201204658 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種於平板顯示器等中所使用之玻璃基 板、或者半導體晶圓或陶瓷等脆性材料基板之表面形成劃 線（及沿著劃線於基板厚度方向上擴展之垂直裂縫）之劃線 方法。本發明尤其是關於一種利用刀輪於較薄之脆性材料 基板上形成劃線時較佳之劃線方法。 【先前技術】 於脆性材料基板上形成劃線，並利用沿著劃線於基板厚 度方向上擴展之垂直裂縫將基板分斷之加工中，藉由使圓 盤狀之刀輪相對於基板表面滾動而形成劃線之方法為眾所 周知，且例如揭示於專利文獻1等中。 於液晶面板等中，如圖5所示，將貼合兩片較薄之玻璃 材而形成之大面積之玻璃基板訄分斷為各自成為成品之單 位基板。此時，首先利用刀輪於基板河之表面形成χ方向 之劃線Sl'，其次形成與X方向交又之γ方向之劃線s2'。如 此形成χ-γ方向上交又之複數條劃線之後，將基板河輸送 至斷裂裝置，藉由使其沿著劃線彎曲而分斷為單位基板。 作為用以於玻璃基板上形成劃線之刀輪，有如圖6所示 之通常之刀輪la(以下，將其稱為普通刀輪la)、及如圖7所 示之於刀尖稜線部2設置有切口 3(槽）之刀輪lb(以下，將其 稱為帶槽刀輪lb)。前者之普通刀輪&中，為形成刀尖棱 線部之兩側之傾斜面而以磨石研磨刀尖稜線部之兩側，因 此於傾斜面形成研磨條痕，源於傾斜面之研磨條痕而於刀 156391.doc 201204658 尖稜線部形成微小之凹凸。通常，刀尖稜線部之凹凸之狀 態不規則，例如刀尖稜線部之中心線表面粗糙度Ra(中心 線表面粗縫度取決於 jIS(japanese lndustrial Standard，日 本工業標準）B 0601-1982之定義）未達1 μπι。後者之帶槽刀 輪lb中，具體而言有三星鑽石公司製造之Penett(註冊商 標）刀輪、APIO(註冊商標）刀輪，通常，切口之深度為 1〜30 μιη(尤其為2〜30 μηι)左右，切口以1〇〜2〇〇 μιη(尤其為 3〇〜150 μη)之間距形成，於刀尖稜線部之稜線方向上切口 之長度較突起之長度（兩個切口間之稜線之長度）長之帶槽 刀輪中，存在沿著劃線而形成之於基板厚度方向上擴展之 垂直裂縫之深度變大之傾向。 普通刀輪la於通常之使用條件下，雖無法形成較深之垂 直裂縫但具有如下優點：可形成加工部位之狀態不錯亂 (於加工。卩位不產生被細之龜裂或缺口等）之劃線，且沿著 所形成之劃線分斷玻璃基板時不會於端面殘留傷痕，可防 止端面強度之劣化。另一方面，因對破璃基板之摩擦力較 J陷入力較小而谷易打滑（運行不良），故必須如圖8所示 乂玻璃基板Μ之*而緣為起點而形成劃線。將如此自外緣 起滾動刀輪而形成劃線之方法稱為「外切(ο* —。 於利用普通刀輪13之外切時，使普通刀輪u自旁邊對玻 璃基板Μ之端緣角部碰觸而開始加工。其原因在於，若欲 自玻璃基板表面之自端续離pq# 螨緣離開之位置起形成劃線，則由於 對玻璃基板表面之運行不良， 个良而產生無法形成劃線之不良 情形。然而，玻璃基祐之她絲_ & β 丞板之蚝緣角部易裂且脆弱，因此有加 156391.doc -4- 201204658 工開始時產生微細之缺口或裂紋之虞。尤其，若為玻璃基 板Μ之板厚為0.4 mm以下（尤其為〇.2 mm以下）之薄板，則 尤其容易產生缺口。又’若欲將普通刀輪la自旁邊對玻璃 基板Μ之端緣角部碰觸，則容易產生普通刀輪1&之刀尖稜 線部產生缺口之不良情形。 又’若使用普通刀輪la對玻璃基板Μ進行又_丫方向之交 叉劃線，則有時如圖9所示，產生如下現象：自普通刀輪 la通過最初形成之χ方向之劃線&，所成之交叉點9起局部 未形成Y方向之劃線I，，即，稱為「交點消失」之現象。 認為其原因在於，在最初形成之又方向之劃線s〗，之槽兩側 殘存有應力，導致形成接τ來之γ方向之劃線&，時，在殘存 有應力之交叉點處，用以形成垂直裂縫之按壓力被削減。 與此相對，於刀尖之稜線處設置有切口（槽）之帶槽刀輪 lb對玻璃基板之摩擦力及陷入力較大，因此無須如普通刀 輪la般自玻璃基板之一端緣開始加工，而可如圖ι〇所示， 猎由使帶槽刀輪Ib自較基板Μ之端緣稍微深入内側之部位 起沿著劃線預定線朝箭頭方向滾動，而形成劃線。如上所 述，將自較端緣稍為内側起形成劃線而非自玻璃基板之一 端緣起之方法料「内切（inner⑽）」。利用帶槽刀輪 lb(尤其是於複線方向上切口之長度較長之帶槽刀輪）形成 之劃線成為較深地擴展之裂縫。 又，帶槽刀輪lb對基板之運行良好，且垂直裂縫較深地 擴展，因此於脆性材料基板上形成χ_γ方向之交又劃線時 亦可消除交點消失之現象。即，於形成¥方向之則線時，、 156391.doc 201204658 即便於帶槽刀輪通過與χ方向之劃線之交叉點時’亦可不 產生交點消失。 [先前技術文獻] [專利文獻] [專利文獻1 ]曰本專利第3074143號公報 【發明内容】 [發明所欲解決之問題] 近年來，為實現單位基板（成品）之輕量化要求玻璃基 板等脆性材料基板之板厚變薄，例如液晶面板等之玻螭^ 板亦開始使用將板厚為〇·2 mm以下之較薄之玻璃板貼合而 成之基板。 於利用刀輪在此種較薄之脆性材料基板上形成劃線之情 形時’帶槽錢係將切口與切口間之稜線交替按壓於基板 表面而形成劃線，因此劃線本身之狀態成為錯亂之狀態， 而容易殘留傷痕，分斷後之單位基板之端面強度會劣化， 成為較小之裂紋等之產生原因。 因此，自單位基板之端面強度方面來看，理想的是使用 均通刀輪，但於此情形時，必須自脆性材料基板之易裂之 彖角。P開始加工，因而導致加工開始時端緣之角部產生 ' 或者產生微細之裂紋。例如，厚度為0.4 mm以下、 為0.2 mm以下之玻璃基板等脆性材料基板難以防止端 彖角。P之缺口。又，存在因缺口而使端面強度顯著下降之 傾向。 又，因藉由打點衝擊而使裂縫之滲入變深，故若板厚為 201204658 0.4 mm以下、尤其為0.2 mm以下，則產生於交叉劃線之前 便分斷之不良情形之可能性變高。 因此’理想的是於此情形時亦使用普通刀輪，但此時， 如上所述有時會產生交點消失之現象，且有時產生於交點 部分無法形成狀態不錯亂（不產生微細之龜裂或缺口等）之 分斷面之不良情形，從而成品良率變差。 因此，本發明之目的在於提供一種使用刀輪對板厚較薄 之玻璃基板等脆性材料基板進行劃線時較佳之劃線方法。 本叙月之目的尤其是在於提供一種能夠以内切對脆性材 料基板進行加非進行外切之驗材料基板之劃線方法。 進而，本發明之目的亦在於提供一種可防止交叉劃線中 成為問題之交點消失之現象之劃線方法。 [解決問題之技術手段] 两連成上述目的 發明中闡述了如下技術手权。 即’本發明之劃線方法係藉由使用刀輪於脆性材料基板上 滚動而形成劃線者，於 於上述基板之表面上在較基板之一端 緣更深入内側之,、 ° 形成成為劃線起點之觸發部 (bigger)(初始龜裂），盆·Α ^ . w _人，使上述刀輪自形成有觸發部 lL ^ 疋線滾動，糟此形成劃線。 此1處，觸發部可驻+ " 刀輪自上述基板上方垂直下降並 〇丞扳碰撞而形成，但 部之長度並無特別一 Μ用刀輪以外者來形成，發 之觸發邱 、 <疋，例如較佳為形成1 mm左右之長度 。之方法。作為形 輪(尤其是切口之…成觸發部之刀輪，較佳為帶槽刀 又馮〗〜60 μηι左右之帶槽刀輪）。 156391.doc 201204658 又，第二發明係藉由使用刀輪於脆性材料基板上滾動而 形成相互交又之X方向之劃線及γ方向之劃線的劃線方 法，使上述刀輪滾動而於上述基板上形成χ方向之劃線， 其次於X方向之劃線與γ方向之劃線預定線交又之部分形 成Υ方向上延伸之觸發部後，使上述刀輪沿著丫方向之劃 線預定線滾動而形成γ方向之劃線。 此處，亦可將觸發部（交點龜裂）藉由使刀輪自上述基板 上方垂直下降並與基板碰撞而形成，但亦可利用刀輪二外 者來形成。觸發部之長度並無特別限^，例如較佳為形成 1 mm左纟之長度之觸發部之方法。作為形成觸發部之刀 輪，較佳為帶槽刀輪（尤其是切口之深度為卜6〇 pm左右之 帶槽刀輪）。 [發明之效果] 根據第-發明之劃線方法，藉由形成成為劃線起點之崩 發部，不論刀輪之種類（不使用帶槽刀輪）而可與帶槽刀報 同樣地藉由内切來形成劃線，因此可抑制於脆性材料基相 之易裂之端緣角部產生缺口或微細之裂紋。進而，因於劃 線之形成時無須使用帶槽刀輪，故於使用普通刀輪進行劃 線之If形時可加ji出加;η部不錯亂之劃線，且於後續步驟 中分斷跪性材料基板時幾乎不會於端面殘留傷痕，從而可 實現提高端面強度之加工。 根據第二發明之劃線方法，形成χ方向之劃線後，於咳 X方向之劃線與Υ方向之劃線預定線交叉之部分形成Υ方向 上延伸之觸發部（交點龜裂），於此狀態下形成γ方向之劃 15639l.doc 201204658 線，因此不會產生交點消失。 進而’藉由使用普通刀輪，可形成亦將交點部分包括在 内之不錯亂（不I生微細之龜裂或缺口等）之槽面之劃線。 上述發明中，脆性材料基板亦可為厚度爪爪以下、尤 其為0.2 mm以下之玻璃基板。若基板之板厚較薄，則進行 自基板之端緣起形成劃線之外切時，基本確定會產生缺 口，而即便為此種較薄之基板，亦可藉由實施本發明之劃 線方法而進行_ ’從巾可實現能夠防止端面強度下降之 劃線。 又’若利用普通刀輪進行劃線，則裂縫之渗入受到抑 制，因此可抑制產生於交又劃線之前便分斷之不良情形之 可能性。 刀輪之刀尖稜線部之中心線平均粗糙度Ra(中心線平均 粗縫度之定義取決於爪B咖.·)較佳為未達！叫， 更佳為0.5 μιη以下。 藉此’可實現劃線不錯亂之美觀之加工。 又，上述發明中，觸發部可藉由使刀輪自上述基板上方 垂直下降並與基板碰撞而確實地形成於交點部分。 上述發明中’亦可於進行χ方向、γ方向之劃線時，於 基板之表面上在較基板之一端緣更深入内側之部位形成成 為劃線起點之觸發部，並進行内切。根據本發明，成為劃 線起點之觸發部（初始龜裂）之形成位置係形成於較端緣稍 微深入内側之部位者，而非脆性材料基板之易裂之端緣角 部，因此於觸發部（初始龜裂）之加工時，可抑制缺口或微 156391.doc 201204658 細之裂紋之產生。並且 部（初始龜裂）開始劃線 亦可確實地執行X方向 線。 ’由於自成為劃線起點之上述觸發 故而即便為容易打滑之普通刀輪 之劃線及之後向Y方向之交又劃 【實施方式】 以下 明。 根據 圖式對本發明 之劃線方法之詳情進行詳細說 圖1係表示用以實施本發明方法 略前視圖。 R般之劃線震置之概 劃線裝置SC包含：平台4’其將脆性材料基板Μ保持於 =面且可進行水平旋轉；軌道5 ,其將上述平台4保持為 可二：¾•向移動；導桿6’其於平台4之上方橫架於與軌道 二广之方向(圖1之左右方向)上；兩台劃線頭7，其設置為 可沿上述導桿6移動；及切割器固持器8，其可升降地安裝 2劃線碩7之下端。於上述切割器固持器8之一者安裝有之 :圖6所示之普通刀輪1&，於另一者安裝有之前圖7所示之 f槽刀輪lb。f歹Η口，於玻璃基板Mi形成觸發部時，使帶 一 輪lb下降並與玻璃基板μ碰撞，而於加工劃線時，使 普通刀輪la下降，自玻璃基板Μ上之觸發部起一邊壓接一 邊使平台4或劃線頭7沿著劃線預定線相對移動。 八人對使用上述劃線裝置之劃線方法進行說明。此 處對以内切於基板上形成成為劃線起點之觸發部（初始 龜裂）後，向ΧΥ方向進行交叉劃線之情形進行說明。 首先’如圖2(a)〜(c)及圖4(a)所示，於X方向之劃線預定 156391.doc • 10· 201204658 線一上在較玻璃基板M之-端緣更深人内側之部位，使帶 槽刀輪lb以輕輕擊打玻璃基板M之表面之方式下降，之後 使其上升’藉&形成成為劃線起點之觸發部㈠刀始龜 裂）T,。 其次’如圖2⑷及圖4(b)所示，使普通刀輪laT降至形 成有觸發部L之位置，並沿著劃線預定線L]—邊壓接一邊 滾動’藉此形成X方向之劃線Sl。即，藉由上述内切之方 法形成劃線。普通刀輪la可陷人至預先形成之觸發部 因此不會打滑，可形成劃線。藉由重複進行相同之作業而 如圖4(c)所示形成所有之X方向劃線\。 繼而，於形成與X方向正交之γ方向之劃線I之情形 時，使平台4於水平方向上旋轉9〇度，進行相同之加工。 即，如圖4(d)及圖4⑷所示，於劃線預定線^上在較玻璃 基板Μ之端緣稍微深人内側之部位，利用帶槽刀輪⑽成 成為劃線起點之觸發部丁2(初始龜裂），使普通刀輪ia自此 處起沿著劃線預定線L2滾動，藉此形成γ方向之劃線&。 再者，於形成上述Y方向之劃線S2之前，為防止交點消 失之現象，而如圖4⑷所示’預先於乂方向之劃線“γ方 向之劃線預定線L2交又之部分形成γ方向上延伸之觸發部 丁3(交點龜裂）。即，如圖3(a)〜(c)及圖4(句所示，使帶槽刀 輪lb於X方向之劃線心與γ方向之劃線預定線L2交叉之^分 以輕輕擊打玻璃基板Μ之表面之方式下降，之後使其上 升，藉此形成觸發部I(交點龜裂卜其後，如圖3(^)所 示’使普通刀輪1&抵接於之前所形成之觸發部^(初始龜 156391.doc • 11 - 201204658 裂）之位置，並自此處起滾動，藉此如圖4(e)所示加工γ方 向之劃線S2。藉由重複進行相同之作業而如圖4w斤示形 成所有之Υ方向劃線S2。 如此，藉由預先於劃線Sl之交又部分之槽兩側（或劃線 時之刀輪之行進方向側）形成觸發部丁3(交點龜裂），而可於 普通刀輪la通過劃線51之部位不產生交點消失地形成劃線 S 2。 又，上述方法中，利用帶槽刀輪lb之觸發部Τι、T2(初 始龜裂）之形成位置係加工於較端緣稍微深入内側之部位 之平面，而非基板Μ之易裂之端緣角部，因此可抑制觸發 部加工時產生缺口或微小之裂紋等。而且，即便為厚度 0.4 mm以下、尤其為〇·2 mm以下之玻璃基板，亦可使用至 今為止無法於内切時使用之普通刀輪而以内切形成劃線。 又，由於藉由普通刀輪1 a加工劃線s丨、S2，故而與使用帶 槽刀輪之情形相比，可加工出加工部不錯亂之劃線，且於 後續步驟中分斷脆性材料基板時不會於端面殘留傷痕，從 而可提尚端面強度。 再者’上述實施例中係分別加工出一個觸發部Τι或 丁2(初始龜裂）後，形成一條劃線s丨或S2，但亦可於形成劃 線S丨、S2之前’先形成成為劃線起始點之觸發部几或丁2， 其後以上述觸發部Τ!或Τ2為起始點而形成劃線S!、s2。 又’上述實施例中，作為於X方向之劃線S】與Y方向之 劃線預定線交叉之部分形成觸發部τ3之裝置，使用有與劃 線形成用之普通刀輪la不同之觸發部形成用之帶槽刀輪 156391 .doc •12· 201204658 lb，但亦可利用劃線形成用之普通刀輪Ia而形成。於此情 形時，劃線頭7只要一個即可。 、以上對本發明之代純之實施例進行了㈣，但本發明 並不限疋於上述實施形態。例如，本發明方法適合於厚度 0.4 mm以下、尤其為〇 2 _以下之玻璃基板之劃線，但亦 可應用於超過0.4 mm之玻璃基板、或其他脆性材料基板。 此^本發明令’可於達成其目的且不脫離中請專利範圍 之範圍内進行適當修正、變更。 [產業上之可利用性] 本發明之劃線方法可用於對包含玻璃基板、石夕、陶究、 化合物半導料脆性材料之基板進行劃線之情形。 【圖式簡單說明】 圖1係表示本發明之書丨丨錄 之 — s a I線方法中所使用之劃線裝置 貫施例之前視圖。 圖2⑷⑷係按步驟依序表示内切之實施態樣之圖。 圖3(a)〜(d)係按步驟依庠 _ 面圖。 4依序表不父又劃線之實施態樣之剖 圖4⑷〜(f)係表示於X方向之劃線與γ方向之 之交點部分形成艏淼# ,二 踝預疋線 面圖。&成觸發部(父點龜裂)而進行劃線之順序之平 圖5係用以對先前之脆性材料基板之劃線方法進行 之平面圖 圖6係表示_ 6(b)為側視圖。 說明 般之普通刀輪之圖，圖6⑷為前視 圖，圖 156391.doc •13. 201204658 圖7係表示一般之帶槽刀輪之側視圖。 圖8係用以表示先前之利用普通刀輪之劃線方法之立體 圖。 圖9係用以對交點消失之現象進行說明之平面圖。 圖10係用以對内切進行說明之立體圖。 【主要元件符號說明】 la 普通刀輪 lb 帶槽刀輪 2 稜線部 3 切口 4 平台 5 轨道 6 導桿 7 劃線頭 8 切割器固持器 9 交叉點 Μ 脆性材料基板 SC 劃線裝置 s, ' s,· X方向之劃線 s2、s2， Y方向之劃線 L, X方向之劃線預定線 l2 Y方向之劃線預定線 T!、T2 成為劃線起點之觸發部 T3 交叉部分之觸發部 156391.doc .14.201204658 VI. Description of the Invention: [Technical Field] The present invention relates to a glass substrate used in a flat panel display or the like, or a surface of a substrate such as a semiconductor wafer or a ceramic material, and a scribe line (and along a scribe line) A scribing method for a vertical crack that expands in the thickness direction of the substrate. More particularly, the present invention relates to a preferred scribing method for forming a score line on a thinner brittle material substrate using a cutter wheel. [Prior Art] A scribe line is formed on a brittle material substrate, and the substrate is cut by a vertical crack extending in the thickness direction of the substrate along the scribe line, by rolling the disk-shaped cutter wheel relative to the substrate surface The method of forming the scribe line is well known, and is disclosed, for example, in Patent Document 1 and the like. In a liquid crystal panel or the like, as shown in Fig. 5, a large-area glass substrate 形成 formed by laminating two thin glass materials is divided into unit substrates each of which is a finished product. At this time, first, a scribe line S1' in the χ direction is formed on the surface of the substrate river by the cutter wheel, and a scribe line s2' in the γ direction intersecting with the X direction is formed next. After forming a plurality of scribe lines in the χ-γ direction, the substrate river is transported to the breaking device, and is divided into unit substrates by bending along the scribe lines. As a cutter wheel for forming a scribe line on a glass substrate, there is a conventional cutter wheel la (hereinafter referred to as a common cutter wheel la) as shown in FIG. 6, and a ridgeline portion as shown in FIG. 2 A cutter wheel 1b having a slit 3 (slot) is provided (hereinafter, referred to as a grooved cutter wheel lb). In the conventional cutter wheel & in order to form the inclined surface on both sides of the ridge line portion of the blade edge, both sides of the ridge line portion of the blade edge are ground by the grindstone, so that the polishing streak is formed on the inclined surface, and the grinding is caused by the inclined surface. The streak is on the knife 156391.doc 201204658 The sharp edge line forms a slight bump. Usually, the state of the unevenness of the ridge line portion of the blade edge is irregular, for example, the center line surface roughness Ra of the blade edge ridge portion (the center line surface roughness depends on the definition of jIS (Japanese industrial standard) B 0601-1982 ) less than 1 μπι. In the latter slotted cutter wheel lb, specifically, the Penett (registered trademark) cutter wheel and the APIO (registered trademark) cutter wheel manufactured by Samsung Diamond Co., Ltd. usually have a depth of 1 to 30 μm (especially 2 to 30). Μηι), the slit is formed at a distance of 1〇~2〇〇μηη (especially 3〇~150 μη), and the length of the slit is longer than the length of the protrusion in the ridgeline direction of the ridgeline portion of the blade edge (the ridge line between the two slits) In the slotted cutter wheel having a long length, there is a tendency that the depth of the vertical crack formed in the thickness direction of the substrate formed along the scribe line becomes large. Under normal conditions of use, the conventional cutter wheel la can not form a deep vertical crack, but has the following advantages: the state of the formed portion can be formed well (in the processing. The niche does not produce a crack or a gap, etc.) When the glass substrate is cut along the line formed, no scratches remain on the end surface, and deterioration of the end surface strength can be prevented. On the other hand, since the frictional force against the glass substrate is smaller than the J sinking force and the valley is easy to slip (the operation is poor), it is necessary to form a scribe line as the starting point of the 乂 glass substrate 如图 as shown in Fig. 8 . The method of forming the scribe line by rolling the cutter wheel from the outer edge is called "external cutting (ο* —. When the ordinary cutter wheel 13 is used for cutting, the edge angle of the ordinary cutter wheel u from the side to the glass substrate is made. When the part is touched, the processing starts. The reason is that if the scribe line is formed from the position where the self-end of the surface of the glass substrate is separated from the edge of the pq#, the operation of the surface of the glass substrate is poor, and the formation of the glass substrate cannot be formed. The bad situation of the scribing. However, the corners of the rim of the glass 佑 & β &; 丞 易 易 易 易 易 易 易 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 156 In particular, if the thickness of the glass substrate is 0.4 mm or less (especially 〇.2 mm or less), the gap is particularly likely to occur. And if the ordinary cutter wheel la is to be smashed from the side to the glass substrate When the edge of the corner is touched, it is easy to cause a problem that the blade edge line portion of the conventional cutter wheel 1& is notched. Further, if the glass substrate Μ is cross-hatched in the _丫 direction using the common cutter wheel la, sometimes As shown in Figure 9, the following phenomenon occurs: The ordinary cutter wheel la passes through the scribe line & the initial direction of the formation, and the intersection point 9 formed is partially formed without the scribe line I in the Y direction, that is, a phenomenon called "the intersection disappears." In the initial direction of the formation of the line s〗, there are residual stresses on both sides of the groove, resulting in the formation of the γ-direction scribe line & τ, at the intersection of residual stress, used to form vertical crack In contrast, the grooved cutter wheel 1b provided with a slit (groove) at the ridge line of the cutting edge has a large frictional force and a plunging force on the glass substrate, so that it is not required to be a glass like a conventional cutter wheel la One end edge of the substrate is processed, and as shown in FIG. ,, the hunting is performed by causing the grooved cutter wheel Ib to roll in the direction of the arrow along the predetermined line of the scribe line from a portion slightly deeper than the edge of the substrate Μ. Scribing. As described above, a method of forming a scribe line from a slightly inner side of the opposite end edge instead of one end edge of the glass substrate is used to "inner (10)". Using the grooved cutter wheel lb (especially in the direction of the double line) a slotted cutter wheel with a long length of the slit) The scribe line becomes a crack that expands deeper. Moreover, the grooved cutter wheel lb works well on the substrate, and the vertical crack expands deep, so that the χ_γ direction is formed on the brittle material substrate and the scribe line is also Eliminate the phenomenon that the intersection point disappears. That is, when the line of the direction of the ¥ direction is formed, 156391.doc 201204658 is convenient for the grooved cutter wheel to pass through the intersection with the scribe line in the χ direction, or the intersection disappears. [Previous technical literature [Patent Document 1] [Patent Document 1] Japanese Patent No. 3074143 [Disclosure] [Problems to be Solved by the Invention] In recent years, in order to reduce the weight of a unit substrate (finished product), a brittle material substrate such as a glass substrate is required. When the thickness of the sheet is reduced, for example, a glass plate such as a liquid crystal panel is used as a substrate in which a thin glass plate having a thickness of 〇·2 mm or less is bonded. When a scribing wheel is used to form a scribe line on such a thin brittle material substrate, the grooving method alternately presses the ridge line between the slit and the slit on the surface of the substrate to form a scribe line, so that the state of the scribe line itself becomes disordered. In the state, the flaw is likely to remain, and the strength of the end surface of the unit substrate after the division is deteriorated, which causes a small crack or the like. Therefore, from the viewpoint of the end face strength of the unit substrate, it is desirable to use a uniform cutter wheel, but in this case, it is necessary to break the corner of the brittle material substrate. P starts to be processed, which results in the occurrence of a sharp corner at the edge of the edge at the beginning of the processing. For example, a brittle material substrate such as a glass substrate having a thickness of 0.4 mm or less and 0.2 mm or less is difficult to prevent the end turn angle. The gap of P. Further, there is a tendency that the strength of the end face is remarkably lowered due to the notch. Further, since the penetration of the crack is deepened by the impact of the impact, if the thickness is 201204658 0.4 mm or less, particularly 0.2 mm or less, the possibility of breakage before the cross-hatching is high becomes high. Therefore, it is desirable to use a common cutter wheel in this case, but at this time, as described above, the intersection point may disappear, and sometimes the intersection portion may not be formed in a good state (no fine cracking occurs). Or a bad situation of the cross-section of the gap, etc., so that the yield of the finished product is deteriorated. Accordingly, it is an object of the present invention to provide a method for scribing a brittle material substrate such as a glass substrate having a small thickness by using a cutter wheel. In particular, the purpose of this month is to provide a scribing method for a substrate of a test material which can be subjected to external cutting of the brittle material substrate by incision. Further, it is an object of the present invention to provide a scribing method which can prevent a phenomenon in which the intersection of a problem in a cross-hatching disappears. [Technical means for solving the problem] The two aspects of the above-mentioned objects are described in the invention. That is, the scribing method of the present invention forms a scribing by rolling a blade on a brittle material substrate, and the surface of the substrate is deeper inside than one end edge of the substrate, and is formed into a stroke. The trigger part (initial crack) of the starting point of the line, the basin Α ^ . w _ person, causes the cutter wheel to roll from the trigger portion lL ^ 疋 line, and the scribe line is formed. In this one, the trigger part can be stationed + " the cutter wheel is vertically descended from above the above-mentioned substrate and formed by collision, but the length of the part is not particularly formed by the use of a cutter wheel, and the trigger is triggered by Qiu, <疋, for example, preferably forms a length of about 1 mm. The method. As the wheel (especially the cutting wheel of the cutting part, preferably the grooved knife and the von] ~60 μηι or so grooved cutter wheel). 156391.doc 201204658 Further, the second invention is a method of scribing a crosswise X-direction scribe line and a γ-direction scribe line by rolling a blade on a brittle material substrate to roll the cutter wheel a scribe line in the χ direction is formed on the substrate, and then a portion of the scribe line in the X direction and a predetermined line in the γ direction intersects the trigger portion extending in the Υ direction, and the scribe line is scribed along the 丫 direction. The predetermined line is rolled to form a scribe line in the gamma direction. Here, the trigger portion (intersection crack) may be formed by vertically lowering the cutter wheel from above the substrate and colliding with the substrate, but may be formed by using a cutter wheel. The length of the trigger portion is not particularly limited. For example, a method of forming a trigger portion having a length of 1 mm left is preferable. As the cutter wheel forming the trigger portion, a grooved cutter wheel (especially a grooved cutter wheel having a depth of about 6 pm) is preferable. [Effects of the Invention] According to the scribing method of the first invention, by forming the caulking portion which is the starting point of the scribing line, the type of the cutter wheel (without using the grooved cutter wheel) can be used in the same manner as the slotted cutter Since the scribe line is formed by incision, it is possible to suppress the occurrence of a chipping or fine crack at the corner portion of the edge of the brittle material base which is liable to crack. Furthermore, since the grooved cutter wheel is not required to be formed when the scribing is formed, it can be added when the ordinary scissor is used for the If shape of the scribing; the η portion is well scribbled and is broken in the subsequent steps. When the substrate of the inert material is used, the flaw is hardly left on the end surface, and the processing for improving the strength of the end face can be realized. According to the scribing method of the second invention, after the scribe line is formed in the χ direction, the trigger portion (intersection crack) extending in the Υ direction is formed in a portion where the scribe line in the X direction and the scribe line at the Υ direction intersects. In this state, a line of 15639l.doc 201204658 is formed in the γ direction, so that the intersection disappears. Further, by using a conventional cutter wheel, it is possible to form a scribe line which also includes a good groove (not a fine crack or a notch, etc.) of the intersection portion. In the above invention, the brittle material substrate may be a glass substrate having a thickness of not less than a claw, particularly 0.2 mm or less. If the thickness of the substrate is thin, when the scribe line is cut from the edge of the substrate, the gap is substantially determined, and even for such a thin substrate, the scribe method of the present invention can be implemented. And the _ 'from the towel can realize the scribe line which can prevent the strength of the end face from decreasing. Further, if the scribing is performed by the ordinary cutter wheel, the penetration of the crack is suppressed, so that it is possible to suppress the possibility of occurrence of a defect that is broken before the cross and the scribing. The center line average roughness Ra of the knife edge line of the cutter wheel (the definition of the center line average rough seam depends on the claw B coffee.) is preferably not reached! Called, more preferably 0.5 μιη or less. By this, it is possible to realize the processing of the beautifully chaotic appearance. Further, in the above invention, the trigger portion can be surely formed at the intersection portion by vertically lowering the cutter wheel from above the substrate and colliding with the substrate. In the above invention, when the scribe line in the χ direction and the γ direction is performed, the trigger portion which becomes the starting point of the scribe line is formed on the surface of the substrate at a position deeper than the one end edge of the substrate, and the undercut is performed. According to the present invention, the formation position of the trigger portion (initial crack) which is the starting point of the scribing line is formed at a portion which is slightly deeper than the end edge, and is not the edge portion of the fragile material substrate which is easily cracked. (Initial cracking) processing can suppress the occurrence of cracks or fine cracks of 156391.doc 201204658. And the part (initial crack) starts to be crossed and the X direction line can be surely executed. In the case of the above-mentioned trigger which is the starting point of the scribing line, the scribing of the ordinary cutter wheel which is easy to slip and the subsequent shift to the Y direction are also described. DETAILED DESCRIPTION OF THE INVENTION The details of the scribing method of the present invention will be described in detail with reference to the drawings. Fig. 1 is a front elevational view showing the method for carrying out the invention. The R-like scribing device generally includes a platform 4' that holds the brittle material substrate 于 on the surface and can be horizontally rotated, and a track 5 that holds the platform 4 as two: 3⁄4• Moving; the guide rod 6' is transversely positioned above the platform 4 in the direction of the track (the left and right direction of FIG. 1); two scribing heads 7 are provided to be movable along the guide rod 6; and cutting The holder 8 is capable of lifting and lowering the lower end of the 2 scribing 7 . One of the cutter holders 8 described above is mounted: the conventional cutter wheel 1& shown in Fig. 6, and the other is mounted with the f-slot cutter wheel lb shown in Fig. 7 previously. In the case where the trigger portion is formed on the glass substrate Mi, the belt wheel lb is lowered and collides with the glass substrate μ, and when the scribing is performed, the normal cutter wheel la is lowered, and the trigger portion from the glass substrate is lifted. The crimping side moves the platform 4 or the scribing head 7 relatively along the predetermined line of the scribe line. Eight people explained the scribing method using the above scribing device. Here, a case where the trigger portion (initial crack) which is the starting point of the scribe line is formed on the substrate, and the cross direction is crossed in the ΧΥ direction will be described. First, as shown in Fig. 2(a) to (c) and Fig. 4(a), the scribe line in the X direction is predetermined to be 156391.doc • 10·201204658. The line one is deeper than the end edge of the glass substrate M. In the portion, the grooved cutter wheel 1b is lowered in such a manner as to gently hit the surface of the glass substrate M, and then it is raised to "borrow" and form a trigger portion (a) which is a starting point of the scribing line). Next, as shown in Fig. 2 (4) and Fig. 4 (b), the ordinary cutter wheel laT is lowered to a position where the trigger portion L is formed, and is rolled along the predetermined line L] - while being crimped, thereby forming the X direction. Lined S1. That is, the scribe line is formed by the above-described inscribed method. The common cutter wheel la can be trapped to a pre-formed trigger portion so that it does not slip and a scribe line can be formed. All X-direction lines are formed as shown in Fig. 4(c) by repeating the same operation. Then, in the case where the scribe line I in the γ direction orthogonal to the X direction is formed, the stage 4 is rotated by 9 degrees in the horizontal direction, and the same processing is performed. That is, as shown in FIG. 4(d) and FIG. 4(4), the groove on the scribe line is slightly deeper than the edge of the edge of the glass substrate, and the grooved cutter wheel (10) is used as the trigger portion of the starting point of the scribe line. Ding 2 (initial crack) causes the ordinary cutter wheel ia to roll along the line to the line L2 from here, thereby forming a scribe line & Further, before the formation of the scribe line S2 in the Y direction, in order to prevent the disappearance of the intersection point, as shown in Fig. 4 (4), the scribe line "in advance in the 乂 direction" and the scribe line L2 in the γ direction intersect to form γ. Trigger 3 (intersection crack) extending in the direction. That is, as shown in Figs. 3(a) to (c) and Fig. 4 (indicated by the sentence, the grooved wheel lb is aligned in the X direction and the γ direction The line of the line D2 intersects to lower the surface of the glass substrate by gently hitting it, and then raises it, thereby forming the trigger portion I (the intersection is cracked, and then, as shown in Fig. 3 (^) Show 'the normal cutter wheel 1 & abuts the position of the trigger part ^ (initial turtle 156391.doc • 11 - 201204658 split) formed before, and scrolls from here, as shown in Figure 4 (e) The y-direction scribe line S2 is processed. By repeating the same operation, all the slanting lines S2 are formed as shown in Fig. 4w. Thus, by the two sides of the groove which are in advance at the intersection of the scribe lines S1 (or The triggering direction 3 (intersection crack) is formed on the traveling direction side of the cutter wheel in the line, and the intersection of the ordinary cutter wheel la through the scribe line 51 is not generated. Further, in the above method, the position at which the trigger portions Τι and T2 (initial cracks) of the grooved cutter wheel 1b are formed is processed on the plane of the portion slightly deeper than the end edge, instead of the substrate. It is possible to suppress the occurrence of notches or minute cracks during the processing of the trigger portion, and it is possible to use a glass substrate having a thickness of 0.4 mm or less, particularly 〇·2 mm or less. It is impossible to form a scribe line by incision in the conventional cutter wheel which is used for in-cutting. Further, since the scribe lines s丨 and S2 are processed by the common cutter wheel 1 a, it can be processed compared with the case where the grooved cutter wheel is used. The processing part is well-lined, and the brittle material substrate is not broken in the subsequent steps, so that no flaws remain on the end surface, so that the end face strength can be improved. Further, in the above embodiment, a trigger portion Τι or D is separately processed. 2 (initial crack), a scribe line s丨 or S2 is formed, but before the scribe lines S丨 and S2 are formed, the trigger portion or the dicing portion which becomes the starting point of the scribe line is formed first, and then The trigger part Τ! or Τ2 is formed as the starting point In the above-described embodiment, the portion in which the scribe line S in the X direction intersects with the predetermined line in the Y direction forms the trigger portion τ3, and is used for forming the scribe line. The cutter wheel 1 is formed by a different cutter wheel 156391.doc •12·201204658 lb, but it can also be formed by the normal cutter wheel Ia for forming the scribe line. In this case, the scribe head 7 only needs one. However, the above embodiment of the present invention is carried out (4), but the present invention is not limited to the above embodiment. For example, the method of the present invention is suitable for a glass substrate having a thickness of 0.4 mm or less, particularly 〇2 _ or less. It can be applied to glass substrates of more than 0.4 mm or other substrates of brittle materials. The present invention can be appropriately modified or changed within the scope of the patent scope without departing from the scope of the invention. [Industrial Applicability] The scribing method of the present invention can be used for scribing a substrate including a glass substrate, a stone substrate, a ceramic material, and a compound semiconductor brittle material. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view showing a schematic embodiment of a scribing apparatus used in the s a I line method of the present invention. Fig. 2 (4) and (4) show the embodiment of the inscribed embodiment in order. Figures 3(a) to (d) are based on the steps of Figure _. 4 Sections 4(4) to (f) show that the intersection of the scribe line in the X direction and the γ direction forms a 艏淼#, 二 踝 pre-疋 line surface view. & Flattening of the sequence of scribing into the triggering portion (parent point cracking) Fig. 5 is a plan view showing the scribing method of the previous brittle material substrate. Fig. 6 is a side view showing _6(b). Description Figure 3 (4) is a front view, Figure 156391.doc • 13. 201204658 Figure 7 shows a side view of a general grooved cutter wheel. Fig. 8 is a perspective view showing a conventional scribing method using a conventional cutter wheel. Fig. 9 is a plan view for explaining the phenomenon in which the intersection disappears. Fig. 10 is a perspective view for explaining the inner cut. [Main component symbol description] la Common cutter wheel lb Slotted cutter wheel 2 ridge line 3 slit 4 platform 5 rail 6 guide rod 7 scribe head 8 cutter holder 9 intersection point 脆 brittle material substrate SC scribe device s, ' s, · X-direction scribe line s2, s2, Y-direction scribe line L, X-direction scribe line predetermined line l2 Y-direction scribe line T!, T2 becomes the start of the scribe line trigger part T3 Department 156391.doc .14.