JPH06170822A - Sheet proceed product and production thereof - Google Patents
Sheet proceed product and production thereofInfo
- Publication number
- JPH06170822A JPH06170822A JP4349900A JP34990092A JPH06170822A JP H06170822 A JPH06170822 A JP H06170822A JP 4349900 A JP4349900 A JP 4349900A JP 34990092 A JP34990092 A JP 34990092A JP H06170822 A JPH06170822 A JP H06170822A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- protective film
- processing
- film
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、シートを切断、穿孔等
して得るシート加工品及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processed sheet product obtained by cutting or punching a sheet and a method for producing the same.
【０００２】[0002]
【従来の技術】グリーンシート法や押しだし法等のシー
ト成形法は広く用いられ、各分野で応用されている。中
でも、セラミック原料をシート状としたセラミックシー
トは、単層では耐熱、耐摩耗用等の板状の製品や電気回
路を形成するセラミック基板、感熱紙用発熱体基板等の
製作用として利用されている。また、多層に重ねるもの
としては、多層配線基板や半導体素子パッケージ、積層
型セラミックコンデンサ、圧電アクチュエータ等の製作
に広く用いられている。成形されたシートは所定の形状
に切断・穿孔されシート加工品として単層で焼成等して
使用される他、例えば、各シート加工品の所定の穿孔に
適当な方法で導電体を孔充填され、所定の配線パターン
等が印刷された後、ラミネート処理等により多層化さ
れ、焼成されて多層配線基板あるいは半導体素子用パッ
ケージとなる。2. Description of the Related Art Sheet forming methods such as a green sheet method and an extrusion method are widely used and applied in various fields. Among them, a ceramic sheet made of a ceramic raw material is used as a single layer for producing plate-shaped products such as heat-resistant and abrasion-resistant products, ceramic substrates for forming electric circuits, and heat-generating substrate substrates for thermal paper. There is. Further, as a multi-layered structure, it is widely used for manufacturing a multilayer wiring board, a semiconductor element package, a multilayer ceramic capacitor, a piezoelectric actuator, and the like. The formed sheet is cut and perforated into a predetermined shape and used as a sheet processed product by firing in a single layer.For example, a conductor is hole-filled by an appropriate method for the predetermined perforation of each sheet processed product. After a predetermined wiring pattern or the like is printed, it is laminated by a laminating process or the like and baked to form a multilayer wiring board or a semiconductor element package.
【０００３】従来、シートの切断・穿孔等の加工は、切
断刃による切断や、打ち抜き金型による切断・穿孔など
の方法がとられていた。これらの加工は、切断刃による
切断では、直線状あるいはこれに類する切断形状しか加
工できず、打ち抜き金型によるものでは、金型によって
加工形状・寸法が決ってしまうため、形状・寸法の変更
が困難であると共に、穿孔の穴径の小さなものは加工困
難であった。更に、近年の多層化・高精度加工の要求が
高まり、切断・穿孔時に金型に切断カスが付着して、加
工精度が低下するのを防止するために、定期的に金型の
清掃・洗浄が必要となることも問題となっていた。Conventionally, the processing such as cutting and punching of a sheet has been performed by cutting with a cutting blade or cutting and punching with a punching die. In these processes, when cutting with a cutting blade, only a linear shape or a similar cutting shape can be processed, and with a punching die, the processing shape and dimensions are determined by the die, so it is not possible to change the shape and dimensions. In addition to the difficulty, it was difficult to process a hole having a small hole diameter. Furthermore, in recent years the demand for multi-layering and high-precision machining has increased, and in order to prevent cutting dust from adhering to the mold during cutting and punching, and reducing the machining accuracy, the mold is regularly cleaned and washed. Was also a problem.
【０００４】かかる問題を解決するために、切断・穿孔
等の加工をレーザ光線によって行なう方法がある。レー
ザ加工は、切断形状の自由度が大きく、形状・寸法の変
更も容易に対応できる上、比較的小さい穴の穿孔も可能
となる。また、金型を必要としないため、金型の清掃等
のメンテナンスも不要となる。In order to solve such a problem, there is a method of performing processing such as cutting and punching with a laser beam. Laser processing has a high degree of freedom in cutting shape, can easily change the shape and size, and can punch relatively small holes. Further, since a mold is not required, maintenance such as cleaning of the mold is unnecessary.
【０００５】[0005]
【解決しようとする課題】しかし、レーザ加工は、レー
ザ光線の持つ熱的作用により、焦点付近にある物質を瞬
時に気化等して加工を行うものである。そのため、当該
物質の爆発的気化や融解により、加工部、特に加工部上
面角部では、角部付近が火山の如くふくらみ、角部は溶
けただれた如き形の加工きず（以下、単に「加工きず」
という）となることが多かった。従って、単層で高精度
の基板等として使用するには、バリ状加工きずとして問
題となり、研磨等の後加工が必要であった。多層化して
多層配線基板や半導体素子用パッケージに用いるには、
切断部や穿孔部等のふくらみによる層厚の不均一や、角
部の溶けただれ状部分による穿孔部で言えばテーパー状
の形状としての穴径の不均一が、精度面で問題となって
いた。上記問題点に鑑み、本発明は、シートをレーザ光
線により切断・穿孔等の加工をする場合に、上記加工き
ずの無い加工部を有するシート加工品及びその製造方法
を提供することを目的とする。However, laser processing is performed by instantaneously vaporizing a substance in the vicinity of the focal point by the thermal action of a laser beam. Therefore, due to the explosive vaporization and melting of the substance, the processed part, especially the upper corner of the processed part, swells like a volcano near the corner, and the corner has a melting-like shape. "
It was often the case. Therefore, when it is used as a single-layered substrate with high accuracy, it becomes a problem as a burr-like processing flaw and requires post-processing such as polishing. To use multiple layers for multilayer wiring boards and semiconductor device packages,
The unevenness of the layer thickness due to the bulge of the cut portion and the perforated portion, and the non-uniformity of the hole diameter as a tapered shape in the perforated portion due to the melted and welded portion of the corner were problems in terms of accuracy. . In view of the above problems, it is an object of the present invention to provide a sheet processed product having a processed portion having no processing flaws and a method for manufacturing the same when the sheet is processed by cutting or punching with a laser beam. .
【０００６】[0006]
【問題を解決するための手段】本発明は、シートをレー
ザ光線により切断・穿孔等して得る加工品において、シ
ートに保護皮膜を形成した後に、保護皮膜の面からレー
ザ光線による切断、穿孔等の加工を行ったことを特徴と
する。および、かかる加工品の製造方法として、シート
に保護皮膜を形成した後に、保護皮膜の面からレーザ光
線による切断、穿孔等の加工を行うことを特徴とする。
シートに保護皮膜を形成するには、シートに溶剤を塗布
し、溶剤でシート中のバインダー等を溶かして粘着力を
出させた後、保護皮膜用フィルムを貼付ける方法が好適
であるが、フィルムにあらかじめ粘着剤等を塗布してお
き、シートに貼付ける方法でも良い。また、塗布型の皮
膜形成方法としては、溶剤に保護皮膜の成分を分散させ
た溶液を、シートに塗布し、当該溶剤を揮発させて保護
皮膜を得る方法や、反応性の薬剤を塗布し、反応後に保
護皮膜となるような方法で、皮膜を形成することもあ
る。The present invention relates to a processed product obtained by cutting and punching a sheet with a laser beam, after forming a protective film on the sheet, and then cutting and punching with a laser beam from the surface of the protective film. It is characterized by having been processed. Further, as a method of manufacturing such a processed product, after forming a protective film on a sheet, processing such as cutting with a laser beam and perforation is performed from the surface of the protective film.
In order to form a protective film on the sheet, it is preferable to apply a solvent to the sheet, dissolve the binder etc. in the sheet with the solvent to give an adhesive force, and then attach the protective film to the sheet. It is also possible to apply a pressure sensitive adhesive or the like in advance to the sheet and attach it to the sheet. Further, as a coating type film forming method, a solution in which components of a protective film are dispersed in a solvent is applied to a sheet, a method for obtaining a protective film by volatilizing the solvent, or a reactive agent is applied, The film may be formed in such a manner that a protective film is formed after the reaction.
【０００７】保護皮膜は、フィルムをシートに貼付ける
方法の場合には、プラスチックフィルム（ＰＥＴ、ポリ
エステル、エポキシ樹脂板等）及び金属フィルム（アル
ミ箔等）が好適である。粘着剤付きフィルムは、いわゆ
るセロテープの如きものをいい、基材としてはポリエス
テル等のプラスチックや金属のフィルムを、粘着剤とし
ては有機系粘着剤が適宜使用される。また、塗布型の皮
膜形成の時には、ゴム（ラテックスゴム、アラビアゴ
ム、シリコンゴム）やエポキシ樹脂、アクリル樹脂など
の有機系皮膜が好適である。皮膜の材質・厚み・幅等は
シートの材質・厚み・幅・柔らかさや、レーザ出力の波
長・大きさ等により適宜決定されるものである。貼付け
や塗布に使用する溶剤は、シート中のバインダーや貼付
け用フィルムの材質、分散させる保護皮膜の成分、揮発
速度等を考慮して選択される。例えば、ＰＥＴフィルム
を貼付けるときには、シートにもよるが、脂肪族系、芳
香族系有機溶剤等が好適である。粘着剤としては、シー
トの材質・厚みや所望の粘着力・ノリ残り等を考慮して
選択される。レーザ光源は、加工機用として使用されれ
ば種類は問わないが、通常炭酸ガスレーザやＹＡＧレー
ザ、エキシマレーザ等が好適に使用され、皮膜やシート
の材質や形態、出力、波長等を考慮して選択される。When the film is attached to a sheet, the protective film is preferably a plastic film (PET, polyester, epoxy resin plate, etc.) and a metal film (aluminum foil, etc.). The film with a pressure-sensitive adhesive refers to a so-called cellophane tape, a plastic or metal film such as polyester is used as a substrate, and an organic pressure-sensitive adhesive is appropriately used as a pressure-sensitive adhesive. Further, when forming a coating type coating, an organic coating such as rubber (latex rubber, gum arabic, silicone rubber), epoxy resin, acrylic resin or the like is suitable. The material, thickness, width, etc. of the film are appropriately determined depending on the material, thickness, width, softness of the sheet, wavelength, size of laser output, etc. The solvent used for sticking or coating is selected in consideration of the binder in the sheet, the material of the sticking film, the components of the protective film to be dispersed, the volatilization rate, and the like. For example, when a PET film is attached, an aliphatic or aromatic organic solvent or the like is suitable, depending on the sheet. The pressure-sensitive adhesive is selected in consideration of the material / thickness of the sheet, desired adhesive strength, residual adhesiveness, and the like. The laser light source may be of any type as long as it is used for a processing machine, but normally a carbon dioxide gas laser, a YAG laser, an excimer laser or the like is preferably used, and the material and form of the film or sheet, output, wavelength, etc. are considered. To be selected.
【０００８】[0008]
【作用】本発明は、シートに保護皮膜を形成した後に、
当該保護皮膜の面からレーザ加工を行うようにしたた
め、レーザ光線による加工きずが、保護皮膜に起こり、
シートには加工部角部付近のふくらみや溶けただれた形
の加工きずが残らないように加工できる作用を有する。
尚、本発明にいう加工は、切断、穿孔のほかスクライビ
ングや面取りなどの加工をも含む。The present invention, after forming a protective film on the sheet,
Since the laser processing is performed from the surface of the protective film, processing flaws due to the laser beam occur in the protective film,
The sheet has the function of being able to process so that there is no swelling near the corners of the machined part or machining marks in the melted form.
The processing referred to in the present invention includes cutting, perforation, scribing and chamfering.
【０００９】[0009]
【実施例】本発明の実施例を、図面と共に説明する。図
１は、本発明の第１の実施例を示す模式図である。シー
ト１は、前もってグリーンシート法で成形されたアルミ
ナ系セラミックシートであり、厚み０.４ｍｍ、幅１５
０ｍｍである。保護皮膜２は、ＰＥＴ製フィルムで、厚
み０.０４ｍｍ、幅１５０ｍｍであり、シート１に脂肪
族系有機溶剤を塗布した後に貼付けられている。図２
は、図１の保護皮膜付きシートを炭酸ガスレーザにて切
断・穿孔加工したときの状態を示す模式図である。レー
ザの熱的作用により、保護皮膜２の加工部３の上面角部
付近はふくらみ、角部は溶けただれたようにダレが出来
る。図３は、保護皮膜２を剥離・除去した後のシート１
の状態を示す模式図である。図２の如きレーザ加工のに
よる角部付近の加工きずを保護皮膜の層で起こさせたた
め、シートの加工部角部４は、きずがなく良好なシート
加工ができる。Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing a first embodiment of the present invention. Sheet 1 is an alumina-based ceramic sheet that has been previously formed by the green sheet method, and has a thickness of 0.4 mm and a width of 15 mm.
It is 0 mm. The protective film 2 is a PET film having a thickness of 0.04 mm and a width of 150 mm, and is applied after the aliphatic organic solvent is applied to the sheet 1. Figure 2
[Fig. 2] is a schematic diagram showing a state when the sheet with a protective film of Fig. 1 is cut and punched with a carbon dioxide laser. Due to the thermal action of the laser, the protective film 2 is swollen near the corners of the upper surface of the processed portion 3 and the corners are melted and drooped. FIG. 3 shows the sheet 1 after the protective film 2 is peeled off and removed.
It is a schematic diagram which shows the state of. Since the processing flaw near the corner portion due to the laser processing as shown in FIG. 2 is caused in the layer of the protective film, the corner portion 4 of the processed portion of the sheet has no flaw and good sheet processing can be performed.
【００１０】図４は、比較例として、保護皮膜がない場
合のレーザ加工後のシートの状態を示す模式図である。
保護皮膜が無いために、加工部１１の角部付近が上部に
ふくらみ、角部は溶けただれており、高精度加工や多層
ラミネート等の使用には問題がある。As a comparative example, FIG. 4 is a schematic view showing a state of a sheet after laser processing when there is no protective film.
Since there is no protective film, the corners of the processed portion 11 bulge upward and the corners are melted, which poses a problem in high-precision processing and the use of multilayer laminates.
【００１１】第２の実施例として、保護皮膜をアルミ箔
とした場合を示す。厚み０.０２ｍｍ、幅１５０ｍｍの
アルミ箔を、第１の実施例と同様にシート１に貼付け
た。貼付け用溶剤は、芳香族系有機溶剤を使用してい
る。図５は、加工後のシートの状態を示す模式図であ
る。保護皮膜５（ここではアルミ箔）の加工部６は、Ｐ
ＥＴ等のフィルムに比べ、きずとなる範囲はせまいが、
やはりレーザにより溶けただれたような加工きずが生ず
る。この場合でも、シート１の加工部角部７は、アルミ
箔５によって保護され、きずは生じなかった。第３の実
施例（図示しない）として、シート１に塗布型皮膜を形
成しても同様な効果がある。シート１にラテックスゴム
をはけぬりし、揮発乾燥させる。ゴムの溶剤は、水系溶
剤である。その後、同様にレーザ加工したところ、やは
り皮膜はきずが生ずるが、シート１はきずが生じないで
同様に良好な結果となった。但し、皮膜としてはある程
度の厚み等が必要であるので、適度な粘度等を選択する
必要がある。本実施例では、塗布皮膜の厚みは、約０.
０３ｍｍ程度である。As a second embodiment, an aluminum foil is used as the protective film. An aluminum foil having a thickness of 0.02 mm and a width of 150 mm was attached to the sheet 1 as in the first embodiment. An aromatic organic solvent is used as the sticking solvent. FIG. 5 is a schematic diagram showing a state of the sheet after processing. The processing portion 6 of the protective film 5 (here, aluminum foil) is P
Compared to films such as ET, the range of scratches is small,
After all, processing flaws like melted by the laser are generated. Even in this case, the processed corner portion 7 of the sheet 1 was protected by the aluminum foil 5 and no flaw was generated. As a third embodiment (not shown), the same effect can be obtained by forming a coating film on the sheet 1. The sheet 1 is smeared with latex rubber and evaporated to dryness. The rubber solvent is an aqueous solvent. After that, when the same laser processing was performed, the coating film also had a flaw, but the sheet 1 did not have a flaw, and the result was similarly good. However, since the film needs to have a certain thickness and the like, it is necessary to select an appropriate viscosity and the like. In this embodiment, the thickness of the coating film is about 0.
It is about 03 mm.
【００１２】[0012]
【発明の効果】以上で詳述したように、シートに保護皮
膜を形成した後に、保護皮膜の面からレーザ加工をする
ようにしたため、レーザ光線の熱的作用による加工きず
が保護皮膜に起こり、シート自体は加工きずのない良好
なシート加工ができることとなる。これにより、精度の
高い加工ができ、高精度な単層の製品用シートや多層に
積層しうるシートが形成できる効果を有するので、板状
のセラミック製品やセラミック基板、多層配線基板、半
導体素子用パッケージに用いる、高精度なシート加工品
が提供可能となる。また、本発明は、上記セラミック製
品に限らず、レーザ加工品において特に角部の加工きず
を無くすのに有効であり、シート状の部材をレーザ加工
するものであれば、いずれの分野でも利用可能である。As described above in detail, since the protective film is formed on the sheet and then the laser processing is performed from the surface of the protective film, processing flaws due to the thermal action of the laser beam occur in the protective film. The sheet itself can be subjected to excellent sheet processing without processing flaws. As a result, it is possible to perform highly accurate processing and to form a highly accurate sheet for single-layer products or sheets that can be laminated in multiple layers, so that plate-shaped ceramic products, ceramic substrates, multilayer wiring substrates, semiconductor devices It is possible to provide highly accurate sheet processed products used for packages. Further, the present invention is not limited to the above ceramic products and is particularly effective in eliminating corner processing flaws in laser processed products, and can be used in any field as long as it can perform laser processing on a sheet-shaped member. Is.
図１ 第１の実施例のレーザ加工前の模式図 図２ 第１の実施例のレーザ加工後の模式図 図３ 第１の実施例の保護皮膜剥離後の模式図 図４ 比較例のレーザ加工後の模式図 図５ 第２の実施例のレーザ加工後の模式図 FIG. 1 Schematic diagram of the first embodiment before laser machining FIG. 2 Schematic diagram of the first embodiment after laser machining FIG. 3 Schematic diagram of the first embodiment after peeling off the protective film FIG. 4 Laser machining of comparative example Schematic diagram after FIG. 5 Schematic diagram after laser processing of the second embodiment
１，１０ シート ２，５ 保護皮膜 ３，６ 保護皮膜のレーザ加工部 ４，７，１１ シートのレーザ加工部 1,10 sheet 2,5 protective film 3,6 laser processing part of protective film 4,7,11 laser processing part of sheet
Claims (8)
ート加工品において、シートに保護皮膜を形成した後
に、当該保護皮膜の面から、レーザ光線による加工を行
ったことを特徴とするシート加工品。1. A sheet processed product obtained by processing a sheet with a laser beam, wherein a protective film is formed on the sheet and then processed with a laser beam from the surface of the protective film. .
チックフィルムであることを特徴とする請求項１のシー
ト加工品。2. The sheet processed product according to claim 1, wherein the protective film formed on the sheet is a plastic film.
ィルムであることを特徴とする請求項１のシート加工
品。3. The sheet processed product according to claim 1, wherein the protective film formed on the sheet is a metal film.
表面に皮膜となるべき物質を塗布して形成された皮膜で
あることを特徴とする請求項１のシート加工品。4. The sheet processed product according to claim 1, wherein the protective film formed on the sheet is a film formed by applying a substance to be a film to the surface of the sheet.
加工品を得る製造方法において、シートに保護皮膜を形
成した後に、当該保護皮膜の面から、レーザ光線による
加工を行うことを特徴とするシート加工品の製造方法。5. A process for producing a sheet product by processing a sheet with a laser beam, wherein after forming a protective film on the sheet, the sheet is processed with a laser beam from the surface of the protective film. Processed product manufacturing method.
チックフィルムであることを特徴とする請求項１のシー
ト加工品の製造方法。6. The method for producing a sheet product according to claim 1, wherein the protective film formed on the sheet is a plastic film.
ィルムであることを特徴とする請求項１のシート加工品
の製造方法。7. The method for producing a processed sheet according to claim 1, wherein the protective film formed on the sheet is a metal film.
表面に皮膜となるべき物質を塗布して形成された皮膜で
あることを特徴とする請求項１のシート加工品の製造方
法。8. The method for producing a sheet-processed product according to claim 1, wherein the protective film formed on the sheet is a film formed by applying a substance to be a film on the surface of the sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4349900A JPH06170822A (en) | 1992-12-02 | 1992-12-02 | Sheet proceed product and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4349900A JPH06170822A (en) | 1992-12-02 | 1992-12-02 | Sheet proceed product and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06170822A true JPH06170822A (en) | 1994-06-21 |
Family
ID=18406870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4349900A Pending JPH06170822A (en) | 1992-12-02 | 1992-12-02 | Sheet proceed product and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06170822A (en) |
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-
1992
- 1992-12-02 JP JP4349900A patent/JPH06170822A/en active Pending
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