KR101334249B1 - Composition for EMC mold cleaning comprising cleaning agent grafted inorganic filler - Google Patents
Composition for EMC mold cleaning comprising cleaning agent grafted inorganic filler Download PDFInfo
- Publication number
- KR101334249B1 KR101334249B1 KR1020120023802A KR20120023802A KR101334249B1 KR 101334249 B1 KR101334249 B1 KR 101334249B1 KR 1020120023802 A KR1020120023802 A KR 1020120023802A KR 20120023802 A KR20120023802 A KR 20120023802A KR 101334249 B1 KR101334249 B1 KR 101334249B1
- Authority
- KR
- South Korea
- Prior art keywords
- rubber
- inorganic filler
- mold
- weight
- parts
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 239000011256 inorganic filler Substances 0.000 title claims abstract description 22
- 229910003475 inorganic filler Inorganic materials 0.000 title claims abstract description 22
- 238000004140 cleaning Methods 0.000 title claims abstract description 17
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 17
- 229920001971 elastomer Polymers 0.000 claims abstract description 33
- 239000005060 rubber Substances 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 229920002943 EPDM rubber Polymers 0.000 claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 12
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 11
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 8
- 229920001084 poly(chloroprene) Polymers 0.000 claims abstract description 8
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 8
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 8
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims abstract description 6
- 230000000996 additive effect Effects 0.000 claims abstract description 6
- 229920003052 natural elastomer Polymers 0.000 claims abstract description 6
- 229920001194 natural rubber Polymers 0.000 claims abstract description 6
- 244000043261 Hevea brasiliensis Species 0.000 claims abstract description 5
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229920001195 polyisoprene Polymers 0.000 claims abstract description 3
- 229920001897 terpolymer Polymers 0.000 claims abstract description 3
- 229920002545 silicone oil Polymers 0.000 claims description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000004408 titanium dioxide Substances 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- 239000003431 cross linking reagent Substances 0.000 claims description 6
- -1 glycol ethers Chemical class 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000021355 Stearic acid Nutrition 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 5
- 239000008117 stearic acid Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 150000001414 amino alcohols Chemical class 0.000 claims description 4
- 239000003599 detergent Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 150000002462 imidazolines Chemical class 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 150000003233 pyrroles Chemical class 0.000 claims description 2
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003517 fume Substances 0.000 abstract description 5
- 239000011538 cleaning material Substances 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 239000001993 wax Substances 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 9
- 230000003578 releasing effect Effects 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000002174 Styrene-butadiene Substances 0.000 description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 238000010058 rubber compounding Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 229940078162 triadine Drugs 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000004291 polyenes Chemical class 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- ZPUQUSWNMIFRHT-UHFFFAOYSA-N (5-methyl-2-phenyl-4,5-dihydro-1h-imidazol-4-yl)methanol Chemical compound OCC1C(C)NC(C=2C=CC=CC=2)=N1 ZPUQUSWNMIFRHT-UHFFFAOYSA-N 0.000 description 1
- HQGYGGZHZWXFSI-UHFFFAOYSA-N 1,4-cycloheptadiene Chemical compound C1CC=CCC=C1 HQGYGGZHZWXFSI-UHFFFAOYSA-N 0.000 description 1
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 1
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 1
- VHQUSQAWNQDYNA-UHFFFAOYSA-N 1-benzyl-2-methyl-4,5-dihydroimidazole Chemical compound CC1=NCCN1CC1=CC=CC=C1 VHQUSQAWNQDYNA-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- PPWUTZVGSFPZOC-UHFFFAOYSA-N 1-methyl-2,3,3a,4-tetrahydro-1h-indene Chemical compound C1C=CC=C2C(C)CCC21 PPWUTZVGSFPZOC-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- WTRDAHHPHDNZRC-UHFFFAOYSA-N 2-(2-methyl-4,5-dihydroimidazol-1-yl)propanenitrile Chemical compound N#CC(C)N1CCN=C1C WTRDAHHPHDNZRC-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- IWSZDQRGNFLMJS-UHFFFAOYSA-N 2-(dibutylamino)ethanol Chemical compound CCCCN(CCO)CCCC IWSZDQRGNFLMJS-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- AVMSWPWPYJVYKY-UHFFFAOYSA-N 2-Methylpropyl formate Chemical compound CC(C)COC=O AVMSWPWPYJVYKY-UHFFFAOYSA-N 0.000 description 1
- BKMMTJMQCTUHRP-UHFFFAOYSA-N 2-aminopropan-1-ol Chemical compound CC(N)CO BKMMTJMQCTUHRP-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- BKCCAYLNRIRKDJ-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1CCN=C1C1=CC=CC=C1 BKCCAYLNRIRKDJ-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- ONGNQBYRKXMMLY-UHFFFAOYSA-N 5-ethyl-2-methyl-4,5-dihydro-1h-imidazole Chemical compound CCC1CN=C(C)N1 ONGNQBYRKXMMLY-UHFFFAOYSA-N 0.000 description 1
- WTQBISBWKRKLIJ-UHFFFAOYSA-N 5-methylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C)CC1C=C2 WTQBISBWKRKLIJ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- STERPHQYGVLMNM-UHFFFAOYSA-N C(CCCCCCCCCCCCCCCCC)(=O)O.[O-2].[Ti+4].[O-2] Chemical compound C(CCCCCCCCCCCCCCCCC)(=O)O.[O-2].[Ti+4].[O-2] STERPHQYGVLMNM-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- JRVYFDBNSAHSKS-UHFFFAOYSA-N cyclododeca-1,6-diene Chemical compound C1CCC=CCCCC=CCC1 JRVYFDBNSAHSKS-UHFFFAOYSA-N 0.000 description 1
- ZLLMHFVWHQSIIV-UHFFFAOYSA-N cyclododeca-1,7-diene Chemical compound C1CCC=CCCCCC=CC1 ZLLMHFVWHQSIIV-UHFFFAOYSA-N 0.000 description 1
- UVJHQYIOXKWHFD-UHFFFAOYSA-N cyclohexa-1,4-diene Chemical compound C1C=CCC=C1 UVJHQYIOXKWHFD-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 210000003244 etp Anatomy 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- GEAWFZNTIFJMHR-UHFFFAOYSA-N hepta-1,6-diene Chemical compound C=CCCCC=C GEAWFZNTIFJMHR-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 150000007523 nucleic acids Chemical class 0.000 description 1
- 102000039446 nucleic acids Human genes 0.000 description 1
- 108020004707 nucleic acids Proteins 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3749—Polyolefins; Halogenated polyolefins; Natural or synthetic rubber; Polyarylolefins or halogenated polyarylolefins
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/20—Water-insoluble oxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
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- C—CHEMISTRY; METALLURGY
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Abstract
천연 고무(NR), 클로로프렌 고무(CR), 부타디엔 고무(BR), 니트릴 고무(NBR), 에틸렌-프로필렌 터폴리머 고무(EPT), 에틸렌-프로필렌 고무(EPM), 에틸렌-프로필렌 디엔 고무(EPDM), 스틸렌-부타디엔 고무(SBR), 폴리이소프렌 고무로 이루어진 군으로부터 선택된 하나 이상의 혼합물 고무성분 100 중량부를 기준으로 하여, 세정제가 그라프팅된 무기 필러 10 - 50 중량부; 및 첨가제 1 - 10 중량부를 혼합하여 이루어지는 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물을 개시한다. 본 발명에 따른 EMC 몰드용 세정 재료는 경화되면서 포르말린 발생이 발생되지 않고, 휘발되면서 흄(Fume)이나 odor가 발생되지 않고 금형 내부에 지속적인 코팅성능이 부여되면서도 효과적인 이형성을 제공하여 EMC 몰드의 작업성이 우수하고 환경오염을 방지할 수 있다.Natural rubber (NR), chloroprene rubber (CR), butadiene rubber (BR), nitrile rubber (NBR), ethylene-propylene terpolymer rubber (EPT), ethylene-propylene rubber (EPM), ethylene-propylene diene rubber (EPDM) 10 to 50 parts by weight of an inorganic filler grafted with a cleaner, based on 100 parts by weight of at least one mixture rubber component selected from the group consisting of styrene-butadiene rubber (SBR) and polyisoprene rubber; And it discloses an EMC mold cleaning composition comprising an inorganic filler grafted with a cleaning agent, characterized in that by mixing 1 to 10 parts by weight of the additive. The cleaning material for EMC mold according to the present invention does not generate formalin while hardening, does not generate fume or odor while volatilization, and provides effective release property while providing continuous coating performance inside the mold, thereby providing workability of the EMC mold. It is excellent and can prevent environmental pollution.
Description
본 발명은 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물에 관한 것으로서, 더욱 상세하게는 휘발되면서 흄(Fume)이나 odor가 발생되지 않고 금형 내부에 지속적인 코팅성능이 부여되면서도 효과적인 이형성을 제공하여 EMC 몰드의 작업성이 우수한 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물에 관한 것이다.The present invention relates to a composition for cleaning an EMC mold including an inorganic filler grafted with a cleaner, and more particularly, volatilization does not generate fume or odor, and provides effective mold release property while providing continuous coating performance inside the mold. The present invention relates to an EMC mold cleaning composition comprising an inorganic filler grafted with a cleaner having excellent workability of the EMC mold.
트랜지스터, 집적회로(IC), 고밀도 집적회로(LSI) 등과 같은 반도체 소자는 통상적으로는 플라스틱 패키징(packaging)에 의해 수지-캡슐화시킨다. 이러한 수지 캡슐화는 에폭시수지 조성물 등과 같은 열경화성수지 조성물을 사용하여, 캐스팅, 압축성형, 사출성형, 이송성형, 특히 매스 생산성 및 작업성이 탁월한 이송성형에 의해 수행한다. 그러나, 상술한 이송성형은, 반도체 소자를 에폭시수지 조성물을 사용하여 이송성형에 의해 수지-캡슐화시키는 경우 연속적으로 수행하며, 이는 성형용 금형 또는 다이(die)가 에폭시수지 조성물 중 금형 탈형제(releasing agent)에 의해 오염되고, 이로 인해 성형이 제대로 수행되지 않기 때문이다.Semiconductor devices such as transistors, integrated circuits (IC), high density integrated circuits (LSI), etc. are typically resin-encapsulated by plastic packaging. Such resin encapsulation is carried out by using a thermosetting resin composition such as an epoxy resin composition or the like, and performing casting, compression molding, injection molding, transfer molding, especially mass transfer productivity with excellent productivity and workability. However, the above-described transfer molding is carried out continuously when the semiconductor element is resin-encapsulated by the transfer molding using the epoxy resin composition, because the molding die or the die is not releasing the mold releasing agent in the epoxy resin composition agent, which causes the molding to fail.
즉, 성형에서, 에폭시수지 조성물 중에 함유된 금형 탈형제가 수지 조성물로부터 상부 금형 및 하부 금형에 의해 형성된 공동의 내면으로 유출되어 금형-탈형작용을 초래하지만, 성형을 반복하는 경우, 금형의 내면으로 유출된 금형 탈형제가 점차적으로 내면에 축적되고 산화됨으로써 열화되어(deteriorated), 경질의 산화된 금형-탈형제층(층 표면이 금형의 내면처럼 매끄럽지 않다는 것) 형성된다. 또한, 산화 및 열화된 금형-탈형제층의 표면에서 성형을 수행하는데, 이로 인해 산화 및 열화된 금형-탈형제층의 표면 패턴이 성형품의 표면으로 이송되어, 성형품의 표면이 거칠어지고 윤기가 나지 않게 된다.That is, in molding, the mold releasing agent contained in the epoxy resin composition flows out of the resin composition to the inner surface of the cavity formed by the upper mold and the lower mold, resulting in a mold- demolding action, but when the molding is repeated, it flows out to the inner surface of the mold. The deformed mold release agent gradually accumulates and oxidizes on the inner surface to be deteriorated, thereby forming a hard oxidized mold-releasing agent layer (the layer surface is not as smooth as the inner surface of the mold). Further, the molding is carried out on the surface of the oxidized and deteriorated mold-defoliating agent layer, whereby the surface pattern of the oxidized and deteriorated mold-defoliating agent layer is transferred to the surface of the molded article so that the surface of the molded article becomes rough and uneven .
또한, 이러한 산화 및 열화된 금형-탈형제층이 성형시 금형의 내면에 일단 형성되면, 그 후 에폭시수지 조성물, 추가로 금형-탈형제가 수지 조성물로부터 금형의 표면으로가 아니고 산화 및 열화된 금형-탈형제층으로 유출되고, 이로 인해 금형-탈형제는 금형-탈형작용을 충분히 제공할 수 없다.In addition, once such an oxidized and deteriorated mold-releasing agent layer is formed on the inner surface of the mold during molding, the epoxy resin composition, and further, the mold-releasing agent is not oxidized and degraded from the resin composition to the surface of the mold. It flows out to the release agent layer, whereby the mold-release agent cannot sufficiently provide the mold- demolding action.
일반적으로 열경화성 수지를 이용하여 제품을 성형하는 경우, 특히 반도체 제조를 위한 EMC 성형공정에서는 고품위의 제품신뢰도를 요하고 있다. 이러한 고품위의 제품성형을 위하여 수시로 반도체 금형에 잔존하는 오염물을 제거하기 위한 세정작업이 이루어져야 하며, 이와 아울러 반복 작업에 따른 열경화성 수지의 탈착을 용이하게 하기 위하여 금형 표면상에 이형제를 코팅하여 사용한다.Generally, when a product is molded using a thermosetting resin, in particular, an EMC molding process for semiconductor manufacturing requires high-quality product reliability. In order to form such a high-quality product, a cleaning operation to remove contaminants remaining in a semiconductor mold must be performed from time to time. In addition, a release agent is coated on the surface of the mold to facilitate detachment of the thermosetting resin by repeated operations.
이러한 세정 및 이형공정은 필수적이며, 반도체 소자가 고집적화될수록 그 중요성은 더 중요한 요소로 작용하고 있다. 특히 이형공정은 반도체 소자의 품질에 직접 영향을 미치는 것으로 금형 표면에 부여된 이형성이 제대로 수행되지 못할 경우 제품 전체의 불량뿐만 아니라 수리를 위하여 많은 시간이 소요되므로 보다 나은 이형성을 부여하고 오랜 시간동안 이형성을 유지하는 제품을 개발하기 위한 노력들이 반도체 소자 고집적화와 맞물려 발전되고 있다.Such a cleaning and releasing process is indispensable, and its importance becomes more important as semiconductor devices become more highly integrated. In particular, the mold release process directly affects the quality of the semiconductor device. If the mold releasing property is not properly performed on the surface of the mold, it takes much time to repair the product as well as the entire product. Therefore, Are being developed in tandem with the high integration of semiconductor devices.
EMC Mold 세정 재료로 사용되는 멜라민 수지의 경우에는 경화되면서 포르말린 발생이 발생된다는 문제점이 있었으며, 고무 시트의 경우에는 세정 성분의 고온 150 ~ 180℃에서 경화되면서 휘발되어 흄(Fume)이나 odor가 발생된다는 문제점이 있었다.
In the case of melamine resin used as EMC Mold cleaning material, there was a problem that formalin was generated while curing, and in the case of rubber sheet, it was volatilized while curing at high temperature of 150 ~ 180 ℃ of cleaning component to generate fume or odor. There was a problem.
상기 문제점을 해결하기 위하여 본 발명은 세정제가 그라프팅된 무기 필러를 배합함으로써 흄(Fume)이나 odor가 발생되지 않고 금형 내부 이형성이 우수한 EMC 몰드 세정용 조성물을 제공하는 것을 목적으로 한다.
In order to solve the above problems, an object of the present invention is to provide an EMC mold cleaning composition having excellent mold release property without generating fume or odor by mixing an inorganic filler grafted with a cleaning agent.
상기 목적을 달성하기 위하여, 본 발명은In order to achieve the above object,
부타디엔고무(BR), 스티렌-부타디엔 고무(SBR), 에틸렌-프로필렌 디엔 모노머 고무(EPDM), 니트릴고무(NR), 니트릴-부타디엔고무(NBR), 및 클로로프렌고무(CR)로 이루어진 군으로부터 선택된 하나 이상의 혼합물 고무성분 100 중량부를 기준으로 하여,Butadiene rubber (BR), styrene-butadiene rubber (SBR), ethylene-propylene diene monomer rubber (EPDM), nitrile rubber (NR), nitrile-butadiene rubber (NBR), and chloroprene rubber (CR) Based on 100 parts by weight of the above mixture rubber component,
세정제가 그라프팅된 무기 필러 10 - 50 중량부; 및10-50 parts by weight of the inorganic filler grafted detergent; And
첨가제 1 - 10 중량부를 혼합하여 이루어지는 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물을 제공한다.
Provided is an EMC mold cleaning composition comprising an inorganic filler grafted with a cleaning agent, characterized by mixing 1 to 10 parts by weight of an additive.
본 발명에 따른 EMC 몰드용 세정 재료는 경화되면서 포르말린 발생이 발생되지 않고, 휘발되면서 흄(Fume)이나 odor가 발생되지 않고 금형 내부에 지속적인 코팅성능이 부여되면서도 효과적인 이형성을 제공하여 EMC 몰드의 작업성이 우수하고 환경오염을 방지할 수 있다.The cleaning material for EMC mold according to the present invention does not generate formalin while hardening, does not generate fume or odor while volatilization, and provides effective release property while providing continuous coating performance inside the mold, thereby providing workability of the EMC mold. It is excellent and can prevent environmental pollution.
이하 본 발명을 상세히 설명한다.
Hereinafter, the present invention will be described in detail.
본 발명에서 사용되는 고무는 천연 또는 인조 고무로서, 상기 고무성분은 반도체 금형 내부가 열과 압력을 받을 경우 함유된 경화제의 작용에 의해 경화되어 금형 내부의 형상대로 형성된다.The rubber used in the present invention is a natural or artificial rubber, the rubber component is cured by the action of the curing agent contained when the inside of the semiconductor mold is subjected to heat and pressure is formed in the shape of the inside of the mold.
금형 내부에서 금형 형상대로 성형되면서 금형 내부와 정확히 일치되는 형상으로 이루어져야 후술하는 코팅성분들이 고무가 성형되면서 외부로 흘러나와 금형의 내면에 정확한 코팅이 이루어질 수 있게 된다. 따라서 본 발명에서 사용되는 고무는 반도체 금형 내부에 정확한 형상을 이룰 수 있어야 한다.Molding in the mold inside the mold shape to be exactly the same as the inside of the mold to be described later coating components flow out to the rubber is molded to be able to make an accurate coating on the inner surface of the mold. Therefore, the rubber used in the present invention should be able to achieve an accurate shape inside the semiconductor mold.
고무성분으로는 천연 고무(NR), 클로로프렌 고무(CR), 부타디엔 고무(BR), 니트릴 고무(NBR), 에틸렌-프로필렌 터폴리머 고무(EPT), 에틸렌-프로필렌 고무(EPM), 에틸렌-프로필렌 디엔 모노머 고무(EPDM), 스틸렌-부타디엔 고무(SBR), 폴리이소프렌 고무(IR), 부틸 고무(IIR), 실리콘 고무(Q), 불소화 고무(FKM)로 이루어진 군으로부터 선택된 하나 이상의 혼합물이거나 이들의 변성물이다.Rubber components include natural rubber (NR), chloroprene rubber (CR), butadiene rubber (BR), nitrile rubber (NBR), ethylene-propylene terpolymer rubber (EPT), ethylene-propylene rubber (EPM), ethylene-propylene diene One or more mixtures selected from the group consisting of monomer rubber (EPDM), styrene-butadiene rubber (SBR), polyisoprene rubber (IR), butyl rubber (IIR), silicone rubber (Q), fluorinated rubber (FKM) Water.
ETP는 에틸렌, α-올레핀, 및 비공역(non-cojugated) 이중결합을 함유하는 사이클릭 또는 비사이클릭 공중합체이다.ETPs are cyclic or acyclic copolymers containing ethylene, α-olefins, and non-cojugated double bonds.
EPDM은 에틸렌, α-올레핀(특히 프로필렌) 및 이하 열거되는 폴리엔 단량체를 함유하는 삼원 공중합체이고, 폴리엔 단량체의 예는 다이사이클로펜타다이엔, 1,5-사이클로옥타다이엔, 1,1-사이클로옥타다이엔, 1,6-사이클로도데카다이엔, 1,7-사이클로도데카다이엔, 1,5,9-사이클로도데카트라이엔, 1,4-사이클로헵타다이엔, 1,4-사이클로헥사다이엔, 노보나다이엔, 메틸렌노보넨, 2-메틸펜타다이엔-1,4,1,5-헥사다이엔, 1,6-헵타다이엔, 메틸-테트라하이드로인덴 및 1,4-헥사다이엔을 포함한다.EPDM is a ternary copolymer containing ethylene, α-olefins (particularly propylene) and polyene monomers listed below, examples of the polyene monomers being dicyclopentadiene, 1,5-cyclooctadiene, 1,1 -Cyclooctadiene, 1,6-cyclododecadiene, 1,7-cyclododecadiene, 1,5,9-cyclododecadiene, 1,4-cycloheptadiene, 1,4 Cyclohexadiene, norbornadiene, methylenenorbornene, 2-methylpentadiene-1,4,1,5-hexadiene, 1,6-heptadiene, methyl-tetrahydroindene and 1, 4-hexadiene.
본 발명에서는 세정제를 무기 필러 성분에 그라프팅시킴으로써 세정성능을 강화하면서 금형의 이형성을 개선하는 것을 특징으로 한다. 세정제의 예는 글리콜에테르, 케톤류, 에스테르류, 피롤류, 이미다졸류, 이미다졸린류 및 아미노 알코올류를 포함하고, 하나 이상의 조합으로 이용될 수 있다.In the present invention, by grafting the cleaning agent to the inorganic filler component, it is characterized by improving the mold release property while enhancing the cleaning performance. Examples of the cleaning agent include glycol ethers, ketones, esters, pyrroles, imidazoles, imidazolines and amino alcohols, and can be used in one or more combinations.
글리콜에테르의 예는 에틸렌글리콜다이메틸에테르, 다이에틸렌글리콜다이메틸에테르, 트라이에틸렌글리콜다이메틸에테르, 테트라에틸렌글리콜다이메틸에테르, 폴리에틸렌글리콜다이메틸에테르, 다이에틸렌글리콜모노프로필에테르, 다이에틸렌글리콜모노부틸에테르, 다이에틸렌글리콜다이에틸에테르, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노프로필에테르 및 에틸렌글리콜모노부틸에테르를 포함할 수 있고 이들 하나 이상의 조합으로 이용될 수 있다.Examples of glycol ethers include ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, polyethylene glycol dimethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl Ether, diethylene glycol diethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether may be used and used in combination of one or more of them.
케톤류의 예는 아세톤, 메틸에틸케톤을 들 수 있다.Examples of ketones include acetone and methyl ethyl ketone.
에스테르류로서는 포름산 에틸, 포름산 프로필, 포름산 이소부틸, 아세트산 메틸, 아세트산 에틸, 프로피온산 메틸, 프로피온산 에틸 등을 들 수 있다.Ester, ethyl formate, propyl formate, isobutyl formate, methyl acetate, ethyl acetate, methyl propionate, ethyl propionate, etc. are mentioned.
이미다졸의 예는 2-메틸이미다졸, 2-에틸-4-메틸이미다졸, 2-페닐이미다졸, 1-벤질-2-메틸이미다졸 및 2,4-다이아미노-6[2'-메틸이미다졸일-(1)']에틸-s-트라이아딘을 포함할 수 있고, 하나 이상의 조합으로 이용될 수 있다.Examples of imidazoles are 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole and 2,4-diamino-6 [ 2'-methylimidazolyl- (1) '] ethyl-s-triadine, and may be used in one or more combinations.
이미다졸린의 예는 2-메틸이미다졸린, 2-메틸-4-에틸이미다졸린, 2-페닐이미다졸린, 1-벤질-2-메틸이미다졸린, 2-페닐-4-메틸-5-하이드록시메틸이미다졸린, 2,4-다이아미노-6[2'-메틸이미다졸리닐-(1)']에틸-s-트라이아딘, 2,4-다이아미노-6[2'-메틸-4'-이미다졸리닐-(1)']에틸-s-트라이아딘, 1-시아노에틸-2-메틸이미다졸린 및 1-시아노에틸-2-메틸-4-에틸이미다졸린을 포함할 수 있고, 하나 이상의 조합으로 이용될 수 있다.Examples of imidazolines include 2-methylimidazoline, 2-methyl-4-ethylimidazoline, 2-phenylimidazoline, 1-benzyl-2-methylimidazoline, 2-phenyl-4-methyl- 5-hydroxymethylimidazoline, 2,4-diamino-6 [2'-methylimidazolinyl- (1) '] ethyl-s-triadine, 2,4-diamino-6 [2' -Methyl-4'-imidazolinyl- (1) '] ethyl-s-triadine, 1-cyanoethyl-2-methylimidazoline and 1-cyanoethyl-2-methyl-4-ethyl Midazoline may be included and may be used in one or more combinations.
아미노 알코올의 대표적인 예는 모노에탄올아민, 다이에탄올아민, 트라이에탄올아민, N-메틸에탄올아민, N,N-다이메틸에탄올아민, N,N-다이부틸에탄올아민, N,N-다이에틸에탄올아민, N-메틸-N,N-다이에탄올아민, 2-아미노-2-메틸프로판올, 3-아미노프로판올 및 2-아미노프로판올을 포함할 수 있고, 하나 이상의 조합으로 이용될 수 있다.Representative examples of amino alcohols include monoethanolamine, diethanolamine, triethanolamine, N-methylethanolamine, N, N-dimethylethanolamine, N, N-dibutylethanolamine, N, N-diethylethanolamine , N-methyl-N, N-diethanolamine, 2-amino-2-methylpropanol, 3-aminopropanol and 2-aminopropanol, and may be used in one or more combinations.
무기 필러에 그라프팅되는 세정제의 함량은 필러 함량 100 중량부에 대해 바람직하게는 10 내지 30 중량부, 더 바람직하게는 15 내지 25 중량부의 범위로 설정될 수 있다. 세정제의 함량이 10 중량부 미만인 경우에는 몰드에 대해 만족스러운 세정 효과를 발휘하는 것은 어렵기 때문에 바람직하지 못하고, 세정제의 함량이 30 중량부를 초과하는 경우, 조성물이 몰드에 부착하고, 몰드로부터 조성물의 제거 작업 효율이 악화되기 때문에 바람직하지 못하다.The content of the detergent grafted to the inorganic filler may be set in the range of preferably 10 to 30 parts by weight, more preferably 15 to 25 parts by weight with respect to 100 parts by weight of the filler content. If the content of the cleaning agent is less than 10 parts by weight, it is not preferable because it is difficult to achieve a satisfactory cleaning effect on the mold. If the content of the cleaning agent is more than 30 parts by weight, the composition adheres to the mold and the composition of the composition is removed from the mold. It is not preferable because the removal operation efficiency is deteriorated.
무기 필러로는 실리카, 알루미나, 카본 블랙, 탄산 칼슘, 칼슘 실리케이트, 수산화 알루미늄, 산화티타늄, 티타늄 다이옥사이드 및 수산화 티타늄 등을 포함할 수 있다. 무기 필러의 함량은 고무 100 중량부를 기준으로 하여 바람직하게는 10 내지 50 중량부의 범위로 설정될 수 있다.Inorganic fillers may include silica, alumina, carbon black, calcium carbonate, calcium silicate, aluminum hydroxide, titanium oxide, titanium dioxide, titanium hydroxide, and the like. The content of the inorganic filler may be preferably set in the range of 10 to 50 parts by weight based on 100 parts by weight of rubber.
세정제의 종류에 따라서 무기 필러에 그라프팅되는 방식은 상이하고, 예를 들어, 알코올류, 케톤류는 하이드록시기와 카르복실기를 이용하여 그라프팅하고 기타 세정제는 커플링제를 이용하여 결합한다. Depending on the type of cleaning agent, the method of grafting on the inorganic filler is different. For example, alcohols and ketones are grafted using a hydroxyl group and a carboxyl group, and other cleaning agents are bonded using a coupling agent.
본 발명의 재료 조성물은 일반적인 고무배합시 첨가되는 첨가제를 포함한다. 이러한 첨가제는 일반고무배합시 사용되는 공지물질에 해당된다. 가교제, 산화방지제 및 이산화티타늄 스테아린산 등 고무배합에 사용되는 첨가제를 첨가하여 제조할 수 있다. 이러한 첨가제의 함량은 고무함량 100 중량부를 기준으로 하여 1 내지 10 중량부인 것이 바람직하다.The material composition of the present invention comprises an additive added during general rubber compounding. Such additives correspond to known materials used in general rubber formulation. It can be prepared by adding an additive used in rubber compounding such as a crosslinking agent, an antioxidant and titanium dioxide stearic acid. The content of such additives is preferably 1 to 10 parts by weight based on 100 parts by weight of rubber.
본 발명에 따르면, 실리콘 오일과 왁스 등을 더 포함할 수 있다. According to the present invention, silicone oil and wax may be further included.
실리콘 오일은 기본적으로 종래에서 유기용제인 핵산에 용해시켜 코팅성분으로 사용되는 물질이며, 본 발명에서는 실리콘오일과 왁스가 혼합되어 보다 우수한 코팅성능을 부여하게 된다.Silicone oil is basically a substance that is used as a coating component by dissolving in a nucleic acid which is an organic solvent in the prior art, in the present invention is a silicone oil and wax is mixed to give a better coating performance.
이러한 실리콘 오일의 기본적인 작용은 금형 코팅성을 좋게 하고, 반도체 제품성형 후, 제품의 이형성을 좋게 하는 것으로, 실리콘 오일 자체는 액상 형태이므로 단독으로는 고무와 혼합되어 사용되기가 곤란하다. 실리콘오일 단독으로 고무와 배합시 골고루 분산이 이루어지지 않으며 고무제 시트의 형성이 이루어질 수 없다. 따라서 왁스가 존재하는 상태에서 실리콘 오일이 첨가됨에 따라 고무와의 배합성이 좋아지며, 실리콘오일의 역할인 코팅성 이형성을 가질 수 있게 된다. 사용가능한 실리콘오일은 반응성기인 아미노기, 아민기, 에폭시기 페닐기를 가지는 반응성 실리콘 오일이나 디메틸실리콘오일처럼 비반응성 실리콘오일 어느 것이나 가능하다. 반응성기가 함유된 실리콘오일의 경우에는 금형표면에서 코팅시 오랜 시간 동안 지속될 수 있으므로 금형코팅능력의 지속성이 증대하게 되며, 비반응성 실리콘 오일의 경우에는 왁스의 에멸젼화를 증대시켜 왁스의 코팅능력이 보다 더 잘 발휘될 수 있도록 한다.The basic action of the silicone oil is to improve the mold coating property, and to improve the mold release property of the product after molding the semiconductor product. Since the silicone oil itself is in liquid form, it is difficult to be mixed with rubber alone. Silicone oil alone does not disperse evenly when mixed with rubber, and rubber sheet formation can not be achieved. Therefore, as the silicone oil is added in the presence of the wax, the blendability with the rubber is improved, and the coating oil release property, which is a role of the silicone oil, can be obtained. The silicone oil that can be used is either a reactive silicone oil having reactive groups such as an amino group, an amine group, an epoxy group phenyl group, or a non-reactive silicone oil such as a dimethyl silicone oil. In the case of silicone oil containing reactive group, it can last for a long time when coating on the mold surface, so the durability of mold coating ability is increased, and in the case of non-reactive silicone oil, wax coating ability is increased by increasing wax emulsification. Make it better.
왁스는 종래에서도 천연카노버 왁스처럼 코팅용 성분으로 사용되는 물질이다. 다만, 본 발명에서는 이러한 왁스가 고무성분과 배합되어 고무성분이 반도체 금형 내부에서 경화됨에 따라 이러한 왁스성분은 용출이 이루어져야 한다. 따라서 이러한 용출을 위해서는 왁스는 적정량의 혼합이 이루어져야 한다. 왁스성분이 5중량% 미만일 경우에는 금형 내부에서 충분한 코팅성능을 발휘할 수 없으며, 15 중량% 를 초과할 경우에는 고무의 경화시 강도가 저하되어 쉽게 부러짐 현상이 일어나 금형 내부의 고무경화성을 저하시킬 뿐만 아니라 금형 내부의 미세한 부분에 부러진 찌꺼기(chip out)가 되어 반도체 제조시 불량을 야기시킬 수도 있다. 또한, 과도한 양의 왁스 첨가시 고무 경화에 오랜 시간이 걸리고, 일부가 자체 탄화가 되어 오염원이 되기도 한다.Wax is a material that is conventionally used as a coating component, like natural canon wax. However, in the present invention, as the wax is mixed with the rubber component and the rubber component is cured in the semiconductor mold, the wax component must be eluted. Therefore, for such elution, the wax must be mixed in an appropriate amount. If the wax content is less than 5% by weight, sufficient coating performance may not be exhibited in the mold. If the content of the wax content is more than 15% by weight, the strength of the rubber decreases, thereby causing easy breakage. Rather, it may cause chip out broken in minute parts inside the mold, causing defects in semiconductor manufacturing. In addition, the addition of an excessive amount of wax takes a long time to cure the rubber, and some of the carbonization itself becomes a source of contamination.
기본적으로 고무의 경화시 약 120℃ 온도가 이루어짐으로써 상기 온도하에서도 탄화기 이루어지지 않는 정도의 왁스가 필요하나, 대개 왁스는 내열성에 취약하므로 왁스 단독보다는 후술하는 내열성을 가지는 실리콘오일과 혼합하여 사용하는 것이 바람직하다. 따라서 내열성의 부족을 실리콘오일이 보완해주어 탄화되는 것이 억제되며 또한, 액상인 실리콘오일 역시 고무와의 배합이 잘 이루어질 수 있게 된다. 그리고 본 발명에서 사용될 수 있는 왁스는 카노버 왁스, 몬탄 오피(OP)악스, 에스테르 왁스, 폴리에틸렌 왁스, 폴리프로필렌 왁스 중 하나 또는 둘 이상의 혼합물이 사용되도록 한다.Basically, when the rubber is hardened, the temperature is about 120 ℃, so it is necessary to have a wax that is not carbonized even under the above temperature. However, since the wax is vulnerable to heat resistance, it is mixed with a silicone oil having heat resistance to be described later rather than the wax alone. It is desirable to. Therefore, the lack of heat resistance is supplemented with silicon oil is suppressed carbonization, and also the liquid silicone oil can be well blended with the rubber. In addition, waxes that can be used in the present invention allow one or a mixture of two or more of cannober wax, montan opac, ester wax, polyethylene wax, and polypropylene wax to be used.
이하 실시예를 들어 본 발명을 설명하되, 본 발명이 실시예에 한정되는 것은 아니다.
Hereinafter, the present invention will be described by way of examples, but the present invention is not limited to the examples.
실시예Example
실시예 1Example 1
SBR 70g과 EPDM 30g이 함유된 고무 성분 100g에 모노 에탄올 아민이 그라프팅된 실리카 70g, 첨가제(스테아린산 1g, 이산화티타늄 5g, 산화방지제 1g, 가교제 2.5g)을 첨가한 후 혼련 및 혼합한 후 시트 형태로 제작하여 몰드에서 180℃에서 2000 ~ 2300 PSi의 압력으로 6분간 몰드 세정을 실시하였다. 결과를 하기 표 1에 나타내었다.
70 g of monoethanolamine grafted silica, 100 g of rubber component containing 70 g of SBR and 30 g of EPDM, and additives (1 g of stearic acid, 5 g of titanium dioxide, 1 g of antioxidant, 2.5 g of crosslinking agent), followed by kneading and mixing, followed by sheet form The mold was cleaned in a mold for 6 minutes at a pressure of 2000 ~ 2300 PSi at 180 ℃. The results are shown in Table 1 below.
실시예 2Example 2
SBR 70g과 EPDM 30g이 함유된 고무 성분 80g에 모노 에탄올 아민이 그라프팅된 실리카 70g, 첨가제(스테아린산 1g, 이산화티타늄 5g, 산화방지제 1g, 가교제 2.5g)을 첨가한 후 혼련 및 혼합한 후 시트 형태로 제작하여 몰드에서 180℃에서 2000 ~ 2300 PSi의 압력으로 6분간 몰드 세정을 실시하였다. 결과를 하기 표 1에 나타내었다.
70 g of monoethanolamine-grafted silica, 70 g of monoethanolamine, and additives (1 g of stearic acid, 5 g of titanium dioxide, 1 g of antioxidant, 2.5 g of crosslinking agent) were added to 80 g of rubber components containing 70 g of SBR and 30 g of EPDM, and then kneaded and mixed. The mold was cleaned in a mold for 6 minutes at a pressure of 2000 ~ 2300 PSi at 180 ℃. The results are shown in Table 1 below.
비교예 1Comparative Example 1
SBR 70g과 EPDM 30g이 함유된 고무 성분 100g에 실리카 80g, 아미노 알코올류 세정제 2g, 첨가제(스테아린산 1g, 이산화티타늄 5g, 산화방지제 1g, 가교제 2.5g)을 첨가한 후 혼련 및 혼합한 후 시트 형태로 제작하여 몰드에서 180℃에서 2000 ~ 2300 PSi의 압력으로 6분간 몰드 세정을 실시하였다. 결과를 하기 표 1에 나타내었다.
80 g of silica, 2 g of amino alcohol detergent, and additives (1 g of stearic acid, 5 g of titanium dioxide, 1 g of antioxidant, 2.5 g of crosslinking agent) were added to 100 g of a rubber component containing 70 g of SBR and 30 g of EPDM, followed by kneading and mixing. The mold was washed in a mold for 6 minutes at a pressure of 2000 to 2300 PSi at 180 ° C. The results are shown in Table 1 below.
비교예 2Comparative Example 2
SBR 70g과 EPDM 30g이 함유된 고무 성분 100g에 실리카 80g, 케톤류 세정제 2g, 첨가제(스테아린산 1g, 이산화티타늄 5g, 산화방지제 1g, 가교제 2.5g)을 첨가한 후 혼련 및 혼합한 후 시트 형태로 제작하여 몰드에서 180℃에서 2000 ~ 2300 PSi의 압력으로 6분간 몰드 세정을 실시하였다. 결과를 하기 표 1에 나타내었다.
After adding 80 g of silica, 2 g of ketone cleaner, and additives (1 g of stearic acid, 5 g of titanium dioxide, 1 g of antioxidant, 2.5 g of crosslinking agent) to 100 g of a rubber component containing 70 g of SBR and 30 g of EPDM, kneading and mixing were carried out to form a sheet. The mold was cleaned for 6 minutes at a pressure of 2000-2300 PSi at 180 ° C in the mold. The results are shown in Table 1 below.
◎: 아주 우수함, ○: 우수함, △: 보통, ×: 나쁨◎: Very good, ○: Excellent, △: Normal, ×: Poor
표 1을 참조하면, 세정제가 그래프팅된 무기 필러를 이용한 실시예 1, 2는 세정제를 그래프팅하지 않은 다른 비교예 1,2와 비교하여 몰드에서 우수한 세정 특성을 확인할 수 있다. 세정제 냄새에 의한 특유의 거부감이 줄어들어 작업성도 향상되었다. 몰드에서 성형성 또한 기존 수준을 유지한 것으로 나타났다. 그래프팅된 무기 필러의 함량 변화가 세정성 및 연무/냄새 등 작업성에 영향을 주는 것으로 나타났다.Referring to Table 1, Examples 1 and 2 using the inorganic filler grafted cleaning agent can confirm the excellent cleaning properties in the mold compared to the other Comparative Examples 1 and 2 not grafting the cleaning agent. The unique rejection caused by the smell of the cleaner was reduced, and workability was also improved. The moldability in the mold was also shown to remain at the existing level. Changes in the content of grafted inorganic fillers have been shown to affect workability, such as cleanliness and mist / odor.
Claims (5)
세정제가 그라프팅된 무기 필러 10 - 50 중량부; 및
첨가제 1 - 10 중량부를 혼합하여 이루어지는 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물.
Natural rubber (NR), chloroprene rubber (CR), butadiene rubber (BR), nitrile rubber (NBR), ethylene-propylene terpolymer rubber (EPT), ethylene-propylene rubber (EPM), ethylene-propylene diene rubber (EPDM) Based on 100 parts by weight of one or more mixture rubber components selected from the group consisting of styrene-butadiene rubber (SBR) and polyisoprene rubber,
10-50 parts by weight of the inorganic filler grafted detergent; And
EMC mold cleaning composition comprising an inorganic filler grafted with a cleaning agent, characterized in that by mixing the additive 1-10 parts by weight.
상기 세정제는 글리콜에테르, 케톤류, 에스테르류, 피롤류, 이미다졸류, 이미다졸린류 및 아미노 알코올류 중에서 선택된 하나 이상인 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물.
The method of claim 1,
The cleaning agent is EMC mold cleaning composition comprising an inorganic filler grafted with a cleaning agent, characterized in that at least one selected from glycol ethers, ketones, esters, pyrroles, imidazoles, imidazolines and amino alcohols.
상기 무기 필러는 실리카, 알루미나, 카본 블랙, 탄산 칼슘, 칼슘 실리케이트, 수산화 알루미늄, 산화티타늄, 티타늄 다이옥사이드 및 수산화 티타늄 중에서 선택된 하나 이상인 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물.
The method of claim 1,
The inorganic filler is for EMC mold cleaning comprising an inorganic filler grafted with a cleaner, characterized in that at least one selected from silica, alumina, carbon black, calcium carbonate, calcium silicate, aluminum hydroxide, titanium oxide, titanium dioxide and titanium hydroxide. Composition.
코팅 성분으로 실리콘 오일 1 내지 5 중량부 및 왁스 5 내지 10 중량부를 추가로 포함하는 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물.
The method of claim 1,
EMC mold cleaning composition comprising an inorganic filler grafted with a cleaning agent, characterized in that it further comprises 1 to 5 parts by weight of silicone oil and 5 to 10 parts by weight of the wax as a coating component.
상기 첨가제는 스테아린산, 이산화티타늄, 산화방지제, 및 가교제 중에서 선택된 하나 이상을 포함하는 것을 특징으로 하는 세정제가 그라프팅된 무기 필러를 포함하는 EMC 몰드 세정용 조성물.
The method of claim 1,
The additive is EMC mold cleaning composition comprising an inorganic filler grafted with a cleaning agent, characterized in that it comprises at least one selected from stearic acid, titanium dioxide, antioxidants, and crosslinking agents.
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| KR1020120023802A KR101334249B1 (en) | 2012-03-08 | 2012-03-08 | Composition for EMC mold cleaning comprising cleaning agent grafted inorganic filler |
| PCT/KR2013/001529 WO2013133570A1 (en) | 2012-03-08 | 2013-02-26 | Composition comprising inorganic filler on which cleansing agent is grafted for cleansing emc mold |
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| KR101667564B1 (en) * | 2015-06-09 | 2016-10-20 | (주)휴이노베이션 | Rubber Composition of Excellent Cavity-filling and Detergency |
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| KR102292739B1 (en) * | 2019-11-27 | 2021-08-25 | 아쿠아켐(주) | Melamine Resin Composition for Cleaning Semiconductor Mold |
| KR102274604B1 (en) * | 2019-11-27 | 2021-07-07 | 아쿠아켐(주) | Melamine Resin Composition for Cleaning Semiconductor Mold |
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| US5556572A (en) | 1994-06-15 | 1996-09-17 | Bridgestone Corporation | Rubber composition for cleaning molds and exhibiting reduced amino-alcohol volatilization and ammonia odor, and method for use thereof |
| KR20110007983A (en) * | 2009-07-17 | 2011-01-25 | 닛토덴코 가부시키가이샤 | Mold cleaner composition and mold cleaning material, and method of cleaning using the same |
| KR20110009873A (en) * | 2009-07-23 | 2011-01-31 | (주)에이씨티 | Rubber compound for clearing of semiconductor mold |
| KR20110062792A (en) * | 2009-12-04 | 2011-06-10 | (주)에이씨티 | Hybrid compound for cleaning of semiconductor mold |
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| US5959072A (en) * | 1998-01-26 | 1999-09-28 | Conpoly Technology Co., Ltd. | Wastewater-recyclable process for producing a polyaniline resin powder |
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|---|---|---|---|---|
| US5556572A (en) | 1994-06-15 | 1996-09-17 | Bridgestone Corporation | Rubber composition for cleaning molds and exhibiting reduced amino-alcohol volatilization and ammonia odor, and method for use thereof |
| KR20110007983A (en) * | 2009-07-17 | 2011-01-25 | 닛토덴코 가부시키가이샤 | Mold cleaner composition and mold cleaning material, and method of cleaning using the same |
| KR20110009873A (en) * | 2009-07-23 | 2011-01-31 | (주)에이씨티 | Rubber compound for clearing of semiconductor mold |
| KR20110062792A (en) * | 2009-12-04 | 2011-06-10 | (주)에이씨티 | Hybrid compound for cleaning of semiconductor mold |
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| KR101667564B1 (en) * | 2015-06-09 | 2016-10-20 | (주)휴이노베이션 | Rubber Composition of Excellent Cavity-filling and Detergency |
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