KR101577301B1 - Embossed mold apparatus and products manufacturing method using this - Google Patents
Embossed mold apparatus and products manufacturing method using this Download PDFInfo
- Publication number
- KR101577301B1 KR101577301B1 KR1020150108207A KR20150108207A KR101577301B1 KR 101577301 B1 KR101577301 B1 KR 101577301B1 KR 1020150108207 A KR1020150108207 A KR 1020150108207A KR 20150108207 A KR20150108207 A KR 20150108207A KR 101577301 B1 KR101577301 B1 KR 101577301B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- chip removal
- film
- release film
- hole
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/02—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of stacked sheets
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The present invention relates to a process for forming an adhesive or a pressure sensitive adhesive on a release film for chip removal on a position corresponding to a hole to be formed in a processed film and a process for bonding the chip removal film formed with the adhesive or pressure sensitive adhesive to the processed film A step of forming the hole in the processed film by using a mold part and a step of separating the release film for chip removal from the processed film, Or by the pressure-sensitive adhesive, so that mass production of the product can be carried out quickly and efficiently while eliminating the occurrence of defects by a simple structure, and a method of manufacturing a product using the same.
Description
The present invention relates to a relief mold apparatus and a method of manufacturing a product using the relief mold apparatus. More particularly, the present invention relates to a relief mold apparatus capable of rapidly and efficiently mass- And a manufacturing method thereof.
Conventionally, a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device and a protective film have been cut into wooden or metal molds. However, the integration degree of electronic parts has been improved, It is the embossed mold that is designed to cut these products more precisely and stably.
Such an embossed metal mold is a metal mold using a blade formed with a boss. Generally, a thin steel sheet having a thickness of 0.6 mm to 3 mm is generally etched according to a shape and then produced through CNC precision machining.
The embossed mold is easy to install and easy to use, it can be applied to all presses, it is suitable for processing precision products because of its high precision, and it is possible to remove chips There are advantages.
The relief mold is applied to various fields such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device, and a protective film by the above-
Embossed molds process a workpiece with a blade having a specific pattern, during which chips cut by the blade are generated and these chips remain on the workpiece or are attached to the blade.
Conventionally, a worker removes a chip cut by a blade, and this operation takes a considerable time. In the case of a small-sized chip, the worker is not conspicuous and can not be removed frequently. Respectively.
In addition, in the case where chips are left on the relief mold, a cutting defect occurs to the workpiece following the remaining chip, and the defective cutting results in a defect of the product.
In view of the above, there has been proposed an apparatus for punching out electronic parts equipped with a guard, a punching system disclosed in Japanese Laid-Open Patent Publication No. 11-70500, "Embossed Mold System ", Registered Patent No. 10-1451896, which has been registered in the past.
However, all of the above-described prior art devices have a problem that a considerable cost is required for a mold design, an air piping, and the like as well as the entire device is structurally very complicated.
Particularly, these prior arts have employed an operation mechanism for ejecting a chip by projecting a pin for chip removal and then sucking the discharged chip back into the air to remove the chip. However, such an operation mechanism can reduce the incidence of defective products However, the process delay is inevitable in accordance with the operation sequence, and such a process delay naturally causes a problem that the production amount is decreased.
In order to solve the above problems, a method of using a method of removing chips as a by-product in processing a workpiece is also applied by using a separate member having an attaching ability such as a release tape or the like.
However, such a removing method using a separate member can not separate the adhesive layer having the adhesive force from the workpiece if the adhesive force is increased, and there is a fear that defects such as tearing of the workpiece in the process of separating the workpiece from the release tape .
Further, in the removing method using such a separate member, if the adhesive force is lowered, the chips may not be separated from the release tape.
The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method for manufacturing a product using the same, which enables mass production of products quickly and efficiently while eliminating defects by a simple structure will be.
In addition, the present invention provides an embossing mold apparatus and a method of manufacturing a product using the same, which can reduce the cost of designing a complicated mold and reduce the time consuming to simplify the entire apparatus, thereby improving the efficiency through cost reduction due to initial installation and construction .
According to an aspect of the present invention, there is provided a method for manufacturing a chip removing film, comprising the steps of: forming an adhesive or a pressure sensitive adhesive on a release film for chip removal, Forming a hole in the processed film by using a mold part; and separating the release film for chip removal and the processed film from each other, And the adhesive is removed by the adhesive or the adhesive formed on the release film for chip removal.
Here, the adhesive or the pressure-sensitive adhesive is formed by printing on the release film for chip removal.
In this case, the adhesive or the adhesive may be printed on all or only a part of the hole corresponding to the hole.
The adhesive or the pressure-sensitive adhesive may be hot-air dried or UV-cured.
After the adhesive formed on the release film for chip removal is hot-air dried, the release film for chip removal and the processed film are laminated together.
The adhesive formed on the release film for chip removal is characterized in that the release film for chip removal and the processed film are cured after UV curing.
The pressure sensitive adhesive formed on the release film for chip removal is characterized in that the release film for chip removal and the processed film are UV-cured before or after being laminated.
The adhesive or the pressure-sensitive adhesive formed on the release film for chip removal is characterized in that it is hot-air dried before the release film for chip removal and the processed film are joined together.
The adhesiveness by the adhesive or the adhesiveness by the adhesive is characterized in that the adhesive or the adhesive is formed on the release film for chip removal, followed by hot air drying or UV curing.
The process for forming an adhesive or a pressure-sensitive adhesive on the release film for chip removal is characterized in that the adhesive or the pressure-sensitive adhesive is printed at a position corresponding to the hole on the release film for chip removal.
The step of forming an adhesive or a pressure-sensitive adhesive on the release film for chip removal may include forming the adhesive or the pressure-sensitive adhesive on the entire surface of the release film for chip removal, And the adhesive or the tackiness of the adhesive or the tacky agent formed on the substrate is removed.
According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: forming a mold on a processed film including a relief mold for forming a hole; a printing unit for forming an adhesive or an adhesive on a position corresponding to the hole on the release film for chip removal; And a joint portion for joining the formed release film for chip removal with the processed film, wherein chips generated from the hole are removed by the adhesive or the adhesive formed on the release film for chip removal. Device may be provided.
According to the present invention having the above-described configuration, the following effects can be achieved.
In the present invention, a hole is formed in a processed film by using a mold part including a relief mold, and a plurality of chips generated by the hole formation are removed by a release film for chip removal, Since it is possible to produce high-quality products free from defects, reliable devices can be provided to the producers and reliable products can be delivered to the consumers.
In particular, the present invention omits a complicated driving mechanism that causes unnecessary process delay compared with most related prior arts including the applicant's original request, thereby reducing the TAG time and enabling rapid and efficient mass production.
In addition, the present invention provides a mold having only a blade having a basic specific pattern formed thereon, thereby greatly reducing the time and cost consuming and wasting of complicated and large mold design for preparing the existing embossing mold apparatus and system .
The present invention also provides a method for manufacturing a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, etc., in which chip and fine powder generated by fine hole processing are scattered, In the long term, it will be possible to prevent any health problems.
That is, according to the present invention, by using the adhesiveness or tackiness imparted to the release film for chip removal, the chips and fine powder generated by the hole machining of the mold portion are immediately attached and removed to give a pleasant work environment It becomes possible.
FIG. 1 is a perspective view schematically showing a hole is perforated and a chip is generated by using a relief mold apparatus according to an embodiment of the present invention. FIG.
2 is a conceptual diagram illustrating the overall structure of a relief mold apparatus according to an embodiment of the present invention.
FIG. 3 is a conceptual view of an enlarged cross-
4 is a perspective view showing a state in which an adhesive or an adhesive is printed on the release film for chip removal by the printing unit of the relief mold apparatus according to the embodiment of the present invention.
FIG. 5 is a conceptual view of an enlarged cross-
FIG. 6 is a conceptual view of an enlarged cross-
7 is a conceptual view showing the overall structure of the relief mold apparatus according to the first modified example of the present invention
8 is a conceptual view showing the overall structure of the relief mold apparatus according to the second modification of the present invention
9 is a conceptual view showing the overall structure of the relief mold apparatus according to the third modification of the present invention
10 is a conceptual diagram schematically showing a process of removing an adhesive force or an adhesive force using a remover on an adhesive or a pressure sensitive adhesive formed on a release film for chip removal according to another embodiment of the present invention
BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings.
However, the present invention is not limited to the embodiments described below, but may be embodied in various other forms.
The present embodiments are provided so that the disclosure of the present invention is thoroughly disclosed and that those skilled in the art will fully understand the scope of the present invention.
And the present invention is only defined by the scope of the claims.
Thus, in some embodiments, well known components, well known operations, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention.
In addition, throughout the specification, like reference numerals refer to like elements, and the terms (mentioned) used herein are intended to illustrate the embodiments and not to limit the invention.
In this specification, the singular forms include plural forms unless the context clearly dictates otherwise, and the constituents and acts referred to as " comprising (or having) " do not exclude the presence or addition of one or more other constituents and actions .
Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs.
Also, commonly used predefined terms are not ideally or excessively interpreted unless they are defined.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
1 is a perspective view schematically showing holes formed by using a relief mold apparatus according to an embodiment of the present invention and generating chips. FIG. 1 (a) shows a state before a drilling operation, and FIG. 1 1 (b) is a view showing the state after the drilling operation.
2 is a conceptual view showing the overall structure of a relief mold apparatus according to an embodiment of the present invention.
FIG. 3 is an enlarged schematic cross-sectional view of part A of FIG. 2, and FIG. 4 is a cross-sectional view illustrating a state in which an adhesive or a pressure-sensitive adhesive is printed on a release film for chip removal by a printing unit of a relief mold apparatus according to an embodiment of the present invention. FIG. 5 is a conceptual enlarged sectional view of FIG. 2, and FIG. 6 is a conceptual enlarged sectional view of a portion C of FIG.
1 and 2, a
1, a hole-corresponding portion 11 'at a position corresponding to the
Here, the
At this time, the processed
Such a product P can include, for example, a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, and the like.
Therefore, the present invention is characterized in that a
In particular, the present invention can eliminate the complicated driving mechanism that causes unnecessary process delay compared to the prior arts described above, thereby reducing the TAG time and enabling rapid and efficient mass production.
The present invention also provides a method of manufacturing a mold for molding a mold having a
In addition, the present invention is applicable to workers in a workplace, such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, etc., And prevent any health problems in the long run.
That is, according to the present invention, the
It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention.
First, the embossing mold apparatus according to an embodiment of the present invention will be described in more detail. It can be understood that the apparatus includes a
The
The
The
The
Therefore, the
On the other hand, the
The
7 to 9 to be described later with reference to Figs. 1 to 6, a manufacturing process for forming the
The
It is a matter of course that the direction in which the
The adhesive 31a or the adhesive 31b printed on the
Concretely, the adhesive 31a or the adhesive 31b is formed on the
That is, the adhesive 31a or the adhesive 31b may be printed over the entire area corresponding to the hole corresponding portion 11 'as shown in FIG. 4 (a), and the hole corresponding portion 11' ', And the
Thus, the processed
The lapped
When the upper
The
It is preferable that the adhesive property and adhesiveness of the adhesive 31a and the adhesive 31b are expressed after the adhesive 31a or the adhesive 31b is printed on the
This is because the adhesive 31a or the adhesive 31b adheres to the
Therefore, it is preferable that the adhesive property or tackiness is caused by hot-air drying or UV curing described later after the adhesive 31a or the adhesive 31b is printed on the
In other words, the adhesive 31a or the adhesive 31b can be hot-air dried or UV-cured to exhibit adhesiveness or adhesiveness.
7, the
The processed
That is, the hot air drying by the
The hot air is dried before the adhesive 31a is laminated in order to prevent damage to the processed
The present invention is also characterized in that it is arranged between the
Thus, the processed
That is, the UV curing by the
The reason that the adhesive 31a is UV cured after being laminated is that if the adhesive 31a is UV-cured before the processed
9, when the pressure
Here, since the adhesive 31b is made of a detachable material, hot-air drying and UV curing may be performed before or after laminating the processed
At this time, even if the
Referring to FIGS. 7 through 9 together with FIG. 2, the present invention is characterized in that the processed
Here, although not shown in the drawing, the separating portion is separately provided for separating the processed
A method of manufacturing the product P using the relief mold apparatus according to various embodiments of the present invention will now be described in more detail with reference to FIGS. 1 to 9.
The present invention is characterized in that chips 12 generated from each of a plurality of
Here, it is understood that the
At this time, the
As described above, the completion work shown in Figs. 2 to 9 may include a process of printing, laminating, pressing, and separating.
First, a process of printing an adhesive 31a or an adhesive 31b on the
Thereafter, a process of laminating the
Next, a process of forming the
Subsequently, a process of separating the
Thus, the
At this time, it is needless to say that the
The adhesive 31a or the adhesive 31b is printed including a position corresponding to the
On the other hand, when the adhesive 31a is printed on the surface of the
After the pressure-
On the other hand, the adhesive 31a or the adhesive 31b can be printed over the entire surface of the
That is, as shown in FIG. 10 (b), the removing agent does not leave the adhesive 31a or the adhesive 31b up to the portion where the adhesive 31a or the adhesive 31b is unnecessary, (31a) or the adhesive (31b).
10 (c), the removing
It is needless to say that the adhesive 31a or the adhesive 31b may be removed by a method of precisely printing using the same equipment as the
Therefore, the adhesive 31a or the adhesive 31b is removed by the removing
As described above, the printing of the adhesive 31a, the adhesive 31b, the
Here, the adhesive 31a may be any one of A, B, C, and D, or a combination of one or more.
At this time, the adhesive 31b may be any one of a, b, c, and d, or a combination of one or more.
The
As described above, the present invention is based on a basic technical idea to provide a relief mold apparatus and a method of manufacturing a product using the same, which enable mass production of a product quickly and efficiently while eliminating defects by a simple structure have.
It will be apparent to those skilled in the art that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.
10 ... processed film
11 ... hole
11 '... hole forming portion
12 ... chip
20 ... mold part (embossed mold)
20d ... lower fixed mold
20u ... upper movable mold
22 ... blade
30 ... Release film for chip removal
31a ... glue
31b ... Adhesive
32 ... Remover
40 ... printing section
51 ... hot air dryer
52 ... UV curing machine
60 ... joint part
70 ... auxiliary release film
72 ... adhesive layer
80 ... guide roller
Claims (12)
Bonding the chip removing film on which the adhesive or pressure-sensitive adhesive is formed, with the processed film;
Forming the hole in the processed film by using a mold part;
Separating the release film for chip removal and the processed film from each other,
Wherein the chip generated during the process of forming the hole using the mold part is removed by the adhesive or the adhesive formed on the release film for chip removal.
Wherein the adhesive or the adhesive is formed by printing on the release film for chip removal.
Wherein the adhesive or the adhesive is printed on all or only a part of the hole corresponding to the hole.
Wherein the adhesive or the pressure-sensitive adhesive is hot-air dried or UV-cured.
Wherein the release agent for chip removal and the processed film are joined together after the adhesive formed on the release film for chip removal is hot air dried.
Wherein the adhesive formed on the release film for chip removal is UV-cured after being laminated with the release film for chip removal and the processed film.
Wherein the pressure sensitive adhesive formed on the release film for chip removal is UV cured before or after the release film for chip removal and the processed film are laminated or laminated.
Wherein the adhesive or the pressure-sensitive adhesive formed on the release film for chip removal is hot-air dried before the release film for chip removal and the process film are laminated together.
Wherein the adhesiveness by the adhesive or the adhesiveness by the adhesive is expressed by hot air drying or UV curing after the adhesive or the adhesive is formed on the release film for chip removal. Way.
The step of forming an adhesive or a pressure-sensitive adhesive on the release film for chip-
And the adhesive or the adhesive is printed at a position corresponding to the hole on the release film for chip removal.
The step of forming an adhesive or a pressure-sensitive adhesive on the release film for chip-
The adhesive or the adhesive is formed over the entire surface of the release film for chip removal and then the adhesiveness or tackiness of the adhesive or the adhesive formed on the remaining portion except for the portion where the hole is to be formed is removed And a method of manufacturing a product using the embossing mold apparatus.
A printing unit for forming an adhesive or a pressure-sensitive adhesive at a position corresponding to the hole on the release film for chip removal,
And a joint portion for joining the release film for chip removal, on which the adhesive or the adhesive is formed, with the processed film,
Wherein the mold part forms the hole in the processed film laminated with the chip removing mold film by the joint part,
Wherein the chip generated from the hole is removed by the adhesive or the adhesive formed on the release film for chip removal.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020150108207A KR101577301B1 (en) | 2015-07-30 | 2015-07-30 | Embossed mold apparatus and products manufacturing method using this |
PCT/KR2015/008751 WO2017018581A1 (en) | 2015-07-30 | 2015-08-21 | Embossing mold apparatus and method for preparing product by means of same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150108207A KR101577301B1 (en) | 2015-07-30 | 2015-07-30 | Embossed mold apparatus and products manufacturing method using this |
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KR101577301B1 true KR101577301B1 (en) | 2015-12-15 |
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KR1020150108207A KR101577301B1 (en) | 2015-07-30 | 2015-07-30 | Embossed mold apparatus and products manufacturing method using this |
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WO (1) | WO2017018581A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180063417A (en) | 2016-12-01 | 2018-06-12 | (주)파인테크 | Embossed mold apparatus and products manufacturing method using this |
KR20190074128A (en) * | 2017-12-19 | 2019-06-27 | (주)파인테크 | Chips deleting apparatus of coverlay film for fpcb |
KR20200000976A (en) * | 2018-06-26 | 2020-01-06 | 주식회사 고려이노테크 | Apparatus for making holes |
WO2020017684A1 (en) * | 2018-07-16 | 2020-01-23 | (주)파인테크 | Apparatus and method for punching film |
Citations (4)
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JP2562182B2 (en) | 1988-07-28 | 1996-12-11 | 日東電工株式会社 | Release sheet temporary adhesion flexible circuit manufacturing method and release sheet temporary adhesion flexible circuit |
JP2001127410A (en) | 1999-10-25 | 2001-05-11 | Lintec Corp | Manufacturing method for circuit board |
KR100432685B1 (en) | 1999-06-18 | 2004-05-22 | 방성현 | A Methods and Device For Cutting Printed Matter |
KR101451896B1 (en) | 2013-01-21 | 2014-10-23 | (주)파인테크 | Embossed mold system |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101469055B1 (en) * | 2013-09-16 | 2014-12-05 | (주)파인테크 | A embossed mold and a embossed mold apparatus comprising the same |
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2015
- 2015-07-30 KR KR1020150108207A patent/KR101577301B1/en active IP Right Grant
- 2015-08-21 WO PCT/KR2015/008751 patent/WO2017018581A1/en active Application Filing
Patent Citations (4)
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JP2562182B2 (en) | 1988-07-28 | 1996-12-11 | 日東電工株式会社 | Release sheet temporary adhesion flexible circuit manufacturing method and release sheet temporary adhesion flexible circuit |
KR100432685B1 (en) | 1999-06-18 | 2004-05-22 | 방성현 | A Methods and Device For Cutting Printed Matter |
JP2001127410A (en) | 1999-10-25 | 2001-05-11 | Lintec Corp | Manufacturing method for circuit board |
KR101451896B1 (en) | 2013-01-21 | 2014-10-23 | (주)파인테크 | Embossed mold system |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180063417A (en) | 2016-12-01 | 2018-06-12 | (주)파인테크 | Embossed mold apparatus and products manufacturing method using this |
KR101943543B1 (en) | 2016-12-01 | 2019-04-18 | (주)파인테크 | Embossed mold apparatus and products manufacturing method using this |
KR20190074128A (en) * | 2017-12-19 | 2019-06-27 | (주)파인테크 | Chips deleting apparatus of coverlay film for fpcb |
KR102088370B1 (en) * | 2017-12-19 | 2020-03-13 | (주)파인테크 | Chips deleting apparatus of coverlay film for fpcb |
KR20200000976A (en) * | 2018-06-26 | 2020-01-06 | 주식회사 고려이노테크 | Apparatus for making holes |
KR102110832B1 (en) | 2018-06-26 | 2020-05-13 | 주식회사 고려이노테크 | Apparatus for making holes |
WO2020017684A1 (en) * | 2018-07-16 | 2020-01-23 | (주)파인테크 | Apparatus and method for punching film |
Also Published As
Publication number | Publication date |
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WO2017018581A1 (en) | 2017-02-02 |
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