electrically-conducting paint is by the raw material group of following weight portion
Become: resin 100 parts and conductive material 30-70 part.The present invention is added with the conductive adhesive layer of conductive material by employing, and it conducts electricity effect
The best.
Being more highly preferred to, described resin is at least one in acrylic resin, epoxy resin and polyurethane.
Be more highly preferred to, described conductive material be any one or the silver in silver, copper, ferrum, zinc, nickel and silver, copper, ferrum, zinc,
The alloy of at least two composition in nickel and silver；Or, described conductive material be in polyaniline, polypyrrole and polythiophene at least
A kind of.
Another object of the present invention is achieved through the following technical solutions: the preparation method of a kind of electromagnetic shielding film, including such as
Lower step:
(1) take a carrier film, at one layer of coatings of coated on one side of carrier film, form insulating barrier；
(2) upper surface one layer of copper ink of coating of the insulating barrier formed in step (1), forms metal level；
(3) take a mould release membrance, at one layer of electrically-conducting paint of coated on one side of mould release membrance, form conductive adhesive layer；
(4) lower surface of conductive adhesive layer step (3) formed is overlying on the upper surface of the metal level that step (2) is formed, and prepares electricity
Magnetic shield film.
The beneficial effects of the present invention is: the electromagnetic shielding film simple in construction of the present invention, effectiveness is good, cost
Low.
The preparation method of the present invention sputters with observing and controlling compared to vacuum coating, and production efficiency is high, and can exempt plated film
Relevant device, reduces simultaneously and produces space, save and put into and production cost.
Accompanying drawing explanation
Fig. 1 is the partial sectional view of the present invention.
Reference is: 1 carrier film, 2 insulating barriers, 3 metal levels, 4 conductive adhesive layers, 5 mould release membrances.
Detailed description of the invention
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment and accompanying drawing 1, the present invention is made further
Illustrate, the content that embodiment is mentioned not limitation of the invention.
Embodiment 1
A kind of electromagnetic shielding film, including the carrier film 1 set gradually from the bottom up, insulating barrier 2, metal level 3, conductive adhesive layer 4 and
Mould release membrance 5, the lower surface of insulating barrier 2, upper surface are fitted with the upper surface of carrier film 1 and the lower surface of metal level 3 respectively, are conducted electricity
The lower surface of glue-line 4, upper surface are fitted with the upper surface of metal level 3 and the lower surface of mould release membrance 5 respectively.
Described carrier film 1 is PET film；Described mould release membrance 5 is the off-type force PET mould release membrance 5 at 5gf；Described carrier film 1
Thickness is 20 μm；The thickness of described insulating barrier 2 is 2 μm；The thickness of described metal level 3 is 0.2 μm；The thickness of described conductive adhesive layer 4
Degree is 7 μm；The thickness of described mould release membrance 5 is 20 μm.
Described insulating barrier 2 is prepared by coatings is coated, and coatings is made up of the raw material of following weight portion: resin
100 parts and light absorbent 0.5 part.
Described resin is acrylic resin.
Described light absorbent is white carbon black, and the particle diameter of described light absorbent is 5 μm.
Described metal level 3 is prepared by copper ink is coated, and copper ink is anti-with aminoquinoxaline compounds by copper nitrate
The copper chelate that should obtain.
Described conductive adhesive layer 4 is prepared by electrically-conducting paint is coated, and electrically-conducting paint is made up of the raw material of following weight portion: resin
100 parts and conductive material 30 parts.
Described resin is acrylic resin.
Described conductive material is any one in silver, copper, ferrum, zinc and nickel.
The preparation method of a kind of electromagnetic shielding film, comprises the steps:
(1) take a carrier film 1, at one layer of coatings of coated on one side of carrier film 1, form insulating barrier 2；
(2) upper surface one layer of copper ink of coating of the insulating barrier 2 formed in step (1), forms metal level 3；
(3) take a mould release membrance 5, at one layer of electrically-conducting paint of coated on one side of mould release membrance 5, form conductive adhesive layer 4；
(4) lower surface of the conductive adhesive layer 4 step (3) formed is overlying on the upper surface of the metal level 3 that step (2) is formed, and prepares
Electromagnetic shielding film.
Embodiment 2
The present embodiment is with the difference of above-described embodiment 1:
Described mould release membrance 5 is the off-type force PE mould release membrance 5 at 6gf；The thickness of described carrier film 1 is 40 μm；Described insulating barrier 2
Thickness is 4 μm；The thickness of described metal level 3 is 0.5 μm；The thickness of described conductive adhesive layer 4 is 9 μm；The thickness of described mould release membrance 5
It is 40 μm.
Described insulating barrier 2 is prepared by coatings is coated, and coatings is made up of the raw material of following weight portion: resin
100 parts and light absorbent 2 parts.
Described resin is epoxy resin.
Described light absorbent is graphite, and the particle diameter of described light absorbent is 1 μm.
Described metal level 3 is prepared by copper ink is coated, and copper ink is anti-with aminoquinoxaline compounds by copper nitrate
The copper chelate that should obtain.
Described conductive adhesive layer 4 is prepared by electrically-conducting paint is coated, and electrically-conducting paint is made up of the raw material of following weight portion: resin
100 parts and conductive material 40 parts.
Described resin is epoxy resin.
Described conductive material is the alloy of at least two composition in silver, copper, ferrum, zinc, nickel and silver.
Embodiment 3
The present embodiment is with the difference of above-described embodiment 1:
Described mould release membrance 5 is the off-type force OPP mould release membrance 5 at 8gf；The thickness of described carrier film 1 is 60 μm；Described insulating barrier 2
Thickness be 6 μm；The thickness of described metal level 3 is 0.8 μm；The thickness of described conductive adhesive layer 4 is 11 μm；Described mould release membrance 5
Thickness is 60 μm.
Described insulating barrier 2 is prepared by coatings is coated, and coatings is made up of the raw material of following weight portion: resin
100 parts and light absorbent 3 parts.
Described resin is polyurethane resin.
Described light absorbent is iron oxide black, and the particle diameter of described light absorbent is 0.5 μm.
Described metal level 3 is prepared by copper ink is coated, and copper ink is anti-with aminoquinoxaline compounds by copper nitrate
The copper chelate that should obtain.
Described conductive adhesive layer 4 is prepared by electrically-conducting paint is coated, and electrically-conducting paint is made up of the raw material of following weight portion: resin
100 parts and conductive material 50 parts.
Described resin is polyurethane.
Described conductive material is the alloy of at least three kinds of compositions in silver, copper, ferrum, zinc, nickel and silver.
Embodiment 4
The present embodiment is with the difference of above-described embodiment 1:
Described mould release membrance 5 is the off-type force BOPET mould release membrance 5 at 9gf；The thickness of described carrier film 1 is 80 μm；Described insulating barrier
The thickness of 2 is 8 μm；The thickness of described metal level 3 is 1.2 μm；The thickness of described conductive adhesive layer 4 is 12 μm；Described mould release membrance 5
Thickness is 80 μm.
Described insulating barrier 2 is prepared by coatings is coated, and coatings is made up of the raw material of following weight portion: resin
100 parts and light absorbent 4 parts.
Described resin is polyester resin.
Described light absorbent is the mixture of any two kinds of compositions, described light absorbent in white carbon black, graphite and iron oxide black
Particle diameter be 0.1 μm.
Described metal level 3 is prepared by copper ink is coated, and copper ink is anti-with aminoquinoxaline compounds by copper nitrate
The copper chelate that should obtain.
Described conductive adhesive layer 4 is prepared by electrically-conducting paint is coated, and electrically-conducting paint is made up of the raw material of following weight portion: resin
100 parts and conductive material 60 parts.
Described resin is the mixture of any two kinds of compositions in acrylic resin, epoxy resin and polyurethane.
Described conductive material is any one in polyaniline, polypyrrole and polythiophene.
Embodiment 5
The present embodiment is with the difference of above-described embodiment 1:
Described mould release membrance 5 is the off-type force BOPP mould release membrance 5 at 10gf；The thickness of described carrier film 1 is 100 μm；Described insulation
The thickness of layer 2 is 10 μm；The thickness of described metal level 3 is 1.5 μm；The thickness of described conductive adhesive layer 4 is 15 μm；Described mould release membrance
The thickness of 5 is 100 μm.
Described insulating barrier 2 is prepared by coatings is coated, and coatings is made up of the raw material of following weight portion: resin
100 parts and light absorbent 5 parts.
Described resin is any two kinds of compositions in acrylic resin, epoxy resin, polyurethane resin and polyester resin
Mixture.
Described light absorbent is white carbon black, graphite and the mixture of iron oxide black composition, and the particle diameter of described light absorbent is
0.05μm。
Described metal level 3 is prepared by copper ink is coated, and copper ink is anti-with aminoquinoxaline compounds by copper nitrate
The copper chelate that should obtain.
Described conductive adhesive layer 4 is prepared by electrically-conducting paint is coated, and electrically-conducting paint is made up of the raw material of following weight portion: resin
100 parts and conductive material 70 parts.
Described resin is acrylic resin, epoxy resin and the mixture of polyurethane composition.
Described conductive material is the mixture of any two kinds of compositions in polyaniline, polypyrrole and polythiophene.
Above-described embodiment is the present invention preferably implementation, and in addition, the present invention can realize with alternate manner,
Without departing from obvious replacement any on the premise of present inventive concept all within protection scope of the present invention.
Claims (10)
1. an electromagnetic shielding film, it is characterised in that: include the carrier film set gradually from the bottom up, insulating barrier, metal level, lead
Electricity glue-line and mould release membrance, the lower surface of insulating barrier, upper surface respectively with upper surface and the lower surface laminating of metal level of carrier film,
The lower surface of conductive adhesive layer, upper surface are fitted with the upper surface of metal level and the lower surface of mould release membrance respectively.
A kind of electromagnetic shielding film the most according to claim 1, it is characterised in that: described carrier film is PET film；Described release
Film is that off-type force is in PET mould release membrance, PE mould release membrance, OPP mould release membrance, BOPET mould release membrance and the BOPP mould release membrance of 5-10gf
Any one；The thickness of described carrier film is 20-100 μm；The thickness of described insulating barrier is 2-10 μm；The thickness of described metal level
For 0.2-1.5 μm；The thickness of described conductive adhesive layer is 7-15 μm；The thickness of described mould release membrance is 20-100 μm.
A kind of electromagnetic shielding film the most according to claim 1, it is characterised in that: described insulating barrier is coated by coatings
Preparing, coatings is made up of the raw material of following weight portion: resin 100 parts and light absorbent 0.5-5 part.
A kind of electromagnetic shielding film the most according to claim 3, it is characterised in that: described resin is acrylic resin, epoxy
At least one in resin, polyurethane resin and polyester resin.
A kind of electromagnetic shielding film the most according to claim 3, it is characterised in that: described light absorbent be white carbon black, graphite and
At least one in iron oxide black, the particle diameter of described light absorbent is less than 6 μm.
A kind of electromagnetic shielding film the most according to claim 1, it is characterised in that: described metal level is by the coated system of copper ink
, copper ink is to be reacted, with aminoquinoxaline compounds, the copper chelate obtained by copper nitrate.
A kind of electromagnetic shielding film the most according to claim 1, it is characterised in that: described conductive adhesive layer by electrically-conducting paint through being coated with
Cloth prepares, and electrically-conducting paint is made up of the raw material of following weight portion: resin 100 parts and conductive material 30-70 part.
A kind of electromagnetic shielding film the most according to claim 7, it is characterised in that: described resin is acrylic resin, epoxy
At least one in resin and polyurethane.
A kind of electromagnetic shielding film the most according to claim 7, it is characterised in that: described conductive material be silver, copper, ferrum, zinc,
The alloy of at least two composition in any one or silver, copper, ferrum, zinc, nickel and the silver in nickel and silver；Or, described conduction material
Material is at least one in polyaniline, polypyrrole and polythiophene.
10. the preparation method of a kind of electromagnetic shielding film as described in any one of claim 1-9, it is characterised in that: include as follows
Step:
Take a carrier film, at one layer of coatings of coated on one side of carrier film, form insulating barrier；
In upper surface one layer of copper ink of coating of the insulating barrier that step (1) is formed, form metal level；
Take a mould release membrance, at one layer of electrically-conducting paint of coated on one side of mould release membrance, form conductive adhesive layer；
The lower surface of conductive adhesive layer step (3) formed is overlying on the upper surface of the metal level that step (2) is formed, and prepares electromagnetic screen
Cover film.
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| CN106604623A (en) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film and preparation method thereof |
| CN106793727A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN106987218A (en) * | 2017-04-14 | 2017-07-28 | 苏州德佑胶带技术有限公司 | The preparation method of electromagnetic shielding adhesive tape and electromagnetic shielding adhesive tape |
| CN107353777A (en) * | 2017-08-16 | 2017-11-17 | 苏州城邦达力材料科技有限公司 | It is electromagnetically shielded the preparation method of membrane coat and electromagnetic shielding film |
| CN107511302A (en) * | 2017-08-16 | 2017-12-26 | 苏州城邦达力材料科技有限公司 | The system of processing and method of screened film |
| CN108976457A (en) * | 2018-07-25 | 2018-12-11 | 深圳市弘海电子材料技术有限公司 | Using Kapton as FPC electromagnetic shielding film of insulating layer and preparation method thereof |
| CN109890187A (en) * | 2017-12-06 | 2019-06-14 | 广东中晨电子科技有限公司 | FPC electromagnetic shielding film and preparation method thereof |
| CN116716027A (en) * | 2023-08-07 | 2023-09-08 | 广东睿智环保科技股份有限公司 | Light-absorbing powder coating and preparation method thereof |
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| CN106987218A (en) * | 2017-04-14 | 2017-07-28 | 苏州德佑胶带技术有限公司 | The preparation method of electromagnetic shielding adhesive tape and electromagnetic shielding adhesive tape |
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| CN108976457A (en) * | 2018-07-25 | 2018-12-11 | 深圳市弘海电子材料技术有限公司 | Using Kapton as FPC electromagnetic shielding film of insulating layer and preparation method thereof |
| CN108976457B (en) * | 2018-07-25 | 2019-07-02 | 深圳市弘海电子材料技术有限公司 | Using Kapton as FPC electromagnetic shielding film of insulating layer and preparation method thereof |
| CN116716027A (en) * | 2023-08-07 | 2023-09-08 | 广东睿智环保科技股份有限公司 | Light-absorbing powder coating and preparation method thereof |
| CN116716027B (en) * | 2023-08-07 | 2023-10-13 | 广东睿智环保科技股份有限公司 | Light-absorbing powder coating and preparation method thereof |
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