KR101704587B1 - How to implement a complex pattern and complex pattern implemented sheet - Google Patents
How to implement a complex pattern and complex pattern implemented sheet Download PDFInfo
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- KR101704587B1 KR101704587B1 KR1020160027804A KR20160027804A KR101704587B1 KR 101704587 B1 KR101704587 B1 KR 101704587B1 KR 1020160027804 A KR1020160027804 A KR 1020160027804A KR 20160027804 A KR20160027804 A KR 20160027804A KR 101704587 B1 KR101704587 B1 KR 101704587B1
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- pattern
- curable resin
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- resin layer
- ultraviolet
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2045—Exposure; Apparatus therefor using originals with apertures, e.g. stencil exposure masks
- G03F7/2047—Exposure with radiation other than visible light or UV light, e.g. shadow printing, proximity printing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70458—Mix-and-match, i.e. multiple exposures of the same area using a similar type of exposure apparatus, e.g. multiple exposures using a UV apparatus
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
Description
The present invention relates to a method of producing a composite pattern and a sheet on which the composite pattern is embodied. More particularly, the present invention relates to a method of producing a composite pattern capable of forming a pattern of various patterns on a sheet at high resolution, Quot;
Generally, the case of an electronic product such as a cellular phone is injection-molded into a synthetic resin material to produce an injection molded article. In order to protect or enhance the surface of the molded case, various coating methods are applied.
In addition to research on technical fields for miniaturization, slimming, and high integration of electronic products, active research has been conducted recently on design aspects to satisfy not only diverse needs of consumers but also emotions.
For example, a keypad of a portable terminal or a window that surrounds the periphery of an LCD liquid crystal is made of a metal material having excellent durability. In order to impart a decorative beauty to the surface of a keypad or a window of such a metal material, , And a decorative effect layer such as a pearl effect.
However, conventionally, when a decorative effect layer is formed on the surface of a keypad or a window of a metal material, a new layer must be formed in addition to the basic structure of a transfer film including a printing layer or the like, thereby increasing the thickness of the transfer film. There is a problem that the moldability is lowered.
Furthermore, since the new decorative effect layer can be added not only in a planar shape but also in a relatively simple pattern, it is difficult to realize a composite pattern such as a variety of patterns in a stereoscopic and high-quality manner.
In addition, in a method of forming a composite pattern and a sheet (registration number: 10-1417797) having the composite pattern, a second imprint resin layer is formed on the base film on which the first pattern is formed, The auxiliary masters are positioned on the upper side of the layer, the photomask is positioned on the upper side of the auxiliary master, and then the imprinting process and the exposure patterning process are simultaneously performed to form the first pattern, the second pattern and the third pattern on the upper side of the base film in a complex manner However, as the auxiliary masters and the photomask are located together and their thicknesses are increased, there is a limitation in that there is a large error in the resolution due to frequent exposure of the miscellaneous light.
It is an object of the present invention to provide a method of forming a composite pattern capable of forming a pattern of various patterns on a sheet and a sheet in which the composite pattern is implemented.
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According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a base mold having a first pattern formed thereon; A photomask preparation step of preparing a first photomask having a second pattern and a second photomask having a third pattern formed thereon; A second pattern transferring step of transferring the second pattern by contacting the first photomask after applying an ultraviolet curable resin to the upper portion of the base mold; And separating the first photomask from the base mold to which the second pattern is transferred, applying an ultraviolet curable resin to an upper portion of the base mold, and transferring the third pattern by contacting the second photomask And a third pattern transfer step, wherein the base mold preparation step comprises: a first mold pattern forming step of forming a first UV curable resin layer by applying an ultraviolet curing resin between a first mold having the first mold pattern formed thereon and the base film; An ultraviolet curable resin layer forming step; Curing the surface of the first ultraviolet-curable resin layer by pressing the first ultraviolet-curable resin layer and irradiating ultraviolet rays to the surface of the first ultraviolet-curable resin layer; And separating the first UV cured resin layer having the surface hardened from the first mold in a state of being coupled with the base film, wherein a first pattern corresponding to the first mold pattern is formed in the first UV curable resin layer And a second pattern forming step of patterning the composite pattern.
Preferably, the first photomask of the photomask preparation step includes: a first substrate preparation step of preparing a first substrate on which a first print layer is formed; Forming a second ultraviolet curable resin layer by applying a UV curable resin between a second mold having a second mold pattern and a first print layer formed on the first substrate; A second ultraviolet curing resin layer surface curing step of curing the surface of the second ultraviolet curable resin layer by irradiating ultraviolet rays after pressing the second ultraviolet curable resin layer; And a second pattern corresponding to the second mold pattern is formed on the second ultraviolet curable resin layer, the second pattern corresponding to the second mold pattern is separated from the second mold, And a second pattern forming step of forming a second pattern.
Preferably, the second photomask in the photomask preparation step may include: a second substrate preparation step of preparing a second substrate on which a second printed layer is formed; Forming a third ultraviolet cured resin layer by applying a UV curable resin between a third mold having a third mold pattern formed thereon and a second printed layer formed on the second substrate; Curing the surface of the third ultraviolet-curable resin layer by irradiating ultraviolet rays after pressing the third ultraviolet-curable resin layer, and curing the surface of the third ultraviolet-curable resin layer; And a third pattern corresponding to the third mold pattern is formed on the third ultraviolet curing resin layer, the third pattern corresponding to the third mold pattern is separated from the third mold in a state where the third ultraviolet- And a third pattern forming step of forming a second pattern.
Preferably, in the second pattern transferring step and the third pattern transferring step, ultraviolet light is irradiated toward the upper surface of the base mold to expose selectively.
The present invention is also directed to a composite pattern embodied in a method of embodying a composite pattern according to the present invention.
The method of implementing a composite pattern according to the present invention and the sheet on which the composite pattern is implemented by the solution of the above-described problems can effectively implement various types of composite patterns on a single sheet at high resolution.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart for manufacturing a base mold according to a preferred embodiment of the present invention; FIG.
2 is a flow chart of a first photomask fabrication process according to a preferred embodiment of the present invention.
3 is a flowchart illustrating a manufacturing process of a second photomask according to a preferred embodiment of the present invention.
4 is a state diagram of a photomask according to a preferred embodiment of the present invention.
5 is an implementation flowchart of a composite pattern according to a preferred embodiment of the present invention.
Figure 6 is a finished sheet according to a preferred embodiment of the present invention.
Hereinafter, a method of implementing a composite pattern including a base mold preparing step, a photomask preparing step, a second pattern transferring step, and a third pattern transferring step according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Respectively.
First, the base mold preparing step is a step of preparing the
FIG. 1 is a flowchart illustrating a manufacturing process of a
For example, the pattern of the hair line can be formed using sandpaper. In the case of forming the pattern of the hair line by using the sandpaper, the occurrence frequency of the article is small and the cleaning is easy even if the article occurs.
The ultraviolet curing resin is applied between the
At this time, the
1, in the base mold preparing step, the
Next, the photomask preparation step is a step of preparing a
2 is a flowchart illustrating a manufacturing process of a
The surface of the second ultraviolet
3 is a flowchart illustrating a manufacturing process of a
That is, the
The third ultraviolet
In addition, it is preferable to form a release layer (not shown) on the surfaces of the
At this time, the releasing layer may be formed by ejecting a releasing agent. As the releasing agent, a melamine-based releasing agent or a silicone-based releasing agent can be selectively used.
For reference, the melamine-based releasing agent or silicone-based releasing agent can be applied thinly in a liquid phase and is also suitable for use as a material for bonding the first ultraviolet-
4 is a state diagram of a photomask according to a preferred embodiment of the present invention. Referring to FIG. 4, there is shown a state of a photomask which is irradiated with ultraviolet rays and cured during a process according to a photomask preparation step. FIG. 4 shows that a variety of photomasks can be fabricated according to a desired design such as shape and size.
Referring to FIG. 4- (a), when the ultraviolet ray is irradiated, it can be seen that the second pattern is formed by curing only at the A portion. Similarly, referring to FIG. 4- (b), when the ultraviolet ray is irradiated, only the portion B is cured to form the third pattern.
However, in the step of preparing the photomask of the present invention, the order of production of the
Next, the second pattern transferring step is a step of transferring the
That is, in the present invention, the second pattern transferring step and the third pattern transferring step are separately performed because conventionally, the auxiliary master and the photomask are placed on the upper side of the base film so that the first pattern, the second pattern, However, since the auxiliary masters and the photomasks on the upper side of the base film are thickly laminated together, they are easily exposed to the common light, resulting in a large resolution error as well as a low resolution.
In view of such drawbacks, in the present invention, the
5 is an implementation flowchart of a composite pattern according to a preferred embodiment of the present invention. Referring to FIG. 5, it can be seen that a composite pattern can be implemented on a single sheet using the
That is, an ultraviolet curable resin is applied to an upper portion of the
Finally, in the third pattern transfer step, the
5, an ultraviolet curable resin is applied to the upper portion of the
It is preferable that the second pattern P 1 transferred on the single sheet and the transferred third pattern P 2 are formed at a height of 1 to 5 μm so that sufficient stereoscopic effect can be exhibited.
If the height of the transferred second pattern P 1 and the transferred third pattern P 2 is less than 1 μm, it is not meaningful to implement the composite pattern through the same process as the present invention, none.
On the contrary, if the height of the transferred second pattern P 1 and the transferred third pattern P 2 exceeds 5 탆, not only the thickness of the entire sheet is increased but also the moldability is lowered and it is difficult to realize a normal composite pattern .
Next, after the third pattern transfer step, it is preferable to further perform an etching and coating step for coating the surface of the etched base mold after etching to remove the remaining ultraviolet cured resin of the
More specifically, the residual ultraviolet-curing resin remaining on the
Figure 6 is a finished sheet according to a preferred embodiment of the present invention. Referring to FIG. 6, it can be seen that the second pattern P 1 transferred on the sheet on which the
However, the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention may be embodied otherwise without departing from the spirit and scope of the invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to illustrate them, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of the claims should be construed as being included in the scope of the present invention.
100: base mold
110: first mold
112: first mold pattern
120: a first UV curable resin layer
122: 1st pattern
130: substrate film
200: First photo mask
210: second mold
212: second mold pattern
220: second UV curable resin layer
222: second pattern
230: first substrate
300: Second photomask
310: Third Mold
312: third mold pattern
320: a third ultraviolet curing resin layer
322: Third pattern
330: second substrate
P 1 : transferred second pattern
P 2 : Transferred third pattern
Claims (6)
A photomask preparation step of preparing a first photomask having a second pattern and a second photomask having a third pattern formed thereon;
A second pattern transferring step of transferring the second pattern by contacting the first photomask after applying an ultraviolet curable resin to the upper portion of the base mold; And
The first photomask is separated from the base mold to which the second pattern is transferred, the ultraviolet curable resin is applied to the upper portion of the base mold, and then the second photomask is contacted to transfer the third pattern. 3 pattern transfer step,
The base mold preparing step may include:
Forming a first ultraviolet-curable resin layer by applying an ultraviolet-curable resin between the first mold having the first mold pattern and the base film;
Curing the surface of the first ultraviolet-curable resin layer by pressing the first ultraviolet-curable resin layer and irradiating ultraviolet rays to the surface of the first ultraviolet-curable resin layer; And
A first pattern corresponding to the first mold pattern is formed on the first ultraviolet-curable resin layer while the first ultraviolet-curable resin layer whose surface is cured from the first mold is separated from the base film in a state where the first ultraviolet- And a first pattern forming step of patterning the composite pattern.
In the first photomask of the photomask preparation step,
A first substrate preparation step of preparing a first substrate on which a first print layer is formed;
Forming a second ultraviolet curable resin layer by applying a UV curable resin between a second mold having a second mold pattern and a first print layer formed on the first substrate;
A second ultraviolet curing resin layer surface curing step of curing the surface of the second ultraviolet curable resin layer by irradiating ultraviolet rays after pressing the second ultraviolet curable resin layer; And
And a second pattern corresponding to the second mold pattern is formed on the second ultraviolet curing resin layer while the second ultraviolet curable resin layer whose surface is cured is separated from the second mold in a state of being coupled with the first substrate, And a second pattern forming step of forming a second pattern on the substrate.
Wherein the second photomask in the photomask preparation step comprises:
A second substrate preparation step of preparing a second substrate on which a second printed layer is formed;
Forming a third ultraviolet cured resin layer by applying a UV curable resin between a third mold having a third mold pattern formed thereon and a second printed layer formed on the second substrate;
Curing the surface of the third ultraviolet-curable resin layer by irradiating ultraviolet rays after pressing the third ultraviolet-curable resin layer, and curing the surface of the third ultraviolet-curable resin layer; And
A third pattern corresponding to the third mold pattern is formed on the third ultraviolet curing resin layer while the third ultraviolet curable resin layer having the surface hardened is separated from the third mold in a state of being coupled with the second substrate, And a second pattern forming step of patterning the second pattern.
In the second pattern transferring step and the third pattern transferring step,
And irradiating ultraviolet rays toward the upper surface of the base mold to selectively expose the composite pattern.
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KR1020160027804A KR101704587B1 (en) | 2016-03-08 | 2016-03-08 | How to implement a complex pattern and complex pattern implemented sheet |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180135682A (en) * | 2017-06-13 | 2018-12-21 | 주식회사 케이에이피에스 | Film with 3d image pattern and method for manufacturing the same |
KR20190050168A (en) * | 2017-11-02 | 2019-05-10 | 주식회사 케이에이피에스 | Film with micro pattern and method for manufacturing the same |
KR20210029935A (en) * | 2019-09-09 | 2021-03-17 | 안병학 | Product Of Lenticular Transferring Printed Matter Heat-Adhered By Hot-Melt Resin |
KR102400656B1 (en) * | 2021-02-17 | 2022-05-23 | (주)제이비필름디자인 | Manufacturing method of multi-patterned film and multi-patterned film |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10148950A (en) * | 1996-11-18 | 1998-06-02 | Dainippon Printing Co Ltd | Formation of patterns |
KR20100056483A (en) * | 2007-08-03 | 2010-05-27 | 캐논 가부시끼가이샤 | Imprint method and processing method of substrate |
KR20100130113A (en) * | 2009-06-02 | 2010-12-10 | 엘지디스플레이 주식회사 | Apparatus and method for forming pattern |
KR101417797B1 (en) | 2013-01-07 | 2014-07-14 | 주식회사 세코닉스 | Manufacturing process for making the multi shaped pattern and multi shaped pattern sheet thereby |
-
2016
- 2016-03-08 KR KR1020160027804A patent/KR101704587B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10148950A (en) * | 1996-11-18 | 1998-06-02 | Dainippon Printing Co Ltd | Formation of patterns |
KR20100056483A (en) * | 2007-08-03 | 2010-05-27 | 캐논 가부시끼가이샤 | Imprint method and processing method of substrate |
KR20100130113A (en) * | 2009-06-02 | 2010-12-10 | 엘지디스플레이 주식회사 | Apparatus and method for forming pattern |
KR101417797B1 (en) | 2013-01-07 | 2014-07-14 | 주식회사 세코닉스 | Manufacturing process for making the multi shaped pattern and multi shaped pattern sheet thereby |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180135682A (en) * | 2017-06-13 | 2018-12-21 | 주식회사 케이에이피에스 | Film with 3d image pattern and method for manufacturing the same |
KR101942241B1 (en) * | 2017-06-13 | 2019-01-25 | 주식회사 케이에이피에스 | Film with 3d image pattern and method for manufacturing the same |
KR20190050168A (en) * | 2017-11-02 | 2019-05-10 | 주식회사 케이에이피에스 | Film with micro pattern and method for manufacturing the same |
KR102042757B1 (en) * | 2017-11-02 | 2019-11-08 | 주식회사 케이에이피에스 | Film with micro pattern and method for manufacturing the same |
KR20210029935A (en) * | 2019-09-09 | 2021-03-17 | 안병학 | Product Of Lenticular Transferring Printed Matter Heat-Adhered By Hot-Melt Resin |
KR102264589B1 (en) * | 2019-09-09 | 2021-06-11 | 안병학 | Product Of Lenticular Transferring Printed Matter Heat-Adhered By Hot-Melt Resin |
KR102400656B1 (en) * | 2021-02-17 | 2022-05-23 | (주)제이비필름디자인 | Manufacturing method of multi-patterned film and multi-patterned film |
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