KR101717536B1 - Complex-functional semi-curing phosphor sheet and preparing method of the same - Google Patents
Complex-functional semi-curing phosphor sheet and preparing method of the same Download PDFInfo
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- KR101717536B1 KR101717536B1 KR1020150075279A KR20150075279A KR101717536B1 KR 101717536 B1 KR101717536 B1 KR 101717536B1 KR 1020150075279 A KR1020150075279 A KR 1020150075279A KR 20150075279 A KR20150075279 A KR 20150075279A KR 101717536 B1 KR101717536 B1 KR 101717536B1
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- Prior art keywords
- semi
- protective film
- cured
- matrix resin
- resin layer
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title description 7
- 230000001681 protective effect Effects 0.000 claims abstract description 59
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000011159 matrix material Substances 0.000 claims abstract description 52
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 35
- 239000010703 silicon Substances 0.000 claims abstract description 35
- 239000002131 composite material Substances 0.000 claims abstract description 24
- 229920002050 silicone resin Polymers 0.000 claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- -1 polydimethylsiloxane Polymers 0.000 claims description 9
- 239000007822 coupling agent Substances 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920005553 polystyrene-acrylate Polymers 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000002834 transmittance Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002518 antifoaming agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910052925 anhydrite Inorganic materials 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a bonded composite semi-cured fluorescent sheet and a method of manufacturing the same. More particularly, the present invention relates to a first protective film; A matrix resin layer formed on the first protective film and including a phosphor; A semi-cured silicone layer formed on the matrix resin layer and made of a semi-curable silicone resin; And a second protective film formed on the semi-cured silicon layer, and a method of manufacturing the same.
Description
The present invention relates to a bonded composite semi-cured fluorescent sheet and a method of manufacturing the same. More particularly, the present invention relates to a first protective film; A matrix resin layer formed on the first protective film and including a phosphor; A semi-cured silicone layer formed on the matrix resin layer and made of a semi-curable silicone resin; And a second protective film formed on the semi-cured silicon layer, and a method of manufacturing the same.
Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps.
Therefore, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode is increasingly used as a light source of a light unit such as a lamp, a display device, a display board, a streetlight,
Meanwhile, the application of the conventional dispensing type phosphor used in the Blue LED packaging process has a problem in that the yield is deteriorated due to the time loss and disproportionation amount required for dispensing each chip.
Disclosure of Invention Technical Problem [8] The present invention has been made to solve the above-mentioned problems, and provides a composite semi-hardened fluorescent material sheet and a method of manufacturing the same which can simplify the process and ensure the uniformity of the surface coverage by producing the matrix resin layer and the semi-cured silicone layer integrally. .
In order to achieve the above object, the present invention provides a protective film comprising: a first protective film; A matrix resin layer formed on the first protective film and including a phosphor; A semi-cured silicone layer formed on the matrix resin layer and made of a semi-curable silicone resin; And a second protective film formed on the semi-cured silicon layer. The present invention also provides a bonded semi-cured fluororesin sheet.
At this time, the thickness of the matrix resin layer is preferably 60 to 250 탆, and the thickness of the semi-cured silicon layer is preferably 10 to 25 탆.
The semi-curable silicone resin preferably contains high molecular weight silicon, low molecular weight silicone, curing agent, coupling agent, initiator and solvent.
The first protective film and the second protective film are preferably one selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, acrylic resin, polycarbonate, polystyrene, and polymethyl methacrylate.
In addition, the present invention provides a method of manufacturing a semiconductor device, comprising: preparing a first protective film; Forming a matrix resin layer including a phosphor on the first protective film to form a first film; Preparing a second protective film; Forming a semi-cured silicone layer made of a semi-curable silicone resin on the second protective film to form a second film; And integrating the first film and the second film such that the first protective film, the matrix resin layer, the semi-cured silicon layer, and the second protective film can be sequentially formed. A method of producing a phosphor sheet is also provided.
Here, the thickness of the matrix resin layer is 60 to 250 탆, and the thickness of the semi-cured silicon layer is 10 to 25 탆.
The adhesive composite semi-cured fluorescent material sheet according to the present invention is capable of ensuring the uniformity of the surface coating amount, has a semi-hardened silicon-integrated type and has a simple process, and has the effect of securing adhesion to silicone material of an adhesive material.
1 is a cross-sectional view of a bonded composite semi-cured fluorescent material sheet according to the present invention.
Hereinafter, the present invention will be described.
The present invention provides a protective film comprising: a first protective film; A matrix resin layer formed on the first protective film and including a phosphor; A semi-cured silicone layer formed on the matrix resin layer and made of a semi-curable silicone resin; And a second protective film formed on the semi-cured silicon layer. The present invention also provides a bonded semi-cured fluororesin sheet.
The matrix resin layer includes a phosphor, and the phosphor is excited by the first light emitted by the light source to emit the second light.
That is, the adhesive composite semi-cured fluorescent material sheet has the effect of changing the wavelength of the light emitted from the light source and releasing it to the outside.
Therefore, the adhesive composite semi-cured fluorescent material sheet is applied to a light source such as various lighting devices, a backlight unit, a light emitting device, and a display device, and is used for generating light having various wavelengths, or a color rendering index ), And the like.
Hereinafter, the adhesive composite semi-cured fluorescent material sheet according to the present invention will be described in more detail for each constitution.
The first protective film is preferably one selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, acrylic resin, polycarbonate, polystyrene and polymethyl methacrylate, but is not limited thereto.
The first protective film can prevent the matrix resin layer formed on the first protective film from being exposed to air or the like to prevent foreign matter from adhering thereto. The adhesive composite semi-cured fluorescent material sheet may be attached to a light source after removing the first protective film.
The thickness of the first protective film may be 10 to 100 mu m, preferably 20 to 70 mu m.
The matrix resin layer may be formed on the first protective film.
The matrix resin layer is preferably formed of a material having good light transmittance, viscosity, curing temperature, and the like. The adhesive composite semi-cured fluorescent material sheet can be applied to a light source emitting light at a high temperature, so that it can maintain good light transmittance, viscosity and hardness even at a high temperature.
Specifically, the matrix resin layer has a light transmittance of 80% or more, is cured at 120 ° C or less, and has a viscosity of 2000 to 10,000 cps, and can be formed of a material having good adhesiveness to the first protective film. For example, the matrix resin layer may be formed of at least one of a resin material and a silicon material, and preferably a silicone resin (Silicone Resin).
The thickness of the matrix resin layer is preferably 60 탆 to 150 탆, but is not limited thereto. The matrix resin layer having such a thickness range can easily mix a phosphor, a diffusing agent, a defoaming agent, and the like to be described later, light can be stably transmitted, and can be easily applied on the first protective film.
Meanwhile, the matrix resin layer may include a phosphor. The fluorescent material may be contained in the matrix resin layer by mixing, for example, in a liquid matrix resin layer and stirring using an agitator.
The phosphor is excited by the first light emitted by the light source and emits the second light. For example, at least one of a silicate series, a YAG series, and a TAG series may be used.
The phosphor may include at least one of yellow, red, green, and blue phosphors that are excited by the first light emitted from the light source to emit yellow, red, green, and blue light. The present invention is not limited thereto.
The fluorescent material may be included in the matrix resin layer in a different kind and amount depending on the light source to which the adhesive composite semi-hardened fluorescent material sheet is applied.
For example, when the adhesive composite semi-cured fluorescent material sheet is applied to a white light source, the matrix resin layer may include green and red phosphors, and 1 to 60 weight parts of the green phosphor may be added to 100 parts by weight of the matrix resin layer And 1 to 60 parts by weight of the red phosphor may be included.
When the adhesive composite semi-cured fluorescent material sheet is applied to a blue light source, the matrix resin layer may include green, yellow and red phosphors, and 1 to 60 weight parts of the green phosphor may be added to 100 parts by weight of the matrix resin layer. 1 to 60 parts by weight of the yellow phosphor and 1 to 60 parts by weight of the red phosphor.
As described above, the type and amount of the fluorescent material contained in the matrix resin layer may vary depending on the type of the light source, but the present invention is not limited thereto.
The matrix resin layer may further include at least one of a diffusing agent, a defoaming agent, an additive, and a curing agent.
The diffusing agent can diffuse the light incident on the matrix resin layer by scattering. The diffusing agent may be, for example, silicon oxide (SiO2), titanium oxide (TiO2), zinc oxide (ZnO), barium sulfate (BaSO4), calcium carbonate (CaSO4), magnesium carbonate (MgCO3) ) 3), synthetic silica, glass beads, and diamond. However, the present invention is not limited thereto.
The particle size of the diffusing agent may be selected to a size suitable for light diffusion, and may be formed to have a diameter of, for example, 5 to 7 μm.
The antifoaming agent can remove the air bubbles in the matrix resin layer to improve the reliability of the adhesive composite semi-cured fluorescent material sheet. In particular, it is possible to solve the bubble problem which is a problem when the matrix resin layer is coated on the first protective film by a screen printing method.
The defoaming agent may include at least one of octanol, cyclohexanol, ethylene glycol, and various surfactants, but is not limited thereto.
The curing agent can cure the matrix resin layer, and the additive can be used to evenly disperse the phosphor in the matrix resin layer.
The semi-cured silicon layer may be formed on the matrix resin layer. The semi-cured silicon layer has good light transmittance and heat resistance, and can be formed of a silicone resin having particularly excellent adhesiveness.
For example, the semi-cured silicone layer may be formed of a silicone resin, preferably a silicone / solventless type silicone resin having an additional curable functional group. The silicone / solventless type silicone resin having an additional curable functional group has excellent adhesiveness and high light transmittance. Therefore, it is necessary to use a separate (non-curable) silicone resin for attaching the adhesive composite semi-cured fluorescent material sheet to a light source or the like There is no need to form an adhesive member.
More specifically, the semi-curable silicone resin preferably includes but is not limited to high molecular weight silicon, low molecular weight silicon, a curing agent, a coupling agent, an initiator and a solvent.
According to one embodiment of the present invention, the semi-cured silicon layer is made of silicon (SH-9000) in which a high molecular weight silicon and a low molecular weight silicon are mixed, a hardener (CAT-5000) May include, but are not limited to, a coupling agent (ADP675), a PDMS azo initiator (VPS-1001) and a solvent (TOL, MEK) to aid curing.
The thickness of the semi-cured silicon layer is preferably 10 to 25 占 퐉, but is not limited thereto.
The semi-cured silicon layer having such a thickness serves to buffer the heat generated from the light source from being transmitted to the fluorescent substance contained in the matrix resin layer, thereby reducing the phenomenon that the fluorescent substance is deteriorated by heat.
Particularly, since the red phosphor has a characteristic of being vulnerable to heat, the protective effect of the phosphor by the semi-cured silicon layer can be more evident.
When the semi-cured silicon layer contains volatile toluene, it is formed into a semi-cured state on the matrix resin layer, and then heat is applied by an electric oven, an infrared drier or the like without using a separate curing agent Whereby curing can be performed. However, the semi-cured silicon layer may be cured by adding a curing agent, but the present invention is not limited thereto.
The second protective film may be formed on the semi-cured silicon layer. The second protective film may prevent the semi-cured silicon layer from being exposed to air or the like to lose the adhesive force. The adhesive composite semi-cured fluorescent material sheet may be attached to a light source after removing the second protective film.
The second protective film is preferably one selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, acrylic resin, polycarbonate, polystyrene and polymethyl methacrylate, but is not limited thereto.
The thickness of the second protective film may be 10 to 100 mu m, and preferably 20 to 70 mu m.
Hereinafter, a method for manufacturing a bonded composite semi-cured fluorescent material sheet according to an embodiment of the present invention will be described in detail. However, the contents overlapping with those described above will be briefly explained or omitted.
First, a first protective film is prepared, and the matrix resin layer is formed on the prepared first protective film.
The first protective film may be prepared by selecting materials and sizes thereof according to the type of light source to which the adhesive composite semi-cured fluorescent material sheet is applied.
The matrix resin layer may be formed on the first protective film.
The matrix resin layer can be formed, for example, by mixing and stirring a silicone resin, a fluorescent material or the like to form a liquid matrix resin material, and then applying the liquid matrix resin material onto the first protective film.
The matrix resin layer may be formed on the first protective film by, for example, a screen printing method, a slit coating method, a roll coating method, or the like, followed by curing. The matrix resin layer may be cured by drying at a temperature of about 100 DEG C by an electric oven, an infrared drier, or the like, or by adding a curing agent.
Thereafter, a second protective film is prepared, and the semi-cured silicon layer is formed on the second protective film prepared.
At this time, the semi-cured silicon layer may be formed in a semi-cured state on the second protective film and then cured.
The semi-cured silicon layer includes silicon of a high molecular weight silicon and a low molecular weight silicon, a hardening agent for hardening the hardening agent, a coupling agent for improving hardness, a PDMS azo initiator and a solvent for hardening But is not limited thereto.
The thickness of the semi-cured silicon layer is preferably 10 to 25 占 퐉, but is not limited thereto.
The semi-cured silicon layer having such a thickness serves to buffer the heat generated from the light source from being transmitted to the fluorescent substance contained in the matrix resin layer, thereby reducing the phenomenon that the fluorescent substance is deteriorated by heat.
Thereafter, the first and second films are integrated so that the first protective film, the matrix resin layer, the semi-cured silicone layer, and the second protective film are sequentially formed, thereby forming the adhesive composite semi-cured fluorescent material sheet .
The adhesive composite semi-cured phosphor sheet according to the embodiment of the present invention has a slim thickness and an improved light transmittance by forming the semi-cured silicon layer, and the manufacturing process thereof can be simplified.
The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
1: Adhesive composite semi-hardened fluorescent sheet
10: first protective film
20: Matrix resin layer
30: semi-cured silicon layer
40: second protective film
Claims (6)
Forming a matrix resin layer including a phosphor on the first protective film to form a first film;
Preparing a second protective film;
Forming a semi-cured silicone layer made of a semi-curable silicone resin on the second protective film to form a second film; And
Forming the adhesive composite semi-cured fluorescent material sheet by integrating the first and second films so that the first protective film, the matrix resin layer, the semi-cured silicone layer, and the second protective film are sequentially formed In addition,
The adhesive composite semi-cured fluorescent sheet is attached after removing the first and second protective films when attached to a light source,
The thickness of the matrix resin layer is 60 to 250 占 퐉, the thickness of the semi-cured silicon layer is 10 to 25 占 퐉,
The semi-curable silicone resin includes silicon mixed with a high molecular weight silicone and a low molecular weight silicone, a curing agent, a coupling agent, a polydimethylsiloxane-based initiator and a solvent,
Wherein the first protective film and the second protective film are one selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, acrylic resin, polycarbonate, polystyrene, and polymethyl methacrylate. ≪ / RTI >
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KR1020150075279A KR101717536B1 (en) | 2015-05-28 | 2015-05-28 | Complex-functional semi-curing phosphor sheet and preparing method of the same |
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KR1020150075279A KR101717536B1 (en) | 2015-05-28 | 2015-05-28 | Complex-functional semi-curing phosphor sheet and preparing method of the same |
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KR101592581B1 (en) * | 2009-10-19 | 2016-02-18 | 엘지이노텍 주식회사 | Optical film and method for fabricating the same |
CN103765313A (en) * | 2011-08-31 | 2014-04-30 | 旭化成电子材料株式会社 | Photosensitive alkali-soluble silicone resin composition |
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