KR101247571B1 - 취성 재료 기판의 스크라이브 방법 - Google Patents

취성 재료 기판의 스크라이브 방법 Download PDF

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Publication number
KR101247571B1
KR101247571B1 KR1020110055518A KR20110055518A KR101247571B1 KR 101247571 B1 KR101247571 B1 KR 101247571B1 KR 1020110055518 A KR1020110055518 A KR 1020110055518A KR 20110055518 A KR20110055518 A KR 20110055518A KR 101247571 B1 KR101247571 B1 KR 101247571B1
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KR
South Korea
Prior art keywords
substrate
scribe
cutter wheel
brittle material
trigger
Prior art date
Application number
KR1020110055518A
Other languages
English (en)
Korean (ko)
Other versions
KR20110136713A (ko
Inventor
하루오 와카야마
타카히로 지누시
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010135477A external-priority patent/JP5210356B2/ja
Priority claimed from JP2010135476A external-priority patent/JP5210355B2/ja
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20110136713A publication Critical patent/KR20110136713A/ko
Application granted granted Critical
Publication of KR101247571B1 publication Critical patent/KR101247571B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020110055518A 2010-06-14 2011-06-09 취성 재료 기판의 스크라이브 방법 KR101247571B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010135477A JP5210356B2 (ja) 2010-06-14 2010-06-14 脆性材料基板のスクライブ方法
JPJP-P-2010-135476 2010-06-14
JPJP-P-2010-135477 2010-06-14
JP2010135476A JP5210355B2 (ja) 2010-06-14 2010-06-14 脆性材料基板のスクライブ方法

Publications (2)

Publication Number Publication Date
KR20110136713A KR20110136713A (ko) 2011-12-21
KR101247571B1 true KR101247571B1 (ko) 2013-03-26

Family

ID=45101112

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110055518A KR101247571B1 (ko) 2010-06-14 2011-06-09 취성 재료 기판의 스크라이브 방법

Country Status (3)

Country Link
KR (1) KR101247571B1 (zh)
CN (1) CN102275229B (zh)
TW (1) TWI457303B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481576B (zh) * 2012-05-02 2015-04-21 Taiwan Mitsuboshi Diamond Ind Co Ltd 切割玻璃之方法及切割設備
JP6287060B2 (ja) * 2013-10-25 2018-03-07 三星ダイヤモンド工業株式会社 スクライビング工具、スクライビング工具の製造方法、およびスクライブラインの形成方法
WO2015151755A1 (ja) * 2014-03-31 2015-10-08 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP6288260B2 (ja) * 2014-05-30 2018-03-07 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN106458690B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
CN106458691B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
JP6303861B2 (ja) * 2014-06-25 2018-04-04 三星ダイヤモンド工業株式会社 単結晶基板の分断方法
JP6288293B2 (ja) * 2014-10-29 2018-03-07 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6311798B2 (ja) * 2014-11-25 2018-04-18 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN106277733A (zh) * 2015-06-03 2017-01-04 三星钻石工业股份有限公司 切割方法及切割设备
JP6519381B2 (ja) * 2015-07-27 2019-05-29 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
JP6544149B2 (ja) * 2015-08-31 2019-07-17 三星ダイヤモンド工業株式会社 脆性材料基板における傾斜クラックの形成方法および脆性材料基板の分断方法
JP2018150191A (ja) * 2017-03-13 2018-09-27 日本電気硝子株式会社 ガラス板の製造方法
CN107379292B (zh) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 显示面板的切割方法、***和存储介质
CN108254312A (zh) * 2018-03-27 2018-07-06 肇庆市现代筑美家居有限公司 一种家具表面漆膜附着力检测设备
TWI837150B (zh) * 2018-09-28 2024-04-01 日商三星鑽石工業股份有限公司 GaN基板之分斷方法
CN112429956A (zh) * 2020-11-24 2021-03-02 谭远茂 一种玻璃方形划线切割装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000264656A (ja) * 1999-03-18 2000-09-26 Berudekkusu:Kk スクライブ方法および装置
JP2003292332A (ja) 2002-03-29 2003-10-15 Nakamura Tome Precision Ind Co Ltd スクライブ方法及びスクライブ装置
JP2004359502A (ja) 2003-06-05 2004-12-24 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法及びその装置
JP2010089144A (ja) 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001255504A (ja) * 2000-03-14 2001-09-21 Matsushita Electric Ind Co Ltd 液晶表示パネルの透光性基板の切断方法
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
AU2003268668A1 (en) * 2002-11-22 2004-06-18 Mitsuboshi Diamond Industrial Co., Ltd. Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
TWI409231B (zh) * 2005-07-06 2013-09-21 Mitsuboshi Diamond Ind Co Ltd Method for manufacturing scratches for brittle materials
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000264656A (ja) * 1999-03-18 2000-09-26 Berudekkusu:Kk スクライブ方法および装置
JP2003292332A (ja) 2002-03-29 2003-10-15 Nakamura Tome Precision Ind Co Ltd スクライブ方法及びスクライブ装置
JP2004359502A (ja) 2003-06-05 2004-12-24 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法及びその装置
JP2010089144A (ja) 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法

Also Published As

Publication number Publication date
TWI457303B (zh) 2014-10-21
CN102275229B (zh) 2014-12-17
TW201204658A (en) 2012-02-01
CN102275229A (zh) 2011-12-14
KR20110136713A (ko) 2011-12-21

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