KR101115868B1 - 기판처리장치 - Google Patents
기판처리장치 Download PDFInfo
- Publication number
- KR101115868B1 KR101115868B1 KR1020090036650A KR20090036650A KR101115868B1 KR 101115868 B1 KR101115868 B1 KR 101115868B1 KR 1020090036650 A KR1020090036650 A KR 1020090036650A KR 20090036650 A KR20090036650 A KR 20090036650A KR 101115868 B1 KR101115868 B1 KR 101115868B1
- Authority
- KR
- South Korea
- Prior art keywords
- susceptor
- substrate
- plate
- chamber
- processing apparatus
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (5)
- 기판에 대한 일정한 공정이 수행되도록 내부에 공간부가 형성되는 챔버;상기 챔버의 공간부에 설치되어 상기 기판을 지지하는 서셉터;상기 서셉터의 상부에 설치되어 상기 기판을 향하여 공정용 가스를 분사하는 가스공급장치;상기 서셉터의 내측으로 몰입되는 위치와 상기 서셉터의 상면위로 돌출된 위치 사이에서 승강가능하게 설치되어, 상기 기판을 상기 서셉터에 로딩 및 언로딩하는 복수의 리프트핀; 및상기 각 리프트핀을 가열하기 위한 히터체;를 포함하며,상기 서셉터의 상면과 하면 사이를 관통하여 복수의 핀홀이 형성되어, 상기 각 리프트핀은 상기 핀홀에 삽입되고,상기 히터체는 봉형상으로 형성되어 상기 리프트핀의 하부에 결합되며, 상기 서셉터의 핀홀에 삽입되는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 서셉터는 상기 챔버 내에 위치고정되는 것을 특징으로 하는 기판처리장치.
- 제1항 또는 제2항에 있어서,상기 리프트핀이 결합되며 상기 리프트핀을 승강시키도록 상하방향으로 이동가능하게 설치되는 승강플레이트와,상기 핀홀과 리프트핀 사이를 밀폐하도록, 상기 핀홀을 감싼 상태로 상기 서셉터의 하면과 승강 플레이트 사이에 신장 및 수축가능하게 설치되는 벨로우즈를 더 구비하는 것을 특징으로 하는 기판처리장치.
- 제3항에 있어서,상기 리프트핀과 핀홀 사이로 퍼지가스를 분사하도록, 상기 벨로우즈 내부의 공간에 연결되는 가스분사라인을 더 구비하는 것을 특징으로 하는 기판처리장치.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090036650A KR101115868B1 (ko) | 2009-04-27 | 2009-04-27 | 기판처리장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090036650A KR101115868B1 (ko) | 2009-04-27 | 2009-04-27 | 기판처리장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100117924A KR20100117924A (ko) | 2010-11-04 |
KR101115868B1 true KR101115868B1 (ko) | 2012-02-21 |
Family
ID=43404363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090036650A KR101115868B1 (ko) | 2009-04-27 | 2009-04-27 | 기판처리장치 |
Country Status (1)
Country | Link |
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KR (1) | KR101115868B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101267397B1 (ko) * | 2011-07-19 | 2013-06-04 | 주성엔지니어링(주) | 박막 증착 장치 및 이를 이용한 박막 증착 방법 |
KR101483824B1 (ko) * | 2012-11-07 | 2015-01-16 | 하이디스 테크놀로지 주식회사 | 평판표시소자 제조용 화학기상증착 장치 |
KR102046109B1 (ko) * | 2015-10-02 | 2019-12-02 | 주식회사 원익아이피에스 | 기판 처리 장치 |
DE102018007307A1 (de) | 2018-09-17 | 2020-03-19 | Vat Holding Ag | Stifthubvorrichtung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0273619A (ja) * | 1988-09-08 | 1990-03-13 | Teru Kyushu Kk | 加熱装置及び加熱方法 |
KR19980085159A (ko) * | 1997-05-28 | 1998-12-05 | 윤종용 | 벨로우즈를 보호하는 반도체 제조 장비 |
KR20060056653A (ko) * | 2004-11-22 | 2006-05-25 | 삼성전자주식회사 | 반도체 소자 제조용 베이크 장치 |
KR20060082091A (ko) * | 2005-01-11 | 2006-07-14 | 삼성전자주식회사 | 반도체 기판 처리장치 |
-
2009
- 2009-04-27 KR KR1020090036650A patent/KR101115868B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0273619A (ja) * | 1988-09-08 | 1990-03-13 | Teru Kyushu Kk | 加熱装置及び加熱方法 |
KR19980085159A (ko) * | 1997-05-28 | 1998-12-05 | 윤종용 | 벨로우즈를 보호하는 반도체 제조 장비 |
KR20060056653A (ko) * | 2004-11-22 | 2006-05-25 | 삼성전자주식회사 | 반도체 소자 제조용 베이크 장치 |
KR20060082091A (ko) * | 2005-01-11 | 2006-07-14 | 삼성전자주식회사 | 반도체 기판 처리장치 |
Also Published As
Publication number | Publication date |
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KR20100117924A (ko) | 2010-11-04 |
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