1344422 • 九、發明說明： - 【發明所屬之技術領域】 本發明係有關於一種塑膠元件的製造方法，且特別有 關於一種具有圖案之塑膠元件的製造方法。 【先前技術】 一般的模内裝飾印刷製程（In-Mold Decoration, IMD ) 多半是應用在塑膠殼體之彩飾加工，如電腦塑膠殼體或行 φ 動電話之塑膠殼體等皆可利用此製程形成。傳統的模内裝 飾印刷製程多是先將油墨圖樣以網版印刷方式印刷在例如 聚碳酸S旨（Polycarbonate film)之可塑型的塑膠膜之一面 上，再將此具有油墨圖樣之可塑型塑膠膜一面設置在成型 模具上，以熱壓或高壓成型之方式沖壓出所欲形狀。接著， 將成型模具移除後，便將塑膠膜之多餘部分裁切，再將裁 切好之可塑型塑膠膜置於射出模具中。隨後於上述可塑型 塑膠膜形成有油墨圖樣之一面射出塑料以包覆油墨圖樣 φ 後，即完成模内裝飾印刷製程。 上述之IMD製程，主要利用PC塑膠膜具有可塑成型、 耐磨、耐刮、透光性好的特性，產品可比傳統塑膠射出成 型更優良。另外，IMD製程使用的PC塑膠膜常用厚度在 175〜380/zm之間，如此PC塑膠膜本身才具有相當硬度， 而能達到可塑成型之條件，也因如此只能用網版印刷（因 為凹版印刷無法印製於硬的表面之上）。 然而，網版印刷可印製之圖樣因受到網目解析度低的 960752/ 0660-A41644-TW/fmal 5 1344422 '* 限制（比較粗），一般只用在印文字、線條或簡單的圖案 ·- 套色。若用於製作高解析度的全彩圖樣，所形成之圖樣的 影樣品質則不佳。再者，由於網版印刷製作彩色圖樣時， 需使用至少二個以上的網版來進行各種顏色的套色，因此 不但製程較為複雜且製造成本也較高。 【發明内容】 本發明係提供一種具有圖案的塑膠元件，包括：提供 一薄膜基板；一成膜圖案，以一熱轉印製程來形成於該薄 _ 膜基板上；一複合材料層，形成於該成膜圖案上；以及一 塑膠基板，形成於該複合材料層上。 本發明又提供一種具有圖案之塑膠元件的製作方法， 包括：形成一成膜圖案於一載具上，形成一薄膜基板於該 成膜圖案上，並進行一熱轉印製程，以使該成膜圖案轉印 至該薄膜基板上。接著，移除該載具。形成一複合材料層 於該薄膜基板的成膜圖案上。其次，形成一塑膠基板於該 複合材料層的表面。 【實施方式】 以下配合第1圖至第11圖之製程剖面圖來說明一具有 圖案之塑膠元件的製作方法。 請參考第1圖，形成一成膜圖案12於一載具10上。 載具10為油墨進行圖案轉移過程的載體，可為例如硬板、 軟板或離形紙等材質。另外，載具10可依據欲形成於其表 面上之油墨的性質進行表面處理，例如親水性、脫水性或 960752/ 0660-A41644-TW/fmal 6 1344422 易脫膜處理等。並且’也可按照不同的油墨配方選擇適當 -材質的載具10，例如需要照光的UV光阻油墨，可選用可 透光的離形紙；熱固型的油墨，則可選用耐熱型的離形紙。 在本實施例中，載具10為一耐熱型的離形紙，例如聚氯乙 烯(PVC)塑膠紙。接著，利用電腦繪圖繪製一圖案或藉由影 像掃陁機將一全彩圖樣輸入電腦，再使用與此電腦連線的 噴墨印表機將此等圖案噴印至載具10上，以形成一成膜圖 案12。成膜圖案12可包括一具有高解析度的單色圖案或 鲁全彩圖樣。 請參照第2圖和第3圖，形成一薄膜基板14於成膜圖 案12上，並進行一熱轉印製程，以使成膜圖案12轉印至 薄膜基板14上。薄膜基板14可為透明塑膠薄膜或不透明 塑膠薄膜。在本實施例中’熱轉印製程包括將上述載具1〇 上形成有成膜圖案12覆蓋至薄膜基板14上，且與薄膜基 板14 一起送入一熱轉印機（圖未顯示）内，其中此熱轉印 機具有加壓、加熱與恆溫的功能。之後，在載具1〇上施加 鲁一壓力17並於高溫下烘烤數分鐘，以使成膜圖案12固化 成型》 接著，請參照第4圖，移除載具10，以使上述載具1〇 上的成膜圖案12轉印至薄膜基板14上。 請參照第5圖，隨後藉由一印刷製程，例如噴墨印刷 (ink-jet printing)或網板印刷（screen printing)，形成一複合 材料層26於成膜圖案12上。在一實施例中，複合材料層 26包括一層或複數層套色油墨層16、一層或複數層耐高溫 960752/ 0660-A41644-TW/fmal 7 1344422 • 油墨層18，形成於套色油墨層16上、一層或複數層耐衝 -· 擊油墨層20，形成於耐高溫油墨層18上、一架橋劑材料 層22，形成於耐衝擊油墨層20上、以及一接著劑材料層 24，形成於架橋劑材料層22之上。其中，套色油墨層16 可增加成膜圖案12顏色的對比、濃度和飽和度，接著劑材 料層24則是用以與後續製程之塑料基材結合。在本實施例 中，上述複合材料層26的每一層皆使用網板印刷（screen printing)製程形成。 _ 請參照第6圖至第8圖，其繪示進行一預成型步驟， 以使上述形成有複合材料層26與成膜圖案12的薄膜基板 14形成一特定的幾何形狀。如第6圖所示，首先將上述薄 膜基板14，以形成有複合材料層26之側設置於一成型模 具28上。接著，如第7圖和第8圖所示，可利用熱壓成型 方式，使薄膜基板14受熱成型及冷卻定型，以形成想要的 形狀，隨後再將成型模具28移除。 如第9圖所示，進行一沖切裁剪製程，以移除上述熱 • 壓成型後之薄膜基板14多餘的部分。 請參照第10圖及第11圖，進行一例如模***出成型 (in_mold forming)製程之塑料基材射出步驟，以形成一塑膠 基板38於薄膜基板14上之複合材料層26暴露出來的表 面。首先，將上述裁切好且形成有複合材料層26與成膜圖 案12的薄膜基板14放置於一射出成型機（圖未顯示）的上 下模具30a、30b之間，其中薄膜基板14上形成有複合材 料層26與成膜圖案12之側係朝向下模具30b。接著，將 960752/ 0660-A41644-TW/fmal 8 1344422 • 塑料基材經由下模具30b内的流道32射入上下模具30a、 - 30b之間的模穴31内，使得塑料基材與複合材料層26之 接著劑材料層24(請參照第5圖）相互結合且在一既定溫度 下固化形成塑膠基板38。在本實施例中，塑膠基板38可 為透明或不透明的塑膠材料。 如第11圖所示，移除上下模具30a、30b後，即形成 一具有圖案的塑膠元件60。 相較於傳統採用網板印刷製程形成全彩圖案於塑膠元 • 件的方法，上述實施例所製造之塑膠元件是利用喷墨印刷 技術與轉印技術，直接將電腦上的全彩圖樣或高解析度的 影像圖案形成於塑膠元件上，不需使用多個網板進行各種 顏色的套色，除可降低製造成本及提高生產效率外，也可 用以製作高解析度的影像圖案。另外，由於上述實施例之 塑膠元件60的成膜圖案12上覆蓋有薄膜基板14，因此可 避免成膜圖案12受到外力刮傷而剝落。 雖然本發明已以實施例揭露如上，然其並非用以限定 ® 本發明，任何熟習此項技藝者，在不脫離本發明之精神和 範圍内，當可做更動與潤飾，因此本發明之保護範圍當視 後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖至第11圖為一系列之按照一實施例所製造之具 有圖案之塑膠元件的剖面圖。 【主要元件符號說明】 10 :載具； 960752/ 0660-A41644-TW/fmal 9 1344422 成膜圖案； 薄膜基板； 套色油墨層； 壓力； 而十南溫油墨層 而十衝擊油墨層 架橋劑材料層 接著劑材料層 複合材料層； 成型模具； :上模具； :下模具； 模穴； 流道； 塑膠基板； 塑膠元件。 960752/ 0660-A41644-TW/fmal1344422 • IX. DESCRIPTION OF THE INVENTION: - Technical Field of the Invention The present invention relates to a method of manufacturing a plastic component, and more particularly to a method of manufacturing a patterned plastic component. [Prior Art] The general In-Mold Decoration (IMD) process is mostly applied to the processing of plastic parts of plastic cases, such as computer plastic case or plastic case of φ mobile phone. form. The traditional in-mold decorative printing process is to first print the ink pattern on one side of a plastic film such as a polycarbonate film by screen printing, and then use the plastic film with the ink pattern. One side is placed on the molding die, and the desired shape is punched out by hot pressing or high pressure molding. Then, after the molding die is removed, the excess portion of the plastic film is cut, and the cut plastic film is placed in the injection mold. Then, after the plastic film is formed on one side of the plastic film to form an ink pattern to cover the ink pattern φ, the in-mold decoration printing process is completed. The above IMD process mainly utilizes the plastic film of PC to have the characteristics of plastic molding, abrasion resistance, scratch resistance and good light transmission, and the product can be better than the traditional plastic injection molding. In addition, the thickness of PC plastic film used in IMD process is usually between 175~380/zm, so PC plastic film itself has quite hardness, and can reach the conditions of plastic molding, so it can only be printed by screen (because of gravure Printing cannot be printed on a hard surface). However, the screen printable pattern is limited by the low resolution of the 960752/ 0660-A41644-TW/fmal 5 1344422 '* (relatively thick), and is generally only used in printed characters, lines or simple patterns. chromatography. If used to make a high-resolution full-color pattern, the resulting image of the pattern is not good. Furthermore, since the screen printing is to produce a color pattern, at least two screens are required to perform color registration of various colors, so that the process is complicated and the manufacturing cost is high. SUMMARY OF THE INVENTION The present invention provides a patterned plastic component, comprising: providing a film substrate; a film forming pattern formed on the thin film substrate by a thermal transfer process; a composite material layer formed on The film forming pattern; and a plastic substrate formed on the composite material layer. The invention further provides a method for fabricating a patterned plastic component, comprising: forming a film forming pattern on a carrier, forming a film substrate on the film forming pattern, and performing a thermal transfer process to make the film The film pattern is transferred onto the film substrate. Next, the carrier is removed. A composite material layer is formed on the film formation pattern of the film substrate. Next, a plastic substrate is formed on the surface of the composite material layer. [Embodiment] Hereinafter, a manufacturing method of a plastic element having a pattern will be described with reference to a process sectional view of Figs. 1 to 11 . Referring to FIG. 1, a film formation pattern 12 is formed on a carrier 10. The carrier 10 is a carrier for performing a pattern transfer process of the ink, and may be a material such as a hard plate, a soft plate, or a release paper. Further, the carrier 10 may be subjected to surface treatment depending on the properties of the ink to be formed on the surface thereof, such as hydrophilicity, dehydration or 960752/0606-A41644-TW/fmal 6 1344422 easy release treatment. And 'you can also choose the appropriate material carrier 10 according to different ink formulas, such as UV photoresist inks that need to be illuminated, and light-transmissive release papers; heat-set inks can be selected from heat-resistant ones. Shaped paper. In the present embodiment, the carrier 10 is a heat-resistant release paper such as polyvinyl chloride (PVC) plastic paper. Then, draw a pattern by computer drawing or input a full color pattern into the computer by using an image broom, and then print the pattern onto the carrier 10 by using an inkjet printer connected to the computer to form A film formation pattern 12. The film formation pattern 12 may include a monochrome pattern or a full color pattern having a high resolution. Referring to Figures 2 and 3, a film substrate 14 is formed on the film formation pattern 12, and a thermal transfer process is performed to transfer the film formation pattern 12 onto the film substrate 14. The film substrate 14 may be a transparent plastic film or an opaque plastic film. In the present embodiment, the 'thermal transfer process includes covering the film substrate 12 with the film formation pattern 12 on the film substrate 14 and feeding it together with the film substrate 14 into a heat transfer machine (not shown). Wherein the heat transfer machine has the functions of pressurization, heating and constant temperature. Thereafter, a pressure 17 is applied to the carrier 1 and baked at a high temperature for several minutes to cure the film formation pattern 12. Next, referring to FIG. 4, the carrier 10 is removed to make the carrier The film formation pattern 12 on one side is transferred onto the film substrate 14. Referring to Figure 5, a composite layer 26 is then formed on the film formation pattern 12 by a printing process such as ink-jet printing or screen printing. In one embodiment, the composite layer 26 includes one or more layers of the color ink layer 16, one or more layers of high temperature resistance 960752 / 0660-A41644-TW/fmal 7 1344422 • an ink layer 18 formed on the color ink layer 16, One or more layers of the impact-resistant ink layer 20 are formed on the high temperature resistant ink layer 18, a bridging agent material layer 22, formed on the impact resistant ink layer 20, and an adhesive material layer 24 formed on the bridging agent. Above the material layer 22. Wherein, the color ink layer 16 can increase the contrast, concentration and saturation of the color of the film formation pattern 12, and the material layer 24 is used to bond with the plastic substrate of the subsequent process. In this embodiment, each of the layers of composite material 26 described above is formed using a screen printing process. _ Referring to FIGS. 6 to 8, a preforming step is performed to form the film substrate 14 on which the composite material layer 26 and the film formation pattern 12 are formed into a specific geometric shape. As shown in Fig. 6, the above-mentioned film substrate 14 is first placed on a molding die 28 with the side on which the composite material layer 26 is formed. Next, as shown in Figs. 7 and 8, the film substrate 14 can be thermoformed and cooled to form a desired shape by hot press molding, and then the molding die 28 is removed. As shown in Fig. 9, a punching and cutting process is performed to remove the excess portion of the film substrate 14 after the heat press molding. Referring to Figures 10 and 11, a plastic substrate ejecting step, such as an in-mold forming process, is performed to form a surface of the composite substrate 26 exposed by the plastic substrate 38 on the film substrate 14. First, the film substrate 14 which has been cut and formed with the composite material layer 26 and the film formation pattern 12 is placed between the upper and lower molds 30a, 30b of an injection molding machine (not shown), wherein the film substrate 14 is formed with The side of the composite material layer 26 and the film formation pattern 12 is directed toward the lower mold 30b. Next, 960752 / 0660-A41644-TW/fmal 8 1344422 • The plastic substrate is injected into the cavity 31 between the upper and lower dies 30a, - 30b via the flow path 32 in the lower mold 30b, so that the plastic substrate and the composite material The layer of adhesive material 24 of layer 26 (please refer to Figure 5) is bonded to each other and cured at a predetermined temperature to form a plastic substrate 38. In this embodiment, the plastic substrate 38 can be a transparent or opaque plastic material. As shown in Fig. 11, after the upper and lower dies 30a, 30b are removed, a patterned plastic member 60 is formed. Compared with the traditional method of forming a full-color pattern on a plastic element by using a screen printing process, the plastic component manufactured by the above embodiment uses inkjet printing technology and transfer technology to directly apply a full-color pattern or high on a computer. The resolution image pattern is formed on the plastic component, and it is not necessary to use multiple stencils for color registration of various colors. In addition to reducing manufacturing cost and improving production efficiency, it can also be used to produce high-resolution image patterns. Further, since the film formation pattern 12 of the plastic element 60 of the above embodiment is covered with the film substrate 14, it is possible to prevent the film formation pattern 12 from being scratched by external force. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and the invention can be modified and retouched without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS Figures 1 through 11 are cross-sectional views of a series of patterned plastic elements fabricated in accordance with an embodiment. [Major component symbol description] 10: Vehicle; 960752/ 0660-A41644-TW/fmal 9 1344422 Film formation pattern; Film substrate; Color ink layer; Pressure; and Tenan temperature ink layer and ten impact ink layer bridging agent material layer Substrate material layer composite material layer; forming mold; upper mold; lower mold; mold cavity; flow channel; plastic substrate; plastic component. 960752/ 0660-A41644-TW/fmal