KR101211813B1 - 접착제 조성물 및 접속 구조체 - Google Patents

접착제 조성물 및 접속 구조체 Download PDF

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Publication number
KR101211813B1
KR101211813B1 KR1020100068812A KR20100068812A KR101211813B1 KR 101211813 B1 KR101211813 B1 KR 101211813B1 KR 1020100068812 A KR1020100068812 A KR 1020100068812A KR 20100068812 A KR20100068812 A KR 20100068812A KR 101211813 B1 KR101211813 B1 KR 101211813B1
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KR
South Korea
Prior art keywords
adhesive composition
group
branched polymer
compounds
compound
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KR1020100068812A
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English (en)
Korean (ko)
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KR20110007970A (ko
Inventor
히로유끼 이자와
시게끼 가또기
게이꼬 구도우
Original Assignee
히다치 가세고교 가부시끼가이샤
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Publication of KR20110007970A publication Critical patent/KR20110007970A/ko
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Publication of KR101211813B1 publication Critical patent/KR101211813B1/ko

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
KR1020100068812A 2009-07-17 2010-07-16 접착제 조성물 및 접속 구조체 KR101211813B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009169270 2009-07-17
JPJP-P-2009-169270 2009-07-17

Publications (2)

Publication Number Publication Date
KR20110007970A KR20110007970A (ko) 2011-01-25
KR101211813B1 true KR101211813B1 (ko) 2012-12-12

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ID=43483336

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100068812A KR101211813B1 (ko) 2009-07-17 2010-07-16 접착제 조성물 및 접속 구조체

Country Status (4)

Country Link
JP (1) JP5338753B2 (ja)
KR (1) KR101211813B1 (ja)
CN (1) CN101955736B (ja)
TW (1) TWI437065B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101933271B1 (ko) * 2016-03-23 2018-12-27 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 접속 구조체

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5418399B2 (ja) * 2009-07-17 2014-02-19 日立化成株式会社 接着剤組成物及び該接着剤組成物を用いた回路部材の接続構造体
KR101381118B1 (ko) * 2011-11-04 2014-04-04 제일모직주식회사 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름
JP5788923B2 (ja) * 2012-03-23 2015-10-07 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
JP6163824B2 (ja) * 2013-03-28 2017-07-19 日立化成株式会社 画像表示装置用粘着性樹脂組成物、画像表示装置用粘着シート、画像表示装置の製造方法及び画像表示装置
JP6056641B2 (ja) * 2013-05-07 2017-01-11 日立化成株式会社 画像表示装置用粘着シート、画像表示装置の製造方法及び画像表示装置
DE102013222739A1 (de) * 2013-06-17 2014-12-18 Tesa Se Reaktives 2-Komponentenklebesystem in Filmform
CN110277559B (zh) * 2019-06-17 2022-02-01 南开大学 用于锂离子电池硅基负极的聚亚胺导电粘结剂

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006257200A (ja) 2005-03-16 2006-09-28 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物及びそれを用いた回路接続構造体、半導体装置

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Publication number Priority date Publication date Assignee Title
JPH11193318A (ja) * 1997-11-04 1999-07-21 Toyo Ink Mfg Co Ltd 硬化性組成物
JP2003277489A (ja) * 2002-03-27 2003-10-02 Dainippon Ink & Chem Inc 多分岐ポリマーおよびその製造方法
JP4231748B2 (ja) * 2003-07-10 2009-03-04 太陽インキ製造株式会社 プリント配線基板用プリプレグ及びそれを用いて作製された多層プリント配線板
CN1635039A (zh) * 2003-12-25 2005-07-06 左晓兵 一种新型b级高速聚氨酯漆包线漆的制备方法
JP4760070B2 (ja) * 2005-03-16 2011-08-31 日立化成工業株式会社 接着剤、回路接続用接着剤、接続体及び半導体装置
JP4872125B2 (ja) * 2006-06-28 2012-02-08 Ｄｉｃ株式会社 多層プリント配線板用硬化性樹脂組成物、熱硬化性接着フィルム及び多層プリント基板
JP5292838B2 (ja) * 2007-08-30 2013-09-18 日立化成株式会社 接着剤、及び回路部材の接続構造体
CN101302395B (zh) * 2008-06-05 2011-03-16 吴江市太湖绝缘材料厂 一种水溶性聚氨酯表面磁漆
JP5418399B2 (ja) * 2009-07-17 2014-02-19 日立化成株式会社 接着剤組成物及び該接着剤組成物を用いた回路部材の接続構造体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006257200A (ja) 2005-03-16 2006-09-28 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物及びそれを用いた回路接続構造体、半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101933271B1 (ko) * 2016-03-23 2018-12-27 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 접속 구조체

Also Published As

Publication number Publication date
TW201127927A (en) 2011-08-16
CN101955736A (zh) 2011-01-26
CN101955736B (zh) 2014-08-27
KR20110007970A (ko) 2011-01-25
JP2011038080A (ja) 2011-02-24
TWI437065B (zh) 2014-05-11
JP5338753B2 (ja) 2013-11-13

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